Paster light source packaging device

Abstract

The utility model belongs to the field of power supplies, and relates to a patch light source packaging device which comprises a support, a bonding pad assembly, a bonding wire and a chip set. The support is used for fixing the bonding pad assembly and the chip set. The bonding pad assembly and the chipset are both fixedly arranged on the support, and the bonding pad assembly is arranged on the support in a coating mode and is electrically connected with the chipset; the bonding pad assembly is used for connecting an external power supply with the chipset to realize input and output of electric energy; and the bonding wire is arranged in the chip set, is welded on an electrode of the chip set, and is used for electrical connection and heat dissipation of the chip set. The light source chips can be tested or used in parallel and can also be used in series, and the application modes are diversified. The rated current and the rated voltage can be adjusted by matching a peripheral circuit according to user requirements, and the voltage can be varied in three modes of low voltage, high voltage and mixed voltage; the circuit can be matched with a wide voltage input stroboscopic-free circuit for application; and the product production yield and application safety can be improved, the material specification can be reduced, and the storage cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of power supply, more particularly to a patch light source packaging device. BACKGROUND

[0002] At present, the common light source packaging structure on the market is basically that the light source manufacturer sets the series and parallel connection mode of the light source chip according to the customer demand, and then performs point gluing and packaging forming. Figure 1 As shown in the figure, this will make the rated current and rated voltage of the light source set as fixed values by the light source manufacturer, which cannot be changed, and the downstream application enterprise needs to design the matching power supply according to the rated current and rated voltage set by the light source manufacturer or re-customize the light source specification from the light source manufacturer.

[0003] (1) If the rated voltage of the light source is too high, the creepage distance between the positive and negative pads is not enough, and during the light source production test, the arc phenomenon between the pads is easy to occur, causing the light source to be short-circuited and unable to be tested, and even the test instrument is damaged.

[0004] (2) The downstream application enterprise cannot adjust the rated current and rated voltage of the light source according to the existing power supply parameters, and can only use the newly developed power supply or light source for matching; the material specification, storage cost, and production time cost of the light source manufacturer and the downstream application enterprise are increased. INVENTION CONTENTS

[0005] In view of the above defects of the prior art, the utility model provides a patch light source packaging device, which comprises:

[0006] a support, a pad assembly, a bonding wire, and a chip set; the support is used for fixing the pad assembly and the chip set; the pad assembly and the chip set are both fixed on the support, and the pad assembly is coated on the support and electrically connected with the chip set; the pad assembly is used for connecting the external power supply with the chip set to realize the input and output of electric energy; the bonding wire is arranged in the chip set and welded on the electrode of the chip set to electrically connect and dissipate heat of the chip set.

[0007] Preferably, the pad assembly is made of copper foil, conductive glue, or solder paste material.

[0008] Preferably, the bonding wire is made of metal material.

[0009] Preferably, the pad assembly comprises a first pad, a second pad, a third pad, a fourth pad, and a fifth pad, and the first pad, the second pad, the third pad, the fourth pad, and the fifth pad are uniformly arranged on the support.

[0010] Preferably, the chip set comprises a first chip set, a second chip set and a third chip set.

[0011] Preferably, the first chip set, the second chip set and the third chip set are all arranged on the support.

[0012] Preferably, the first chip set is connected with the first pad and the third pad respectively.

[0013] Preferably, the second chip set is connected with the second pad and the fourth pad respectively.

[0014] Preferably, the third chip set is connected with the fourth pad.

[0015] Preferably, the device further comprises a wide voltage input strobe-free circuit, which comprises a rectifier filter circuit, a sampling circuit, a control IC and an LED connected electrically.

