Circuit board OS testing device

Abstract

The utility model relates to the technical field of flexible circuit board testing, and discloses a circuit board OS testing device. The circuit board OS testing device comprises a frame which is rotatably provided with a rotary table; the carrier plate assembly comprises a carrier plate and a first test unit; the support plate is arranged on the rotary table, the first test unit is arranged on the support plate, and the first test unit is provided with a placing position for placing and fixing a circuit board to be tested; the sky board assembly comprises a sky board and a second test unit; the top plate is arranged on the frame in a lifting mode, and the second test unit is arranged on the side, facing the carrier plate assembly, of the top plate. The circuit board OS testing device provided by the utility model can realize the automatic OS testing operation of the circuit board, is high in testing efficiency, can be connected to an automatic production line, saves the testing time, and reduces the labor intensity of workers.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board testing technology, and in particular to a circuit board OS testing device. Background Technology

[0002] Flexible printed circuit boards (PCBs) are highly reliable and extremely flexible printed circuit boards made with polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bendability. The demand for testing flexible PCBs is increasing rapidly, with a wide variety of testing types, including 5G communications, computers, mobile phones, and wearable electronic devices. The number of components integrated on flexible PCBs is also increasing dramatically, such as chips, sensors, and buttons.

[0003] In the production of flexible printed circuit boards (FPCs), to ensure the quality of the manufactured FPCs, each FPC needs to undergo OS testing. OS testing, or Open-Short testing, can detect whether the circuit board has open circuits or short circuits. Depending on the specific needs, it can include testing open circuits, short circuits, capacitors, resistors, inductors, switches, buttons, and other components. For integrated FPCs, current testing equipment mainly uses separate ICT (In-Circuit Tester) instruments to test each circuit board individually. To improve testing efficiency, multiple instruments need to be equipped. However, because they cannot be integrated into automated production lines, this method is inefficient, costly, and requires a large investment for large-scale testing, failing to meet the needs of automated production lines.

[0004] Therefore, existing circuit board testing equipment is inefficient and cannot meet the needs of automation. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide a circuit board OS testing device that can solve the problems of low efficiency and inability to meet automation requirements in existing circuit board testing equipment.

[0006] The above-mentioned technical objective of this utility model is achieved through the following technical solution:

[0007] A circuit board OS testing device, comprising:

[0008] A frame, on which a turntable is rotatably mounted;

[0009] A carrier board assembly, comprising a carrier board and a first test unit; the carrier board is disposed on the turntable, the first test unit is disposed on the carrier board, and the first test unit has a placement position for placing and fixing the circuit board to be tested; and

[0010] The top plate assembly includes a top plate and a second test unit. The top plate is vertically and vertically mounted on the frame, and the second test unit is located on the side of the top plate facing the carrier assembly. At least one of the first test unit and the second test unit is provided with pins for contacting test points on the circuit board under test. When the top plate is raised or lowered closer to the carrier board, the first test unit and the second test unit are pressed together to make the pins contact the test points on the circuit board under test.

[0011] In one feasible embodiment, the frame includes a base plate, a middle plate, a top plate, and columns, wherein the base plate and the middle plate, and the middle plate and the top plate are respectively connected by columns to form a frame structure.

[0012] In one feasible embodiment, a lifting platform is provided on the frame, and the top plate is provided on the lifting platform. The lifting platform includes a first frame plate, a second frame plate, a guide cylinder, a connecting rod, and a lifting drive mechanism. The first frame plate and the second frame plate are fixedly connected by the connecting rod. The top plate is provided on the second frame plate. The guide cylinder is provided on the first frame plate and is sleeved on the column to form a lifting guide. The lifting drive mechanism is fixedly provided on the intermediate plate, and the output end of the lifting drive mechanism is connected to the first frame plate.

[0013] In one feasible embodiment, a first positioning block is provided on the frame, and a position sensor is provided on the first positioning block. A second positioning block is provided on the turntable. When the carrier plate rotates into position, the first positioning block and the second positioning block move closer to each other and are sensed by the position sensor.

[0014] In one feasible embodiment, a plurality of carrier plates are provided, which are arranged in the circumferential direction of the turntable, and each carrier plate is provided with a plurality of the first test units.

