Socket structure for testing chip and chip aging test device

Abstract

The utility model relates to a socket structure used for testing a chip and a chip aging test device, the socket structure comprises a support part and a plurality of signal pins, the support part comprises an insulation block and an insulation film, the surface of the insulation block is provided with a plurality of grounding holes and a plurality of signal holes in a penetrating manner, the inner wall of each grounding hole is provided with a first electroplated layer, and the inner wall of each signal hole is provided with a second electroplated layer. The insulating blocks are provided with the insulating films at the two sides of the ports of the grounding hole and the signal hole; the plurality of signal pins are respectively arranged in the grounding hole and the signal hole in a penetrating manner, and the two ends of each signal pin are arranged in a manner of penetrating through the insulating film. According to the utility model, the electroplated layer is arranged in the grounding hole, so that the contact resistance of the whole socket can be reduced, the shielding effect and the conductivity are improved, and the grounding performance is further enhanced; and power supply noise can be prevented from leaking to the outside through electromagnetic coupling through the insulating films at the top and the bottom, so that the stability of the power supply transmission network is improved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit testing technology, and in particular to a socket structure for testing chips and a chip aging test device. Background Technology

[0002] Chip test sockets are widely used in the semiconductor industry, especially after chip packaging, to comprehensively test the chip's functionality, performance, and reliability by simulating real-world working environments. These tests include functional testing, performance testing, reliability testing, and aging testing. The socket used for testing chips is commonly referred to as a chip test socket or IC socket; it is a precision device used for electrical performance testing.

[0003] Existing test sockets typically consist of two parts, upper and lower, with a signal pin inserted in the middle. Signal transmission is achieved through contact between the signal pin and the pins on the chip surface. The contact resistance between the probe and the outer support is relatively high, making the test socket prone to poor grounding during use. Furthermore, the signal transmission effect is poor, making it susceptible to electromagnetic interference. Utility Model Content

[0004] Therefore, the technical problem to be solved by this utility model is to overcome the defects of the existing detection socket structure, which is prone to poor grounding, signal leakage and electromagnetic interference.

[0005] To solve the above-mentioned technical problems, this utility model provides a socket structure for testing chips, comprising:

[0006] The support includes an insulating block and an insulating film. The surface of the insulating block is provided with a plurality of grounding holes and a plurality of signal holes. The inner wall of the grounding holes is provided with a first electroplated layer. The insulating film is provided on both sides of the ports of the grounding holes and signal holes.

[0007] Multiple signal pins are respectively inserted into the grounding hole and the signal hole, and both ends of the signal pins are inserted through the insulating film.

[0008] In one embodiment of the present invention, a second electroplating layer is provided at both ports of the grounding hole, and the second electroplating layer is disposed between the insulating film and the insulating block.

[0009] In one embodiment of this utility model, the first electroplating layer and the second electroplating layer are integrally formed.

[0010] In one embodiment of this utility model, the insulating film and the insulating block are connected by pressure-sensitive adhesive.

[0011] In one embodiment of the present invention, the signal needle includes a first probe, a second probe, and a spring, one end of the first probe is connected to the second probe, and the spring is sleeved on the outside of the first probe and the second probe.

[0012] In one embodiment of the present invention, a first slot is provided at one end of the first probe connected to the second probe, and a second slot is provided at one end of the second probe connected to the first probe. The first slot is engaged in the second slot, and the first slot is perpendicular to the second slot.

[0013] In one embodiment of this utility model, a first probe is provided at the end of the first probe away from the second probe, and a second probe is provided at the end of the second probe away from the first probe. The insulating film has mounting holes that cooperate with the first probe and the second probe.

[0014] In one embodiment of this utility model, the diameter of the mounting hole is smaller than the diameter of the grounding hole and the signal hole.

[0015] In one embodiment of this utility model, protrusions are provided on both sides of the first probe, and the two ends of the spring are engaged between the protrusions and the insulating film.

[0016] A chip aging test apparatus includes the aforementioned socket structure for testing chips.

[0017] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0018] The present invention discloses a socket structure for testing chips and a chip aging test device. By setting an electroplated layer inside the grounding hole, the contact resistance of the entire socket can be reduced and the grounding performance can be enhanced, while improving the shielding effect and conductivity. Secondly, the insulating films at the top and bottom can prevent power noise from leaking to the outside through electromagnetic coupling, protect the integrity of the signal, reduce signal interference, and improve the stability of the power transmission network. Attached Figure Description

[0019] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a cross-sectional view of the internal structure of this utility model;

[0022] Figure 3 for Figure 2A partial structural diagram at point A in the middle;

[0023] Figure 4 for Figure 1 A schematic diagram of the structure of the signal needle;

[0024] Figure 5 for Figure 4 A schematic diagram of the structure of the first probe in the middle;