[0016] The patch light source packaging device has the following beneficial effects: the support, the pad assembly, the bonding wire and the chip set are arranged; the support is used for fixing the pad assembly and the chip set; the pad assembly and the chip set are both fixed on the support, and the pad assembly is coated on the support and electrically connected with the chip set; the pad assembly is used for connecting the external power supply with the chip set, so as to realize the input and output of electric energy; the bonding wire is arranged in the chip set and welded on the electrode of the chip set, and is used for electrical connection and heat dissipation of the chip set; the light source can work in low-voltage, high-voltage and mixed-voltage modes; the light source chip can be tested or used in parallel or in series, and the application mode is various; the wide voltage input strobe-free circuit is arranged, the rated current and the rated voltage can be adjusted, and the voltage can be changed in low-voltage, high-voltage and mixed-voltage modes; the product production yield and application safety can be improved, the material specification can be reduced, and the warehouse cost can be reduced; the device can be widely applied in the field of lighting and the like. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in the drawings without creative labor. The present application will be further described below in combination with the drawings and embodiments. In the drawings:

[0018] Figure 1 is a schematic diagram of a patch light source packaging device in the prior art;

[0019] Figure 2It is the schematic diagram of the patch light source packaging device of the utility model.

[0020] Figure 3 It is the circuit diagram of the wide voltage input no flicker circuit arranged in the patch light source packaging device of the utility model.

[0021] In the figure, 1 is a support, 2 is a first solder pad, 3 is a second solder pad, 4 is a third solder pad, 5 is a fourth solder pad, 6 is a fifth solder pad, 7 is a bonding wire, 8 is a first chip set, 9 is a second chip set, 10 is a third chip set, 11 is a positive electrode pad, 12 is a negative electrode pad, 13 is a chip, 22 is a rectifier filter circuit, 33 is a sampling circuit, 44 is a control IC, and 55 is an LED. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0023] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if the embodiments of the utility model involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art. When the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist and is not within the protection scope required by the utility model.

[0025] Please refer to Figure 2 It is the structural schematic diagram of the patch light source packaging device of the utility model. As shown in Figure 2As shown, in the patch light source packaging device provided by the first embodiment of the utility model, at least comprising, support 1, pad assembly, bonding wire 7, chip group;Support 1 is used for fixing pad assembly and chip group;Pad assembly, chip group are fixedly arranged on support 1, and pad assembly is coated on support 1, and electrical connection is realized with chip group;Pad assembly is used for connecting external power supply with chip group, realizes the input and output of electric energy;Bonding wire 7 is arranged in chip group, is welded on the electrode of chip group, and is used for electrical connection and the heat dissipation of chip group.

[0026] Support 1 is the basic structure of the patch light source packaging device of the utility model, it not only bears the whole light source assembly, also bears the important task of heat dissipation.Specific implementation, support 1 can be made of high thermal conductivity metal material, for example, copper or aluminum, to ensure that the heat generated by chip group can be promptly dissipated to the environment when working, avoid the performance decline caused by heat accumulation even damage.

[0027] Support 1 can be set as the metal substrate of specific shape such as rectangle and size in this embodiment, and the chip group is directly fixed on the support 1 by packaging process such as eutectic welding, conductive glue sticking, etc.At the same time, the mounting position of the pad assembly is reserved on the support 1, so as to facilitate the subsequent connection and packaging.

[0028] Support 1 has the bearing effect, by stably fixing the key components such as chip group, pad assembly, ensure the stability and reliability of the whole light source packaging structure.

[0029] Support 1 also has the heat dissipation effect, by the efficient heat conduction path, the heat generated by chip group is rapidly conducted to the external environment, and the working temperature of chip group is kept within a reasonable range.

[0030] The pad assembly is the electrical connection part in the patch light source packaging device of the utility model.In specific implementation, the pad assembly can be made of copper foil, conductive glue or solder paste material, which has good conductivity and stability.

[0031] The pad assembly forms a one-to-one corresponding connection relationship with the chip group on the support 1 through wiring design.In the packaging process, the pad assembly is pre-coated on the support 1, and then electrical connection can be realized with the chip group by welding or sticking, etc.The pad assemblies are connected to each other through wires or circuit boards, etc., forming a complete electrical circuit.

