Block-up AB glue for electronic product module manufacturing process

Abstract

The utility model relates to the technical field of pressure-sensitive adhesives, in particular to a heightening AB adhesive for an electronic product module manufacturing process. The upper high-viscosity layer, the lower low-viscosity layer are used for being attached to the surface of a protective material, the viscosity reducing adhesive layer is used for connecting the upper high-viscosity layer and the lower low-viscosity layer, the upper high-viscosity layer comprises a release film protective layer, a high-viscosity adhesive layer and a base material layer, and the lower low-viscosity adhesive layer comprises an adhesive force enhancing bottom coating, a base material layer, a low-viscosity adhesive layer and a release film protective layer; according to the utility model, the high thickness can be achieved during the first use, so as to play a role in heightening protection; meanwhile, a double-layer adhesive structure is provided, after treatment, the middle adhesive layer is subjected to viscosity reduction, the upper layer structure can be peeled off, and the remaining lower low-viscosity layer has the functions of secondary heightening, protection and the like.

Description

TECHNICAL FIELD

[0001] The utility model relates to pressure sensitive adhesive technical field, concretely is a kind of electronic product module process pad high AB glue. BACKGROUND

[0002] With the rapid development of new die-cutting process automation, and the rapid updating of new materials, the size of electronic products is getting smaller and smaller, the weight is getting lighter and lighter, the storage capacity is getting larger and larger, the running speed is getting faster and faster, while the internal structure of product is getting smaller and smaller, the design is getting more and more complex, the process requirement is getting higher and higher.

[0003] Therefore, in the production process of electronic product, protective layer is generally used for protection, for example, the Chinese patent with publication number CN206317500U discloses a silica gel protective film for processing process protection, which comprises a substrate layer, a tensile-resistant puncture-resistant layer, a heat insulation layer, a waterproof layer, a silica gel layer and a release layer; the tensile-resistant puncture-resistant layer is embedded in the substrate layer, and the heat insulation layer is attached to the bottom surface of the substrate layer.

[0004] By setting the tensile-resistant puncture-resistant layer, the product has the characteristics of tensile resistance and puncture resistance, and is not easy to be punctured and stretched by heat, and by setting the heat insulation layer and the waterproof layer, good heat insulation and waterproof effects are achieved, and by setting the silica gel layer, the product has fast exhaust and outstanding adsorption performance, does not delaminate and leave residue after high temperature and high humidity test, meets the selection difficulties of different product surfaces in die-cutting process, and is suitable for various product surfaces.

[0005] However, due to the increasing process requirements of electronic products, the steps are more and more, although the production and processing process is protected by single-layer or double-layer protective film, but after tearing off once, it cannot be used for padding or protection again, so that other components at the same position or peripheral components are easily damaged in subsequent processing process.

[0006] To solve the above problems, the utility model provides an electronic product module process pad high AB glue. UTILITY MODEL CONTENTS

[0007] The utility model discloses a kind of electronic product module process pad high AB glue, can reach higher thickness when first use, play the role of pad high protection;It has double-layer adhesive structure simultaneously, after processing, the middle layer glue layer reduces adhesion, can be stripped upper structure, remaining lower low adhesion layer plays secondary pad high and protection and the like functions.

[0008] To solve the above technical problems, the utility model provides the following technical scheme:

[0009] An electronic product module processing cushion AB glue, comprising an upper high-adhesion layer, a lower low-adhesion layer for being attached to the surface of a protective material and an adhesion-reducing glue layer for connecting the two, which are sequentially attached;

[0010] The lower low-adhesion layer comprises a release film protective layer, a low-adhesion glue layer and a substrate layer.

[0011] The upper high-adhesion layer comprises an adhesion-enhancing primer layer, a substrate layer, a high-adhesion glue layer and a release film protective layer.

[0012] The adhesion-enhancing primer layer is between the adhesion-reducing glue layer and the substrate layer and is used to increase the adhesion of the adhesion-reducing glue layer and the substrate layer.

[0013] The initial adhesion of the adhesion-reducing glue layer is greater than 1000 gf / in, and the adhesion after adhesion reduction is less than 20 gf / in.

[0014] More preferably, the release film protective layer is a PET release film coated with a release adhesive on one side, and the release adhesive includes but is not limited to a silicon release, a non-silicon release or a fluorine release.

[0015] More preferably, the high-adhesion glue layer has an adhesion higher than 100 gf / in, and the glue layer type used includes but is not limited to a silicon glue, an acrylic glue and a silicone rubber, and the thickness is 10-50 um.

[0016] More preferably, the low-adhesion glue layer has an adhesion lower than 20 gf / in, and the glue layer type used includes but is not limited to a silicon glue, an acrylic glue and a silicone rubber, and the thickness is 10-50 um.