[0015] In one feasible embodiment, the carrier plate assembly further includes a pad plate, the pad plate being fixedly disposed on the turntable, the carrier plate being disposed on the pad plate, the carrier plate being movable up and down relative to the pad plate, and a buffer spring being provided between the carrier plate and the pad plate.

[0016] In one feasible embodiment, the first test unit is provided with a clamping block, which is rotatably disposed at the edge of the placement position via a rotating shaft, and the clamping block can rotatably clamp the circuit board to be tested placed at the placement position.

[0017] In one feasible embodiment, the first test unit is provided with a placement slot as the placement position, and the second test unit is provided with a positioning structure corresponding to the circuit board to be tested. When the first test unit and the second test unit are aligned and pressed together, the positioning structure is used to insert into the placement slot and press the circuit board to be tested.

[0018] In one possible embodiment, a test control box is further included, which is electrically connected to the pins and is used to control the testing of the circuit board to be tested.

[0019] In one feasible embodiment, a barcode scanning component is further included, the barcode scanning component including a camera bracket and a camera, the camera bracket being fixed on the frame and the camera being mounted on the camera bracket, the barcode scanning component being used to scan and confirm the circuit board to be tested.

[0020] By adopting the above technical solution, this utility model has at least the following beneficial effects:

[0021] The circuit board OS testing device provided by this utility model is configured with a top plate assembly and a carrier plate assembly to perform circuit board testing. Specifically, it consists of a first testing unit and a second testing unit to test the electrical functions of the circuit board under test. The first testing unit is rotated and switched by a turntable, and the second testing unit is raised and lowered by a lifting top plate. This device can realize automated OS testing of circuit boards with high testing efficiency. It can be integrated into automated production lines, saving testing time and reducing the labor intensity of workers. Attached Figure Description

[0022] Figure 1 This is a three-dimensional side view of the circuit board OS testing device provided in this embodiment of the utility model;

[0023] Figure 2 This is a schematic diagram of the main structure of the circuit board OS testing device provided in this embodiment of the utility model;

[0024] Figure 3 This is a schematic diagram of the carrier plate assembly structure provided in this embodiment of the utility model;

[0025] Figure 4 This is a schematic diagram of the ceiling panel assembly structure provided in an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of a circuit board to be tested provided in an embodiment of this utility model;

[0027] Figure 6 This is a schematic diagram of the structure of the frame provided in this embodiment of the utility model;

[0028] Figure 7This is a three-dimensional structural diagram of the first layer of the frame provided in this embodiment of the utility model;

[0029] Figure 8 This is a schematic diagram of the main view of the first layer structure of the frame provided in this embodiment of the utility model;

[0030] Figure 9 This is a schematic diagram of the mating structure of the carrier plate and the pad provided in an embodiment of this utility model;

[0031] Figure 10 This is a schematic diagram of the main view of the second layer structure of the frame provided in this embodiment of the utility model;

[0032] Figure 11 This is another schematic diagram of the circuit board OS testing device provided in this embodiment of the utility model;

[0033] Figure 12 This is an exploded structural diagram of the first test unit and the second test unit cooperating according to an embodiment of the present invention;

[0034] Figure 13 This is a schematic diagram of the structure of the first test unit provided in this embodiment of the utility model;

[0035] Figure 14 This is a schematic diagram of the structure of the second test unit provided in this embodiment of the present invention;

[0036] Figure 15 This is a schematic diagram of the structure of the barcode scanning component provided in this embodiment of the utility model.

[0037] In the attached diagram, 1. Frame; 11. Turntable; 111. First positioning block; 112. Position sensor; 113. Second positioning block; 12. Base plate; 13. Middle plate; 14. Top plate; 15. Column; 16. Rotation drive device; 17. Support structure; 18. Lifting platform; 181. First support plate; 182. Second support plate; 183. Guide cylinder; 184. Connecting rod; 185. Lifting drive mechanism; 2. Carrier plate assembly; 21. Carrier plate; 22. First test unit; 2 3. Pad; 24. Buffer spring; 25. Guide rod; 26. Clamping block; 27. Rotating shaft; 28. Placement slot; 3. Top plate assembly; 31. Top plate; 32. Second test unit; 33. Positioning structure; 4. Pin; 5. Test control box; 6. Barcode scanning assembly; 61. Camera bracket; 62. Camera; 63. Illumination lamp; 7. Signal conversion module; 71. Top plate signal conversion unit; 72. Carrier board signal conversion unit; 100. Circuit board to be tested; 101. Test point. Detailed Implementation

