DC-DC converter with high voltage input and large current output

Abstract

The utility model relates to a DC-DC converter with high voltage input and large current output, which supports 540V DC input and two paths of DC 24V and DC 32V respectively 160A DC output, and the design difficulty of the DC-DC converter is the design of a heat dissipation structure of a topological space. Accordingly, the integrated supporting beam frame for connecting the upper layer plate and the lower bottom plate is designed, a main body heat dissipation component of the DC-DC converter is formed, MOS tube heat dissipation fixing holes are formed in the two sides of the supporting beam frame, two circular hollow cavities are formed in the middle of the supporting beam frame, a rectangular communication groove is connected with the circular hollow cavities, and the metal oxide semiconductor (MOS) tube heat dissipation fixing holes are formed in the middle of the supporting beam frame. The two ends of the two circular hollow cavities are communicated through the heat dissipation elbows, cooling liquid is contained in the two circular hollow cavities, the pressurizing pipeline pump is further installed in the center of one heat dissipation elbow, the cooling liquid in the two circular cavities rapidly and circularly flows through the push-pull effect of the pressurizing pipeline pump, and the heat dissipation structure is simple in design scheme and high in cost performance and has quite demonstration significance.

Description

TECHNICAL FIELD

[0001] The present application relates to a high-voltage input, high-current output DC-DC converter, supporting 540V DC input and two 160A DC outputs of DC24V and DC32V, and the continuous working time can exceed 60 minutes; therefore, the design of the high-voltage input, high-current output DC-DC conversion device itself is a great challenge for the heat dissipation space, especially the low-cost heat conduction structure design scheme is more symbolic. BACKGROUND

[0002] The high-voltage input, high-current output DC-DC converter described in the present application refers to a DC-DC conversion device working in high-voltage and high-current conditions, according to the user's demand, the DC input voltage of the device is DC540V, two-way DC (24V and 32V) each output is not less than 160A, and the reliable continuous working time exceeds 60 minutes. Therefore, the DC-DC converter under the condition of large power is quite different from the DC-DC converter under the condition of small power, and the biggest difficulty in design is not how to realize the circuit, because the DC-DC converter is quite mature in circuit implementation, on the contrary, the biggest difficulty in design is how to realize the heat dissipation of the large power MOS device in the effective space with lower cost, and at the same time, the electromagnetic interference and the leakage problem caused by multi-point grounding are also solved.

[0003] Obviously, the DC-DC converter with high-voltage input and large-current output involved in the present application is designed to solve the problems of heat dissipation and leakage under the condition of large-current output. Some people think that the emergence of silicon nitride MOS tube seems to solve the heat dissipation problem of DC-DC converter under the condition of small power output, but it seems that the silicon nitride MOS tube is still powerless to the heat surge brought by the DC-DC converter under the condition of large power output. Accordingly, the present application proposes a set of overall most economical and system optimal design scheme according to the theory of system engineering, and the main framework adopts a support beam structure connecting the upper plate and the lower plate, that is, the support beam is a I-shaped aluminum profile heat sink with upper plate ribs and lower plate ribs, therefore, the whole machine only needs front, rear, left and right aluminum alloy side plates to form a closed body together with the support beam structure connecting the upper plate and the lower plate, the upper and lower ends of the I-shaped aluminum profile are provided with push-pull type embedding grooves which can be inserted into the PCB, and the outermost side is provided with a circular groove with a rectangular opening for inserting and mounting the left and right aluminum alloy side plates with heat dissipation ribs; a plurality of MOS tube heat dissipation fixing holes are formed on both sides of the aluminum profile, and the middle part of the aluminum profile is a two circular hollow cavities, a rectangular communication groove is connected to the circular hollow cavities, one end of the two circular hollow cavities is connected through a heat dissipation elbow, and the other end of the two circular hollow cavities is connected through a heat dissipation elbow with a booster pipeline pump installed in the central part. Through the push-pull action of the booster pipeline pump, the cooling liquid in the two circular cavities starts to circulate, achieving the purpose of heat dissipation. Obviously, the communication groove in the middle part of the circular cavity ensures the rapid upward and downward flow of the cooling liquid, improving the heat dissipation efficiency, and the low-cost heat dissipation structure has a demonstration significance.

