Piezoelectric fan

Abstract

This invention proposes a piezoelectric fan, comprising: a blade assembly connected to a heat source, the blade assembly including a liquid-cooled heat dissipation module formed in a stacked structure, the blade assembly having a fixed region and a swinging region, the fixed region being fixed and the swinging region being suspended and capable of reciprocating swinging; and a piezoelectric actuation unit connected to the blade assembly, the piezoelectric actuation unit providing power for the swinging of the swinging region. According to the piezoelectric fan of this invention, the heat from the heat source can be quickly and evenly distributed onto the blade assembly. Simultaneously, the piezoelectric actuation unit vibrates under external periodic electrical signal excitation, driving the swinging region to reciprocate, thereby improving heat dissipation efficiency. Furthermore, the structure is more compact, occupies less space, and can adapt to the heat dissipation needs of confined spaces, thus solving the problems of large system size, low integration, complex structure, high manufacturing difficulty, and high cost in existing technologies.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation, and in particular to a piezoelectric fan. Background Technology

[0002] The development and application of large-scale and very large-scale integrated circuits have improved product functionality, but at the same time, they have increased the power consumption of the whole machine, resulting in serious heat generation during product use. If the heat cannot be dissipated in time, the excessive heat will affect the working performance and lifespan of the electronic components in the product, thereby greatly damaging the user experience. Heat dissipation has become a key technical factor restricting the development of electronic, electromechanical, optoelectronic and other products toward high performance and miniaturization.

[0003] Piezoelectric fans have received increasing attention due to their advantages such as low power consumption, low noise, good fan directionality, and ease of miniaturization. In related technologies, piezoelectric fans are mainly composed of piezoelectric ceramics and vibrating plates. Utilizing the inverse piezoelectric effect, when an AC voltage is input, the piezoelectric ceramic material drives the vibrating plate to resonate, causing the surrounding air to flow in a regular manner, thus playing a role in convective heat transfer.

[0004] However, piezoelectric fans are usually used as external heat dissipation devices. That is, the piezoelectric fan is placed near heat-conducting accessories or heat sources such as heat sinks and heat spreaders to blow away the hot air that has completed convective heat transfer around the heat sinks, heat spreaders, and heat sources to achieve the purpose of heat dissipation. In this way, on the one hand, the heat-conducting accessories or heat sources such as heat sinks and heat spreaders are scattered and occupy a lot of space. On the other hand, the heat-conducting accessories such as heat sinks and heat spreaders have complex structures, large weight, high manufacturing difficulty, and high cost, making it difficult to apply on a large scale to the heat dissipation of small-scale electromechanical, electronic, and optoelectronic equipment in confined spaces. Summary of the Invention

[0005] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a piezoelectric fan with high heat dissipation efficiency, which can solve the problems of large system size, low integration, complex structure, high manufacturing difficulty, and high cost in the prior art.

[0006] According to an embodiment of the present invention, a piezoelectric fan includes: a blade assembly connected to a heat source, the blade assembly including a liquid-cooled heat dissipation module formed in a stacked structure, the blade assembly having a fixed region and a swinging region, the fixed region being fixed and the swinging region being suspended and capable of reciprocating swinging; and a piezoelectric actuation unit connected to the blade assembly, the piezoelectric actuation unit providing power for the swinging of the swinging region.

[0007] According to an embodiment of the present invention, a piezoelectric fan, by comprising a blade assembly including a liquid-cooled heat dissipation module and a piezoelectric actuation unit, when the piezoelectric fan is working, under the combined action of heat transfer from the blade assembly and the circulation of the working fluid in the liquid-cooled heat dissipation circuit of the liquid-cooled heat dissipation module, the heat from the heat source can be quickly and evenly distributed onto the blade assembly. At the same time, the piezoelectric actuation unit vibrates under the excitation of an external periodic electrical signal, causing the swing area to swing back and forth, striking the surrounding air, thereby increasing the airflow speed and forming vortices and turbulence locally. As a result, a strong convective heat transfer is formed between the thermal boundary layer on the surface of the blade assembly and the surrounding air. The air quickly sweeps away the heat from the surface of the blade assembly, and the continuous back-and-forth swing of the swing area pushes the hot air away, carrying away the heat. Meanwhile, the heat from the heat source is continuously transferred to the blade assembly, thus forming efficient heat dissipation. At the same time, the structure is more compact, occupies less space, and can adapt to the heat dissipation needs of narrow spaces. This solves the problems of large system size, low integration, complex structure, high manufacturing difficulty, and high cost in the prior art.