[0038] The technical solution of this utility model patent will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0039] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0040] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] See Figures 1-5 ,in Figure 1 This is a three-dimensional side view of the circuit board OS testing device provided in this embodiment of the utility model. Figure 2 This is a front view structural diagram of the circuit board OS testing device provided in this embodiment of the utility model. Figure 3 This is a schematic diagram of the carrier board assembly structure provided in this embodiment. Figure 4 This is a schematic diagram of the ceiling panel assembly structure provided in this embodiment of the utility model. Figure 5 This is a schematic diagram of the structure of a circuit board to be tested provided in this embodiment of the present invention. The circuit board OS testing device provided in this embodiment includes:

[0042] Frame 1, on which a turntable 11 is rotatably mounted;

[0043] Carrier assembly 2, comprising a carrier plate 21 and a first test unit 22; the carrier plate 21 is disposed on the turntable 11, and the first test unit 22 is disposed on the carrier plate 21, the first test unit 22 having a placement position for placing and fixing the circuit board 100 to be tested; and

[0044] The top plate assembly 3 includes a top plate 31 and a second test unit 32. The top plate 31 is vertically and vertically mounted on the frame 1, and the second test unit 32 is located on the side of the top plate 31 facing the carrier plate assembly 2. At least one of the first test unit 22 and the second test unit 32 is provided with a pin 4, which is used to contact the test point of the circuit board 100 under test. When the top plate 31 is raised and lowered close to the carrier plate 21, the first test unit 22 and the second test unit 32 are pressed together to make the pin 4 contact the test point of the circuit board 100 under test.

[0045] It is understood that the circuit board to be tested in this embodiment can be placed on the first test unit 22 by a robotic arm or robot, or the tested circuit board can be removed from the first test unit 22 by a robotic arm or robot. This enables the circuit board OS testing device in this embodiment to be connected to the automated production line of circuit board production, thereby improving the efficiency of automated testing and production.

[0046] It is understandable that "circuit board to be tested 100" does not specifically refer to any particular type of circuit board; it mainly includes any integrated circuit board that requires OS testing. For example... Figure 5 As shown, this embodiment mainly uses a flexible circuit board as an example for explanation. Generally, when the circuit board to be tested needs to test the electrical function of the circuit, test points 101 will be reserved. This embodiment is based on... Figure 5 The example is used for illustration, but it does not explicitly and strictly limit the type and specific structure of the circuit board to be tested. Those skilled in the art can select the specific circuit board object according to actual needs and make simple modifications and adjustments to the circuit board OS testing device of this utility model, which will not be further described here.

[0047] It is understandable that, such as Figure 6The diagram shows the structural schematic of the frame provided in this embodiment. Frame 1 mainly includes two layers. From bottom to top, the first layer is used to set the carrier plate assembly 2, and the second layer is used to set the top plate assembly 3. The main structure of frame 1 mainly includes a base plate 12, a middle plate 13, a top plate 14, and columns 15. The base plate 12 and the middle plate 13, and the middle plate 13 and the top plate 14 are connected by columns 15 to form a frame structure. In this embodiment, the relationship between the base plate 12 and the middle plate 13 is represented as the first layer structure, and the relationship between the middle plate 13 and the top plate 14 is represented as the second layer structure for ease of description. It is understood that the main function of frame 1 is to support and set other parts and components. The frame 1 described in this embodiment is only one possible specific embodiment. Those skilled in the art can set different simple deformation structures to form an overall frame according to actual needs and in combination with the description in this embodiment of the utility model. Further description is not provided here.

