Mylar conduction structure and electronic equipment
By aligning the projections of the first and second layers of the myla sheet onto the conductive layer, the problem of complex myla sheet processing steps was solved, achieving efficient production and low-cost myla sheet manufacturing.
Patent Information
- Application Number
- CN202520159980.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2035-01-21
AI Technical Summary
In the existing technology, the different opening positions of Mylar sheets require different processing steps during the production process, which increases processing costs and reduces production efficiency.
By aligning the projections of the first Mylar layer onto the conductive layer with the projections of the second Mylar layer onto the conductive layer, the shape and structure of the two Mylar layers are made identical, thereby simplifying the processing steps and reducing the number of processing operations.
This improved the production efficiency of Mylar sheets, reduced processing costs, and ensured the insulation and shielding effects of Mylar sheets.
Smart Images
Figure CN223770894U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of conduction technology, and in particular to a Mylar sheet conduction structure and electronic device. Background Technology
[0002] Typically, laptops and other electronic devices have two adjacent USB (Universal Serial Bus) ports, each connected to a separate device such as a hard drive or mouse. This can easily lead to mouse lag or unresponsiveness. To address this, related technologies use aluminum foil for shielding, and to mitigate the risk of short circuits, Mylar sheets are placed on both the top and bottom of the aluminum foil for insulation.
[0003] However, due to the different connection positions with the aluminum foil, the opening positions on the upper and lower Mylar sheets of the aluminum foil are different. As a result, in the process of producing three-layer Mylar aluminum, the two Mylar sheets require different production steps because of the different opening positions. This makes the processing process complicated, increases the processing cost, and is not conducive to improving the production efficiency of Mylar aluminum. Utility Model Content
[0004] The main purpose of this invention is to propose a conductive structure and electronic device for Mylar sheets, aiming to reduce the processing cost of Mylar sheets and improve production efficiency.
[0005] To achieve the above objectives, the Mylar sheet conductive structure proposed in this utility model includes:
[0006] A first Mylar layer, wherein a first through-hole is provided on the first Mylar layer;
[0007] A second Mylar layer, wherein a second through-hole is provided on the second Mylar layer;
[0008] A conductive layer is disposed between the first Mylar layer and the second Mylar layer;
[0009] Wherein, the projection of the first Mylar layer onto the conductive layer coincides with the projection of the second Mylar layer onto the conductive layer.
[0010] In one embodiment, the profile cross-section of the first through hole is equal to the profile cross-section of the second through hole.
[0011] In one embodiment, the conductive layer is exposed in the first via and the conductive layer is exposed in the second via;
[0012] Wherein, the cross-sectional area of the conductive layer is greater than the outline cross-sectional area of the first through hole, and the cross-sectional area of the conductive layer is greater than the outline cross-sectional area of the second through hole.
[0013] In one embodiment, a gap is provided between the edge of the conductive layer and the edge of the first Mylar layer, and the gap is provided between the edge of the conductive layer and the edge of the second Mylar layer;
[0014] The edge of the conductive layer is located between the first Mylar layer and the second Mylar layer.
[0015] In one embodiment, the vertical spacing is greater than or equal to 0.5 mm.
[0016] In one embodiment, the first Mylar layer has a first extension on its side, and the first extension has a first through hole; the second Mylar layer has a second extension on its side, and the second extension has a second through hole.
[0017] The first extension portion and the second extension portion are disposed opposite to each other, and the conductive layer extends between the first extension portion and the second extension portion.
[0018] In one embodiment, the surface of the first Mylar layer facing away from the conductive layer is coated with an adhesive portion, or the surface of the second Mylar layer facing away from the conductive layer is coated with the adhesive portion.
[0019] In one embodiment, the conductive layer surface exposed in the first through hole is coated with a conductive adhesive portion, and / or the conductive layer surface exposed in the second through hole is coated with the conductive adhesive portion.
[0020] This invention also proposes an electronic device, which further includes the Mylar sheet conductive structure.
[0021] In one embodiment, the electronic device further includes a housing, within which a circuit board is disposed, and the circuit board is connected to an interface via a connector;
[0022] The conductive layer exposed in the first through hole is connected to the connector, and the conductive layer exposed in the second through hole is connected to the housing.
