Tinning device for double-layer mold

Abstract

The utility model provides a double-layer mould tinning device, which comprises a tin furnace, tin alloy solution, a mould support, a double-layer mould, a round copper wire and a round welding strip, the tin furnace is filled with the tin alloy solution, the mould support is arranged on the upper surface of the tin alloy solution, the double-layer mould is arranged in the middle of the mould support, and the round copper wire is arranged on the double-layer mould. A mold hole is formed in the middle of the double-layer mold, a round copper wire penetrates through the mold hole and extends into the tin alloy solution, and when the round copper wire penetrates out of the mold hole, a round welding strip is formed on the outer surface of the round copper wire. The double-layer die tin plating device solves the problem of consistency of the thickness of a tin alloy coating of a circular welding strip, tin plating work can be stably output, a good foundation is laid for high-speed operation of equipment, and the production efficiency can be remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic soldering technology, and in particular to a double-layer mold tin plating device. Background Technology

[0002] Currently, there are two main production methods for photovoltaic (PV) solder ribbons: electroplating and hot-dip plating. Electroplating is more expensive and has a smaller market share in the PV industry, while the mainstream hot-dip plating method is cheaper and simpler, giving it a significant advantage in the PV industry. In the hot-dip plating process, tin plating is the core technology; the tin plating process affects important indicators such as coating thickness, finished product size, and surface quality of the PV solder ribbon. Currently, in the production of hot-dip coated circular PV solder ribbons, the industry commonly uses the annular air knife method, which creates a uniform airflow around the entire circumference of the round copper wire, using gas to wipe and form a PV solder ribbon with a consistent coating.

[0003] With the continuous emergence of new photovoltaic module technologies, micro-fine circular solder ribbons (SMBB and OBB) have become the mainstream. As the size of the solder ribbon continues to decrease, major manufacturers usually compensate for the loss of production capacity by increasing production speed. However, after speeding up, the amount of tin applied to the copper wire increases, and wiping away the excess tin solution puts a lot of pressure on the existing air knife. Common problems include air knife blockage and the product tin layer exhibiting a micro-bamboo-like appearance, which seriously affects product yield and finished product quality.

[0004] Among the existing publicly disclosed patent technologies, such as: CN202320791771.1, a circular air knife for tin-plated photovoltaic solder ribbon based on secondary tin blowing, which uses a double-layer airflow to wipe the tin solution, excess tin solution in the interlayer still cannot be removed in time, resulting in product defects; CN212199393U, a circular air knife for tin-plated photovoltaic solder ribbon; CN216129656U, a circular air knife for tin-plated photovoltaic solder ribbon; CN215628235U, an air knife; and CN215947385U, an air knife, all use a single-layer circular air knife, and all have the problem of not being able to wipe away a large amount of tin solution; CN... 214060621U, a tin plating mold for photovoltaic irregularly shaped solder ribbon, and CN112501534B, a tin plating mold for double-layer photovoltaic irregularly shaped solder ribbon, both use molds to control the tin layer thickness. However, they are limited to slightly larger mold openings and copper wires. This results in problems such as residual flux organic matter easily adhering to the area around the mold opening during the tin plating process, causing mold blockage and a gradual reduction in the diameter of the copper wires. The molds are also difficult to clean and are not suitable for long-term use.

[0005] As the equipment operates at higher speeds, when the speed exceeds 300 m / min, the gas pressure is relatively high. At this time, when the high-pressure annular airflow blown out of the annular vent acts on the circular solder strip with a large amount of molten tin alloy attached, the molten tin alloy splashes in all directions, causing fluctuations in the molten tin surface. The main disadvantages are as follows: 1. The splashed molten tin alloy will gradually accumulate and adhere to the lower surface of the air knife mold and the inner wall of the hole, and the long-term accumulation will cause blockage and blockage, making it impossible to work continuously and stably. 1. The splashing of molten tin again poses certain safety hazards, as it can easily splash onto the operator's arms and other areas, posing a risk of burns; 2. When the airflow pressure at the vent is high, the splashing of molten tin causes fluctuations in the molten tin surface, resulting in significant dimensional fluctuations and an uneven, miniature bamboo-like appearance on the product after being wiped by the air knife; 3. During the air knife tin plating process, the tin dust floating on the surface of the molten tin will continuously move. As the amount increases, if it is not cleaned in time, it will adhere to the surface of the upward-pulled solder strip, causing surface quality problems; 4. With the increasing size of existing products, although a single mold can precisely control the amount of tin, the round copper wire will always scrape against one side of the mold's central hole as it passes through it, resulting in uneven molten tin coating around the circumference of the round copper wire, which seriously affects the consistency of the tin alloy coating thickness of the product.

