Ceramic substrate

Abstract

The utility model relates to a ceramic substrate, which comprises a ceramic substrate main body, a heat conduction pipe and a heat conduction shell, a snakelike track groove is formed in the bottom wall of the ceramic substrate body in the length direction, and a heat conduction pipe is embedded into the snakelike track groove in an attached mode; the two heat conduction shells are fixedly arranged on the two opposite side walls of the ceramic substrate body correspondingly. The two ends of the heat conduction pipe communicate with the two heat conduction shells correspondingly. The heat conduction shell and the heat conduction pipe are filled with heat conduction oil. Compared with the prior art, the ceramic substrate has the advantages that heat can be more uniformly distributed in the pipe due to the winding shape of the heat conduction pipe, and the phenomenon of local overheating or supercooling is avoided, so that the temperature of the whole ceramic substrate main body is more uniform. The snakelike heat conduction pipe can better meet the requirement, the situation that the temperature difference between the heat conduction rods is large possibly occurs due to the fact that the heat conduction rods are arranged in a rectangular mode, heat conduction oil in the heat conduction pipe is beneficial to heat conduction, and the temperature of the ceramic substrate body is further improved to be more uniform.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of electronic technology, concretely relates to a ceramic substrate. BACKGROUND

[0002] The ceramic substrate has very high insulation resistance, can effectively isolate different parts in the circuit, prevent current leakage and short circuit, and can be safely used in high-voltage environment. At the same time, the dielectric loss is low, which can reduce the delay and attenuation of signal transmission in high-frequency circuits, and ensure the integrity and accuracy of signals. For example, the patent CN220731500U-Chinese utility model patent temperature-resistant ceramic substrate and ceramic substrate assembly, in which multiple heat-conducting rods are arranged in a rectangular shape for heat conduction. However, the heat-conducting rods arranged in a rectangular shape are relatively independent, and heat may form local high-temperature or low-temperature areas between adjacent heat-conducting rods during transmission, resulting in uneven overall temperature distribution and affecting overall performance. SUMMARY

[0003] The main purpose of the utility model is to provide a ceramic substrate to solve the problem of uneven overall temperature distribution caused by the formation of local high-temperature or low-temperature areas between adjacent heat-conducting rods during heat transmission in the prior art temperature-resistant ceramic substrate and ceramic substrate assembly.

[0004] In order to achieve the above purpose, the utility model provides a ceramic substrate, which comprises a ceramic substrate body, a heat-conducting pipe and a heat-conducting shell.

[0005] A serpentine track groove is formed in the bottom wall of the ceramic substrate body along its length direction, and the heat-conducting pipe is embedded in the serpentine track groove.

[0006] Two heat-conducting shells are fixedly arranged on the opposite two side walls of the ceramic substrate body, and the two ends of the heat-conducting pipe are in communication with the two heat-conducting shells respectively.

[0007] The heat-conducting shell and the heat-conducting pipe are both filled with heat-conducting oil.

[0008] In one preferred embodiment, a glue-filled rectangular groove is formed in the bottom wall of the ceramic substrate body, and the serpentine track groove is located in the glue-filled rectangular groove, which is filled with glue.

[0009] In one preferred embodiment, the glue is heat-conducting silica gel.

[0010] In one preferred embodiment, the ceramic substrate body is in the shape of a rectangular body.

[0011] In one preferred embodiment, the heat-conducting shell is fixedly connected to the side wall of the ceramic substrate body by heat-conducting silica gel.

[0012] In one preferred embodiment, a copper track is fixedly arranged on the top wall of the ceramic substrate body.

[0013] A preferred solution is that the heat-conducting shell and the heat-conducting pipe are made of copper.

[0014] The above solution has the following advantages:

[0015] The bottom wall of the ceramic substrate body is provided with a serpentine track groove along the length direction, and the heat-conducting pipe is embedded in the serpentine track groove. The present application has the following advantages: the serpentine shape of the heat-conducting pipe makes the heat more evenly distributed in the pipe, avoiding the phenomenon of local overheating or overcooling, so that the temperature of the entire ceramic substrate body is more uniform. The serpentine heat-conducting pipe can better meet the demand, while the rectangular arrangement of multiple heat-conducting rods may have a large temperature difference between the rods. The heat-conducting oil in the heat-conducting pipe helps heat conduction, further improving the temperature uniformity of the ceramic substrate body. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0017] Figure 1 is a schematic diagram of the three-dimensional structure of the ceramic substrate of the present application;

[0018] Figure 2 is a schematic diagram of the three-dimensional structure of the ceramic substrate of the present application without the heat-conducting pipe;

[0019] Figure 3 is a schematic diagram of the top view structure of the ceramic substrate of the present application.