[0023] The technical solution of this utility model is to make the projection of the first Mylar layer on the conductive layer coincide with the projection of the second Mylar layer on the conductive layer, so that the first Mylar layer and the second Mylar layer have the same shape and structure, which facilitates the processing of the first Mylar layer and the second Mylar layer, reduces the number of times Mylar sheets are processed, thereby improving the production efficiency of Mylar sheets and reducing the cost of processing and producing Mylar sheets. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0025] Figure 1 A schematic diagram of an embodiment of the Mylar sheet conductive structure provided by this utility model;
[0026] Figure 2 A schematic diagram of another embodiment of the Mylar sheet conductive structure provided by this utility model;
[0027] Figure 3 A schematic diagram of another embodiment of the Mylar sheet conductive structure provided by this utility model;
[0028] Figure 4 for Figure 3 Sectional view at point AA;
[0029] Figure 5 This is a schematic diagram of another embodiment of the Mylar sheet conductive structure provided by this utility model.
[0030] Explanation of icon numbers:
[0031] 100. Mylar sheet conductive structure; 10. First Mylar layer; 20. Conductive layer; 30. First through hole; 40. Second Mylar layer; 50. Second through hole.
[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0036] This invention proposes a Mylar sheet conductive structure.
[0037] Please see Figure 1 In one embodiment of this utility model, the Mylar sheet conductive structure includes:
[0038] A first Mylar layer 10 is provided with a first through-hole 30;
[0039] A second Mylar layer 40 is provided with a second through hole 50;
[0040] Conductive layer 20, wherein the conductive layer 20 is disposed between the first Mylar layer 10 and the second Mylar layer 40;
[0041] The projection of the first Mylar layer 10 onto the conductive layer 20 coincides with the projection of the second Mylar layer 40 onto the conductive layer 20.
[0042] It is understood that the conductive layer 20 is disposed between the first Mylar layer 10 and the second Mylar layer 40, and the conductive layer 20 is isolated by wrapping it with two Mylar layers.
[0043] It is understood that when the conductive layer 20 is made of a conductive material such as aluminum foil, the first Mylar layer 10 and the second Mylar layer 40 sandwich the conductive layer 20 to achieve insulation of the aluminum foil and prevent short circuits or other faults from occurring when the conductive layer 20 comes into contact with other components.
[0044] In another embodiment, when the conductive layer 20 is a thermally conductive layer, the first Mylar layer 10 and the second Mylar layer 40 sandwich the conductive layer 20 to achieve thermal insulation of the thermally conductive layer, so as to avoid the heat of the thermally conductive layer from affecting other components during the heat transfer process and to ensure the stability of heat dissipation.
[0045] like Figure 4 As shown, the first Mylar layer 10 is provided with the first through hole 30, so that the conductive layer 20 is exposed through the first through hole 30, so that the exposed conductive layer 20 can be connected to the interface of the circuit board or other equipment. The second Mylar layer 40 is also provided with the second through hole 50, so that the conductive layer 20 can also be exposed through the second through hole 50, so that the exposed conductive layer 20 can be connected to the interface of the circuit board or other equipment.
[0046] It is understood that by opening the first through hole 30 and the second through hole 50 on the first Mylar layer 10 and the second Mylar layer 40 respectively, the conductive layer 20 is exposed through the first through hole 30 and the second through hole 50, and the components to be connected are connected by relying on the exposed conductive layer 20. In this way, the components can be shielded from each other by relying on the conductive layer 20, or the components can be made heat-conducting and dissipated by relying on the conductive layer 20.
[0047] It should be noted that the outer contour size of the first Mylar layer 10 is the same as that of the second Mylar layer 40, and the position of the first through hole 30 in the first Mylar layer 10 is the same as that of the second through hole 50 in the second Mylar layer 40.
[0048] It is understood that the first through hole 30 and the second through hole 50 are both provided to expose the conductive layer 20 so as to facilitate connection with the device.
[0049] It should be noted that when the Mylar film conductive structure 100 is applied to shield between two adjacent USB ports of a laptop, the positions of the electronic devices connected to the conductive layer 20 exposed in the first through hole 30 and the positions of the electronic devices connected to the conductive layer 20 exposed in the second through hole 50 are different, which results in the position of the first through hole 30 on the first Mylar layer 10 being different from the position of the second through hole 50 on the second Mylar layer 40.
[0050] Therefore, the intersection of the projections of the first through hole 30 and the second through hole 50 on the conductive layer 20 is taken, and the intersection area is expanded to form a new first through hole 30 and a new second through hole 50, thereby making the first Mylar layer 10 and the second Mylar layer 40 have the same shape and structure, which facilitates the processing of the first Mylar layer 10 and the second Mylar layer 40.
