Semiconductor laser engraving device

Abstract

The utility model relates to the technical field of laser engraving equipment, in particular to a semiconductor laser engraving device which comprises a base, a light path converter is fixed at one end of the base, a first reflecting mirror and a second reflecting mirror are detachably connected and installed at the two ends of the light path converter respectively, and a semiconductor laser light source is fixed on the base. A linear driving assembly is fixed to the base, a sliding seat is installed on the linear driving assembly in a sliding mode, a third reflecting mirror is detachably connected and fixed to the sliding seat, and a laser cutting head is detachably connected and installed to the sliding seat. The laser generator has the advantages that the laser generator is divided into a plurality of independent accessories such as the semiconductor laser light source, the first reflecting mirror and the second reflecting mirror, the position of the semiconductor laser light source can be adjusted under the condition that the installation angles of the first reflecting mirror and the second reflecting mirror are guaranteed, installation is more flexible, and the heat dissipation effect is good; due to the split type design, accessories can be replaced conveniently.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser engraving equipment technical field especially is concerned with a kind of semiconductor laser engraving device. BACKGROUND

[0002] Laser engraving is an advanced equipment using laser to engrave the material needing to be engraved.Because laser engraving machine is higher than traditional handwork's engraving precision, engraving speed is also more fast, and engraving effect is very delicate.Therefore the application of laser engraving machine has gradually replaced traditional engraving equipment and mode.

[0003] The Chinese patent with application number 202323109093.5 discloses a kind of laser engraving equipment, it is related to laser engraving equipment technical field, including rack, mobile mechanism is equipped on the rack, liftable cutting head is equipped on the mobile mechanism, laser generation part is equipped on the either end of the rack;First refracting part is equipped on the mobile mechanism, the emission end of the laser generation part is towards the first refracting part, for the laser generated by laser generation part is irradiated on first refracting part;Focusing mirror is equipped on the cutting head top, the focusing mirror is located below the first refracting part, for the laser that first refracting part refracts is aggregated to the end of cutting head and is emitted.

[0004] The laser generation part in the above patent is integrally designed, the light emitting position of laser is fixed, and the installation is poor in adaptation, and the heat dissipation effect of integral structure is poor. UTILITY MODEL CONTENT

[0005] The utility model just to solve the above problem and propose a kind of semiconductor laser engraving device.

[0006] The technical scheme of the utility model is realized as follows:

[0007] The utility model provides a semiconductor laser engraving device, including the base, one end of base is fixed with optical path converter, two ends of optical path converter are through detachable connection installs first mirror and second mirror respectively, the included angle between first mirror, second mirror is ninety degrees, the both ends of optical path converter are formed with the light inlet hole and the light outlet hole corresponding with the first mirror, second mirror position, light inlet hole and light outlet hole are perpendicular, the base is fixed with semiconductor laser light source on the light inlet hole position of optical path converter, the laser of semiconductor laser light source is between forty -five degrees angle with first mirror, the base is fixed with linear drive assembly, the sliding seat is installed on linear drive assembly and slides, third mirror is fixed through detachable connection on the sliding seat, third mirror corresponds with second mirror position, laser cutting head is installed through detachable connection on the sliding seat, laser cutting head is located below third mirror, the focusing mirror is fixed on the inside upper end of laser cutting head, the height of laser cutting head is adjustable.

[0008] Further, the semiconductor laser light source is fixed with a fan away from the optical path converter.

[0009] Further, a protective laser beam sleeve is installed between the semiconductor laser light source and the optical path converter.

[0010] Further, the optical path converter is fixed on the base through detachable connection, the light inlet hole and the light outlet hole on the optical path converter are parallel, and the laser beam emitted by the semiconductor laser light source is reflected by the first mirror and the second mirror and then reflected horizontally onto the third mirror.

[0011] Further, an air pipe connection joint is fixed on the side wall of the laser cutting head.

[0012] Further, the linear drive assembly includes a fixed vertical plate fixed vertically on the base, a linear slide rail slidably connected with the sliding seat is fixed on one side of the fixed vertical plate, a closed transmission belt and a stepping motor driving the closed transmission belt to rotate are fixed on the side wall of the fixed vertical plate, and the sliding seat and the closed transmission belt are fixed together.

