Probe card

Abstract

The utility model relates to a probe card, which is applied to the field of semiconductors and comprises a limiting unit arranged on a control panel and used for fixing a wafer chip, a mounting rack is arranged on the control panel, and a magnetic field unit used for simulating a magnetic field environment is arranged on the mounting rack. The wafer chip testing device has the advantages that the wafer chip needing to be tested is installed on the limiting unit, a magnetic field is generated through the magnetic field unit, the magnetic field environment is simulated in the testing process, the testing requirement of the wafer chip of an electronic product in the magnetic field environment is met, the steps of testing the wafer chip are simplified, the testing time and cost are greatly saved, and the testing efficiency is improved. And the detection efficiency of the wafer chip is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a probe card. BACKGROUND

[0002] The probe card transmits signals to test the parameters of the wafer chip by connecting the control panel of the test machine and the wafer chip. In the real environment, many electronic products need to be used in a magnetic field environment. The wafer chip also needs to simulate the magnetic field environment during the test process to determine whether the test parameters of the wafer chip meet the requirements.

[0003] Publication No. CN76U discloses a vertical probe card, which comprises a top support frame, a probe card body arranged at the bottom of the top support frame, a rectangular clamping block arranged at each of the four corners of the probe card body, a circular mounting column fixed at the top of the top support frame, four rectangular rotating columns uniformly arranged at the outer side of the inside of the circular mounting column, and a moving mechanism arranged in the inside of the rectangular rotating column for moving the rectangular clamping block; and a limiting mechanism arranged in the inside of the circular mounting column for limiting the rotation of the rectangular rotating column.

[0004] The above probe card is difficult to simulate a magnetic field environment during use, and cannot meet the test requirements of the wafer chip of the electronic product in the magnetic field environment, resulting in low detection efficiency of the wafer chip. SUMMARY

[0005] In order to help solve the problem that the probe card in the related art is difficult to simulate a magnetic field environment, cannot meet the test requirements of the wafer chip of the electronic product in the magnetic field environment, and results in low detection efficiency of the wafer chip, the present application provides a probe card, which adopts the following technical scheme: a limiting unit for fixing a wafer chip is arranged on a control panel, an installation frame is arranged on the control panel, and a magnetic field unit for simulating a magnetic field environment is arranged on the installation frame.

[0006] In a specific implementable scheme, the installation frame comprises a support column arranged on the control panel, a pressing plate is arranged at the end of the support column away from the control panel, and the magnetic field unit is abutted between the pressing plate and the control panel.

[0007] In a specific implementable scheme, the magnetic field unit comprises an electromagnetic ring arranged on the control panel, and the electromagnetic ring is abutted between the pressing plate and the control panel.

[0008] In a specific implementable scheme, a support ring is arranged on the control panel, the electromagnetic ring is located at the inner edge of the support ring and in contact with the support ring, and the end of the support column towards the control panel is arranged on the support ring.

[0009] In a specific implementable scheme, the support column is arranged in a plurality of and arranged in a circumferential array along the support ring.

[0010] In one specific implementation, the pressing plate is provided with a first observation hole, the control panel is provided with a second observation hole, and the axis of the first observation hole, the axis of the electromagnetic ring, the axis of the second observation hole and the limiting unit are on the same straight line in the vertical direction.

[0011] In one specific implementation, the control panel is provided with a mounting hole, a first mounting bolt matched with the mounting hole is arranged in the mounting hole, the support column is provided with a first mounting groove matched with the first mounting bolt on the surface of the control panel, and the first mounting bolt is screwed into the mounting groove through the support ring on the end of the pressing plate.

[0012] In one specific implementation, the mounting hole is provided with a countersunk groove on the hole wall, and the end of the first mounting bolt is located in the countersunk groove.

[0013] In one specific implementation, the pressing plate is provided with a second mounting bolt, the support column is provided with a second mounting groove matched with the second mounting bolt on the surface away from the control panel, and the second mounting bolt is screwed into the second mounting groove on the end of the control panel.

[0014] In one specific implementation, the limiting unit includes a fixing block arranged on the control panel, the fixing block is provided with a plurality of probes, the fixing block is provided with a limiting groove matched with the wafer chip, the wafer chip is arranged in the limiting groove, and the wafer chip is connected to the control panel through the plurality of probes.

[0015] In summary, the application has at least the following beneficial technical effects: the wafer chip to be tested is installed on the limiting unit, a magnetic field is generated by the magnetic field unit, a magnetic field environment is simulated during the test, the test requirements of the wafer chip of the electronic product in the magnetic field environment are met, the steps of testing the wafer chip are simplified, the test time and cost are greatly saved, and the detection efficiency of the wafer chip is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall structure of the embodiment of the application.

[0017] Figure 2 is a schematic diagram of the structure of the fixing block in the embodiment of the application.