[0051] It is understood that the first Mylar layer 10 and the second Mylar layer 40 have the same shape and structure. Therefore, when processing the first Mylar layer 10 and the second Mylar layer 40, the first Mylar layer 10 and the second Mylar layer 40 can be processed simultaneously, or the processing technology and processing tools for processing the first Mylar layer 10 and the second Mylar layer 40 can be the same. This avoids generating the first Mylar layer 10 and the second Mylar layer 40 through different processing methods, thereby improving the processing efficiency of the first Mylar layer 10 and the second Mylar layer 40.
[0052] The technical solution of this utility model is to make the projection of the first Mylar layer 10 on the conductive layer 20 coincide with the projection of the second Mylar layer 40 on the conductive layer 20, so that the first Mylar layer 10 and the second Mylar layer 40 have the same shape and structure, thereby facilitating the processing of the first Mylar layer 10 and the second Mylar layer 40, reducing the number of times Mylar sheets are processed, thereby improving the production efficiency of Mylar sheets and reducing the cost of processing and producing Mylar sheets.
[0053] In one embodiment, the profile cross-section of the first through hole 30 is equal to the profile cross-section of the second through hole 50.
[0054] It is understood that the edge contour of the first through hole 30 is the same as the edge contour of the second through hole 50. Therefore, the process of processing the first through hole 30 on the first Mylar layer 10 is the same as the process of processing the second through hole 50 on the second Mylar layer 40. Furthermore, the first Mylar layer 10 and the second Mylar layer 40 can be processed simultaneously, thereby reducing the processing steps of the first Mylar layer 10 and the second Mylar layer 40 and reducing processing costs.
[0055] In one embodiment, the conductive layer 20 is exposed in the first through-hole 30, and the conductive layer 20 is exposed in the second through-hole 50;
[0056] Wherein, the cross-sectional area of the conductive layer 20 is larger than the outline cross-sectional area of the first through hole 30, and the cross-sectional area of the conductive layer 20 is larger than the outline cross-sectional area of the second through hole 50.
[0057] It is understood that the conductive layer 20 exposed in the first through hole 30 and the conductive layer 20 exposed in the second through hole 50 are both used to overlap or connect electronic devices, while the remaining conductive layers 20 are all wrapped by the first Mylar layer 10 and the second Mylar layer 40, thereby achieving heat insulation or insulation of the conductive layer 20.
[0058] It should be noted that, as Figure 3 and Figure 5As shown, the conductive layer 20 is disposed between the first Mylar layer 10 and the second Mylar layer 40, and the outer contour of the conductive layer 20 is similar to the outer contour of the first Mylar layer 10.
[0059] It is understood that the area of the conductive layer 20 is larger than the outline cross-sectional area of the first through hole 30, and the area of the conductive layer 20 is larger than the outline cross-sectional area of the second through hole 50. This facilitates the conductive layer 20 to cover both the first through hole 30 and the second through hole 50, thereby ensuring the stability of the connection when connected to an electronic device.
[0060] In one embodiment, a gap is provided between the edge of the conductive layer 20 and the edge of the first Mylar layer 10, and the gap is provided between the edge of the conductive layer 20 and the edge of the second Mylar layer 40.
[0061] The edge of the conductive layer 20 is located between the first Mylar layer 10 and the second Mylar layer 40.
[0062] It is understood that the edge contour of the conductive layer 20 does not overlap with the edge contour of the first Mylar layer 10, and the edge contour of the conductive layer 20 does not overlap with the edge contour of the second Mylar layer 40, thereby causing the edge contour of the conductive layer 20 to be recessed within the first Mylar layer 10, and the edge contour of the conductive layer 20 to be recessed within the second Mylar layer 40.
[0063] It is understood that the conductive layer 20 is recessed to avoid the conductive layer 20 being exposed and affecting the heat insulation or insulation effect of the first Mylar layer 10 and the second Mylar layer 40.
[0064] It is understood that there is a gap between the edge of the conductive layer 20 and the edge of the first Mylar layer 10, and there is a gap between the edge of the conductive layer 20 and the edge of the first Mylar layer 10, so that the edge of the conductive layer 20 can be wrapped by the first Mylar layer 10 and the second Mylar layer 40, thereby preventing the conductive layer 20 from contacting other electronic devices and causing short circuits, and ensuring shielding or heat insulation effects.
[0065] In one embodiment, the vertical spacing is greater than or equal to 0.5 mm.
[0066] In one embodiment, the first Mylar layer 10 has a first extension on its side, and the first extension has a first through hole 30. The second Mylar layer 40 has a second extension on its side, and the second extension has a second through hole 50.
[0067] The first extension portion and the second extension portion are disposed opposite to each other, and the conductive layer 20 extends between the first extension portion and the second extension portion.