[0004] In order to supplement the cooling liquid, the top of the main framework aluminum profile is provided with a cooling liquid supplementing injection hole; in order to meet the needs of reliability and expansion, a four-core CAN FD local bus socket and an equipotential wiring screw are installed on the rear panel of the DC-DC converter, and the equipotential wiring screw is directly connected to the main framework.

[0005] The conventional DC-DC converter only exists as an ordinary information island of electronic equipment, in order to keep pace with the development background of Internet of Things and artificial intelligence, the DC-DC converter with high-voltage input and large-current output is increased with an expansion type CAN FD socket, so as to ensure that the DC-DC converter not only becomes a node of CAN local bus, but also can communicate with upper computer network, and strengthens the technical upgrading of Internet of Things or DeepSeek to the DC-DC converter with high-voltage input and large-current output; obviously, if matched with a large power three-phase rectifier device, this DC-DC converter can also be directly used in the charging pile service station of the community, and the DC-DC converter with high-voltage input and large-current output based on CAN FD local bus interface is lucky to become a standard configuration of an electric vehicle charging pile with expansion intelligence. SUMMARY

[0006] In view of the above, the present application proposes a DC-DC converter with high voltage input and large current output, which has a simple heat dissipation topology structure and cost-effective features, and the specific content is as follows:

[0007] A DC-DC converter with high voltage input and large current output, comprising a front panel, a rear panel, an upper panel, a right side panel, a left side panel, a lower bottom panel, a support beam connecting the upper panel and the lower bottom panel, a heat dissipation elbow A, a heat dissipation elbow B, and a pipeline micro booster pump at the central position of the heat dissipation elbow B, and the key points are as follows:

[0008] The support beam connecting the upper panel and the lower bottom panel is the core component of the DC-DC converter with high voltage input and large current output, which is made of aluminum material, and the upper panel and the lower bottom panel are integrated with the support beam connecting the upper panel and the lower bottom panel, and form the main framework of the DC-DC converter, and are also the main heat dissipation support components of the MOS tube in the DC-DC converter with high voltage input and large current output;

[0009] The upper panel is provided with a push-pull type embedding groove M, and the lower bottom panel is provided with a push-pull type embedding groove N, and during installation, the right side panel and the left side panel are sequentially inserted into the support beam through the push-pull type embedding groove M and the push-pull type embedding groove N;

[0010] The upper panel, the right side panel, the left side panel, and the lower bottom panel are all provided with heat dissipation ribs, wherein the upper panel is provided with fixed mounting holes P at both ends, and the lower bottom panel is provided with fixed mounting holes Q at both ends, and during installation, screws are inserted through the front panel mounting holes on the front panel and then connected with the fixed mounting holes P and the fixed mounting holes Q; similarly, screws are inserted through the rear panel mounting holes on the rear panel and then connected with the fixed mounting holes P and the fixed mounting holes Q, and since the front panel and the rear panel block the stretching displacement path of the right side panel and the left side panel respectively, an integral whole is formed after assembly;

[0011] The support beam connecting the upper panel and the lower bottom panel is provided with a circular hollow cavity C and a circular hollow cavity D respectively, a communication groove is formed between the circular hollow cavity C and the circular hollow cavity D, one end of the circular hollow cavity C and the circular hollow cavity D is connected through the heat dissipation elbow A, and the other end of the circular hollow cavity C and the circular hollow cavity D is connected through the heat dissipation elbow A, and the pipeline micro booster pump is located at the intermediate position of the heat dissipation elbow A, during operation, the circular hollow cavity C and the circular hollow cavity D are filled with cooling liquid, under the pushing of the pipeline micro booster pump, the cooling liquid in the circular hollow cavity C, the circular hollow cavity D, and the communication groove starts to flow, forming an up-and-down cooling liquid flow loop between the circular hollow cavity C, the circular hollow cavity D, and the communication groove, and completing the circulation of the cooling liquid;

[0012] The upper layer plate has a cooling liquid filling hole in the center position, which is aligned with the circular hollow cavity C, and after the filling of the cooling liquid, the filling hole is sealed with a plug to prevent the cooling liquid from overflowing;

[0013] The support beam frame connecting the upper layer plate and the lower bottom plate also has a screw fixing hole for the MOS tube, the PCB board E and the PCB board F are pushed and pulled into the PCB board mounting slot X and the mounting slot Y, then the MOS tube legs are bent and welded on the PCB board E and the PCB board F, then the fixing screw is inserted through the PCB board mounting MOS tube mounting hole on the PCB board E and the PCB board F, and the heat dissipation surface of the MOS tube is fixed on the support beam frame connecting the upper layer plate and the lower bottom plate.