[0018] Figure 3 is a schematic diagram of the structure of the second observation hole in the embodiment of the application.

[0019] Reference signs: 1, mounting frame; 2, support column; 3, pressing plate; 4, control panel; 5, electromagnetic ring; 6, support ring; 7, first observation hole; 8, second observation hole; 9, second mounting groove; 10, fixed block; 11, limiting groove. DETAILED DESCRIPTION

[0020] The following description will be made in conjunction with the accompanying drawings. Figures 1-3 The application is further described in detail.

[0021] The application discloses a probe card.

[0022] Referring to Figure 1 , the probe card comprises a limiting unit arranged on the control panel 4 for fixing a wafer chip, the control panel 4 is in communication with an external testing machine, the mounting frame 1 is installed on the control panel 4, and the magnetic field unit for simulating a magnetic field environment is arranged on the mounting frame 1. Therefore, the wafer chip to be tested is installed on the limiting unit, a magnetic field is generated by the magnetic field unit, a magnetic field environment is simulated during the testing process, the testing requirement of the wafer chip of the electronic product in the magnetic field environment is met, the step of testing the wafer chip is simplified, the testing time and cost are greatly saved, and the detection efficiency of the wafer chip is improved.

[0023] Referring to Figure 1 and Figure 2 , the limiting unit comprises the fixed block 10 arranged on the control panel 4, the fixed block 10 is installed on the surface of the control panel 4 away from the mounting frame 1, a plurality of probes are arranged on the fixed block 10, the limiting groove 11 matched with the size of the wafer chip is formed in the fixed block 10, the wafer chip is arranged in the limiting groove 11, and the wafer chip is connected to the welding point of the control panel 4 through the plurality of probes. Therefore, the limiting groove 11 plays a limiting role on the wafer chip, the stability of the wafer chip arranged on the fixed block 10 is improved, the wafer chip is connected to the welding point of the control panel 4 through the plurality of probes, the probes realize the connection between the wafer chip and the channel of the testing machine, the wafer chip is in communication with the control panel 4, and it is convenient to detect the wafer chip by using the testing machine subsequently.

[0024] Referring to Figure 1 and Figure 3The mounting frame 1 comprises a support column 2 arranged on the control panel 4, and the support column 2 is provided with a pressing plate 3 at an end away from the control panel 4. The magnetic field unit comprises an electromagnetic ring 5 arranged on the control panel 4, and the electromagnetic ring 5 is abutted between the pressing plate 3 and the control panel 4. The electromagnetic ring 5 is energized to generate a magnetic field, thereby simulating a magnetic field environment. Therefore, during the wafer chip testing process, the tester will vibrate when running. If the pressing plate 3 is not installed, the electromagnetic ring 5 will be offset in the vibration of the tester, thereby affecting the consistency of the magnetic field environment. Therefore, the pressing plate 3 is used to limit the position of the electromagnetic ring 5, thereby improving the stability of the position of the electromagnetic ring 5 and the consistency of the magnetic field environment, and improving the accuracy of the wafer chip detection.

[0025] With reference to Figure 1 and Figure 3 , the pressing plate 3 is provided with a second mounting bolt, the support column 2 is provided with a second mounting groove 9 matching the size of the second mounting bolt at an end away from the control panel 4, and the second mounting bolt is threadedly connected to the second mounting groove 9 at an end toward the control panel 4. Therefore, the operator can detach the pressing plate 3 from the support column 2 by means of bolt disassembly, thereby achieving detachable pressing plate 3, which is more flexible and facilitates the disassembly and replacement of the electromagnetic ring 5. Different types of electromagnetic rings 5 can be replaced for different chips, thereby improving the application range of the probe card.

[0026] With reference to Figure 1 and Figure 3 , the control panel 4 is provided with a support ring 6, the electromagnetic ring 5 is located at an inner edge of the support ring 6 and in contact with the support ring 6, and the support column 2 is arranged on the support ring 6 at an end toward the control panel 4. The support column 2 limits the position of the electromagnetic ring 5, thereby reducing the possibility of position offset of the electromagnetic ring 5. In the embodiment, the support column 2 is arranged in four and arranged in a circumferential array along the support ring 6, thereby further improving the stability of the mounting frame 1. The control panel 4 may be deformed during high-temperature testing, thereby affecting the contact effect of the probe and the wafer chip and affecting the normal transmission of the signal. In addition, the electromagnetic ring 5 itself has a certain weight. Therefore, the support ring 6 is used to enhance the structural rigidity of the outer edge of the electromagnetic ring 5 on the control panel 4, thereby reducing the possibility of deformation of the control panel 4.