[0025] Figure 6 for Figure 4 A schematic diagram of the structure of the second probe in the middle;

[0026] Explanation of reference numerals in the accompanying drawings: 1. Insulating block; 2. Signal pin; 3. Insulating film; 4. Pressure-sensitive adhesive; 11. Grounding hole; 12. Signal hole; 21. First probe; 22. Second probe; 23. Spring; 31. Mounting hole; 111. First electroplating layer; 112. Second electroplating layer; 211. First probe; 212. First slot; 213. Protrusion; 221. Second probe; 222. Second slot. Detailed Implementation

[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention. Example 1

[0028] Reference Figures 1-6 As shown, this utility model discloses a socket structure for testing chips, comprising:

[0029] The support part includes an insulating block 1 and an insulating film 3. The surface of the insulating block 1 is provided with a plurality of grounding holes 11 and a plurality of signal holes 12. The inner wall of the grounding hole 11 is provided with a first electroplated layer 111. The insulating film 3 is provided on both sides of the ports of the grounding hole 11 and the signal hole 12.

[0030] Multiple signal pins 2 are respectively inserted into the grounding hole 11 and the signal hole 12, and both ends of the signal pins 2 are inserted through the insulating film 3.

[0031] The support structure of this invention includes an insulating block 1, which provides a support structure, protects the internal signal pins 2 and electroplated layer, prevents physical damage, and ensures that the signal path will not deviate or short-circuit. Specifically, the insulating block 1 has multiple grounding holes 11 and multiple signal holes 12, with the multiple signal pins 2 passing through the grounding holes 11 and signal holes 12 respectively. The inner wall of the grounding holes 11 is provided with an electroplated layer, which firstly reduces contact resistance and enhances the grounding effect. Secondly, the electroplated layer can shield the signal transmission, reduce leakage and electromagnetic interference, and improve the conductivity of the signal transmission path. As a preferred embodiment of this invention, the electroplated layer uses a high-conductivity material (such as gold or silver) to reduce surface loss during high-frequency transmission and improve transmission efficiency.

[0032] In addition, in some high-frequency and power transmission applications, the insulating film 3 at the top and bottom can prevent power noise from leaking to the outside through electromagnetic coupling, thereby improving the stability of the power transmission network; the insulating film 3 can also prevent external electromagnetic interference from coupling with the internal signal through the top or bottom, protecting the integrity of the signal and further reducing signal interference.

[0033] This invention reduces the contact resistance of the entire socket and enhances grounding performance by setting an electroplated layer inside the grounding hole 11, while also improving shielding effect and conductivity. Secondly, the insulating films 3 at the top and bottom prevent power noise from leaking to the outside through electromagnetic coupling, protect signal integrity, reduce signal interference, and improve the stability of the power transmission network.

[0034] Furthermore, a second electroplating layer 112 is provided at both ports of the grounding hole 11, and the second electroplating layer 112 is disposed between the insulating film 3 and the insulating block 1.

[0035] In this invention, a second electroplated layer 112 is provided at the port of the grounding hole 11, and the first electroplated layer 111 and the second electroplated layer 112 are integrally formed. The entire electroplated layer extends from the inside to the outside of the hole, which can further enhance the grounding effect. Specifically, firstly, after the electroplated layer extends to the upper and lower surfaces, it can better connect to the ground layer of the PCB (usually a large area of ​​copper foil), forming a more complete and lower impedance grounding path. This provides a stronger shielding effect, especially when the electric and magnetic field coupling between the signal line and the ground layer is strong. Secondly, after the electroplated layer extends to the upper and lower surfaces, it can distribute the grounding current more evenly, reduce the grounding potential difference caused by the incomplete return path of high-frequency signals, and improve signal integrity. In addition, at the grounding hole 11, especially in high-speed signal transmission, parasitic capacitance and parasitic inductance can cause high-frequency interference. The extended electroplated layer helps to reduce these parasitic effects and improve the signal's anti-interference ability.

[0036] Furthermore, the insulating film 3 and the insulating block 1 are connected by pressure-sensitive adhesive 4.

[0037] Specifically, in the actual production process, after the first electroplating layer 111 and the second electroplating layer 112 are applied to the grounding hole 11, pressure-sensitive adhesive 4 is applied to the surfaces of both sides of the insulating block 1, and the insulating film 3 is fixed to both sides of the insulating block 1 by the pressure-sensitive adhesive 4. As a preferred embodiment of this utility model, the insulating film 3 can also be fixed by bolt connection, adhesive tape containing adhesive, rivets, or ultrasonic welding, etc.

[0038] Furthermore, the signal needle 2 includes a first probe 21, a second probe 22, and a spring 23. One end of the first probe 21 is connected to the second probe 22, and the spring 23 is sleeved on the outside of the first probe 21 and the second probe 22.

