Silicon wafer cleaning and degumming device

Abstract

The utility model discloses a silicon wafer cleaning and degumming device, which comprises a spraying pool, a first degumming pool and a second degumming pool, the spraying pool is cuboid, a spraying pipe is arranged in the spraying pool, and the spraying pipe extends along a second direction; the degumming pool and the spraying pool are arranged side by side in the first direction; the cleaning pool and the degumming pool are arranged on one side, far away from the spraying pool, of the degumming pool side by side in the first direction; the flower basket moving assembly comprises a cross beam and a vertical beam, the cross beam extends in the first direction, the vertical beam extends in the third direction, the cross beam is arranged on the upper sides of the spraying pool, the degumming pool and the cleaning pool, and the vertical beam is arranged on the cross beam; the silicon wafer flower basket is extracted, put down and moved through the flower basket moving assembly, switching of the silicon wafer flower basket among the spraying pool, the degumming pool and the cleaning pool is achieved, manual participation is not needed in the whole process, a large amount of manpower is saved, and efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer separation technology, and in particular to a silicon wafer cleaning and degumming device. Background Technology

[0002] During the production of silicon wafers, after the silicon rod is cut, the silicon rod and the top support need to be debonded to facilitate the separation of the silicon wafer from the top support. However, the silicon wafer basket and the top support are relatively heavy, making the handling during the separation process quite troublesome. Therefore, a silicon wafer cleaning and debonding device is provided. Utility Model Content

[0003] To overcome the above-mentioned shortcomings, the purpose of this utility model is to provide a silicon wafer cleaning and degumming device. By using a basket moving component to pick up, put down and move the silicon wafer basket, the device can switch between the spray tank, the degumming tank and the cleaning tank. The whole process does not require manual intervention, saving a lot of manpower and is highly efficient.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a silicon wafer cleaning and degumming device, comprising:

[0005] A spray tank, wherein a spray pipe is provided inside the spray tank and the spray pipe extends along a second direction;

[0006] A degumming tank, wherein the degumming tank and the spray tank are arranged side by side along a first direction;

[0007] A cleaning tank, wherein the cleaning tank and the degumming tank are arranged side by side along a first direction on the side of the degumming tank away from the spray tank;

[0008] The flower basket moving assembly includes a horizontal beam and a vertical beam. The horizontal beam extends along a first direction, and the vertical beam extends along a third direction. The horizontal beam is disposed on the upper side of the spray tank, the degumming tank, and the washing tank, and the vertical beam is disposed on the horizontal beam.

[0009] In this technical solution, the spray tank uses spray pipes to clean the cut silicon wafer baskets and wash away the silicon sludge generated during cutting. The degumming tank is used to separate the silicon wafers from the top support, making it easier to remove the silicon wafers. The cleaning tank is used to clean the liquid residue left after the silicon wafers are degummed from the degumming tank. The basket moving assembly uses horizontal and vertical beams to lift and move the silicon wafer baskets. The vertical beam is used to lift the silicon wafers for testing and move them along a third direction, thereby lifting the silicon wafer baskets from the spray tank, degumming tank, and cleaning tank, or placing the silicon wafer baskets into the spray tank, degumming tank, and cleaning tank for appropriate processing. The horizontal beam is used to move the vertical beam, thereby switching the silicon wafer baskets sequentially in the spray tank, degumming tank, and cleaning tank. By using the basket moving assembly to lift, lower, and move the silicon wafer baskets, the switching of the silicon wafer baskets between the spray tank, degumming tank, and cleaning tank is realized. The entire process requires no manual intervention, saving a lot of manpower and is highly efficient.

[0010] In some embodiments, the basket moving assembly further includes a lateral movement drive assembly, through which the vertical beam is mounted on the horizontal beam.

[0011] In this technical solution, the transverse drive component is used to drive the vertical beam to move along the length of the transverse beam.

[0012] In some embodiments, the lateral drive assembly includes a first drive gear that moves along a first axial direction, one side of the crossbeam is serrated along its length, and the first drive gear is engaged with the crossbeam.

[0013] In this technical solution, the first drive gear is used to drive the transverse drive assembly to move along the length direction of the crossbeam. The first drive gear engages with the serrated side of the crossbeam. When the first drive gear rotates, it will cause the drive gear to move along the length direction of the crossbeam.

[0014] In some embodiments, the lateral drive assembly further includes a first drive device connected to the first drive gear.