[0014] The rear panel is provided with a four-core CAN FD socket and an equipotential terminal, and the screw of the equipotential terminal is directly connected to the support beam frame connecting the upper layer plate and the lower bottom plate.

[0015] The upper layer plate has an upper layer plate mounting annular fixing hole, and the lower bottom plate has a lower bottom plate mounting annular fixing hole, and the high-voltage input and large-current output DC-DC converter can be fixed on the mounting platform by nuts.

[0016] Further, the support beam frame connecting the upper layer plate and the lower bottom plate is made of aluminum alloy material with excellent heat conduction characteristics, and is one-time stretch formed and treated by metal anodic oxidation, but the both ends of the support beam frame connecting the upper layer plate and the lower bottom plate are treated by wire cutting shaping.

[0017] Further, the cooling liquid filled through the cooling liquid filling hole is a kind of ethylene glycol antifreeze with strong water absorption, colorless, slightly sweet and can significantly reduce the freezing point.

[0018] Further, the rear panel is provided with a CAN FD socket, which is an extended CAN interface supporting 64-bit data byte communication, so that the high-voltage input and large-current output DC-DC converter can be connected to the upper computer to meet the development needs of artificial intelligence, and the DC-DC converter can also become an information node based on the CAN FD local area network system.

[0019] Further, the front panel has a direct current two-core input socket, a DC32V output socket area and a DC24V output socket area, and the output socket is a large positive and negative separated single core structure to support large current output.

[0020] Further, the equipotential terminal provided on the back panel allows multiple DC power supply devices to be connected through the equipotential terminal and then grounded at a single point, thereby completely eliminating the influence of the potential difference caused by the loop current leakage due to the multi-point grounding. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings described below are only some of the embodiments of the present application, and those skilled in the art can easily obtain other similar drawings according to these drawings without creative labor.

[0022] Figure 1 High-voltage input and large-current output DC-DC converter front view Figure One ;

[0023] Figure 2 High-voltage input and large-current output DC-DC converter back view Figure Two ;

[0024] Figure 3 High-voltage input and large-current output DC-DC converter front view Figure Three ;

[0025] Figure 4 High-voltage input and large-current output DC-DC converter back view Figure Four ;

[0026] Figure 5 Aluminum alloy main skeleton internal view after removing PCB Figure One ;

[0027] Figure 6 Aluminum alloy main skeleton internal view after removing PCB Figure Two ;

[0028] Figure 7 Aluminum alloy main skeleton internal view after removing PCB Figure Three ;

[0029] Figure 8 Aluminum alloy main skeleton internal view after removing PCB Figure Four ;

[0030] Figure 9 Aluminum alloy main skeleton internal view after removing PCB Figure Five ;

[0031] Figure 10 Aluminum alloy main skeleton internal view after removing PCB Figure Six ;

[0032] Figure 11 Internal view of the aluminum alloy main skeleton after removing the PCB board Figure Seven ;

[0033] Figure 12 Internal view of the aluminum alloy main skeleton after removing the PCB board Figure Eight ;

[0034] Figure 13 Internal view of the aluminum alloy main skeleton after adding double PCB boards Figure One ;

[0035] Figure 14 Internal view of the aluminum alloy main skeleton after adding double PCB boards Figure Two ;

[0036] Figure 15 Internal view of the aluminum alloy main skeleton after adding double PCB boards Figure Three ;

[0037] Figure 16 Internal view of the aluminum alloy main skeleton after adding double PCB boards Figure Four ;

[0038] Figure 17 Internal view and sectional view of the aluminum alloy main skeleton.