[0008] In some embodiments of the present invention, the oscillating blade assembly further includes an oscillating blade, and at least one of the oscillating blade and the liquid cooling heat dissipation module has a contact surface formed on it, which is suitable for cooperating with the heat source. The contact surface is formed as a single continuous type, or the contact surface is formed as a discrete type.

[0009] In some embodiments of the present invention, the oscillating blades and the liquid cooling heat dissipation module are an integral part.

[0010] In some embodiments of the present invention, the liquid cooling heat dissipation module is stacked on at least one side of the blade in the thickness direction.

[0011] In some embodiments of the present invention, at least one of the oscillating blade and the liquid cooling heat dissipation module is provided with a thermally conductive film, the thermal conductivity of which is higher than that of the oscillating blade and the liquid cooling heat dissipation module.

[0012] In some embodiments of the present invention, at least one of the oscillating blade and the liquid cooling heat dissipation module is provided with protrusions and recesses, or at least one of the oscillating blade and the liquid cooling heat dissipation module is provided with heat-conducting fins.

[0013] In some embodiments of the present invention, the oscillating blade has a fixed portion and an oscillating portion, the fixed portion corresponding to the fixed region, the oscillating portion corresponding to the oscillating region, at least a portion of the piezoelectric actuation unit is arranged on the oscillating portion of the oscillating blade, or at least a portion of the piezoelectric actuation unit is arranged on the liquid cooling heat dissipation module attached to the oscillating blade, and the attachment position corresponds to the oscillating portion of the oscillating blade.

[0014] In some embodiments of the present invention, the liquid cooling heat dissipation module includes a flow channel device and a power pump. The flow channel device has a flow channel, and the power pump is connected to the flow channel device to drive the flow of the cooling working fluid in the flow channel.

[0015] In some embodiments of the present invention, the power pump includes: a pump body having at least one pump chamber, the pump body further having an inlet and an outlet communicating with the pump chamber, the inlet and the outlet being used to communicate with the flow channel; a vibrating plate covering the pump chamber and connected to the pump body, the vibrating plate generating reciprocating vibration under the drive of an alternating signal to change the volume of the pump chamber; a first fluid valve disposed at the inlet, the first fluid valve being used to control the unidirectional flow of the cooling medium in the flow channel into the pump chamber; the cooling medium in the flow channel being unidirectionally introduced into the pump chamber; and a second fluid valve disposed at the outlet, the second fluid valve being used to control the unidirectional flow of the cooling medium in the pump chamber into the flow channel.

[0016] In some embodiments of the present invention, the flow channel device includes: a flow channel layer, the flow channel layer including a substrate and a flow guide groove formed on the substrate; a panel layer, the panel layer including at least one panel, the panel covering the flow guide groove, defining an outlet flow channel between the flow guide groove and the panel layer, and the panel layer having an inlet hole and an outlet hole suitable for communication with a power pump.

[0017] In some embodiments of the present invention, the panel layer is provided with an injection port communicating with the flow channel, and the injection port is sealed by a cover plate.

[0018] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0020] Figure 1 This is a schematic diagram of the structural principle of a piezoelectric fan according to an embodiment of the present invention, wherein the blade assembly is integrally formed as a liquid-cooled heat dissipation module;

[0021] Figure 2 This is a schematic diagram of the structural principle of a piezoelectric fan according to an embodiment of the present invention, wherein the oscillating blade assembly is formed into multiple liquid-cooled heat dissipation modules;

[0022] Figure 3 This is a schematic diagram of the structural principle of a piezoelectric fan according to an embodiment of the present invention, wherein the oscillation region is connected to a heat source;

[0023] Figure 4 This is a schematic diagram of the structural principle of a piezoelectric fan according to an embodiment of the present invention, wherein the oscillation area is connected to a heat source, and the oscillation blade assembly is formed into multiple liquid cooling heat dissipation modules;

[0024] Figure 5 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there is a continuous fixed area, a continuous oscillating area, and a single piezoelectric actuation unit;

[0025] Figure 6 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there are multiple piezoelectric actuation units in a continuous fixed region and a continuous oscillating region.

[0026] Figure 7 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there is a continuous fixed region and a discrete oscillating region with a single piezoelectric actuation unit;

[0027] Figure 8 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there are multiple piezoelectric actuation units in a continuous fixed region and a discrete oscillating region.

