Heat dissipation device for heating electronic component in closed space

Abstract

The utility model discloses a heat dissipation device for a heating electronic component in a closed space, which comprises a heat dissipation box, the left end and the right end of the heat dissipation box are respectively provided with an end exhaust cylinder, fins are arranged in the end exhaust cylinders, the inner walls of the fins are integrally connected with heat dissipation fins, heat dissipation pipes are arranged in the fins, and the heat dissipation pipes are connected with the heat dissipation box. A heat dissipation pipe is fixedly installed at the tail end of the heat dissipation box, an electronic pump is installed on the surface of the heat dissipation pipe, a rear end cover is fixedly installed at the tail end of the heat dissipation box, a connector is installed on the surface of the rear end cover, a butt joint opening is connected to one end of the connector, and a circulating pipe is connected to the interior of the butt joint opening; one end of a circulating pipe is connected with a cooling liquid pipe, the other end of the circulating pipe is communicated with a heat dissipation pipe in a heat dissipation box, cooling liquid in the cooling liquid pipe can be subjected to circulating heat dissipation, and the cooling liquid pipe is connected with an electronic component through a connecting pipe. And the heat of the electronic component is led out from the interior of the closed space by using the circulating pipe for heat dissipation.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment heat dissipation technical field, concretely is a kind of heat dissipation device for heating electronic components in closed space. BACKGROUND

[0002] Electronic equipment is internally provided with electronic components, and electronic components are essential parts inside electronic equipment. Since the interior of the electronic equipment is in a closed space, it will affect the heat dissipation of the electronic components inside the equipment, thereby affecting the use effect and service life of the electronic equipment.

[0003] The existing heat dissipation device for electronic components in a closed space occupies the space inside the electronic equipment during use, thereby increasing the volume and weight of the electronic equipment body. Meanwhile, the built-in cooling needs to be disassembled one by one during maintenance, which takes a long time and is not convenient for quick maintenance and replacement of parts. In addition, due to the arrangement of the closed space, the heat dissipation effect of the electronic components is affected.

[0004] Therefore, the technical personnel in the art provide a heat dissipation device for heating electronic components in a closed space to solve the problems raised in the background. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a heat dissipation device for heating electronic components in a closed space to solve the problem of the existing electronic component heat dissipation device increasing the volume and weight of the electronic equipment body while having poor heat dissipation effect.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0007] A heat dissipation device for heating electronic components in a closed space comprises a heat dissipation box, end exhaust cylinders are installed at the left and right ends of the heat dissipation box, fins are installed inside the end exhaust cylinders, heat dissipation fins are integrally connected to the inner walls of the fins, heat dissipation pipes are installed inside the fins, electronic pumps are installed on the surfaces of the heat dissipation pipes, rear end covers are fixedly installed at the ends of the heat dissipation box, connecting heads are installed on the surfaces of the rear end covers, and docking ports are connected to one end of the connecting heads. Circulation pipes are connected inside the docking ports, and tightening heads are installed at the ends of the circulation pipes away from the docking ports. Cooling liquid pipes are threadedly connected to the lower ends of the tightening heads, and connecting pipes are connected to the lower ends of the cooling liquid pipes.

[0008] As a further scheme of the utility model, the circulation pipes are connected to the heat dissipation pipes inside the heat dissipation box through the docking ports, and the circulation pipes and the heat dissipation pipes are one-to-one correspondingly arranged at both ends.

[0009] As a further scheme of the utility model: the cooling liquid pipe is connected with the heat dissipation pipe through the circulation pipe, and the cooling liquid pipe is connected with the outer wall of the electronic component through the connecting pipe.

[0010] As a further scheme of the utility model: the fins are equidistantly distributed along the inner wall of the fin, and the inside of the heat dissipation box is communicated with the outside through the hole in the surface of the end exhaust pipe.

[0011] As a further scheme of the utility model: the front end cover is installed at the front end of the heat dissipation box, and the surface of the front end cover is provided with perforations, and the water cooling pipe is inserted in the inside of the perforation.

[0012] As a further scheme of the utility model: the surface center line of the front end cover is installed with the exhaust pipe, and the inside of the exhaust pipe is installed with the heat dissipation fan.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] 1. One end of the circulation pipe is connected with the cooling liquid pipe, the other end of the circulation pipe is communicated with the heat dissipation pipe in the inside of the heat dissipation box, the cooling liquid in the inside of the cooling liquid pipe can be circulated and radiated, the cooling liquid pipe is connected with the electronic component through the connecting pipe, the heat of the electronic component is led out from the inside of the sealed space to radiate by the circulation pipe, the heat dissipation device occupies less space in the inside of the electronic equipment, the connecting head is connected with the butt joint through the screw structure, the butt joint can be screwed on the connecting head, the butt joint is connected with the connecting head with the circulation pipe, the connecting position is external, the connection convenience between the equipment and the heat dissipation box is improved, the maintenance is fast, and the maintenance time is shortened.