[0013] Further, a drag chain is fixed on the base, and the drag chain is connected with the sliding seat through a connecting frame fixed on the side wall of the sliding seat.

[0014] The beneficial effects of the utility model are that the laser generator is divided into a semiconductor laser light source, a first reflector, a second reflector and multiple independent accessories, the position of the semiconductor laser light source can be adjusted under the condition that the installation angle of the first reflector and the second reflector is ensured, the installation is more flexible and the heat dissipation effect is good; the split design facilitates replacement of the accessories; the laser generator is separated from the laser cutting head, and the cutting speed and stability can be improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0016] Figure 1 It is the first perspective view of the utility model;

[0017] Figure 2 It is the second perspective view of the utility model;

[0018] Figure 3 It is the front view of the utility model;

[0019] Figure 4 It is the top view of the utility model.

[0020] The following explains the reference signs:

[0021] 1, semiconductor laser light source;2, optical path converter;3, first reflector;4, second reflector;5, sliding seat;6, linear drive assembly;61, linear slide rail;62, fixed vertical plate;63, stepping motor;64, closed transmission belt;65, connecting frame;66, tow chain;7, third reflector;8, laser cutting head;9, air pipe connecting joint;10, fan;11, base. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model, obviously, the described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0023] As Figures 1-4As shown, a semiconductor laser engraving device, including a base 11, one end of the base 11 is fixed with a light path converter 2, the light path converter 2 is respectively connected with a first mirror 3 and a second mirror 4 through detachable connection at both ends, the included angle between the first mirror 3 and the second mirror 4 is ninety degrees, the light path converter 2 is formed with a light inlet hole and a light outlet hole corresponding to the positions of the first mirror 3 and the second mirror 4 at both ends, the light inlet hole and the light outlet hole are perpendicular, the laser beam can be changed by 180° after two reflections, the light path converter 2 can protect the light beam and reduce energy loss, the base 11 is fixed with a semiconductor laser light source 1 near the light inlet hole of the light path converter 2, which is used to generate laser, the laser generated by the semiconductor laser light source 1 and the first mirror 3 form an angle of forty-five degrees, the base 11 is fixed with a linear drive assembly 6, the linear drive assembly 6 is slidably connected with a sliding seat 5, the sliding seat 5 is fixed with a third mirror 7 through detachable connection, the third mirror 7 corresponds to the position of the second mirror 4, the sliding seat 5 is connected with a laser cutting head 8 through detachable connection, the laser cutting head 8 can be moved to realize cutting through the linear drive assembly 6, the laser cutting head 8 is located below the third mirror 7, a focusing mirror is fixed inside the laser cutting head 8, which is used for focusing, the height of the laser cutting head 8 can be adjusted to adjust the height of the focusing mirror, and the size of the light beam after focusing is adjusted.

[0024] In this embodiment, the semiconductor laser light source 1 is fixed with a fan 10 away from the light path converter 2, which is convenient for heat dissipation of the semiconductor laser light source 1.

[0025] In this embodiment, a sleeve for protecting the laser beam is installed between the semiconductor laser light source 1 and the light path converter 2, which avoids the interference of external environment on the laser beam generated by the semiconductor laser light source 1 and reduces energy loss.

[0026] In this embodiment, the light path converter 2 is fixed on the base 11 through detachable connection, the light inlet hole and the light outlet hole on the light path converter 2 are parallel, and the laser beam emitted by the semiconductor laser light source 1 is reflected to the third mirror 7 horizontally after being reflected by the first mirror 3 and the second mirror 4.

[0027] In this embodiment, the laser cutting head 8 is fixed with an air pipe connection joint 9 on the side wall, which is convenient for connecting the gas supply device to provide a carbon dioxide protector to ensure the cutting effect.

[0028] In the embodiment, the linear driving assembly 6 comprises a fixed vertical plate 62 fixed on the base 11, one side of the fixed vertical plate 62 is fixed with a linear slide rail 61 in sliding fit connection with the sliding seat 5, the side wall of the fixed vertical plate 62 is fixed with a closed conveying belt 64 and a stepping motor 63 for driving the closed conveying belt 64 to rotate, the sliding seat 5 is fixed with the closed conveying belt 64, and the sliding seat 5 is driven to translate on the linear slide rail 61 by the closed conveying belt 64 rotating under the driving of the stepping motor 63.