[0048] It is understood that the circuit board OS test mentioned in this embodiment mainly refers to the open-short circuit test, which can detect whether there are open circuits and short circuits on the circuit board. In this field, OS testing is generally performed by contacting test points arranged on the circuit board with probes or pins. Without disassembling electronic components, a comprehensive electrical test of the circuit board can be performed. Specifically, it can include open circuit and short circuit tests, resistance tests, capacitance and inductance tests, etc., depending on actual needs. The specific test content can be selected and set by those skilled in the art according to actual needs. In this embodiment, they are collectively referred to as OS testing. In the existing technology, the most common equipment for OS testing is ICT testing equipment (In-Circuit Tester, also known as online tester). The implementation of OS testing, the content of conventional ICT testing equipment, and other functions can be referenced from existing ICT testing equipment. For example, ICT testing equipment generally includes a PC (either a computer or test control box 5), test circuits, a test platen and bed of pins, and a display. In this embodiment, the circuit board OS testing device can implement the basic control functions of the PC, test circuits, and display by integrating them with the test control box 5. That is, the test control box 5 can also be used for specific control, calculation, and display of OS testing, which will not be further described here. This embodiment focuses on the first test unit 22 and the second test unit 32 required for OS testing. The pressing principle of the first test unit 22 and the second test unit 32 is equivalent to the test platen and bed of pins of traditional ICT testing equipment; specific details will be introduced later.

[0049] Furthermore, when testing the circuit board, it is necessary to test the electrical performance of the circuit, which needs to be done with the circuit connected. Therefore, in this embodiment, the circuit board to be tested is connected to an external test circuit by setting pins, so as to simulate whether the button function is working properly when the circuit board is working normally. The specific external test circuit can be pre-designed by those skilled in the art according to the actual test content, and will not be described in detail here. For example, to test whether the circuit can be switched normally, the external test circuit can be a circuit system including a power supply and a light bulb. Of course, this is only a simple example, and more specific situations will not be further elaborated here.

[0050] In this embodiment, as Figure 6 as well as Figure 7 As shown, Figure 7 This is a three-dimensional structural diagram of the first layer of the frame provided in this embodiment. The frame 1 is provided with a rotatable turntable 11, and the carrier plate 21 is provided on the turntable 11. There are several carrier plates 21, which are arranged in the circumferential direction of the turntable 11. Several first test units 22 are provided on each carrier plate 21.

[0051] It is understood that in this embodiment, the carrier plate 21 is mounted on the turntable 11, so that the carrier plate 21 can be rotated by rotating the turntable 11, thus separating the loading position and the testing position. Specifically, for example... Figure 1 The side facing outwards from the paper is the front side, serving as the loading position, and the rear side is the testing position. Initially, the carrier board 21 is located at the front side. After placing the circuit board 100 to be tested in the placement position of the first testing unit 22, the turntable 11 is controlled to rotate, causing the carrier board 21 to rotate the circuit board 100 to be tested to the rear testing position for testing. This facilitates the separation of the testing position and the loading position, which firstly improves safety. Secondly, in this embodiment, multiple carrier boards 21 are used, and multiple first testing units 22 are set for each carrier board 21, which is equivalent to performing testing work on multiple circuit boards 100 to be tested at one time, which can improve work efficiency. Furthermore, when the carrier board 21 rotated to the testing position is tested sequentially, the carrier board 21 located at the loading position can perform loading or unloading operations, and the cyclical operation improves work efficiency.

[0052] Specifically, in this embodiment, such as Figure 7As shown, there are two carrier boards 21, corresponding to the loading and testing positions. Each time the turntable 11 rotates, one carrier board 21 rotates into the testing position, while the other carrier board 21 remains in the loading position. The carrier board 21 in the testing position can perform testing, while the carrier board 21 in the loading position can be used for loading or unloading. It is understood that the number of carrier boards 21 can be selected according to actual needs, such as three or four. More carrier boards 21 temporarily store more circuit boards between loading and testing, but this will not be further described here. Furthermore, in this embodiment, one carrier board 21 is provided with two first testing units 22, and the corresponding top plate 31 is provided with two second testing units 32 for synchronous testing. This allows the circuit board OS testing device in this embodiment to test two circuit boards at once. In addition, in other embodiments, the carrier boards 21 can be integrated into a single design, i.e., only one overall carrier board structure is set up. For example, in this embodiment, two carrier boards are integrated into a single design, and the corresponding testing and loading positions are set up and controlled accordingly. In general, each of the carrier plate 21, the first test unit 22, and the second test unit 32 in this embodiment of the present invention is provided at least once to form an overall device that realizes basic testing functions. However, the specific number of each component can be simply adjusted and implemented according to the workstations designed as needed and the number of tests conducted at one time, which will not be further described here.