[0015] In this technical solution, the first driving device is used to drive the first gear, so that the first gear moves along the length of the crossbeam, thereby moving the vertical beam and thus moving the silicon wafer basket upward in the first direction.

[0016] In some embodiments, the flower basket moving assembly further includes a vertical movement drive assembly, wherein the vertical beam is mounted on the horizontal movement drive assembly via the vertical movement drive assembly.

[0017] In this technical solution, the vertical movement drive component is used to drive the vertical beam to move along its length, thereby achieving the effect of picking up and putting down the silicon wafer basket.

[0018] In some embodiments, the vertical movement drive assembly includes a second drive gear that moves along a second axial direction, one side of the vertical beam is serrated along its length, the second drive gear is engaged with the vertical beam, the vertical beam is disposed on both sides of the horizontal beam, and the serrated side of the vertical beam faces the same side.

[0019] In this technical solution, the second drive gear is used to drive the vertical beam to move along its length. The serrated side of the vertical beam is used to engage with the second drive gear, thereby causing the second drive gear to rotate and drive the vertical beam to move. A vertical beam is set on each side of the horizontal beam, which helps to make the silicon wafer basket more stable during the movement of the vertical beam and prevents the silicon wafers in the silicon wafer basket from spilling out.

[0020] In some embodiments, the vertical movement drive assembly further includes a second drive device connected to the second drive gear, the second drive gear being disposed on both sides of the second drive device.

[0021] In this technical solution, the second drive device is used to drive the second drive gear, thereby using the second drive gear to drive the vertical beam to move.

[0022] In some embodiments, the vertical movement drive assembly further includes a track, one end of which is fixed to the lateral movement drive assembly, and the other end of which is fixed to the vertical beam, the vertical beam being slidably connected to the track along its length.

[0023] In this technical solution, the tracks are used to prevent the vertical beam from moving too much and falling off, and at the same time, they are used to assist the movement of the vertical beam and cushion its movement.

[0024] In some embodiments, the spray tank further includes a spray pipe driving device, wherein the spray pipe is provided with a plurality of spray holes, and the spray pipe driving device is disposed at both ends of the spray pipe.

[0025] In this technical solution, the spray holes are used to spray water from the spray pipe to clean the silicon wafer basket, and the spray pipe drive device is used to rotate the spray pipe so that the water sprayed from the spray pipe covers a wider area of ​​the silicon wafer basket, thereby making the cleaning more thorough.

[0026] In some embodiments, a heating device is provided inside the degumming tank.

[0027] In this technical solution, the heating device is used to heat the liquid in the tray pool, thereby accelerating the debonding process of the silicon wafer.

[0028] The beneficial effect of this utility model is that by using the basket moving component to pick up, put down and move the silicon wafer basket, the silicon wafer basket can be switched between the spray tank, degumming tank and cleaning tank. The whole process does not require manual intervention, saving a lot of manpower and is highly efficient. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer cleaning and degumming device according to an embodiment of the present invention;

[0030] Figure 2 This is a schematic diagram of a spray tank, a degumming tank, and a cleaning tank according to an embodiment of the present invention;

[0031] Figure 3 This is a front view schematic diagram of a flower basket moving component according to an embodiment of the present utility model;

[0032] Figure 4 This is a side view schematic diagram of a flower basket moving component according to an embodiment of the present utility model;

[0033] Figure 5 This is a schematic diagram of the overall structure of a flower basket moving component according to an embodiment of the present invention;

[0034] In the diagram: 1. Spray tank; 11. Spray pipe; 2. Degumming tank; 21. First degumming tank; 22. Second degumming tank; 3. Washing tank; 4. Flower basket moving assembly; 41. Crossbeam; 42. Vertical beam; 431. First drive gear; 432. First drive device; 441. Second drive gear; 442. Second drive device; 443. Track; x, first direction; y, second direction; z, third direction; α, first axial direction; β, second axial direction. Detailed Implementation

[0035] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.

[0036] Combined with appendix Figure 1 and attached Figure 2 As shown, this utility model provides a silicon wafer cleaning and degumming device, comprising:

[0037] Spray pool 1, the spray pool 1 is cuboid, and a spray pipe 11 is provided inside the spray pool 1, the spray pipe 11 extends along the second direction y;

[0038] Degumming tank 2, which is arranged side by side with spray tank 1 along the first direction x, includes a first degumming tank 21 and a second degumming tank 22. The first degumming tank 21 and the second degumming tank 22 are arranged side by side. When the first degumming tank 21 is already in operation, the silicon wafer basket can be put into the second degumming tank 22 for degumming treatment, thereby interfering with and improving the working efficiency of the silicon wafer cleaning and degumming device.