[0068] To facilitate connection with components, such as Figure 2 As shown, the first extension is provided on the side of the first Mylar layer 10, and the second extension is provided on the side of the second Mylar layer 40, so that the first extension and the second extension can clamp and wrap the extended portion on the conductive layer 20.
[0069] It is understandable that the conductive layer 20 extends towards the component in order to connect with the component, thereby improving the convenience of connecting the component.
[0070] It should be noted that, in order to connect with multiple components, the conductive layer 20 is provided with multiple extensions.
[0071] It is understood that the first Mylar layer 10 has multiple first extensions on its side, and the second Mylar layer 40 has multiple second extensions on its side, so that each part of the conductive layer 20 can be wrapped by one first extension and one second extension to avoid the extension of the conductive layer 20 being exposed and affecting the insulation and heat insulation effect.
[0072] In one embodiment, the surface of the first Mylar layer 10 facing away from the conductive layer 20 is coated with an adhesive portion, or the surface of the second Mylar layer 40 facing away from the conductive layer 20 is coated with the adhesive portion.
[0073] It is understood that the adhesive portion is coated on the surface of the first Mylar layer 10 or the second Mylar layer 40 to facilitate the fixation of the conductive layer 20, which is held between the first Mylar layer 10 and the second Mylar layer 40, onto the device.
[0074] In one embodiment, the conductive layer 20 exposed in the first through hole 30 is coated with a conductive adhesive portion, and / or the conductive layer 20 exposed in the second through hole 50 is coated with the conductive adhesive portion.
[0075] It is understood that by applying a conductive adhesive to the surface of the conductive layer 20 exposed in the first through hole 30 and the second through hole 50, the stability of the connection with the components is ensured, and the conductive adhesive improves the conduction efficiency between the conductive layer 20 and the components.
[0076] This utility model also proposes an electronic device, which includes the Mylar sheet conductive structure 100. The specific structure of the Mylar sheet conductive structure 100 is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0077] In one embodiment, the electronic device further includes a housing, within which a circuit board is disposed, and the circuit board is connected to an interface via a connector;
[0078] The conductive layer 20 exposed in the first through hole 30 is connected to the connector, and the conductive layer 20 exposed in the second through hole 50 is connected to the housing.
[0079] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A Mylar sheet conductive structure, characterized by, The application relates to a Mylar conductive structure, comprising: a first Mylar layer provided with a first through hole; a second Mylar layer provided with a second through hole; a conductive layer arranged between the first Mylar layer and the second Mylar layer; wherein the projection of the first Mylar layer on the conductive layer coincides with the projection of the second Mylar layer on the conductive layer.
2. The Mylar conducting structure of claim 1 wherein, The profile cross section of the first through hole is equal to the profile cross section of the second through hole.
3. The Mylar conducting structure of claim 2, wherein, The conductive layer is exposed to the first through hole and the conductive layer is exposed to the second through hole; wherein the cross section area of the conductive layer is greater than the profile cross section area of the first through hole and the cross section area of the conductive layer is greater than the profile cross section area of the second through hole.
4. The Mylar conducting structure of claim 1 wherein, The edge of the conductive layer is provided with a spacing from the edge of the first Mylar layer and the edge of the conductive layer is provided with the spacing from the edge of the second Mylar layer; the edge of the conductive layer is located between the first Mylar layer and the second Mylar layer.
5. The Mylar conducting structure of claim 4, wherein, The spacing is vertically greater than or equal to 0.5 mm.
6. The Mylar conducting structure of claim 2, wherein, The side of the first Mylar layer is provided with a first extension, the first through hole is arranged on the first extension, the side of the second Mylar layer is provided with a second extension, and the second through hole is arranged on the second extension; wherein the first extension is arranged opposite to the second extension, and the conductive layer extends to the space between the first extension and the second extension.
7. The Mylar conducting structure according to any one of claims 1 to 6, wherein, The surface of the first Mylar layer away from the conductive layer is coated with an adhesive part, or the surface of the second Mylar layer away from the conductive layer is coated with the adhesive part.
8. The Mylar conducting structure according to any one of claims 1 to 6, wherein, The surface of the conductive layer exposed to the first through hole is coated with a conductive adhesive part, and / or the surface of the conductive layer exposed to the second through hole is coated with the conductive adhesive part.
9. An electronic device, comprising: The application relates to a Mylar conductive structure, comprising:
10. The electronic device of claim 9, wherein, The electronic device further comprises a shell, a circuit board is arranged in the shell, and an interface is connected to the circuit board through a connector; the conductive layer exposed to the first through hole is connected to the connector, and the conductive layer exposed to the second through hole is connected to the shell.