Automatic quartz wafer polishing device

Abstract

The utility model relates to an automatic quartz wafer polishing device which comprises a working table, vertically-arranged stand columns are arranged at the four corners of the upper portion of the working table, transverse plates are arranged between the stand columns, a groove is formed in the end, close to the stand column on the left side, of the working table, and a plurality of electric rolling shafts are distributed in the groove front and back. A wafer body driven by the electric rolling shaft to move is placed on the electric rolling shaft, a grinding assembly for clamping and grinding the wafer body is arranged at the end, close to the right stand column, of the workbench, the electric rolling shaft and the grinding assembly are arranged among the four stand columns, and a taking assembly for sucking and moving the wafer body is arranged on the transverse plate. According to the wafer body polishing device, wafer bodies are sequentially conveyed to the side close to the polishing assembly through the electric rolling shaft, the wafer bodies are placed in the polishing assembly through the moving assembly and the taking assembly to be rapidly polished and finally taken out, and automation and efficiency are higher.

Description

Technical Field

[0001] This utility model belongs to the field of quartz wafer technology, specifically relating to an automated quartz wafer polishing device. Background Technology

[0002] Quartz crystal is an important electronic material. Quartz crystal wafers cut along a certain direction not only have piezoelectric effect, but also have excellent mechanical, electrical and temperature characteristics. Resonators, oscillators and filters designed and made with it have outstanding advantages in frequency stabilization and frequency selection. In the wafer processing, polishing is an important step.

[0003] In the process of developing this application, the inventors discovered that the technology has at least the following problems: In the prior art, when a wafer grinding equipment finishes grinding a group of wafers, it is necessary to manually place the next group of wafers at the grinding point, which results in low grinding efficiency; therefore, further improvements can be made. Utility Model Content

[0004] In view of the problem in the prior art where the wafer grinding equipment requires manual placement of the next set of wafers after grinding a set of wafers, resulting in low grinding efficiency, this application provides an automated quartz wafer grinding device. This utility model uses an electric roller to sequentially transport the wafer body to a side close to the grinding component. The moving component and the picking component place the wafer body into the grinding component for rapid grinding, and finally remove it, resulting in higher automation and efficiency.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows:

[0006] An automated quartz wafer polishing device includes a worktable with vertically arranged columns at the four corners above the worktable. A horizontal plate is provided between the columns. A groove is provided at the end of the worktable near the left column, and multiple electric rollers are distributed back and forth in the groove. A wafer body is placed on the electric roller and moved by it. A polishing component is provided at the end of the worktable near the right column to clamp and polish the wafer body. The electric rollers and the polishing component are both arranged between the four columns. A picking component is provided on the horizontal plate to pick up and move the wafer body. A moving component is provided inside the horizontal plate to drive the picking component to move laterally.

[0007] Furthermore, the polishing assembly includes two slide rails arranged symmetrically on the worktable, with a space between the two slide rails. A clamping plate that moves along the slide rail is placed on the slide rail. The clamping plate is in an arc shape with the same center as the wafer body. A polishing blade is provided on the side of the clamping plate facing the wafer body.

[0008] Furthermore, the polishing assembly also includes a first drive motor disposed on the worktable, the first drive motor being disposed toward the clamping plate and driving the clamping plate to move toward the wafer body, and a first moving rod being disposed on the side of the first drive motor facing the clamping plate.

[0009] Furthermore, the picking component includes a movable stage disposed below the horizontal plate, a downward-through rotating groove provided at the bottom center of the movable stage, a rotating stage placed in the rotating groove, a first rotating motor for driving the rotating stage to rotate provided at the top center of the movable stage, and multiple vacuum suction cups for picking up the wafer body provided below the rotating stage.

[0010] Furthermore, at least two second drive motors are provided above the horizontal plate, symmetrically distributed around the center of the moving platform, and a second moving rod is provided below the horizontal plate, which is driven by the second drive motors to move up and down. The bottom of the second moving rod is connected to the top of the moving platform.

[0011] Furthermore, the moving component includes a second rotating motor disposed on one side of the horizontal plate, a lead screw driven to rotate by the second rotating motor is disposed inside the horizontal plate, and limiting rods corresponding to the lead screw are disposed on both the front and rear sides of the lead screw, a moving plate is disposed on the lead screw, and both sides of the moving plate are sleeved on the limiting rods, and the second driving motor is disposed on the moving plate.