[0032] The pad assembly has the function of electrical connection, providing the electrical connection path between the chip group and the external power supply, ensuring that the current can flow smoothly.

[0033] The pad assembly also has the function of signal transmission, and the pad assembly is also responsible for transmitting control signals to realize the adjustment of light source brightness, color temperature and other parameters.

[0034] In specific implementation, the pad assembly is provided with a plurality of pads, including the first pad 2, the second pad 3, the third pad 4, the fourth pad 5 and the fifth pad 6 in the embodiment, which are evenly arranged on the bracket 1.

[0035] The bonding wire 7 is a micro connection element in the patch light source packaging device of the utility model, which is mainly used for realizing electrical connection between each unit in the chip set. In specific implementation, the bonding wire 7 is made of high-purity metal materials such as gold and aluminum, and has excellent electrical conductivity and mechanical strength.

[0036] The connection process of the bonding wire 7 is usually carried out by automatic equipment, and the metal wire is welded on the electrode of the chip set by ultrasonic welding or hot pressure welding. This connection method has the characteristics of high precision and strong reliability, and can ensure the stability and durability of the electrical connection in the chip set.

[0037] The bonding wire 7 has the function of electrical connection, and in the chip set, each unit (such as light-emitting diode, driving circuit, etc.) needs to realize electrical connection through the bonding wire 7 to ensure the transmission of signals and the circulation of current.

[0038] The bonding wire 7 also has the function of heat conduction, although the main function of the bonding wire 7 is electrical connection, but it also participates in the conduction of heat to some extent, which is helpful for the heat dissipation of the chip set.

[0039] The chip set includes a plurality of light-emitting diodes (LEDs), which are the key to realize light energy output. The design, manufacture and packaging process of the chip set directly determine the performance and life of the light source. The chip set realizes electrical connection with external power supply and internal units through the pad assembly and the bonding wire 7. In the packaging process, the chip set is first fixed on the bracket 1, and then forms a complete electrical circuit with other components through the pad assembly and the bonding wire 7.

[0040] In some optional implementation manners, the chip set includes a first chip set 8, a second chip set 9 and a third chip set 10. The first chip set 8, the second chip set 9 and the third chip set 10 are arranged on the bracket 1. The first chip set 8 is connected with the first pad 2 and the third pad 4 respectively. The second chip set 9 is connected with the second pad 3 and the fourth pad 5 respectively. The third chip set 10 is connected with the fourth pad 5.

[0041] The chip set has the function of light energy output, and the LED in the chip set is the main light-emitting element of the light source, which realizes the output of light energy through the input of electrical energy. Different color and different brightness of LED combination can produce rich and colorful light effect.

[0042] The chip set also has the function of voltage conversion, and a voltage conversion circuit is integrated in the chip set, which can adjust the size and shape of the input voltage as needed to adapt to the needs of different application scenarios.

[0043] In specific implementation, as shown in the drawings, Figure 3 The wide voltage input flicker-free circuit includes a rectifier filter circuit 22, a sampling circuit 33, a control IC 44, and an LED 55 connected electrically.

[0044] The rectifier filter circuit 22 includes one end of a fuse FR1 connected with a pin 1 of an adjustable resistor RV1 and a pin AC1 of a rectifier bridge BD1, a pin 2 of the adjustable resistor RV1 connected with a pin AC2 of the rectifier bridge BD1, a pin of the rectifier bridge BD1 grounded, a pin + of the rectifier bridge BD1 connected with a positive electrode of a diode D0, a negative electrode of the diode D0 connected with a positive electrode of a capacitor EC1 and one end of a resistor R1, and a negative electrode of the capacitor EC1 connected with the other end of the resistor R1.

[0045] The rectifier filter circuit 22 is a front-end part of the wide voltage input flicker-free circuit, mainly responsible for converting the input alternating current into stable direct current and reducing output fluctuation. The rectifier circuit converts the alternating signal into a direct current signal through the adjustable resistor RV1, and the filter circuit removes the ripple component in the direct current signal through the rectifier bridge BD1, so that the output signal is more smooth and stable. This step is crucial for the subsequent circuit work, because it provides a stable power supply environment and reduces the influence of voltage fluctuation on the light emission of the LED 55.

