Multi-angle semiconductor heater purging device

Abstract

The utility model relates to the technical field of multi-angle semiconductor heater purging devices, and discloses a multi-angle semiconductor heater purging device, which comprises a first box body, a second box body, a third box body, a fourth box body, a fourth box body, a fourth box body, a fifth box body, a fifth box body and a sixth box body, the heating and blowing mechanism comprises heating box bodies fixedly arranged on the two sides of the first box body, second opening and closing doors are hinged to the heating box bodies and used for opening and observing the interiors of the heating box bodies, copper core heating switches are further arranged on one sides of the heating box bodies and used for starting the second opening and closing doors, and heating assemblies are arranged in the heating box bodies; the first bevel gear drives the second bevel gear, the first rotating rod and the rotating connecting rod are made to rotate, then the swing connecting rod and the sweeping fan blades are driven to swing, hot air can be distributed to different directions to heat the semiconductor, and the heating requirements of different parts of the semiconductor can be met.

Description

Technical Field

[0001] This utility model relates to the technical field of multi-angle semiconductor heater purging device, specifically a multi-angle semiconductor heater purging device. Background Technology

[0002] Semiconductor heaters are a new type of heating device that uses semiconductor materials as heating elements, typically silicon, silicon carbide, and silicon nitride. These materials have excellent thermal conductivity and high-temperature stability, allowing them to withstand high-temperature environments. When an electric current passes through the heating element, the semiconductor material heats up, thus achieving the heating purpose. Compared to traditional heating devices, semiconductor heaters offer advantages such as higher efficiency, faster response speed, more precise temperature control, and smaller size, leading to their widespread application in industrial, medical, and household appliance fields.

[0003] A search revealed an existing technology (application number: CN202420602365.0) for a multi-angle purging device for a semiconductor heater. The document describes a device as follows: "It includes a purging box, within which a cleaning component is installed and driven laterally by a first driving component. A second driving component is fixed to the top of the purging box, driving the first driving component to slide longitudinally. A cleaning platform is installed at the bottom of the purging box and driven vertically by a third driving component on its side wall. The cleaning component includes a cleaning head and an air pump. Several sets of cleaning heads are distributed laterally and longitudinally and mounted on the air pump's air base. This is a novel multi-angle purging device for a semiconductor heater." This invention improves the heating or heat dissipation effect of the heater and enhances its operational stability.

[0004] However, while existing technologies have improved the heating or heat dissipation effect of heaters and enhanced operational stability, they still have some shortcomings: they cannot heat semiconductors from multiple directions. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a multi-angle semiconductor heater purging device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multi-angle semiconductor heater purging device, comprising a housing, including a switch door arranged on one side of the housing, an air outlet at the rear of the housing for air outlet, and a semiconductor inside the housing; a heating blower mechanism, including heating chambers fixedly arranged on both sides of the housing, and a switch door hinged to the heating chamber for opening and observing the interior of the heating chamber, and a copper core heating switch on one side of the heating chamber for activating the heating component inside the switch door; and a sweeping mechanism, including a sweeping chamber fixedly arranged inside the housing, an air inlet at the top of the sweeping chamber, a swing groove inside the sweeping chamber, and a motor fixedly arranged at the top of the sweeping chamber for driving the active component and the swing component inside the sweeping chamber to adjust the purging angle.

[0007] As a further description of the above technical solution:

[0008] The heating blower mechanism is symmetrically arranged in two sets with the housing as the center, and is used for heating.

[0009] As a further description of the above technical solution:

[0010] The heating assembly includes: an air outlet two, located on one side of the heating chamber and connected to an air inlet three; a heating wire conduit, electrically connected to a copper core heating switch and located inside the heating chamber; multiple heating copper cores, all fixedly arranged above the heating wire conduit; a hot air circulation conduit, running through the heating chamber and with a fan fixedly connected to one end for air intake; and a heat-conducting pipe, with one end located inside the hot air circulation conduit and the other end fixedly connected to the end of the heating copper core furthest from the heating wire conduit, for transmitting hot air.

[0011] As a further description of the above technical solution:

[0012] The heat pipe is L-shaped. When the copper core heating switch is turned on, the copper core begins to heat up. Then, fan one is turned on to blow the hot air inside the heated copper core into the air outlet two to the air inlet three, thereby heating it.

[0013] As a further description of the above technical solution:

[0014] The active component includes: a bevel gear one, fixedly arranged below the motor output end and inside the sweeping box; a rotating rod one, rotating inside the sweeping box, and a bevel gear two is fixedly mounted on the rotating rod one; and a rotating connecting rod, fixedly arranged at both ends of the rotating rod one.