[0039] 1 Front panel

[0040] 1-1 Front panel mounting hole

[0041] 1-2 DC two-core input socket

[0042] 1-3 32V DC output socket area

[0043] 1-4 24V DC output socket area

[0044] 2 Rear panel

[0045] 2-1 Rear panel mounting hole

[0046] 2-2 CAN FD socket

[0047] 2-3 Isolated terminal

[0048] 3 Upper layer plate

[0049] 3-1 Upper layer plate mounting ring-shaped fixing hole

[0050] 3-2 Cooling liquid filling hole

[0051] 3-3 PCB board mounting slot X

[0052] 3-4 Push-pull slot M

[0053] 3-5 fixed mounting hole P

[0054] 4 right side plate

[0055] 5 left side plate

[0056] 6 lower bottom plate

[0057] 6-1 lower bottom plate mounting ring fixed hole

[0058] 6-3 PCB board mounting slot Y

[0059] 6-4 push-pull slot N

[0060] 6-5 fixed mounting hole Q

[0061] 7 support beam frame connecting upper plate and lower bottom plate

[0062] 7-1 heat dissipation elbow A

[0063] 7-2 heat dissipation elbow B

[0064] 7-3 pipeline micro booster pump

[0065] 7-5 circular hollow cavity C

[0066] 7-6 circular hollow cavity D

[0067] 7-7 connecting groove

[0068] 8-1 PCB board E

[0069] 8-2 PCB board F

[0070] 8-3 MOS tube

[0071] 8-4 PCB board mounting MOS tube mounting hole

[0072] 9 injection hole sealing plug DETAILED DESCRIPTION

[0073] The specific embodiments of the present application will be described below in conjunction with the accompanying drawings. It should be noted that, for simplicity, all mounting screws are omitted in the views.

[0074] A DC-DC converter with high voltage input and large current output comprises a front panel (1), a rear panel (2), an upper plate (3), a right side plate (4), a left side plate (5), a lower bottom plate (6), a support beam frame (7) connecting the upper plate and the lower bottom plate, a heat dissipation elbow A (7-1), a heat dissipation elbow B (7-2), and a pipeline micro booster pump (7-3) at the central position of the heat dissipation elbow B (7-2), and the key points are:

[0075] The support beam frame (7) connecting the upper layer plate and the lower bottom plate is a core component of the DC-DC converter with high voltage input and large current output, is made of aluminum profile, and is integrated with the upper layer plate (3) and the lower bottom plate (6) and the support beam frame (7) connecting the upper layer plate and the lower bottom plate, and forms the main framework of the DC-DC converter and is the main heat dissipation support component of the MOS tube in the DC-DC converter with high voltage input and large current output;

[0076] The upper layer plate (3) is provided with a push-pull embedding groove M (3-4), the lower bottom plate (6) is provided with a push-pull embedding groove N (6-4), and the right side plate (4) and the left side plate (5) are sequentially inserted into the support beam frame (7) through the push-pull embedding groove M (3-4) and the push-pull embedding groove N (6-4) during installation;

[0077] The upper layer plate (3), the right side plate (4), the left side plate (5) and the lower bottom plate (6) are all provided with heat dissipation ribs, the upper layer plate (3) is provided with fixed mounting holes P (3-5) at two ends, the lower bottom plate (6) is provided with fixed mounting holes Q (6-5) at two ends, and screws are connected to the fixed mounting holes P (3-5) and the fixed mounting holes Q (6-5) after passing through the front panel mounting holes (1-1) on the front panel (1) during installation; similarly, screws are connected to the fixed mounting holes P (3-5) and the fixed mounting holes Q (6-5) after passing through the rear panel mounting holes (2-1) on the rear panel (2), and the front panel (1) and the rear panel (2) block the stretching displacement paths of the right side plate (4) and the left side plate (5) respectively, so that an integral assembly is formed after assembly;

[0078] The support beam frame (7) connecting the upper layer plate and the lower bottom plate is provided with a circular hollow cavity C (7-5) and a circular hollow cavity D (7-6), a communication groove (7-7) is arranged between the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6), one end of the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) is connected through a heat dissipation elbow A (7-1), the other end of the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) is connected through a heat dissipation elbow A (7-2), and a pipeline micro booster pump (7-3) is arranged at the middle position of the heat dissipation elbow A (7-2), the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) are filled with cooling liquid during work, the cooling liquid in the circular hollow cavity C (7-5), the circular hollow cavity D (7-6) and the communication groove (7-7) starts to flow under the pushing of the pipeline micro booster pump (7-3), so that the circulation of the cooling liquid is completed, and an up-down through cooling liquid flow loop is formed between the circular hollow cavity C (7-5), the circular hollow cavity D (7-6) and the communication groove (7-7);

[0079] The upper layer plate (3) is provided with a cooling liquid filling hole (3-2) at the center position, the cooling liquid filling hole (3-2) is aligned with the circular hollow cavity C (7-5), and after the filling of the cooling liquid, the cooling liquid filling hole (3-2) is tightly plugged with the injection hole sealing plug (9) to prevent the overflow of the cooling liquid;