[0046] The sampling circuit 33 includes a resistor R3, a resistor R4, and a resistor R5, one end of the resistor R3 connected with one end of the resistor R4 and grounded, and the other end of the resistor R3 connected with the other end of the resistor R4.

[0047] The sampling circuit 33 is responsible for capturing key parameters such as voltage and current in the wide voltage input flicker-free circuit. It converts these analog signals into digital signals through accurate conversion and processing, providing reliable data support for the subsequent control IC 44. The accuracy of the sampling circuit 33 directly affects the judgment and control effect of the control IC 44 on the circuit state, so its design precision and stability are crucial.

[0048] The control IC 44 includes but is not limited to any one of STM32F10C8T6, PIC16F877A, and ESP8266. In this embodiment, the control IC 44 is selected as STM32F10C8T6.

[0049] The control IC 44 is the core component of the whole circuit, which controls the working state and function realization of the device according to the data provided by the sampling circuit 33 through logical operation and data storage, etc. In the wide voltage input non-flicker circuit, the control IC 44 can automatically adjust the working state of the circuit according to the change of the input voltage, so as to ensure that the LED 55 can stably emit light under various voltage conditions, and the flicker phenomenon does not occur.

[0050] In the embodiment, the other end of the resistor R3 and the other end of the resistor R4 are connected with the pin 6 of the control IC, and one end of the resistor R5 is connected with the pin 8 of the control IC.

[0051] The LED is the load part of the circuit, which converts electrical energy into light energy to realize the lighting function. In the wide voltage input non-flicker circuit, the luminance and stability of the LED are significantly improved, which benefits from the stable power supply environment provided by the rectifier filter circuit and the precise control of the control IC.

[0052] In the patch light source packaging device, the working principle of the light source is:

[0053] The working state of the light source can be divided into three test / working states of low voltage, high voltage and mixed voltage, as shown in the drawing. Figure 3 Figure 3 The utility model discloses a patch light source packaging device schematic diagram, first chip group, second chip group voltage all are V1, third chip group voltage is V2.

[0054] Low voltage state: the first pad and the second pad are the positive pole of the light source, and the third pad and the fourth pad are the negative pole of the light source, and the working state is that the first chip group and the second chip group are lit, the working voltage of the light source V=V1, and the light source can be used for testing or being matched with a low-voltage power supply scheme, so that arc phenomenon between the pads is avoided, the light source is short-circuited and cannot be tested, and even the testing instrument is damaged.

[0055] High voltage state: the first pad is the positive pole of the light source, the second pad and the third pad need to be connected through the external substrate circuit, and the fourth pad is the negative pole of the light source, and the working voltage of the light source V=2V1, and the light source can be matched with a conventional high-voltage linear power supply scheme.

[0056] Mixed voltage state (with Figure 3 ​The first pad is connected with the positive pole of the light source and the positive pole of the capacitor EC1 in the wide voltage input no strobe circuit, the second pad and the third pad are connected through the external substrate circuit, the fourth pad is connected with the D2 pin of the power management chip U1, and the fifth pad is connected with the D3 pin of the power management chip U1; when the D2 pin of the power management chip U1 works and the D3 pin of the power management chip U1 is cut off, the first chip set and the second chip set work, the third chip set does not work, and the working voltage V of the light source is 2V1; when the D3 pin of the power management chip U1 works and the D2 pin of the power management chip U1 is cut off, all the chip sets work, and the working voltage V of the light source is 2V1+V2.