[0015] As a further description of the above technical solution:

[0016] The swing assembly includes: a swing link, rotatably arranged at the end of the rotating link away from the first rotating link; a sweeping fan blade, rotatably arranged at the end of the swing link away from the rotating link; and a second rotating link, fixedly arranged on one side of the sweeping fan blade and sliding inside the swing groove, used to limit the position of the sweeping fan blade.

[0017] As a further description of the above technical solution:

[0018] The first bevel gear meshes with the first rotating rod. When the motor is started, the first bevel gear drives the second bevel gear, which in turn drives the first rotating rod and the rotating connecting rod to rotate. The rotating connecting rod drives the swing connecting rod and the sweeping fan blades to swing, causing the hot air blown out of the third air inlet to be diverted and heat the semiconductor.

[0019] This utility model has the following beneficial effects:

[0020] 1. The sweeping mechanism uses a motor to drive the active component and the swing component to swing the sweeping fan blades, thereby adjusting the sweeping angle. When the motor starts, bevel gear one drives bevel gear two, causing rotating rod one and rotating connecting rod to rotate, which in turn drives the swing connecting rod and the sweeping fan blades to swing, so that hot air can be diverted to different directions to heat the semiconductor, which can meet the heating needs of different parts of the semiconductor.

[0021] 2. Two sets of heating blowers are symmetrically arranged around the center of the housing, which can heat the semiconductor inside the housing from both sides at the same time, making the heating more uniform, improving the heating efficiency, and ensuring that each part can quickly reach the required temperature. Attached Figure Description

[0022] Figure 1 This is an overall schematic diagram of a multi-angle semiconductor heater purging device proposed in this utility model;

[0023] Figure 2 This is a side view of the multi-angle semiconductor heater purging device proposed in this utility model;

[0024] Figure 3 This is a schematic diagram of the air outlet of a multi-angle semiconductor heater purging device proposed in this utility model;

[0025] Figure 4 This is a schematic diagram of the heating blower structure of a multi-angle semiconductor heater purging device proposed in this utility model;

[0026] Figure 5 This is a schematic diagram of the purging mechanism of a multi-angle semiconductor heater purging device proposed in this utility model;

[0027] Figure 6 This is a schematic diagram of the air purging box of a multi-angle semiconductor heater purging device proposed in this utility model;

[0028] Figure 7 This is a schematic diagram of the active component of a multi-angle semiconductor heater purging device proposed in this utility model;

[0029] Figure 8 This is a schematic diagram of the swing assembly of a multi-angle semiconductor heater purging device proposed in this utility model.

[0030] Legend: 1. Box 1; 11. Door 1; 12. Air outlet 1; 4. Semiconductor; 2. Heating blower mechanism; 27. Heating box; 21. Door 2; 28. Copper core heating switch; 29. ​​Heating wire conduit; 22. Heating copper core; 23. Heat pipe; 24. Fan 1; 25. Hot air circulation pipe; 26. Air outlet 2; 3. Sweeping mechanism; 310. Sweeping box; 301. Air inlet 3; 302. Motor; 303. Bevel gear 1; 304. Bevel gear 2; 305. Rotating rod 1; 306. Rotating connecting rod; 307. Swinging connecting rod; 308. Sweeping fan blade; 309. Rotating rod 2; 311. Swinging groove. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Example 1:

[0033] like Figures 1 to 8 As shown, this embodiment provides a multi-angle semiconductor heater purging device, including: a housing 1, including a switch door 11 arranged on one side of the housing 1, an air outlet 12 at the rear of the housing 1 for air outlet, and a semiconductor 4 inside the housing 1; a heating blower mechanism 2, including heating housings 27 fixedly arranged on both sides of the housing 1, and a switch door 21 hinged to the heating housing 27 for opening to observe the interior of the heating housing 27, and a copper core heating switch 28 on one side of the heating housing 27 for activating the heating component inside the switch door 21; and a purging mechanism 3, including a purging box 310 fixedly arranged inside the housing 1, an air inlet 301 at the top of the purging box 310, a swing groove 311 inside the purging box 310, and a motor 302 fixedly arranged at the top of the purging box 310 for driving the active component and the swing component inside the purging box 310 to adjust the purging angle.

[0034] In this embodiment, the housing 1, the heating blower mechanism 2, and the sweeping mechanism 3 constitute the multi-angle semiconductor heater purging device involved in this application, realizing a multi-angle semiconductor heater purging device. In this application, any semiconductor that needs to be heated can be used with this device, and this application does not limit the specific semiconductor category.