[0039] The cleaning tank 3 is arranged side by side with the degumming tank 2 along the first direction x on the side of the degumming tank 2 away from the spray tank 1;

[0040] The flower basket moving assembly 4 includes a horizontal beam 41 and a vertical beam 42. The horizontal beam 41 extends along a first direction x, and the vertical beam 42 extends along a third direction z. The horizontal beam 41 is disposed on the upper side of the spray tank 1, the degumming tank 2, and the washing tank 3, and the vertical beam 42 is disposed on the horizontal beam 41.

[0041] Spray tank 1 uses spray pipes 11 to clean the cut silicon wafer basket and wash away the silicon sludge generated during cutting. Degumming tank 2 is used to separate the silicon wafer from the top support, making it easier to remove the silicon wafer. Cleaning tank 3 is used to clean the liquid residue left after the silicon wafer is degummed from degumming tank 2. The basket moving assembly 4 uses a horizontal beam 41 and a vertical beam 42 to lift and move the silicon wafer basket. The vertical beam 42 is used to lift the silicon wafer for testing and move it along the third direction z, thereby moving the silicon wafer basket from spray tank 1, degumming tank 2, and cleaning tank 3. The silicon wafers are extracted from the pool 3, or placed in the spray pool 1, degumming pool 2, and cleaning pool 3 for appropriate processing. The crossbeam 41 is used to move the vertical beam 42, thereby switching the silicon wafers in the spray pool 1, degumming pool 2, and cleaning pool 3 in sequence. By using the basket moving component 4 to extract, place, and move the silicon wafers, the switching of the silicon wafers between the spray pool 1, degumming pool 2, and cleaning pool 3 is realized. The whole process does not require manual intervention, saving a lot of manpower and is highly efficient.

[0042] Continue to combine with the appendix Figure 3 To be continued Figure 5 As shown, in some embodiments, the flower basket moving assembly 4 further includes a lateral movement drive assembly, wherein the vertical beam 42 is disposed on the horizontal beam 41 via the lateral movement drive assembly, and the lateral movement drive assembly is used to drive the vertical beam 42 to move along the length direction of the horizontal beam 41.

[0043] Continue to combine with the appendix Figure 3 To be continued Figure 5As shown, in some embodiments, the lateral movement drive assembly includes a first drive gear 431, which moves along a first axial direction α. ​​One side of the crossbeam 41 is serrated along its length direction. The first drive gear 431 is engaged with the crossbeam 41. The first drive gear 431 is used to drive the lateral movement drive assembly to move along the length direction of the crossbeam 41. The first drive gear 431 is engaged with the serrated side of the crossbeam 41. When the first drive gear 431 rotates, it will cause the drive gear to move along the length direction of the crossbeam 41.

[0044] Continue to combine with the appendix Figure 3 To be continued Figure 5 As shown, in some embodiments, the transverse drive assembly further includes a first drive device 432, which is connected to the first drive gear 431. The first drive device 432 is used to drive the first gear, causing the first gear to move along the length direction of the crossbeam 41, thereby achieving the effect of moving the vertical beam 42, and thus moving the silicon wafer basket in the first direction x.

[0045] Continue to combine with the appendix Figure 3 To be continued Figure 5 As shown, in some embodiments, the flower basket moving assembly 4 further includes a vertical movement driving assembly. The vertical beam 42 is disposed on the horizontal movement driving assembly via the vertical movement driving assembly. The vertical movement driving assembly is used to drive the vertical beam 42 to move along its length direction, thereby achieving the effect of extracting and placing the silicon wafer flower basket.

[0046] Continue to combine with the appendix Figure 3 To be continued Figure 5 As shown, in some embodiments, the vertical drive assembly includes a second drive gear 441, which moves along a second axial direction β. One side of the vertical beam 42 is serrated along its length. The second drive gear 441 is engaged with the vertical beam 42. The vertical beam 42 is disposed on both sides of the horizontal beam 41, with the serrated side of the vertical beam 42 facing the same side. The second drive gear 441 is used to drive the vertical beam 42 to move along its length. The serrated side of the vertical beam 42 is used to engage with the second drive gear 441, thereby causing the second drive gear 441 to rotate and drive the vertical beam 42 to move. The arrangement of a vertical beam 42 on each side of the horizontal beam 41 helps to make the silicon wafer basket more stable during the movement of the vertical beam 42 and prevents the silicon wafers in the silicon wafer basket from spilling out.