[0006] In view of this, this utility model is hereby proposed. Utility Model Content

[0007] This utility model relates to a double-layer mold tin plating device, which is mainly used in the photovoltaic industry and in fully automatic tin plating machines for solder strips. The double-layer mold tin plating device adopts an integrated double-layer mold with upper and lower holes, and floats on the surface of the tin alloy solution through a mold support, so that the tin plating work is stable and output, laying a good foundation for the high-speed operation of the equipment and significantly improving production efficiency.

[0008] This utility model discloses a double-layer mold tin plating device, comprising: a tin furnace containing a tin alloy solution, a mold support placed on the upper surface of the tin alloy solution, a double-layer mold installed in the middle of the mold support, a mold hole in the middle of the double-layer mold, a circular copper wire passing through the mold hole into the tin alloy solution, and a circular solder strip forming on the outer surface of the circular copper wire when the circular copper wire exits from the mold hole.

[0009] Furthermore, a boss-shaped mounting through hole is provided in the middle of the mold support. The mold support is integrally connected from top to bottom by an upper mold support and a lower mold support. Multiple first rectangular through holes are evenly spaced along the circumferential direction in the middle of the lower mold support.

[0010] Furthermore, the upper support of the mold is a circular disc-shaped structure.

[0011] Furthermore, the double-layer mold is formed by connecting the upper mold, the connecting ring, and the lower mold from top to bottom. Multiple second rectangular through holes are evenly spaced along the circumferential direction on the connecting ring. The number of the first rectangular through holes and the second rectangular through holes are the same, and their positions are correspondingly set.

[0012] Furthermore, an upper mold hole is provided in the middle of the upper mold, and a lower mold hole is provided in the middle of the lower mold. The upper mold hole and the lower mold hole are concentrically arranged, and the line connecting the upper mold hole and the lower mold hole is perpendicular to the liquid surface of the tin alloy solution.

[0013] Furthermore, the upper surface of the lower mold has an upward conical surface in the middle, and correspondingly, an upward conical hole is opened in its lower part. The apex of the conical surface and the apex of the conical hole are connected through the lower hole of the mold.

[0014] Furthermore, the upper part and the lower part of the upper mold are both provided with conical holes, and the apexes of the two conical holes are connected through the upper hole of the mold.

[0015] Furthermore, the dimensions of the circular copper wire are between Φ0.10mm and Φ0.35mm.

[0016] Furthermore, the dimensions of the circular welding strip are between Φ0.11mm and Φ0.37mm.

[0017] Furthermore, the density of the tin alloy solution is 8.5-9.5 g / cm³. 3 The material density of the mold support is 4-5 g / cm³. 3 between.

[0018] This invention has the following advantages over the prior art:

[0019] 1. The double-layer mold tin plating device of this utility model adopts an integrated double-layer mold tin plating operation with an upper mold hole and a lower mold hole. The lower mold hole can be used to position the round copper wire, and the upper mold hole, which is concentric with the lower mold hole, can solve the problem of uniformity of tin alloy liquid adhering to the surface of the round copper wire, and further solve the problem of uniform thickness of tin alloy coating on round solder strip.

[0020] 2. In the double-layer mold tin plating device of this utility model, when the round copper wire passes through the upper hole of the mold, the amount of tin alloy adhering to the surface of the round copper wire can be precisely controlled by the size of the upper hole of the mold, thereby further controlling the size of the finished round solder strip and reducing the fluctuation range of the finished product size.

[0021] 3. The double-layer mold tin plating device of this utility model does not require the use of compressed air or nitrogen during tin plating operations, which can greatly reduce the amount of tin ash generated on the surface of the tin alloy solution and greatly reduce energy consumption. It reduces the production cost of products by reducing energy consumption and reducing the amount of tin ash.

[0022] 4. In the double-layer mold tin plating device of this utility model, the liquid level of the tin alloy solution is stable during the tin plating operation, and there is no splashing of tin alloy liquid, which further reduces the safety hazards of the tin plating operation.