[0020] EXPLANATION OF REFERENCE NUMERALS

[0021] 10, ceramic substrate body; 11, serpentine track groove; 12, glue-filled rectangular groove; 20, heat-conducting pipe; 30, heat-conducting shell; 40, copper track. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein, and those skilled in the art can make similar generalizations without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below. EMBODIMENT

[0023] As shown in the drawings, Figures 1-3 The present embodiment provides a ceramic substrate, which comprises a ceramic substrate body 10, a heat-conducting pipe 20 and two heat-conducting shells 30. The ceramic substrate body 10 is in the shape of a rectangular body. As shown in the drawings, Figure 2As shown, a serpentine track groove 11 is formed on the bottom wall of the ceramic substrate body 10 along its length direction, such as... Figure 1 As shown, a heat-conducting pipe 20 is embedded within the serpentine track groove 11. Two heat-conducting shells 30 are respectively fixedly mounted on opposite sidewalls of the ceramic substrate body 10, and both ends of the heat-conducting pipe 20 are connected to the two heat-conducting shells 30. Both the heat-conducting shells 30 and the heat-conducting pipes 20 are filled with heat-conducting oil. Both the heat-conducting shells 30 and the heat-conducting pipes 20 are made of copper.

[0024] A serpentine track groove 11 is formed along the length of the bottom wall of the ceramic substrate body 10, and a heat-conducting pipe 20 is embedded in the serpentine track groove 11. The advantages of this new technology compared with the prior art are that the meandering shape of the heat-conducting pipe 20 allows the heat to be distributed more evenly in the pipe, avoiding local overheating or overcooling, thereby making the temperature of the entire ceramic substrate body 10 more uniform. The serpentine heat-conducting pipe 20 can better meet the requirements, while a rectangular arrangement of multiple heat-conducting rods may result in large temperature differences between the rods. The heat-conducting pipe 20 is filled with heat-conducting oil, which helps heat conduction and further improves the temperature uniformity of the ceramic substrate body 10.

[0025] A rectangular groove 12 for potting adhesive is formed on the bottom wall of the ceramic substrate body 10. A serpentine track groove 11 is located within the rectangular groove 12, which is filled with adhesive (not shown). The adhesive is thermally conductive silicone. The thermally conductive silicone aids in heat conduction, further improving the temperature uniformity of the ceramic substrate body 10. The thermally conductive shell 30 is fixedly connected to the side wall of the ceramic substrate body 10 via the thermally conductive silicone. Figure 3 As shown, a copper circuit 40 is fixedly provided on the top wall of the ceramic substrate body 10.

[0026] Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

Claims

1. A ceramic substrate, characterized by, Comprising: A ceramic substrate body (10), a bottom wall of the ceramic substrate body (10) is provided with a serpentine track groove (11) along the length direction thereof, a heat-conducting pipe (20) is attached and embedded in the serpentine track groove (11); Two heat-conducting shells (30) are respectively fixedly arranged on two opposite side walls of the ceramic substrate body (10), and two ends of the heat-conducting pipe (20) are respectively communicated with the two heat-conducting shells (30); Wherein, the heat-conducting shells (30) and the heat-conducting pipe (20) are both filled with heat-conducting oil.

2. The ceramic substrate of claim 1, wherein, A glue-filled rectangular groove (12) is provided on the bottom wall of the ceramic substrate body (10), the serpentine track groove (11) is located in the glue-filled rectangular groove (12), and the glue-filled rectangular groove (12) is filled with glue.

3. The ceramic substrate of claim 2, wherein, The glue is heat-conducting silica gel.

4. The ceramic substrate of claim 1, wherein, The ceramic substrate body (10) is in the shape of a rectangular body.

5. The ceramic substrate of claim 3, wherein, The heat-conducting shells (30) are fixedly connected with the side walls of the ceramic substrate body (10) through the heat-conducting silica gel.

6. The ceramic substrate of claim 3, wherein, A copper circuit (40) is fixedly arranged on the top wall of the ceramic substrate body (10).

7. The ceramic substrate of claim 3, wherein The heat-conducting shells (30) and the heat-conducting pipe (20) are both made of metal copper material.

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