[0029] In the embodiment, in order to improve the stability of the sliding seat 5 when translating, the base 11 is fixed with a drag chain 66, and the drag chain 66 is connected with the sliding seat 5 through a connecting frame 65 fixed on the side wall of the sliding seat 5.

[0030] The working principle of the utility model is as follows: when using, the laser beam generated by the semiconductor laser light source 1 is shot into the light path converter 2, and after being reflected by the first reflecting mirror 3 and the second reflecting mirror 4, the light path is changed by 180 degrees, then the laser beam shot from the light emitting hole is horizontally shot on the third reflecting mirror 7, and after being reflected, the laser beam is turned by 90 degrees, finally, the laser beam is shot into the focusing mirror inside the laser cutting head 8, the focusing mirror focuses the laser spot again, the energy is gathered to form the laser beam, and the laser beam is shot out from the laser cutting head 8 to cut the material below the base 11.

[0031] The circuit connection related in the utility model is a common means adopted by the person skilled in the art, and can be obtained by limited tests, and belongs to the prior art widely used.

[0032] The components not described in detail in the present application are the prior art.

[0033] The above only describes the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A semiconductor laser engraving device comprising a base (11), characterized in that: The base (11) is fixed with a light path converter (2) at one end, the light path converter (2) is respectively fixed with a first mirror (3) and a second mirror (4) through detachable connection at both ends, the included angle between the first mirror (3) and the second mirror (4) is ninety degrees, the light path converter (2) is formed with a light inlet hole and a light outlet hole corresponding to the positions of the first mirror (3) and the second mirror (4) at both ends, the light inlet hole and the light outlet hole are perpendicular, the base (11) is fixed with a semiconductor laser light source (1) near the light inlet hole position of the light path converter (2), the laser generated by the semiconductor laser light source (1) forms an angle of forty-five degrees with the first mirror (3), the base (11) is fixed with a linear drive assembly (6), the linear drive assembly (6) is slidably installed with a sliding seat (5), the sliding seat (5) is fixed with a third mirror (7) through detachable connection, the third mirror (7) corresponds to the position of the second mirror (4), the sliding seat (5) is installed with a laser cutting head (8) through detachable connection, the laser cutting head (8) is located below the third mirror (7), the laser cutting head (8) is fixed with a focusing mirror at the upper end inside.

2. A semiconductor laser engraving apparatus according to claim 1, characterized in that: The height of the laser cutting head (8) can be adjusted.

3. A semiconductor laser engraving apparatus according to claim 1, wherein: The semiconductor laser light source (1) is fixed with a fan (10) at the end away from the light path converter (2).

4. A semiconductor laser engraving apparatus according to claim 1, wherein: A sleeve for protecting laser beam is installed between the semiconductor laser light source (1) and the light path converter (2).

5. A semiconductor laser engraving apparatus as defined in claim 1, wherein: The light path converter (2) is fixed on the base (11) through detachable connection, the light inlet hole and the light outlet hole on the light path converter (2) are parallel, the laser beam emitted by the semiconductor laser light source (1) is reflected by the first mirror (3) and the second mirror (4) and then reflected horizontally to the third mirror (7).

6. A semiconductor laser engraving apparatus as defined in claim 1, wherein: The laser cutting head (8) is fixed with an air pipe connecting joint (9) on the side wall.

7. A semiconductor laser engraving apparatus as defined in claim 1, wherein: The linear drive assembly (6) includes a fixed vertical plate (62) fixed vertically on the base (11), the fixed vertical plate (62) is fixed with a linear slide rail (61) slidably connected with the sliding seat (5) on one side, the fixed vertical plate (62) is fixed with a closed transmission belt (64) and a stepping motor (63) driving the closed transmission belt (64) to rotate on the side wall, the sliding seat (5) and the closed transmission belt (64) are fixed together.

8. A semiconductor laser engraving apparatus as defined in claim 7, characterized in that: The base (11) is fixed with a drag chain (66), the drag chain (66) is connected with the sliding seat (5) through a connecting frame (65) fixed on the side wall of the sliding seat (5).

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