[0047] Continue to combine with the appendix Figure 3 To be continued Figure 5As shown, in some embodiments, the vertical movement drive assembly further includes a second drive device 442, which is connected to the second drive gear 441. The second drive gear 441 is disposed on both sides of the second drive device 442, and the second drive device 442 is used to drive the second drive gear 441, thereby using the second drive gear 441 to drive the vertical beam 42 to move.

[0048] Continue to combine with the appendix Figure 3 To be continued Figure 5 As shown, in some embodiments, the vertical movement drive assembly further includes a track 443, one end of which is fixed to the horizontal movement drive assembly, and the other end of which is fixed to the vertical beam. The vertical beam is slidably connected to the track 443 along its length. The track 443 is used to prevent the vertical beam 42 from moving too much and falling off, and at the same time, it is used to assist the movement of the vertical beam 42 and buffer the movement of the vertical beam 42.

[0049] In some embodiments, the spray tank 1 further includes a spray pipe 11 driving device. The spray pipe 11 is provided with a plurality of spray holes. The spray pipe 11 driving device is disposed at both ends of the spray pipe 11. The spray holes are used to spray water out of the spray pipe 11 to clean the silicon wafer basket. The spray pipe 11 driving device is used to rotate the spray pipe 11 so that the water sprayed out of the spray pipe 11 covers a wider area of ​​the silicon wafer basket, thereby making the cleaning more thorough.

[0050] In some embodiments, the debonding tank 2 is equipped with a heating device for heating the liquid in the tray tank, thereby accelerating the debonding process of the silicon wafer.

[0051] In summary, this utility model provides a silicon wafer cleaning and degumming device. By utilizing a basket-moving component to extract, place, and move the silicon wafer basket, the device enables the switching of the silicon wafer basket between the spray tank, degumming tank, and cleaning tank. The entire process requires no manual intervention, saving a significant amount of manpower and achieving high efficiency.

[0052] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A device for cleaning and degumming a silicon wafer, characterized by comprising: The application relates to a flower basket cleaning device. The device comprises a spraying pool, a degumming pool and a cleaning pool. The spraying pool is provided with a spraying pipe extending along a second direction. The degumming pool is provided beside the spraying pool along a first direction. The cleaning pool is provided beside the degumming pool along the first direction and away from the spraying pool.

2. The device according to claim 1, wherein The device further comprises a flower basket moving assembly.

3. The apparatus according to claim 2, wherein the apparatus further comprises a cleaning device. The moving assembly comprises a horizontal beam extending along the first direction and a vertical beam extending along a third direction.

4. The apparatus according to claim 3, wherein the apparatus further comprises a cleaning device. The horizontal beam is arranged above the spraying pool, the degumming pool and the cleaning pool.

5. The apparatus for cleaning and debonding a silicon wafer of claim 2, wherein, The vertical beam is arranged on the horizontal beam through a horizontal moving driving assembly.

6. The apparatus for cleaning and debonding a silicon wafer according to claim 5, wherein The horizontal moving driving assembly comprises a first driving gear moving along a first axial direction.

7. The apparatus according to claim 6, wherein the apparatus further comprises a cleaning device. One side of the horizontal beam is serrated along the length direction.

8. The apparatus according to claim 7, wherein the apparatus further comprises a cleaning device. The first driving gear is arranged in engagement with the horizontal beam.

9. The apparatus for cleaning and debonding a silicon wafer of claim 1, wherein, The horizontal moving driving assembly further comprises a first driving device connected with the first driving gear.

10. The apparatus for cleaning and debonding a silicon wafer of claim 1, wherein, The device further comprises a vertical moving driving assembly. The vertical moving driving assembly comprises a second driving gear moving along a second axial direction. One side of the vertical beam is serrated along the length direction. The second driving gear is arranged in engagement with the vertical beam. The vertical beam is arranged on both sides of the horizontal beam. The serrated side of the vertical beam faces the same side. The vertical moving driving assembly further comprises a second driving device connected with the second driving gear. The second driving gear is arranged on both sides of the second driving device. The vertical moving driving assembly further comprises a track. One end of the track is fixed to the horizontal moving driving assembly. The other end of the track is fixed to the vertical beam. The vertical beam is slidably connected with the track along the length direction. The spraying pool further comprises a spraying pipe driving device. The spraying pipe is provided with a plurality of spraying holes. The spraying pipe driving device is arranged on both ends of the spraying pipe. The degumming pool is provided with a heating device.

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