[0053] In this embodiment, as Figure 7 As shown, a first positioning block 111 is provided on the frame 1, and a position sensor 112 is provided on the first positioning block 111. A second positioning block 113 is provided on the turntable 11. When the carrier plate rotates into position, the first positioning block 111 and the second positioning block 113 move closer to each other and are sensed by the position sensor 112. Specifically, two first positioning blocks 111 are provided on the left and right sides of the middle plate 13 of the frame 1, and a second positioning block 113 is provided on the turntable 11. When the carrier plate 21 rotates into position with the turntable 11, the first positioning blocks 111 and the second positioning blocks 113 move closer to each other and are sensed by the position sensor 112 to form a positioning, ensuring accurate positioning and preventing the carrier plate 21 from rotating excessively and causing accidents, thereby ensuring safety. The position sensor can be a conventional infrared positioning sensing device, which will not be described further here. Note that in this embodiment, as... Figure 7The diagram shows two carrier plates 21. The turntable 11 can rotate clockwise and counterclockwise, causing the second positioning block 113 on the turntable 11 to move closer to the two first positioning blocks 111 on the left and right sides respectively. This process switches the carrier plates 21. Further details are not described here. It is understood that although this embodiment uses the first positioning block 111 and the second positioning block 113 respectively on the middle plate 13 and the turntable 11 as an example, those skilled in the art can make simple adjustments according to actual needs to achieve limiting and safety protection. For example, the second positioning block 113 can be placed on the carrier plate 21, or the turntable 11 can be designed to rotate only in one direction, clockwise or counterclockwise. Further details are not described here. Furthermore, this embodiment uses the first and second positioning blocks being on the same plane as an example. However, if multiple carrier plates are used, the first and second positioning blocks can be staggered vertically, so that when the carrier plates rotate in a specific direction, they can be sensed into position sequentially. Further details and possible scenarios are not described here.

[0054] like Figure 8 The image shown is a schematic diagram of the main structure of the first layer of the frame provided in this embodiment. Figure 7 In this embodiment, the turntable 11 is fixed to the base plate 12 of the frame 1 by a rotation drive device 16. The rotation drive device 16 can be a conventional rotation motor and a general combination of auxiliary parts. The rotation setting of the turntable 11 can refer to the conventional design and will not be described further here.

[0055] Furthermore, such as Figure 7 , Figure 8 and Figure 9 As shown, Figure 9 This is a schematic diagram of the cooperation structure of the carrier plate and the pad provided in this embodiment. In this embodiment, the carrier plate assembly 2 also includes a pad 23. The pad 23 is fixedly mounted on the turntable 11. The carrier plate 21 is mounted on the pad 23. The carrier plate 21 can move up and down relative to the pad 23. A buffer spring 24 is connected between the carrier plate 21 and the pad 23.

[0056] Specifically, the pad 23 is fixedly mounted on the turntable 11. The pad 23 and the carrier plate 21 are connected by a guide rod 25. The upper part of the guide rod 25 is fixed on the pad 23, and the end passes through the guide hole (not shown) on the carrier plate 21, so that the carrier plate 21 can move up and down relative to the pad 23. A buffer spring 24 is provided between the pad 23 and the carrier plate 21. In general, in this embodiment, by raising and lowering the pad 23 and the carrier plate 21 and by using the buffer spring 24 to buffer the movement, the impact can be reduced when the top plate 31 and the carrier plate 21 are pressed together, so as to avoid damage to the components and the circuit board to be tested. At the same time, a certain spring compression space can also ensure that the first test unit 22 and the second test unit 32 are effectively pressed together.

[0057] Furthermore, in combination Figure 8 In this embodiment, the bottom plate 12 of the frame 1 is provided with a support structure 17. The support structure 17 is located directly below the guide rod 25. It can prevent the guide rod 25 from being damaged when the top plate 31 is pressed down excessively due to a malfunction. The shape and structure of the support structure 17 can be designed according to actual needs. For example, it can be a regular support block or support column. It can also be combined into a simple bracket structure according to actual needs. It will not be described further here.