[0027] With reference to Figure 1 and Figure 3 , the pressing plate 3 is provided with a first observation hole 7, and the control panel 4 is provided with a second observation hole 8. The axis of the first observation hole 7, the axis of the electromagnetic ring 5, the axis of the second observation hole 8, and the vertical direction of the limiting unit are located on the same straight line, thereby facilitating the operator to observe the specific situation of the wafer chip on the limiting unit through the first observation hole 7 and the second observation hole 8 from the top of the pressing plate 3.

[0028] With reference to Figure 1 and Figure 3The mounting hole is provided with a first mounting bolt matched with the size of the mounting hole, the surface of the support column 2 facing the control panel 4 is provided with a first mounting slot matched with the size of the first mounting bolt, one end of the first mounting bolt facing the pressing plate 3 is threaded into the mounting slot through the support ring 6, and the mounting hole is provided with a countersunk groove on the hole wall, and the end of the first mounting bolt is located in the countersunk groove, so that the interference between the end of the first mounting bolt and external components is reduced. Therefore, the operator can disassemble the support column 2 and the support ring 6 from the control panel 4 by means of bolt disassembly, and the flexibility is higher.

[0029] In addition, the magnetic field needs to be as close as possible to the measured wafer chip to achieve the best test effect, and in the embodiment of the application, the magnetic field around the wafer chip can be maximized to approach the required value, so that the test parameters are closer to the real situation, and the electromagnetic ring 5 of the required type can be installed and replaced more quickly during the test process, without the need to stop the machine.

[0030] The implementation principle of the embodiment of the application is that the wafer chip to be tested is installed on the fixed block 10, the wafer chip is in conduction with the control panel 4, the electromagnetic ring 5 is powered to generate a magnetic field, the control panel 4 is connected with the tester, the signal is transmitted to test the parameters of the wafer chip, the magnetic field environment is simulated during the test process, the test requirements of the wafer chip of the electronic product in the magnetic field environment are met, the steps of testing the wafer chip are simplified, the test time and cost are greatly saved, and the detection efficiency of the wafer chip is improved.

[0031] The specific embodiment is only an explanation of the application, and is not a limitation of the application, and those skilled in the art can make modifications to the embodiment without creative contribution according to the needs after reading the specification, but as long as the modifications are within the scope of the claims of the application, they are protected by the patent law.

Claims

1. A probe card, characterized by: The application relates to a control panel (4) provided with a limiting unit for fixing a wafer chip, wherein a mounting rack (1) is arranged on the control panel (4), and a magnetic field unit for simulating a magnetic field environment is arranged on the mounting rack (1). The mounting rack (1) comprises support columns (2) arranged on the control panel (4), and a pressing plate (3) is arranged at the end of the support columns (2) away from the control panel (4), and the magnetic field unit is abutted between the pressing plate (3) and the control panel (4). The magnetic field unit comprises an electromagnetic ring (5) arranged on the control panel (4), and the electromagnetic ring (5) is abutted between the pressing plate (3) and the control panel (4).

2. The probe card of claim 1, wherein: A support ring (6) is arranged on the control panel (4), the electromagnetic ring (5) is located at the inner edge of the support ring (6) and is in contact with the support ring (6), and the end of the support column (2) towards the control panel (4) is arranged on the support ring (6).

3. The probe card of claim 2, wherein: The support columns (2) are arranged in a plurality of and are arranged in a circumferential array along the support ring (6).

4. The probe card of claim 3, wherein: First observation holes (7) are arranged on the pressing plate (3), second observation holes (8) are arranged on the control panel (4), the axis of the first observation holes (7), the axis of the electromagnetic ring (5), the axis of the second observation holes (8) and the limiting unit are located on the same straight line in the vertical direction.

5. The probe card of claim 2, wherein: Mounting holes are arranged on the control panel (4), first mounting bolts matched with the mounting holes are arranged in the mounting holes, first mounting grooves matched with the first mounting bolts are arranged on the surface of the support column (2) towards the control panel (4), and the end of the first mounting bolt towards the pressing plate (3) is arranged through the support ring (6) and is threadedly connected in the mounting groove.

6. The probe card of claim 5, wherein: A countersunk groove is arranged on the hole wall of the mounting hole, and the end of the first mounting bolt is located in the countersunk groove.

7. The probe card of claim 1, wherein: Second mounting bolts are arranged on the pressing plate (3), second mounting grooves (9) matched with the second mounting bolts are arranged on the surface of the support column (2) away from the control panel (4), and the end of the second mounting bolt towards the control panel (4) is threadedly connected in the second mounting groove (9).

8. The probe card of claim 1, wherein: The limiting unit comprises a fixing block (10) arranged on the control panel (4), a plurality of probes are arranged on the fixing block (10), a limiting groove (11) matched with the wafer chip is arranged on the fixing block (10), the wafer chip is arranged in the limiting groove (11), and the wafer chip is connected with the control panel (4) through the plurality of probes.

Images