[0035] In this embodiment, the switch door 11 can be opened and closed to facilitate personnel to enter the interior of the housing 1 for operation. Hot air is discharged from the air outlet 12, and the semiconductor 4 is heated and purged inside the housing 1.

[0036] In this embodiment, the housing 1 can be made of metal such as stainless steel, and is the main frame of the entire device, used to house components such as semiconductor 4.

[0037] It should be noted that the oscillating component changes the direction of the blowing air by oscillating within the oscillating groove 311, thereby achieving a multi-angle blowing function and heating the semiconductor 4.

[0038] Specifically, the heating blower mechanism 2 is symmetrically arranged with the housing 1 as the center, and is used for heating.

[0039] In this embodiment, opening the second switch door 21 allows observation of the interior of the heating chamber 27, and pressing the copper core heating switch 28 activates the heating assembly to heat the semiconductor 4.

[0040] Specifically, the heating components include: an air outlet 26, located on one side of the heating chamber 27 and connected to an air inlet 301; a heating wire conduit 29, electrically connected to a copper core heating switch 28 and located inside the heating chamber 27; multiple heating copper cores 22, all fixedly arranged above the heating wire conduit 29; a hot air circulation conduit 25, running through the heating chamber 27, with one end fixedly connected to a fan 24 for air intake; and a heat-conducting pipe 23, with one end located inside the hot air circulation conduit 25 and the other end fixedly connected to the end of the heating copper core 22 away from the heating wire conduit 29 for transmitting hot air.

[0041] In a preferred embodiment, the copper core heating switch 28 is turned on, and the current passes through the heating wire conduit 29 to heat the copper core 22. The heat is transferred through the heat pipe 23 to the hot air circulation pipe 25. The fan 24 is turned on to blow the hot air into the air outlet 26 and then into the air inlet 301 to heat the semiconductor 4.

[0042] Specifically, the heat pipe 23 is L-shaped. When the copper core heating switch 28 is turned on, the heating copper core 22 starts to heat up. Then, the fan 24 is turned on to blow the hot air in the heating copper core 22 into the air outlet 26 to the air inlet 301, thereby heating it.

[0043] It should be noted that after the heating copper core 22 generates heat, the heat is conducted to the hot air circulation pipe 25 through the heat conduction pipe 23. When the fan 24 is working, it blows the hot air along the path of the heat conduction pipe 23 into the air outlet 26 and the air inlet 301.

[0044] Specifically, the active components include: a bevel gear 303, which is fixedly arranged below the output end of the motor 302 and inside the sweeping box 310; a rotating rod 305, which rotates inside the sweeping box 310, and a bevel gear 304 is fixedly mounted on the rotating rod 305; and a rotating connecting rod 306, which is fixedly arranged at both ends of the rotating rod 305.

[0045] In a preferred embodiment, the motor 302 is started, which drives the first bevel gear 303 to rotate. The first bevel gear 303 drives the second bevel gear 304 to rotate through meshing, thereby causing the first rotating rod 305 and the rotating connecting rod 306 to rotate.

[0046] Specifically, the swing assembly includes: a swing link 307, rotatably arranged at the end of the rotating link 306 away from the rotating link 305; a sweeping fan blade 308, rotatably arranged at the end of the swing link 307 away from the rotating link 306; and a rotating link 309, fixedly arranged on one side of the sweeping fan blade 308 and sliding inside the swing groove 311, used to limit the position of the sweeping fan blade 308.

[0047] It should be noted that when the rotating connecting rod 306 rotates, it drives the swing connecting rod 307 to swing, and the swing connecting rod 307 drives the sweeping fan blade 308 to swing. The rotating rod 309 slides in the swing groove 311, limiting the swing position of the sweeping fan blade 308.

[0048] Example 2:

[0049] Based on Example 1, in order to further improve the uniform heating of semiconductor 4, a sweeping fan blade 308 is arranged under the swing link 307 to perform sweeping;

[0050] Specifically, bevel gear 303 meshes with rotating rod 305. When motor 302 is started, bevel gear 303 drives bevel gear 304, which in turn drives rotating rod 305 and rotating connecting rod 306 to rotate. Rotating connecting rod 306 drives swing connecting rod 307 and sweeping fan blade 308 to swing, causing the hot air blown out of air inlet 301 to be diverted and heat semiconductor 4.

[0051] In this embodiment, the rotating link 306 drives the swing link 307 and the sweeping fan blade 308 to swing. The rotating rod 309 slides in the swing groove 311 to restrict the position of the sweeping fan blade 308, so that the hot air blown out of the air inlet 301 is diverted to heat the semiconductor 4 from multiple angles.