[0057] The utility model discloses a design through above embodiment, its beneficial effect is: through setting up support, pad assembly, bonding wire, chip set, support is used for fixing pad assembly and chip set, pad assembly, chip set all are fixed to be located on the support, and pad assembly is coated to be located on the support, realizes electrical connection with chip set, pad assembly is used for connecting external power supply and chip set, realizes the input and output of electric energy, bonding wire is located in chip set, and is welded on the electrode of chip set, is used for electrical connection and the heat dissipation of chip set, make light source can work in low pressure, high pressure and mixed pressure three modes, this light source chip can be parallel and can be used in series, and the application mode is various, also can according to user demand and match peripheral circuit adjustment rated current, rated voltage, voltage exists low pressure, high pressure, mixed pressure three modes variable, can with wide voltage input no strobe circuit and match application, can improve product production yield and application safety, can reduce material specification, reduce warehousing cost, can be generally applicable to the field such as illumination.

[0058] The utility model discloses a design through above embodiment, its beneficial effect is: through setting up support, pad assembly, bonding wire, chip set, support is used for fixing pad assembly and chip set, pad assembly, chip set all are fixed to be located on the support, and pad assembly is coated to be located on the support, realizes electrical connection with chip set, pad assembly is used for connecting external power supply and chip set, realizes the input and output of electric energy, bonding wire is located in chip set, and is welded on the electrode of chip set, is used for electrical connection and the heat dissipation of chip set, make light source can work in low pressure, high pressure and mixed pressure three modes, this light source chip can be parallel and can be used in series, and the application mode is various, also can according to user demand and match peripheral circuit adjustment rated current, rated voltage, voltage exists low pressure, high pressure, mixed pressure three modes variable, can with wide voltage input no strobe circuit and match application, can improve product production yield and application safety, can reduce material specification, reduce warehousing cost, can be generally applicable to the field such as illumination.

[0058] The utility model discloses a design through above embodiment, its beneficial effect is: through setting up support, pad assembly, bonding wire, chip set, support is used for fixing pad assembly and chip set, pad assembly, chip set all are fixed to be located on the support, and pad assembly is coated to be located on the support, realizes electrical connection with chip set, pad assembly is used for connecting external power supply and chip set, realizes the input and output of electric energy, bonding wire is located in chip set, and is welded on the electrode of chip set, is used for electrical connection and the heat dissipation of chip set, make light source can work in low pressure, high pressure and mixed pressure three modes, this light source chip can be parallel and can be used in series, and the application mode is various, also can according to user demand and match peripheral circuit adjustment rated current, rated voltage, voltage exists low pressure, high pressure, mixed pressure three modes variable, can with wide voltage input no strobe circuit and match application, can improve product production yield and application safety, can reduce material specification, reduce warehousing cost, can be generally applicable to the field such as illumination.

Claims

1. A patch light source package apparatus, characterized by, It includes: Support, pad assembly, bonding wire, chip set; The support is used for fixing the pad assembly and the chip set; the pad assembly and the chip set are fixed on the support, the pad assembly is coated on the support and is electrically connected with the chip set; the pad assembly is used for connecting an external power supply with the chip set to realize input and output of electric energy; the bonding wire is arranged in the chip set and is welded on an electrode of the chip set to realize electrical connection and heat dissipation of the chip set; The pad assembly includes a first pad, a second pad, a third pad, a fourth pad and a fifth pad, and the first pad, the second pad, the third pad, the fourth pad and the fifth pad are uniformly arranged on the support; the chip set includes a first chip set, a second chip set and a third chip set; the first chip set, the second chip set and the third chip set are arranged on the support; the first chip set is connected with the first pad and the third pad respectively; the second chip set is connected with the second pad and the fourth pad respectively; and the third chip set is connected with the fourth pad.

2. The patch light source package apparatus according to claim 1, wherein, The pad assembly is made of copper foil, conductive glue or solder paste material.

3. The patch light source package apparatus of claim 1, wherein, The bonding wire is made of metal material.

4. The surface-mounted light source package device according to any one of claims 1 to 3, wherein It also includes a wide voltage input strobe-free circuit, which includes a rectifier filter circuit, a sampling circuit, a control IC and an LED connected by electricity.

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