[0058] In this embodiment, as Figure 6 and Figure 10 As shown, Figure 10 This is a schematic diagram of the main structure of the second layer of the frame provided in this embodiment. Specifically, a lifting platform 18 is provided on the frame 1, and the top plate 31 is provided on the lifting platform 18. The lifting platform 18 includes a first frame plate 181, a second frame plate 182, a guide cylinder 183, a connecting rod 184, and a lifting drive mechanism 185. The first frame plate 181 and the second frame plate 182 are fixedly connected by the connecting rod 184. The top plate 31 is provided on the second frame plate 182. The guide cylinder 183 is provided on the first frame plate 181, and the guide cylinder 183 is sleeved on the column 15 to form a lifting guide. The lifting drive mechanism 185 is fixedly provided on the intermediate plate 13, and the output end of the lifting drive mechanism 185 is connected to the first frame plate 181. In this embodiment, the lifting drive mechanism 185 can be a conventional lifting mechanism such as a telescopic cylinder, telescopic rod, screw slider, etc. The lifting drive mechanism 185 drives the top plate 31 to move up and down along the column 15 of the frame 1, so that the second test unit 32 set on the top plate 3 moves up and down with it, pressing the second test unit 32 and the first test unit 22 together.

[0059] Furthermore, such as Figure 10As shown, in this embodiment, the number of second test units 32 corresponding to the number of first test units 22 set on the top plate 31 and the number of second test units 32 on the top plate 31 can be pressed together with the first test units 22 on the carrier plate 21 by raising and lowering the top plate 31. It is understood that this embodiment takes two second test units 32 as an example, but the specific number can be selected according to actual needs, which will not be further described here.

[0060] In this embodiment, as Figure 11 The diagram shown is a schematic diagram of another state structure of the circuit board OS testing device provided in this embodiment. In this embodiment, a test control box 5 is also included. The test control box 5 is electrically connected to the pin 4 and is used to control the testing of the circuit board 100 to be tested.

[0061] It is understood that the test control box 5 may include necessary hardware and software such as control circuits, a display screen, and a microprocessor. Its main function is to control the testing of the first test unit 22 and the second test unit 32, as well as other actions such as the rotation of the carrier board 21 and the lifting of the top plate 31. It also receives real-time test data during the testing process. Further hardware and software functions can be implemented by those skilled in the art based on the above description and the desired functionality. If necessary, existing ICT test equipment control boxes can be referenced and combined with simple modifications for implementation; these will not be further described here. It is understood that, as mentioned earlier, OS testing mainly detects whether the electrical functions of the circuit board are normal. In this embodiment, testing is mainly performed on preset test points on the circuit board. Generally, if it is a continuity test, the circuit board can be connected to the circuit through an external circuit for testing. The specific test circuit can be set in the test control box 5 according to actual needs; these will not be further described here.

[0062] In this embodiment, at least one of the first and second test units is provided with pins. These pins are electrically connected to preset test points on the circuit board under test to facilitate OS testing. Several scenarios are possible: first, the first test unit has pins, and the second test unit primarily clamps and secures the circuit board under test; second, the second test unit has pins, and the first test unit primarily clamps and secures the circuit board under test; third, both the first and second test units have pins. Those skilled in the art can choose the appropriate design based on actual needs. Figures 12-14 As shown, Figure 12 This is a schematic diagram of the exploded structure of the first test unit and the second test unit provided in this embodiment. Figure 13 This is a schematic diagram of the structure of the first test unit provided in this embodiment of the present invention. Figure 14This is a schematic diagram of the structure of the second test unit provided in this embodiment of the present invention. In this embodiment, the first case described above is used as an example. The pin 4 is disposed on the first test unit 22. The pin 4 is used to connect the test point 101 of the circuit board 100 to be tested, which is placed at the placement position of the first test unit 22, to the test circuit to conduct OS test.

[0063] In this embodiment, as Figure 12 As shown, the first test unit 22 is provided with a clamping block 26. The clamping block 26 is rotatably disposed on the edge of the placement position via a rotating shaft 27. The clamping block 26 can rotate to clamp the circuit board 100 to be tested placed in the placement position, so that the circuit board 100 to be tested can make effective contact with the pins 4. It also makes it easier for the operator to fix the circuit board to be tested before loading. The other two types of pin combinations will not be further described and illustrated here. Those skilled in the art can simply adjust and implement them according to the above examples and actual needs.