[0012] The beneficial effects of this utility model are:

[0013] 1. First, place the wafer body on the electric rollers one by one. Each electric roller is equipped with a drive unit to rotate it. Each electric roller moves the wafer body toward the polishing component, which is more automated and more efficient.

[0014] 2. After the wafer body is placed between the two clamping plates, the first drive motor pushes the first moving rod to move the clamping plates toward the outer wall of the wafer body until the grinding blade touches the outer wall of the wafer body and grinds it. This process is more automated and more efficient.

[0015] 3. When the wafer body approaches the polishing assembly, the second rotary motor is started, driving the lead screw to rotate. The lead screw drives the moving plate to move until the moving plate is aligned above the wafer body. Then, the second drive motor is started, driving the moving stage downward until the vacuum chuck approaches the wafer body and picks it up. The device has an internal drive unit (not shown) to drive the vacuum chuck. After picking up the wafer body, it is placed above the polishing assembly and then moved between the two side clamps. After the polishing blade contacts the outer wall of the wafer body, the first rotary motor starts, driving the wafer body to rotate, which facilitates rapid polishing of the outer circumference of the wafer body, resulting in higher automation and efficiency. Attached Figure Description

[0016] The foregoing and other objects, features and advantages of this invention will become apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0017] Figure 1 This is a front view structural diagram of the present invention;

[0018] Figure 2 This is a top view of the structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the mobile component of this utility model.

[0020] The components include: 1. Workbench; 2. Column; 3. Horizontal plate; 4. Groove; 5. Electric roller; 6. Wafer body; 7. Grinding assembly; 701. Slide rail; 702. Clamping plate; 703. Grinding blade; 704. First drive motor; 705. First moving rod; 8. Picking assembly; 801. Moving table; 802. Rotating groove; 803. Rotating table; 804. First rotating motor; 805. Vacuum suction cup; 806. Second drive motor; 807. Second moving rod; 9. Moving assembly; 901. Second rotating motor; 902. Lead screw; 903. Limiting rod; 904. Moving plate. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings.

[0022] Example 1, referring to Figure 1-2 This utility model includes a workbench 1, with vertically arranged columns 2 at the four corners of the workbench 1. A horizontal plate 3 is arranged between the columns 2. A groove 4 is provided at one end of the workbench 1 near the left column 2. Multiple electric rollers 5 are distributed in the groove 4. A wafer body 6 is placed on the electric roller 5 and moved by it. The wafer body 6 is placed on the electric roller 5 in sequence. Each electric roller 5 is equipped with a drive component to drive it to rotate. Each electric roller 5 drives the wafer body 6 to move towards the polishing component 7, which is more automated and more efficient.

[0023] Reference Figure 1-2The worktable 1 has a polishing assembly 7 near the right column 2 for clamping and polishing the wafer body 6. Both the electric roller and the polishing assembly 7 are positioned between the four columns 2. The polishing assembly 7 includes two slide rails 701 symmetrically distributed on the worktable 1, with space between them. A clamping plate 702, moving along the slide rails 701, is placed on each slide rail 701. The clamping plate 702 is arc-shaped with the wafer body 6 concentric with it. A polishing blade 703 is positioned on the side of the clamping plate 702 facing the wafer body 6. The grinding assembly 7 also includes a first drive motor 704 mounted on the worktable 1. The first drive motor 704 is positioned toward the clamping plate 702 and drives the clamping plate 702 to move toward the wafer body 6. A first moving rod 705 is provided on the side of the first drive motor 704 facing the clamping plate 702. When the wafer body 6 is placed between the two clamping plates 702, the first drive motor 704 pushes the first moving rod 705 to move the clamping plate 702 toward the outer wall of the wafer body 6 until the grinding blade 703 touches the outer wall of the wafer body 6 to grind it. This results in higher automation and higher efficiency.

[0024] Reference Figure 3 The horizontal plate 3 is equipped with a moving component 9 that drives the picking component 8 to move laterally. The moving component 9 includes a second rotating motor 901 set on one side of the horizontal plate 3. The horizontal plate 3 is equipped with a lead screw 902 driven to rotate by the second rotating motor 901. The lead screw 902 is equipped with limiting rods 903 on both the front and rear sides. The lead screw 902 is equipped with a moving plate 904. Both sides of the moving plate 904 are sleeved on the limiting rods 903. The second drive motor 806 is set on the moving plate 904.