[0080] The support beam frame (7) connecting the upper layer plate and the lower bottom plate is further provided with a screw fixing hole for the MOS tube, the PCB board E (8-1) and the PCB board F (8-2) are pushed and pulled into the PCB board mounting slot X (3-3) and the mounting slot Y (6-3), then the MOS tube legs are bent and welded on the PCB board E (8-1) and the PCB board F (8-2), and then the fixing screw is respectively inserted through the PCB board mounting MOS tube mounting hole (8-4) on the PCB board E (8-1) and the PCB board F (8-2), and the heat dissipation surface of the MOS tube is fixed on the support beam frame (7) connecting the upper layer plate and the lower bottom plate.

[0081] The rear panel (2) is provided with a four-core CAN FD socket (2-2) and an equipotential terminal (2-3), in order to ensure reliable wiring, the screw of the equipotential terminal (2-3) is directly connected with the support beam frame (7) connecting the upper layer plate and the lower bottom plate.

[0082] The upper layer plate (3) is provided with an upper layer plate mounting annular fixing hole (3-1), and the lower bottom plate (6) is provided with a lower bottom plate mounting annular fixing hole (6-1), and according to the needs, the DC-DC converter with high voltage input and large current output can be fixed on the mounting platform by nuts.

[0083] Further, the support beam frame (7) connecting the upper layer plate and the lower bottom plate is made of aluminum alloy material with excellent heat conduction characteristics, is one-time stretch formed, and is treated by metal anodic oxidation, but the two ends of the support beam frame (7) connecting the upper layer plate and the lower bottom plate are subjected to wire cutting shaping treatment.

[0084] Further, the cooling liquid filled through the cooling liquid filling hole (3-2) is a kind of ethylene glycol antifreeze liquid with strong water absorption, colorless, slightly sweet and can significantly reduce the freezing point.

[0085] Further, the rear panel (2) is provided with a CAN FD socket (2-2), which is an extended CAN interface supporting 64-bit data byte communication, so that the DC-DC converter with high voltage input and large current output can be connected with the upper computer to meet the development needs of artificial intelligence, and the DC-DC converter can also become an information node based on the CAN FD local area network system.

[0086] Further, the front panel (1) has a DC two-core input socket (1-2), a DC 32V output socket area (1-3), and a DC 24V output socket area (1-4). The output sockets are large positive and negative separated single-core structures to support large current output.

[0087] Further, the back panel (2) provides an equipotential terminal (2-3) to allow multiple DC power supply devices to be connected through the equipotential terminal (2-3) and then grounded at a single point, thereby completely eliminating the potential difference caused by multi-point grounding and the resulting loop leakage effect. Advantages

[0088] In summary, the DC-DC converter with high voltage input and large current output has the following significant advantages:

[0089] Firstly, the applicant and inventor of the present application believe that the DC-DC converter has reached maturity in terms of circuit form and there is little room for innovation. Therefore, in the implementation example, no distribution diagram of other devices except MOS tubes is drawn on the PCB board. However, the converter shows great innovation space in the heat dissipation structure, especially the DC-DC converter under large current working conditions, which has a good three-dimensional topological design scheme in the heat dissipation structure. Therefore, the applicant and inventor of the present application actively introduce the concept of I-shaped aluminum profile main skeleton into the topological space of the DC-DC converter with high voltage input and large current output. The support beam connecting the upper plate and the lower plate appears as an I-shaped main skeleton. The whole machine only needs front, back, left and right aluminum alloy side plates and the support beam structure connecting the upper plate and the lower plate to form a closed body. This successfully solves four problems at low cost and high reliability: first, multiple MOS tube heat dissipation fixing holes are opened on both sides of the aluminum profile support beam, thereby solving the uniform design of the heat dissipation structure of the large power MOS device under large current conditions; second, the heat dissipation efficiency of the DC-DC converter is rapidly improved through the design of the circular hollow cavity and communication groove on the main skeleton and the pipeline micro booster pump; third, the two circular hollow cavities and communication grooves on the main skeleton are used as the main structure for storing cooling liquid, which successfully solves the trouble of externally hanging an additional storage tank for cooling liquid; fourth, the support beam connecting the upper plate and the lower plate directly replaces the upper plate and the lower plate, thereby making the whole machine more cost-effective.