[0064] In this embodiment, as Figure 12 , Figure 13 , Figure 14 As shown, the first test unit 22 is provided with a placement slot 28 serving as the placement position, and the second test unit 32 is provided with a positioning structure 33 corresponding to the button 101 of the circuit board 100 under test. When the first test unit 22 and the second test unit 32 are aligned and pressed together, the positioning structure 33 is used to insert into the placement slot 28 and press the circuit board 100 under test firmly. It can be understood that by pressing the circuit board under test with the positioning structure 33, loosening during testing can be avoided, which would affect the test results. In addition, the positioning structure 33 can be adaptively designed according to the shape of the circuit board 100 under test, for example... Figure 12 As shown, the positioning structure 33 is a ring-shaped protrusion structure. More feasible solutions will not be described in detail here.

[0065] It is understood that the placement slot 28 as a placement position is only one possible embodiment in this embodiment. In addition, the placement position can also be a non-recessed structure, such as a structure in which positioning blocks are set around the perimeter to form a structure that surrounds and fixes the circuit board to be tested. In addition, there can be other simpler variations, which will not be described in detail here.

[0066] In this embodiment, as Figure 1 and Figure 15 As shown, Figure 15The diagram below shows the structure of the barcode scanning component provided in this embodiment. The circuit board OS testing device provided in this embodiment also includes a barcode scanning component 6. The barcode scanning component 6 includes a camera bracket 61 and a camera 62. The camera bracket 61 is fixed on the frame 1, and the camera 62 is mounted on the camera bracket 61. The barcode scanning component 6 is used to scan and confirm the circuit board to be tested.

[0067] Understandably, identification codes can be set on the circuit board under test, and the barcode scanning component 6 can identify and record them to facilitate the management of automated production operations. Furthermore, specific barcodes or labels, as well as the camera 62, can be selected from existing mature components according to actual needs, and will not be described further here. Understandably, the barcode scanning component 6 can communicate with the test control box 5 or control terminal devices such as computers, and can also be equipped with lighting 63 to provide sufficient lighting conditions.

[0068] It is understandable that, such as Figures 3-4 As shown, in addition to the above-described content, this embodiment may also include a signal conversion module 7. The signal conversion module 7 mainly includes a top plate signal conversion unit 71 and a carrier plate signal conversion unit 72. The top plate signal conversion unit 71 is disposed on the top plate 31, and the carrier plate signal conversion unit 72 is disposed on the carrier plate 21. The top plate signal conversion unit 71 and the carrier plate signal conversion unit 72 are plug-in combined signal conversion devices. When the top plate 31 and the carrier plate 21 move close together, the top plate signal conversion unit 71 and the carrier plate signal conversion unit 72 cooperate to plug in and transfer the control and test signals of the carrier plate 21 to the test control box 5 or the computer. In general, the signal conversion module 7 mainly performs signal conversion to facilitate the control of equipment operation. The specific type of signal conversion module 7 can adopt the mature and conventional signal conversion devices in the prior art, which will not be further described here.

[0069] Furthermore, when necessary, the circuit board OS testing device in this embodiment can be equipped with a safety protection plate or an infrared safety sensing laser on the outside of the frame 1, and can also be equipped with necessary conventional components such as a start button and lights, which will not be described further here.

[0070] The working process and principle of the circuit board OS testing device in this embodiment of the utility model are as follows:

[0071] The circuit board to be tested is placed in the first test unit 22 placement slot 28 of the front upper part position carrier board 21. The camera 62 in the barcode scanning assembly 6 is activated to scan the circuit board to be tested in the first test unit 22 of the upper part position for confirmation. After scanning, the upper part position carrier board 21 is driven to rotate to the test position by the turntable 11. The top plate assembly 3 is pressed down with the carrier board assembly 2 by the top plate 31. After it is in place, the test is started. The first test unit 22 on the carrier board 21 and the second test unit 32 on the top plate 31 work together to perform electrical function tests on the circuit board to be tested. After the test is completed, the top plate 31 is raised. During the test, a new circuit board to be tested can be placed in the first test unit 22 on another carrier board 21. After the test of the test position is completed, the new circuit board to be tested can be rotated to the test position by the turntable 11 for testing. The test can be carried out by reciprocating the cycle.