[0017] More preferably, the adhesion-reducing method of the adhesion-reducing glue layer includes but is not limited to light irradiation or heating, and the thickness of the adhesion-reducing glue layer is 10-50 um.

[0018] More preferably, the thickness of the adhesion-enhancing primer layer is 200-800 nm.

[0019] More preferably, the adhesion-enhancing primer layer is a coating layer formed by thermal curing of a two-component functional coating agent composed of an acrylic polymer main agent and an isocyanate curing agent.

[0020] More preferably, the substrate layer is a film structure including but not limited to PET, PU, PE or PC.

[0021] Compared with the prior art, the electronic product module processing cushion AB glue has the following beneficial effects:

[0022] (1) The utility model discloses a preparation electronic product module process pad high AB glue from bottom to top is stacked in turn release film protective layer, low viscosity adhesive layer, substrate layer, tack reducing adhesive layer, adhesion enhancement primer layer, substrate layer, high viscosity adhesive layer, release film protective layer, can realize the demand of different thickness pad in process simultaneously.

[0023] (2) The utility model discloses a preparation electronic product module process pad high AB glue from bottom to top is stacked in turn release film protective layer, low viscosity adhesive layer, substrate layer, tack reducing adhesive layer, adhesion enhancement primer layer, substrate layer, high viscosity adhesive layer, release film protective layer, can realize the demand of different thickness pad in process simultaneously.

[0024] (3) The utility model discloses a preparation electronic product module process pad high AB glue from bottom to top is stacked in turn release film protective layer, low viscosity adhesive layer, substrate layer, tack reducing adhesive layer, adhesion enhancement primer layer, substrate layer, high viscosity adhesive layer, release film protective layer, can realize the demand of different thickness pad in process simultaneously.

[0025] (4) The utility model discloses a preparation electronic product module process pad high AB glue from bottom to top is stacked in turn release film protective layer, low viscosity adhesive layer, substrate layer, tack reducing adhesive layer, adhesion enhancement primer layer, substrate layer, high viscosity adhesive layer, release film protective layer, can realize the demand of different thickness pad in process simultaneously. BRIEF DESCRIPTION OF DRAWINGS

[0026] The accompanying drawings are included to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute the limitation to the utility model. In the drawings:

[0027] Figure 1 It is the overall structure schematic diagram of example 1.

[0028] In the drawing, 1, release film protective layer, 2, low viscosity adhesive layer, 3, substrate layer, 4, tack reducing adhesive layer, 5, adhesion enhancement primer layer, 6, high viscosity adhesive layer, 10, lower low viscosity layer, 20, upper high viscosity layer. DETAILED DESCRIPTION

[0029] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of the utility model protection.

[0030] Example 1:

[0031] As Figure 1The utility model provides a kind of electronic product module process pad high AB glue, including 25 μm PET release film protective layer, 10 μm low viscosity adhesive layer, 50 μm PET film, 10 μm UV viscosity reducing adhesive layer, 500nm adhesion enhancement primer, 50 μm PET substrate layer, 15 μm high viscosity adhesive layer and 50 μm release film protective layer from bottom to top sequentially laminated;Low viscosity adhesive layer and high viscosity adhesive layer are all used silicone adhesive layer.

[0032] The preparation method of the electronic product module process pad high AB glue is as follows:

[0033] Step one, sequentially add organic silicon polymer main agent and solvent and matching auxiliary agent into liquid preparation barrel, stir for 20-40min, then stand for 0.5-1h, prepare coating liquid 1 with solid content of 20%;

[0034] Step two, evenly coat 10u dry adhesive to 50u PET surface, dry at 150 DEG C for 3min, obtain low viscosity silicone adhesive layer;

[0035] Step three, paste 25 μm PET release film protective layer to the adhesive surface of step two, obtain low viscosity silicone adhesive semi-finished product;

[0036] Step four, sequentially add organic silicon polymer main agent and solvent and matching auxiliary agent into liquid preparation barrel, stir for 20-40min, then stand for 0.5-1h, prepare coating liquid 2 with solid content of 20%;

[0037] Step five, evenly coat 15u dry adhesive to 50u PET surface of prepared coating liquid 2, dry at 150 DEG C for 3min, obtain high viscosity silicone adhesive layer;

[0038] Step six, paste 50 μm PET release film protective layer to the adhesive surface obtained in step five, obtain high viscosity silicone adhesive semi-finished product;

[0039] Step seven, sequentially add acrylic polymer main agent and isocyanate curing agent and solvent into liquid preparation barrel, stir for 20-40min, then stand for 0.5-1h, prepare coating liquid 3 with solid content of 10-15%;

[0040] Step eight, evenly coat prepared coating liquid 3 to the non-adhesive surface of semi-finished product of step three, dry at 120 DEG C for 3min, obtain adhesion enhancement primer;

[0041] Step nine, sequentially add acrylic polymer main agent and epoxy curing agent, heat-conducting particles, ultraviolet absorber and solvent into liquid preparation barrel, stir for 20-40min, then stand for 0.5-4h, prepare coating liquid 4 with solid content of 25-35%;

[0042] Step ten, evenly coat the prepared coating liquid 4 to the adhesion-enhancing primer surface of step nine, and fully dry at 120-140°C to obtain a UV adhesion-reducing glue layer;

[0043] Step eleven, attach the high-adhesion silicone semi-finished product of step six to the UV adhesion-reducing glue layer obtained in step ten, to obtain the electronic product module processing pad high AB glue finished product.