[0090] Obviously, the conventional DC-DC converter is not arranged with the CAN node, that is, the conventional DC-DC converter usually only exists as a common information island of the electronic device, and it cannot become an information node of the CAN local bus without the support of hardware; in the application, the extended CAN FD socket is adopted, so that the technology upgrading of the Internet of Things or DeepSeek on the DC-DC converter with high-voltage input and large-current output is strengthened; obviously, if the high-power three-phase rectifier device is matched, the DC-DC converter can be directly used in the charging pile service station of the community, and the DC-DC converter with high-voltage input and large-current output based on the CANFD local bus interface can be upgraded to a standard configuration of an electric vehicle charging pile with extended intelligence.

[0091] In the embodiment, the DC-DC converter with high-voltage input and large-current output utilizes the I-shaped structure of the aluminum profile main skeleton slot structure to realize the PCB circuit board expansion scheme, which is also remarkable because it provides a wide PCB circuit board expansion structure mode, so that it has the physical meaning of compactness, density and mutual connectivity; for example, the MOS tube welded on the DC output side PCB circuit board is backed against the main skeleton of the aluminum profile, which successfully solves the heat dissipation problem under large current; it can be seen that this heat dissipation mode has strong generalization and coverage ability, and the demonstration effect is remarkable.

[0092] In the embodiment, the equipotential wiring scheme of the DC-DC converter with high-voltage input and large-current output completely eliminates the possibility of multi-point grounding of the system and the leakage effect of induced circulating current caused by potential difference after multi-point grounding, and it is meaningful that the equipotential wiring method allows multiple electrical equipment to be connected through the equipotential wiring end and then grounded in a single point, since the equipotential wiring screw is directly connected with the I-shaped structure of the aluminum profile main skeleton, and there is only one single lane to the ground, thereby effectively eliminating the multi-point loop of different electrical equipment to the ground and eliminating the circulating leakage risk caused by multi-point grounding.

[0093] The above is the preferred embodiment of the application, in the specification, the principles and implementation modes of the application are described by using specific embodiments, which are only used to help the engineering technicians in the field to understand the core idea of the application, and should not be misinterpreted as limiting the application. It is understood by those skilled in the art that various changes made in form and detail to the application without departing from the spirit and scope of the application defined in the appended claims, all belong to the protection scope of the application.