[0015] 2. The heat dissipation pipe is arranged in the inside of the heat dissipation box, the cooling liquid can be circulated, thereby realizing the cooling of the cooling liquid, the fins and the fins in the inside of the heat dissipation box are arranged to assist heat dissipation, the heat dissipation efficiency of the heat dissipation box is improved, the water cooling pipe is inserted into the inside of the heat dissipation box from the perforation, the cold water is poured from the outside, and the inside is heat exchanged, thereby realizing heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is a structure schematic view of a heat dissipation device for the heat generating electronic component in the sealed space.

[0017] Fig. 2 It is a structure schematic view of a heat dissipation device for the heat generating electronic component in the sealed space.

[0018] Fig. 3 It is a structure schematic view of a heat dissipation device for the heat generating electronic component in the sealed space.

[0019] Fig. 4 It is an internal structure diagram of a heat dissipation box of a heat dissipation device for heat generating electronic components in a closed space.

[0020] In the figure: 1, heat dissipation box; 2, end exhaust cylinder; 3, rear end cover; 4, front end cover; 5, connecting head; 6, docking port; 7, circulating pipe; 8, tightening head; 9, cooling liquid pipe; 10, connecting pipe; 11, exhaust cylinder; 12, heat dissipation fan; 13, perforation; 14, fin; 15, heat dissipation pipe; 16, water cooling pipe; 17, heat dissipation fin; 18, electronic pump. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0022] Please refer to Figs. 1-4 The present application provides a heat dissipation device for heat generating electronic components in a closed space, comprising: a heat dissipation box 1, both ends of the heat dissipation box 1 are provided with end exhaust cylinders 2, the inside of the end exhaust cylinders 2 is provided with fins 14, the inner wall of the fins 14 is integrally connected with heat dissipation fins 17, the inside of the fins 14 is provided with heat dissipation pipes 15, the surface of the heat dissipation pipes 15 is provided with electronic pumps 18, the end of the heat dissipation box 1 is fixedly provided with a rear end cover 3, the surface of the rear end cover 3 is provided with a connecting head 5, one end of the connecting head 5 is connected with a docking port 6, the inside of the docking port 6 is connected with a circulating pipe 7, one end of the circulating pipe 7 away from the docking port 6 is provided with a tightening head 8, the lower end of the tightening head 8 is threadedly connected with a cooling liquid pipe 9, and the lower end of the cooling liquid pipe 9 is connected with a connecting pipe 10.

[0023] The circulating pipe 7 is connected with the heat dissipation pipes 15 in the heat dissipation box 1 through the docking port 6, and the two ends of the circulating pipe 7 and the heat dissipation pipes 15 are one-to-one correspondingly arranged, the cooling liquid pipe 9 is connected with the outer wall of the electronic components through the connecting pipe 10 and the heat dissipation pipes 15;

[0024] Specifically, the circulating pipe 7 is provided with two groups, the two groups of circulating pipes 7 are connected with the two ends of the heat dissipation pipes 15 respectively, so as to realize the in-and-out of the cooling liquid and the cooling circulation heat dissipation, the cooling liquid pipe 9 is in contact with the outer wall of the electronic components through the connecting pipe 10, the heat of the electronic components in the closed space can be absorbed by the cooling liquid, and the cooling liquid in the cooling liquid pipe 9 is pumped out by the electronic pump 18, so that the heat of the electronic components in the closed space can be led out for heat dissipation.

[0025] The heat dissipation fins 17 are equidistantly distributed along the inner wall of the fins 14, and the inside of the heat dissipation box 1 is communicated with the outside through the holes on the surface of the end exhaust cylinder 2.

[0026] Specifically, the fins 14 and the heat dissipation fins 17 cooperate with each other to increase the heat dissipation area and improve the heat dissipation efficiency, and the surface of the end exhaust cylinder 2 is provided with holes to communicate the inside of the heat dissipation box 1 with the outside, thereby helping to ventilate and dissipate heat in the inside of the heat dissipation box 1.

[0027] The front end of the heat dissipation box 1 is provided with a front end cover 4, the surface of the front end cover 4 is provided with a perforation 13, the inside of the perforation 13 is inserted with a water cooling pipe 16, the surface center line of the front end cover 4 is provided with an exhaust cylinder 11, and the inside of the exhaust cylinder 11 is provided with a heat dissipation fan 12.