[0023] After solving the above core tin plating technology problems, the tin plating output is stable, laying a good foundation for the high-speed operation of the equipment and significantly improving production efficiency. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the double-layer mold tin plating device of this utility model;

[0025] Figure 2 This is a schematic diagram of the assembly structure of the mold support and the double-layer mold of this utility model;

[0026] Figure 3 This is a schematic diagram of the structure of the double-layer mold of this utility model.

[0027] Among them, 1-tin furnace; 2-tin alloy solution; 3-mold support; 31-upper mold support; 32-lower mold support; 33-first rectangular through hole; 4-double-layer mold; 41-upper mold; 42-connecting ring; 43-lower mold; 44-second rectangular through hole; 401-lower mold hole; 402-upper mold hole; 5-circular copper wire; 6-circular solder strip. Detailed Implementation

[0028] The embodiments of the present invention will be described in detail below with reference to the examples. However, those skilled in the art will understand that the following examples are only for illustrating the present invention and should not be regarded as limiting the scope of the present invention.

[0029] According to an embodiment of the present invention, a double-layer mold tin plating device of the present invention, such as... Figure 1 As shown, it includes: a tin furnace 1, a tin alloy solution 2, a mold support 3, a double-layer mold 4, a circular copper wire 5, and a circular solder strip 6. The tin furnace 1 contains the tin alloy solution 2. The mold support 3 is placed on the upper surface of the tin alloy solution 2. The double-layer mold 4 is installed in the middle of the mold support 3. A mold hole is opened in the middle of the double-layer mold 4. The circular copper wire 5 passes through the mold hole and extends into the tin alloy solution 2. When the circular copper wire 5 passes through the mold hole, a circular solder strip 6 is formed on the outer surface of the circular copper wire 5.

[0030] According to embodiments of the present invention, such as Figure 2As shown, a boss-shaped mounting through hole is provided in the middle of the mold support 3, and the double-layer mold 4 is installed into the mounting through hole from the lower end of the mold support 3. The mold support 3 is integrally connected from top to bottom by an upper mold support 31 and a lower mold support 32. A plurality of first rectangular through holes 33 are evenly spaced along the circumferential direction in the middle of the lower mold support 32. The upper mold support 31 has a circular disc structure.

[0031] According to embodiments of the present invention, such as Figure 3 As shown, the double-layer mold 4 is composed of an upper mold 41, a connecting ring 42, and a lower mold 43 connected sequentially from top to bottom. Multiple second rectangular through holes 44 are evenly spaced along the circumference of the connecting ring 42. The number of first rectangular through holes 33 and second rectangular through holes 44 are the same, and their positions correspond. Due to the arrangement of the first rectangular through holes 33 and second rectangular through holes 44, the tin alloy solution 2 can enter the double-layer mold 4 through the two through holes, immersing the circular copper wire 5 located in the middle of the double-layer mold in the tin alloy solution 2. An upper mold hole 402 is formed in the middle of the upper mold 41, and a lower mold hole 401 is formed in the middle of the lower mold 43. The upper mold hole 402 and the lower mold hole 401 are concentrically arranged, and the line connecting the upper mold hole 402 and the lower mold hole 401 is perpendicular to the liquid surface of the tin alloy solution 2. The lower mold 43 has an upward-facing conical surface at the center of its upper surface, and correspondingly, an upward-facing conical hole is formed at its lower part. The apex of the conical surface and the apex of the conical hole are connected through the lower mold hole 401. The upper mold 41 has conical holes at both its upper and lower parts, and the apexes of the two conical holes are connected through the upper mold hole 402.

[0032] According to an embodiment of this utility model, the size of the circular copper wire 5 is between Φ0.10mm and Φ0.35mm, and the size of the circular solder strip 6 is between Φ0.11mm and Φ0.37mm. The density of the tin alloy solution 2 is 8.5-9.5g / cm³. 3 The material density of the mold support 3 is 4-5 g / cm³. 3 The mold support 3 is positioned to ensure that it floats on the tin alloy solution 2. The mold support 3 is a circular disc-shaped structure with a certain outer diameter, ranging from Φ70 to Φ120 mm. The size of the lower hole 401 of the mold is 0.001 mm to 0.003 mm larger than the size of the corresponding circular copper wire 5; the size of the upper hole 402 of the mold is 0.005 mm to 0.030 mm larger than the size of the corresponding circular copper wire 5.