Claims

1. A high-voltage input, high-current output DC-DC converter comprising: The front panel (1), the back panel (2), the upper layer panel (3), the right side panel (4), the left side panel (5), the lower bottom panel (6), the support beam frame (7) connecting the upper layer panel and the lower bottom panel, the heat dissipation elbow A (7-1), the heat dissipation elbow B (7-2) and the pipeline micro booster pump (7-3) in the central position of the heat dissipation elbow B (7-2) are composed, and the heat dissipation elbow B (7-2) is characterized by the following: The support beam frame (7) connecting the upper layer panel and the lower bottom panel is the core component of the DC-DC converter with high voltage input and large current output, adopts aluminum material, the upper layer panel (3) and the lower bottom panel (6) are integrated with the support beam frame (7) connecting the upper layer panel and the lower bottom panel, and form the main framework of the DC-DC converter, and are the main heat dissipation support components of the MOS tube in the DC-DC converter with high voltage input and large current output; The upper layer panel (3) is provided with a push-pull type embedding groove M (3-4), and the lower bottom panel (6) is provided with a push-pull type embedding groove N (6-4), when installed, the right side panel (4) and the left side panel (5) are sequentially inserted into the support beam frame (7) through the push-pull type embedding groove M (3-4) and the push-pull type embedding groove N (6-4); The upper layer panel (3), the right side panel (4), the left side panel (5) and the lower bottom panel (6) are all provided with heat dissipation ribs, the upper layer panel (3) is provided with fixed mounting holes P (3-5) at two ends, the lower bottom panel (6) is provided with fixed mounting holes Q (6-5) at two ends, when installed, screws pass through the front panel mounting holes (1-1) on the front panel (1) and are connected with the fixed mounting holes P (3-5) and the fixed mounting holes Q (6-5); similarly, the screws pass through the back panel mounting holes (2-1) on the back panel (2) and are connected with the fixed mounting holes P (3-5) and the fixed mounting holes Q (6-5), since the front panel (1) and the back panel (2) block the tensile displacement paths of the right side panel (4) and the left side panel (5) respectively, a whole is formed after assembly; The support beam frame (7) connecting the upper layer panel and the lower bottom panel is provided with a circular hollow cavity C (7-5) and a circular hollow cavity D (7-6), a communication groove (7-7) is arranged between the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6), one end of the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) is connected through the heat dissipation elbow A (7-1), and the other end of the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) is connected through the heat dissipation elbow B (7-2), the pipeline micro booster pump (7-3) is arranged at the intermediate position of the heat dissipation elbow B (7-2), when working, the circular hollow cavity C (7-5) and the circular hollow cavity D (7-6) are filled with cooling liquid, under the pushing of the pipeline micro booster pump (7-3), the cooling liquid in the circular hollow cavity C (7-5), the circular hollow cavity D (7-6) and the communication groove (7-7) starts to flow, so that the circulation of the cooling liquid is completed, and a loop for the flow of the cooling liquid is formed between the circular hollow cavity C (7-5), the circular hollow cavity D (7-6) and the communication groove (7-7). The upper layer plate (3) is provided with a cooling liquid filling hole (3-2) in the center position, the cooling liquid filling hole (3-2) is aligned with the circular hollow cavity C (7-5), and the cooling liquid filling hole (3-2) is tightly plugged with the injection hole sealing plug (9) after the filling of the cooling liquid, so as to prevent the overflow of the cooling liquid; The support beam frame (7) connecting the upper layer plate and the lower bottom plate is further provided with screw fixing holes for MOS tubes, the PCB board E (8-1) and the PCB board F (8-2) are pushed and pulled into the PCB board mounting slot X (3-3) and the mounting slot Y (6-3), the legs of the MOS tubes are bent and welded on the PCB board E (8-1) and the PCB board F (8-2), then the fixing screws are respectively inserted through the PCB board mounting MOS tube mounting holes (8-4) on the PCB board E (8-1) and the PCB board F (8-2) to fix the heat dissipation surface of the MOS tube on the support beam frame (7) connecting the upper layer plate and the lower bottom plate. The rear panel (2) is provided with a four-core CAN FD socket (2-2) and an equipotential terminal (2-3), in order to ensure reliable wiring, the screw of the equipotential terminal (2-3) is directly connected with the support beam frame (7) connecting the upper layer plate and the lower bottom plate. The upper layer plate (3) is provided with an upper layer plate mounting annular fixing hole (3-1), and the lower bottom plate (6) is provided with a lower bottom plate mounting annular fixing hole (6-1), and the DC-DC converter with high voltage input and large current output can be fixed on the mounting platform by nuts according to needs.

2. The high-voltage input, high-current output DC-DC converter of claim 1, wherein: The support beam frame (7) connecting the upper layer plate and the lower bottom plate is made of aluminum alloy material with excellent heat conduction characteristics, is one-time stretch formed, and is subjected to metal anodic oxidation post-processing, but the two ends of the support beam frame (7) connecting the upper layer plate and the lower bottom plate are subjected to wire cutting shaping processing.

3. The high-voltage input, high-current output DC-DC converter of claim 1, wherein: The cooling liquid filled through the cooling liquid filling hole (3-2) is a kind of ethylene glycol antifreeze liquid with strong water absorption, colorless, slightly sweet and can significantly reduce the freezing point.

4. The high-voltage input, high-current output DC-DC converter of claim 1, wherein: The rear panel (2) is provided with a CAN FD socket (2-2), which is an extended CAN interface supporting 64-bit data byte communication, so that the DC-DC converter with high voltage input and large current output can be connected with an upper computer to meet the development needs of artificial intelligence, and the DC-DC converter can also become an information node based on a CAN FD local area network system.

5. The high-voltage input, high-current output DC-DC converter of claim 1, wherein: The front panel (1) is provided with a direct current two-core input socket (1-2), a DC 32V output socket area (1-3), and a DC 24V output socket area (1-4), the output sockets are large single-core structures with positive and negative separation structures to support large current output.

6. The high-voltage input, high-current output DC-DC converter of claim 1, wherein: The equipotential terminal (2-3) provided on the rear panel (2) allows multiple direct current power supply devices to be connected through the equipotential terminal (2-3) and then grounded at a single point, thereby completely eliminating the influence of potential difference caused by loop current leakage due to multiple grounding points.

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