[0028] Specifically, the water cooling pipe 16 is inserted in the inside of the heat dissipation box 1, and the water cooling pipe 16 is parallel to the heat dissipation pipe 15, cold water is poured into the water cooling pipe 16, and then the cold water is introduced into the inside of the heat dissipation box 1, thereby heat exchange is carried out in the inside of the heat dissipation box 1, the heat dissipation pipe 15 is assisted to dissipate heat, the exhaust cylinder 11 is communicated with the inside of the heat dissipation box 1, and the heat dissipation fan 12 is used to take out the heat in the inside of the heat dissipation box 1, thereby improving the heat dissipation effect.

[0029] The working principle of the utility model is:

[0030] When the utility model is used, the connecting pipe 10 is contacted with the outer wall of the electronic component, the connecting pipe 10 is connected with the cooling liquid pipe 9, one end of the cooling liquid pipe 9 is connected with one end of the circulating pipe 7 through the tightening head 8, the circulating pipe 7 is provided with two groups, two ends of the two groups of circulating pipes 7 are connected with two ends of the cooling liquid pipe 9 and the heat dissipation pipe 15 respectively, the cooling liquid in the cooling liquid pipe 9 is drawn into the inside of the heat dissipation pipe 15 by the electronic pump 18, the liquid flows in the inside of the heat dissipation pipe 15, the fins 14 and the heat dissipation fins 17 dissipate heat for the heat dissipation pipe 15, then the cold water is poured into the water cooling pipe 16, and then the cold water is introduced into the inside of the heat dissipation box 1, thereby heat exchange is carried out in the inside of the heat dissipation box 1, the heat dissipated by the heat dissipation fins 17 and the fins 14 is discharged from the holes on the surface of the end exhaust cylinder 2, the exhaust cylinder 11 is communicated with the inside of the heat dissipation box 1, the heat dissipation fan 12 takes out the heat in the inside of the heat dissipation box 1, after the heat of the cooling liquid in the heat dissipation pipe 15 is dissipated, the cooling liquid reenters the other group of circulating pipes 7 through the other end of the heat dissipation pipe 15, and then reenters the cooling liquid pipe 9 through the circulating pipe 7, thereby continuously absorbing the heat of the electronic component.

[0031] The above merely describes a preferred embodiment of the present application, and the protection scope of the present application is not limited thereto, and any skilled person in the art, according to the technical scheme and the inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A heat dissipating device for heat generating electronic components in an enclosed space, characterized by, Include: The heat dissipation box (1), both ends of the heat dissipation box (1) are provided with end exhaust cylinder (2), the inside of exhaust cylinder (2) is provided with fin (14), the inner wall of fin (14) is integrally connected with fin (17), the inside of fin (14) is provided with heat dissipation pipe (15), and the surface of heat dissipation pipe (15) is provided with electronic pump (18), the end of heat dissipation box (1) is fixedly provided with rear end cover (3), the surface of rear end cover (3) is provided with connector (5), one end of connector (5) is connected with docking interface (6), the inside of docking interface (6) is connected with circulating pipe (7), one end of circulating pipe (7) away from docking interface (6) is provided with tightening head (8), and the lower end of tightening head (8) is threadedly connected with cooling liquid pipe (9), the lower end of cooling liquid pipe (9) is connected with connecting pipe (10).

2. A heat dissipating device for heat generating electronic components in an enclosed space according to claim 1, wherein, The circulating pipe (7) is connected with the heat dissipation pipe (15) in the heat dissipation box (1) through the docking interface (6), and the circulating pipe (7) and the heat dissipation pipe (15) are one-to-one corresponding.

3. The heat dissipating device for heat generating electronic components in an enclosed space according to claim 1, wherein, The cooling liquid pipe (9) is connected with the heat dissipation pipe (15) through the circulating pipe (7), and the cooling liquid pipe (9) is communicated with the outer wall of the electronic component through the connecting pipe (10).

4. The heat dissipating device for heat generating electronic components in an enclosed space according to claim 1, wherein, The fin (17) is equidistantly distributed along the inner wall of the fin (14), and the inside of the heat dissipation box (1) is communicated with the outside through the hole in the surface of the end exhaust cylinder (2).

5. The heat dissipating device for heat generating electronic components in an enclosed space according to claim 1, wherein, The front end of the heat dissipation box (1) is provided with front end cover (4), the surface of front end cover (4) is provided with perforation (13), and the inside of perforation (13) is inserted with water cooling pipe (16).

6. A heat dissipating device for heat generating electronic components in an enclosed space according to claim 5, wherein, The surface centerline of the front end cover (4) is provided with exhaust cylinder (11), and the inside of the exhaust cylinder (11) is provided with heat dissipation fan (12).

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