[0039] In this application, the signal pin 2 needs to ensure a stable contact load and contact formation with the integrated circuit. Specifically, the signal pin 2 structure includes a first probe 21, a second probe 22 and a spring 23. The spring 23 is located between the first probe 21 and the second probe 22. The whole structure is a three-section structure, which can adapt to smaller socket structures. Secondly, the tension force that the spring 23 can provide ensures stable contact between the signal pin 2 and the product.

[0040] Furthermore, a first slot 212 is provided at the end where the first probe 21 connects to the second probe 22, and a second slot 222 is provided at the end where the second probe 22 connects to the first probe 21. The first slot 212 is engaged within the second slot 222, and the first slot 212 is perpendicular to the second slot 222. A first probe 211 is provided at the end of the first probe 21 away from the second probe 22, and a second probe 221 is provided at the end of the second probe 22 away from the first probe 21. The insulating film 3 has mounting holes 31 that mate with the first probe 211 and the second probe 221.

[0041] Specifically, one end of the first slot 212 of the first probe 21 is connected to one end of the second slot 222 of the second probe 22, and the two are installed perpendicular to each other. After assembly, the probes at both ends of the entire signal needle 2 extend out of the mounting holes 31 of the insulating film 3.

[0042] In this invention, the insulating film 3 can also provide limiting support for the signal needle 2. Specifically, the first probe 211 has protrusions 213 on both sides, and the two ends of the spring 23 are engaged between the protrusions 213 and the insulating film 3, so that the extension and retraction of the signal needle 2 can be achieved by the tension of the spring 23.

[0043] Furthermore, the diameter of the mounting hole 31 is smaller than the diameter of the grounding hole 11 and the signal hole 12.

[0044] Specifically, the insulating film 3 can act as an encapsulation part of the signal pin 2, preventing dust, moisture or other contaminants from entering the coaxial structure, protecting the internal signal transmission path, and extending the service life of the device. Example 2

[0045] A chip aging test apparatus includes the aforementioned socket structure for testing chips.

[0046] In summary, this utility model introduces a socket structure for testing chips and a chip aging test device. By setting an electroplating layer inside the grounding hole 11, the contact resistance of the entire socket can be reduced and the grounding performance can be enhanced, while improving the shielding effect and conductivity. Secondly, the insulating films 3 at the top and bottom can prevent power noise from leaking to the outside through electromagnetic coupling, protect the integrity of the signal, reduce signal interference, and improve the stability of the power transmission network.

[0047] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A socket structure for testing a chip, characterized by, The utility model relates to a socket structure for testing chip, including: Support part, the support part includes insulating block and insulating film, the surface of insulating block is provided with a plurality of ground hole and a plurality of signal hole throughout, the inner wall of ground hole is provided with first electroplated layer, and insulating block is provided with insulating film on both sides of the port of ground hole and signal hole; A plurality of signal pins are respectively arranged in the ground hole and the signal hole, and both ends of the signal pin pass through the insulating film.

2. The socket structure for testing a chip according to claim 1, wherein: Second electroplated layer is arranged at both ports of the ground hole, and the second electroplated layer is arranged between the insulating film and the insulating block.

3. The socket structure for testing a chip according to claim 2, wherein: The first electroplated layer and the second electroplated layer are integrally formed.

4. The socket structure for testing a chip according to claim 1, wherein: The insulating film and the insulating block are connected by pressure-sensitive adhesive.

5. The socket structure for testing a chip according to claim 1, wherein: The signal pin includes a first probe, a second probe and a spring, one end of the first probe is connected with the second probe, and the spring is sleeved outside the first probe and the second probe.

6. The socket structure for testing a chip according to claim 5, wherein: The first probe is provided with a first clamping groove at the end connected with the second probe, the second probe is provided with a second clamping groove at the end connected with the first probe, the first clamping groove is clamped in the second clamping groove, and the first clamping groove is perpendicular to the second clamping groove.

7. The socket structure for testing a chip according to claim 5, wherein: The first probe is provided with a first probe head at the end away from the second probe, the second probe is provided with a second probe head at the end away from the first probe, and the insulating film is provided with a mounting hole matched with the first probe head and the second probe head.

8. The socket structure for testing a chip according to claim 7, wherein: The diameter of the mounting hole is smaller than the diameter of the ground hole and the signal hole.

9. The socket structure for testing a chip according to claim 7, wherein: The first probe head is provided with a protrusion at both sides, and both ends of the spring are clamped between the protrusion and the insulating film.

10. A chip burn-in test apparatus, characterized by comprising: The utility model relates to a socket structure for testing chip, including as claimed in any one of claims 1-9.

Images