[0052] When it is necessary to heat the semiconductor 4, the user can open the switch door 11, put the semiconductor 4 into the housing 1, close the switch door 11, turn on the copper core heating switch 28, and connect the internal wiring of the heating wire pipe 29 to each heating copper core 22. The heating copper core 22 begins to generate heat, and hot air enters the hot air circulation pipe 25 from the heat conduction pipe 23. The fan 24 starts to rotate, blowing hot air from the hot air circulation pipe 25 into the sweeping box 310. At the same time, the motor 302 is started. The motor 302 is connected to the bevel gear 303 to rotate. The bevel gear 303 meshes with the bevel gear 304 to rotate. The bevel gear 304 drives the rotating rod 305. The rotating connecting rod 306 rotates around the rotating rod 305 as the center. The swing connecting rod 307 is connected to one end of the rotating connecting rod 306 and swings up and down. The sweeping fan blade 308 is connected to one end of the swing connecting rod 307 and swings up and down, so that the hot air blows up and down to sweep the semiconductor 4.

[0053] Finally, it should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0054] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-angle semiconductor heater purging device, characterized by: The utility model relates to a kind of multi-angle semiconductor heater blowing devices, including: Box one (1), including the switch door one (11) being arranged in the one side of box one (1), the rear of box one (1) is equipped with air outlet one (12), for air outlet, and the inside of box one (1) is equipped with semiconductor (4); Heating blower mechanism (2), including fixedly arranged in the heating box (27) of both sides of box one (1), and hinged with switch door two (21) on heating box (27), for opening and observing inside heating box (27), and one side of heating box (27) is also equipped with copper core heating switch (28), for starting switch door two (21) inside is equipped with heating assembly; Sweeping mechanism (3), including fixedly arranged in the inside of box one (1) of sweeping box (310), the top of sweeping box (310) is equipped with air inlet three (301), and the inside of sweeping box (310) is equipped with swing groove (311), the top of sweeping box (310) is fixedly equipped with motor (302), for driving the driving assembly and swing assembly in the inside of sweeping box (310), for adjusting blowing angle.

2. The multi-angle semiconductor heater blowing device according to claim 1, wherein: The heating blower mechanism (2) is symmetrically provided with two groups with box one (1) as the center for heating.

3. The multi-angle semiconductor heater blowing device according to claim 2, wherein: The heating assembly comprises: Air outlet two (26) arranged on one side of the heating box (27) and communicated with the air inlet three (301); A heating wire duct (29) electrically connected with the copper core heating switch (28) and arranged in the inside of the heating box (27); A plurality of heating copper cores (22) fixedly arranged above the heating wire duct (29); A hot gas flow passage (25) arranged through the heating box (27) and having a fan one (24) fixedly connected at one end for air suction; A heat conducting pipe (23) arranged in the hot gas flow passage (25) at one end and fixedly connected at the other end with the heating copper core (22) away from the other end of the heating wire duct (29) for conveying hot gas.

4. The multi-angle semiconductor heater blowing device according to claim 3, wherein: The heat conducting pipe (23) is in "L" shape, when the copper core heating switch (28) is turned on, the heating copper core (22) starts to heat, and then the fan one (24) is started to make the hot gas in the heating copper core (22) blow into the air outlet two (26) to the air inlet three (301) to further heat.

5. The multi-angle semiconductor heater blowing device according to claim 4, wherein: The driving assembly comprises: A bevel gear one (303) fixedly arranged below the output end of the motor (302) and arranged in the inside of the sweeping box (310); A rotating rod one (305) rotating in the inside of the sweeping box (310) and having a bevel gear two (304) fixedly arranged on the rotating rod one (305); and A rotating link (306) fixedly arranged at both ends of the rotating rod one (305).

6. The multi-angle semiconductor heater blowing device according to claim 5, wherein: The swing assembly comprises: Swing link (307), rotation arranged in the rotary link (306) away from the rotary rod one (305) one end; Sweep fan blade (308), rotation arranged in swing link (307) away from the rotary link (306) one end; Rotary rod two (309), fixed arrangement in sweep fan blade (308) one side, and in swing groove (311) inside sliding, for limiting sweep fan blade (308) position.

7. The multi-angle semiconductor heater purging device according to claim 6, wherein: The bevel gear one (303) is engaged with the rotary rod one (305), when the motor (302) is started, the bevel gear one (303) drives the bevel gear two (304), the bevel gear two (304) drives the rotary rod one (305) and the rotary link (306) to rotate, the rotary link (306) drives the swing link (307) and the sweep fan blade (308) to swing, so that the hot air blown out of the air inlet three (301) is divided, and the semiconductor (4) is heated.

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