[0072] Due to the adoption of the above technical solution, the circuit board OS testing device of this utility model embodiment has at least the following beneficial effects:

[0073] The circuit board OS testing device provided by this utility model is configured with a top plate assembly 3 and a carrier board assembly 2 to perform circuit board testing. Specifically, it uses a first testing unit 22 and a second testing unit 32 to test the electrical functions of the circuit board to be tested. The first testing unit 22 is rotated and switched by a turntable 11, and the second testing unit 32 is raised and lowered by a lifting top plate 31. This device can realize automated OS testing of circuit boards, with high testing efficiency. It can be integrated into automated production lines, saving testing time and reducing the labor intensity of workers.

[0074] Although the present invention has been described in detail above with general descriptions and specific embodiments, some modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A circuit board OS testing apparatus characterized by comprising: The utility model relates to a circuit board testing device, including: Frame, the frame is rotationally provided with rotary table on it; The carrier plate assembly includes a carrier plate and a first test unit. The carrier plate is arranged on the rotary table, the first test unit is arranged on the carrier plate, and a placement position for placing a circuit board to be tested is arranged on the first test unit. The utility model also includes a ceiling plate assembly, which includes a ceiling plate and a second test unit. The ceiling plate is arranged on the frame in a lifting manner, and the second test unit is arranged on the side of the ceiling plate facing the carrier plate assembly. At least one of the first test unit and the second test unit is provided with a pin for contacting the test points of the circuit board to be tested. When the ceiling plate is lifted to be close to the carrier plate, the first test unit and the second test unit are pressed together to make the pin contact the test points of the circuit board to be tested. The frame includes a bottom plate, an intermediate plate, a top plate and a stand. The bottom plate and the intermediate plate, and the intermediate plate and the top plate are connected by the stand to form a frame structure.

2. The circuit board OS testing apparatus according to claim 1, characterized by The frame is provided with a lifting platform, and the ceiling plate is arranged on the lifting platform. The lifting platform includes a first shelf plate, a second shelf plate, a guide cylinder, a connecting rod and a lifting driving mechanism. The first shelf plate and the second shelf plate are fixedly connected by the connecting rod. The second shelf plate is provided with the ceiling plate. The guide cylinder is arranged on the first shelf plate and is sleeved on the stand to form a lifting guide. The lifting driving mechanism is fixedly arranged on the intermediate plate, and the output end of the lifting driving mechanism is connected with the first shelf plate.

3. The circuit board OS testing apparatus according to claim 2, characterized by The frame is provided with a first positioning block, and the first positioning block is provided with a position sensor. The rotary table is provided with a second positioning block. When the carrier plate is rotated to a position, the first positioning block and the second positioning block are close to each other and are sensed by the position sensor.

4. The circuit board OS testing apparatus according to claim 1, characterized by The carrier plate is provided with a plurality of carrier plates arranged in the circumferential direction of the rotary table. Each carrier plate is provided with a plurality of first test units.

5. The circuit board OS testing apparatus according to claim 1, characterized by The carrier plate assembly further includes a backing plate fixedly arranged on the rotary table. The carrier plate is arranged on the backing plate. The carrier plate can move up and down relative to the backing plate, and a buffer spring is arranged between the carrier plate and the backing plate.

6. The circuit board OS testing apparatus according to claim 1, wherein The first test unit is provided with a pressing block rotatably arranged on the edge of the placement position by a rotating shaft. The pressing block can rotate to press the circuit board to be tested placed in the placement position.

7. The circuit board OS testing apparatus according to claim 1, wherein The first test unit is provided with a placement groove as the placement position. The second test unit is provided with a positioning structure corresponding to the circuit board to be tested. When the first test unit and the second test unit are aligned and pressed together, the positioning structure is inserted into the placement groove and presses the circuit board to be tested.

8. The circuit board OS testing apparatus according to claim 1, characterized by The utility model also includes a test control box electrically connected with the pin for controlling the test of the circuit board to be tested.

9. The circuit board OS testing apparatus according to claim 1, wherein The utility model also includes a code scanning assembly, which includes a camera support and a camera. The camera support is fixed on the frame, and the camera is arranged on the camera support. The code scanning assembly is used for code scanning confirmation of the circuit board to be tested.

10. The circuit board OS testing apparatus according to claim 1, characterized by ​

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