[0025] Reference Figure 1-2 The horizontal plate 3 is provided with a picking component 8 for picking up and moving the wafer body 6. The picking component 8 includes a moving stage 801 located below the horizontal plate 3. The center of the bottom of the moving stage 801 is provided with a downward-through rotating groove 802. The rotating stage 803 is placed in the rotating groove 802. The center of the top of the moving stage 801 is provided with a first rotating motor 804 that drives the rotating stage 803 to rotate. Below the rotating stage 803 are multiple vacuum suction cups 805 for picking up the wafer body 6. Above the horizontal plate 3 are two second drive motors 806 symmetrically distributed around the center of the moving stage 801. Below the horizontal plate 3 are two second moving rods 807 that are driven up and down by the second drive motors 806. The bottom of the second moving rods 807 is connected to the top of the moving stage 801.

[0026] When the wafer body 6 approaches the polishing assembly 7, the second rotary motor 901 is started, driving the lead screw 902 to rotate. The lead screw 902 drives the moving plate 904 to move until the moving plate 904 is aligned above the wafer body 6. Then, the second drive motor 806 is started, driving the moving stage 801 to move downwards until the vacuum chuck 805 approaches the wafer body 6 and picks it up. The device has a drive device (not shown) that drives the vacuum chuck 805. After picking up the wafer body 6, it is placed above the polishing assembly 7 and then moved between the two clamping plates 702. After the polishing blade 703 contacts the outer wall of the wafer body 6, the first rotary motor 804 starts, driving the wafer body 6 to rotate, which facilitates rapid polishing of the outer peripheral surface of the wafer body 6, resulting in higher automation and efficiency.

[0027] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0028] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0029] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications or equivalent changes made to the above embodiments based on the technical essence of the present utility model shall fall within the protection scope of the present utility model.

Claims

1. An automated quartz wafer polishing apparatus, characterized by: The utility model provides a wafer polishing device, including workbench, the vertical column of four corners of workbench top is equipped with, the crosspiece between vertical column is equipped with, the recess of one end of workbench near left side vertical column is equipped with, the recess is equipped with a plurality of electric roller in front and back distribution, the wafer body of being driven to move is placed on electric roller, the polishing assembly of being equipped with to wafer body is clamped and polished one end of workbench near right side vertical column, electric roller and polishing assembly all set up between four vertical column, the take -up assembly of wafer body is equipped with to the crosspiece of being moved and sucking, the moving assembly of taking -up assembly is equipped with in crosspiece inside and drives taking -up assembly transverse movement.

2. The automated quartz wafer lapping apparatus of claim 1, wherein: The polishing assembly includes two slide rails arranged in front of and behind the workbench, the slide rails are symmetrically distributed on the workbench, and spaces are left between the two slide rails. A clamping plate is placed on the slide rails and moves along the slide rails. The clamping plate is in an arc shape with the wafer body as a common center. A grinding knife is arranged on the side of the clamping plate facing the wafer body.

3. The automated quartz wafer lapping apparatus of claim 2, wherein: The polishing assembly further includes a first driving motor arranged on the workbench. The first driving motor is arranged towards the clamping plate and drives the clamping plate to move towards the wafer body. A first moving rod is arranged on the side of the first driving motor facing the clamping plate.

4. The automated quartz wafer lapping apparatus of claim 1, wherein: The take-up assembly includes a moving table arranged below the crosspiece. A rotating groove is arranged in the center of the bottom of the moving table and penetrates downward. A rotating table is placed in the rotating groove. A first rotating motor is arranged at the center of the top end of the moving table and drives the rotating table to rotate. A plurality of vacuum suction cups are arranged below the rotating table and suck the wafer body.

5. The automated quartz wafer lapping apparatus of claim 4, wherein: At least two second driving motors are arranged above the crosspiece and symmetrically distributed with the center of the moving table as the center. A second moving rod is arranged below the crosspiece and driven by the second driving motor to move up and down. The bottom of the second moving rod is connected to the top end of the moving table.

6. The automated quartz wafer lapping apparatus of claim 1, wherein: The moving assembly includes a second rotating motor arranged on one side of the crosspiece. A screw rod is arranged inside the crosspiece and driven by the second rotating motor to rotate. Limiting rods corresponding to the screw rod are arranged on the front and back sides of the screw rod. A moving plate is arranged on the screw rod. The limiting rods are sleeved on the moving plate on the two sides. The second rotating motor is arranged on the moving plate.

Images