[0033] According to the embodiments of the utility model, the mold support 3 and the double-layer mold 4 of the utility model are made of titanium alloy. They can also be made of other materials that meet the above density, but the selected materials must not react with the tin alloy solution 2, otherwise the quality of the tin alloy solution 2 will be affected.

[0034] According to the embodiments of the utility model, when the double-layer mold tin plating device of the present utility model performs tin plating operation, the double-layer mold 4 needs to be installed in the mold support 3, and then the mold support 3 is placed on the tin alloy solution 2. At this time, the mold support 3 floats on the surface of the tin alloy solution 2. The mold support 3 ensures that the center line connecting the upper mold hole 402 and the lower mold hole 401 in the double-layer mold 4 is perpendicular to the liquid surface of the tin alloy solution 2. After passing through the tin alloy solution 2, the circular copper wire 5 first passes through the lower mold hole 401 of the double-layer mold 4, and then passes through the upper mold hole 402 to form a circular solder strip 6.

[0035] According to an embodiment of this utility model, the tin furnace 1 is a liftable type. At the lower end of the circular copper wire 5, there is a semi-circular guide plate for passing the copper wire. The guide plate is mounted on the frame via a bracket. The circular copper wire 5 is first passed through the guide plate from left to right, then through the double-layer mold 4 and mold support 3 before entering the next mechanism. The wire threading is then completed. The tin furnace 1 is then raised and lowered to its position, and the machine is started. Both the frame and the tin furnace 1 are fixed to the fully automatic tin plating machine.

[0036] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

Claims

1. A double-layer mold tinning apparatus characterized by comprising: The application relates to a tin furnace (1) which contains a tin alloy solution (2), a mold support (3) is arranged on the upper surface of the tin alloy solution (2), a double-layer mold (4) is arranged in the middle of the mold support (3), a mold hole is arranged in the middle of the double-layer mold (4), a circular copper wire (5) passes through the mold hole and extends into the tin alloy solution (2), and a circular solder strip (6) is formed on the outer surface of the circular copper wire (5) when the circular copper wire (5) passes out of the mold hole. A boss-shaped mounting through hole is arranged in the middle of the mold support (3), the mold support (3) is integrally connected from top to bottom by a mold upper support (31) and a mold lower support (32), and a plurality of first rectangular through holes (33) are uniformly arranged in the middle of the mold lower support (32) in the circumferential direction. The mold upper support (31) is a circular disc structure.

2. The double-layered die tinning apparatus according to claim 1, wherein The double-layer mold (4) is sequentially connected from top to bottom by an upper mold (41), a connecting ring (42) and a lower mold (43), a plurality of second rectangular through holes (44) are uniformly arranged on the connecting ring (42) in the circumferential direction, 3. The double-layered die tinning apparatus according to claim 2, wherein The first rectangular through holes (33) and the second rectangular through holes (44) are arranged in the same number and in corresponding positions.

4. The double-layered die tinning apparatus according to claim 2, wherein An upper mold hole (402) is arranged in the middle of the upper mold (41), and a lower mold hole (401) is arranged in the middle of the lower mold (43), The upper mold hole (402) and the lower mold hole (401) are concentrically arranged, and the connecting line of the upper mold hole (402) and the lower mold hole (401) is perpendicular to the liquid surface of the tin alloy solution (2).

5. The double-layered die tinning apparatus according to claim 4, wherein An upward conical surface is arranged in the middle of the upper surface of the lower mold (43), and a corresponding upward conical hole is arranged in the lower part of the lower mold (43), and the vertex of the conical surface and the vertex of the conical hole are connected through the lower mold hole (401). Conical holes are arranged in the upper part and the lower part of the upper mold (41), and the vertices of the two conical holes are connected through the upper mold hole (402).

6. The double-layered tinning apparatus according to any one of claims 4 to 5, wherein The size of the circular copper wire (5) is between phi 0.10 mm and phi 0.35 mm.

7. The double-layered tinning apparatus according to any one of claims 4 to 5, wherein The size of the circular solder strip (6) is between phi 0.11 mm and phi 0.37 mm.

8. The double-layered die tinning apparatus according to claim 1, wherein ​ 9. The double-layered mold tinning apparatus according to claim 1, wherein ​ 10. The double-layered mold tinning apparatus according to claim 1, wherein The tin alloy solution (2) has a density of 8.5-9.5 g / cm 3 The material density of the mold support (3) is 4-5 g / cm 3 between.

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