[0044] Next, the performance of Example 1 is tested, and the testing method is as follows:

[0045] Remove the high-adhesion silicone release film protective layer, and attach 50u PET to prepare a standard sample of 25.4mm*310mm:

[0046] Test one: place the sample in a yellow light standard room temperature environment, attach the sample to a test 316L SUS plate, roll and press with a 2kg roller, and then stand for 20min for testing, and test at a peeling speed of 300mm / min;

[0047] Test two: place the sample under a UV lamp, treat with 90% light intensity UV for 15s, place the sample in a 25°C room temperature environment, attach the sample to a test double-sided adhesive SUS plate, peel off the UV adhesion-reducing glue layer, and test the peeling force at a peeling speed of 300mm / min.

[0048] The test results are shown in Table 1.

[0049] Table 1: Peeling force test results of Example 1

[0050] Item Test 1 (gf / in) Test 2 (gf / in) 1 18.25 12.55 2 20.03 10.37 3 19.65 12.91

[0051] As can be seen from the test results in Table 1, the peeling force of the adhesion-reducing glue layer treated in two ways is below 20gf / in, and the peeling force of the adhesion-reducing glue layer treated by UV irradiation is below 15gf / in, close to 10gf / in. It can be seen that the electronic product module processing pad high AB glue after treatment can completely achieve the peeling of the upper layer structure, and the remaining lower layer low-adhesion layer can achieve the effect of secondary pad height and protection.

[0052] It should be noted that in this document, relational terms such as first and second and the like can only be used to distinguish one entity or action from another entity or action, without necessarily requiring or implying that there is any such actual relationship or order between these entities or actions. Moreover, the terms "comprises", "comprising", or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article, or apparatus that comprises a list of elements does not only include those elements, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0053] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application have been described in detail, for the skilled in the art, it still can be modified, or for the equivalent replacement of part of the technical features of the technical solutions recorded in the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included within the scope of the present application.

Claims

1. An AB adhesive for raising the level in the manufacturing process of electronic product modules, characterized in that: The upper high-adhesion layer (20), the lower low-adhesion layer (10) and the adhesive layer (4) are sequentially attached. The lower low-adhesion layer (10) comprises a release film protective layer (1), a low-adhesion adhesive layer (2) and a substrate layer (3). The upper high-adhesion layer (20) comprises an adhesion-enhancing primer layer (5), a substrate layer (3), a high-adhesion adhesive layer (6) and a release film protective layer (1). The adhesion-enhancing primer layer (5) is between the adhesive layer (4) and the substrate layer (3) to increase the adhesion between the adhesive layer (4) and the substrate layer (3). The initial adhesive force of the adhesive layer (4) is greater than 1000 gf / in, and the adhesive force after the adhesion reduction treatment is less than 20 gf / in.

2. The electronic product module process spacer AB glue according to claim 1, characterized in that: The release film protective layer (1) is a PET release film coated with a silicon release, a non-silicon release or a fluorine release adhesive on one side, and the thickness of the release film protective layer (1) is 15-75 μm.

3. The electronic product module process spacer AB glue according to claim 1, characterized in that: The high-adhesion adhesive layer (6) has an adhesive force greater than 100 gf / in, and is any one of a silicon adhesive, an acrylic adhesive and a silicone rubber, and the thickness of the high-adhesion adhesive layer (6) is 10-50 μm.

4. The electronic product module process spacer AB glue according to claim 1, characterized in that: The low-adhesion adhesive layer (2) has an adhesive force less than 20 gf / in, and is any one of a silicon adhesive, an acrylic adhesive and a silicone rubber, and the thickness of the low-adhesion adhesive layer (2) is 10-50 μm.

5. The electronic product module process spacer AB glue according to claim 1, characterized in that: The adhesion reduction mode of the adhesive layer (4) includes light irradiation or heating, and the thickness of the adhesive layer (4) is 10-50 μm.

6. The AB adhesive for raising the electronic product module manufacturing process according to claim 1, characterized in that: The thickness of the adhesion-enhancing primer layer (5) is 200-800 nm.

7. The electronic product module process spacer AB adhesive of claim 1, wherein: the adhesive is a one-part adhesive. The substrate layer (3) is PET, PU, PE or PC.

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