[0028] Figure 9 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there is a discrete fixed region and a continuous oscillating region with a single piezoelectric actuation unit;

[0029] Figure 10 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there are multiple piezoelectric actuation units in a discrete fixed region and a continuous oscillating region.

[0030] Figure 11 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there is a discrete fixed region, a discrete oscillating region, and a single piezoelectric actuation unit;

[0031] Figure 12 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein there is a discrete fixed region, a discrete oscillating region, and a single piezoelectric actuation unit;

[0032] Figure 13 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein the piezoelectric fan and the heat source are bonded together by discrete multi-faceted bonding.

[0033] Figure 14 This is a schematic diagram of the structure of a heat source according to an embodiment of the present invention, wherein the contact surface is a spatial curved surface;

[0034] Figure 15 This is a schematic diagram of the structure of a heat source according to an embodiment of the present invention, wherein the contact surface is a spatial hybrid type of at least one plane and curved surface;

[0035] Figure 16 This is a schematic diagram of the structure of a heat source according to an embodiment of the present invention, wherein the bonding surface is a spatial polyhedron composed of multiple planes;

[0036] Figure 17 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein the oscillation region of the oscillating blade assembly extends out a piezoelectric actuation unit and is connected to the oscillating member;

[0037] Figure 18 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein the piezoelectric actuation unit is connected to the oscillating element;

[0038] Figure 19 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein one or more liquid cooling heat dissipation modules are arranged on one side of the blades;

[0039] Figure 20 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein multiple liquid cooling heat dissipation modules are arranged on both sides of the blades;

[0040] Figure 21 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein multiple liquid cooling heat dissipation modules are arranged on both sides of the blades;

[0041] Figure 22 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein one or more liquid cooling heat dissipation modules are arranged on one side of the blades;

[0042] Figure 23 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein multiple liquid cooling heat dissipation modules are arranged on both sides of the blades;

[0043] Figure 24 This is a schematic diagram of the structure of a piezoelectric fan according to an embodiment of the present invention, wherein multiple liquid cooling heat dissipation modules are arranged on both sides of the blades in another form;

[0044] Figure 25 This is a schematic diagram of the structure of a power pump according to an embodiment of the present invention;

[0045] Figure 26 This is a schematic diagram of the structure of a power pump according to an embodiment of the present invention, wherein the power pump is in the suction head state;

[0046] Figure 27 This is a schematic diagram of the structure of a power pump according to an embodiment of the present invention, wherein the power pump is in a scheduling state;

[0047] Figure 28This is a schematic diagram of the structure of a vibrating plate according to an embodiment of the present invention, wherein the vibrating plate is an integral vibrating plate;

[0048] Figure 29 This is a schematic diagram of the structure of a vibrating plate according to an embodiment of the present invention, wherein the vibrating plate is a split-type vibrating plate;

[0049] Figure 30 This is a schematic diagram of the structure of a power pump according to an embodiment of the present invention, wherein the power pump is a dual-chamber pump;

[0050] Figure 31 This is a schematic diagram of the structure of a power pump according to an embodiment of the present invention. The power pump is a combined dual-chamber pump.

[0051] Figure 32 This is a schematic diagram of the structure of the power valve according to an embodiment of the present invention;

[0052] Figure 33 This is a schematic diagram of the structure of a liquid cooling heat dissipation module according to an embodiment of the present invention, wherein the liquid cooling heat dissipation module adopts a through-channel flow path;

[0053] Figure 34 This is a schematic diagram of the structure of a liquid cooling heat dissipation module according to an embodiment of the present invention, wherein the liquid cooling heat dissipation module adopts a recessed groove flow channel;

[0054] Figure 35 This is a schematic diagram of the structure of a liquid cooling heat dissipation module according to an embodiment of the present invention, wherein the liquid cooling heat dissipation module adopts a hybrid channel flow channel;

[0055] Figure 36 This is a schematic diagram of the structure of a liquid cooling heat dissipation module according to an embodiment of the present invention, wherein the liquid cooling heat dissipation module adopts a multi-layer basic flow channel hybrid flow channel;

[0056] Figure 37 This is a schematic diagram of the structure of a liquid cooling heat dissipation module according to an embodiment of the present invention, wherein the liquid cooling heat dissipation module is in a flexible bending state.

[0057] Figure label:

[0058] Piezoelectric fan 100,

[0059] The oscillating blade assembly 10 has a fixed area 101 and an oscillating area 102.

[0060] 1. A pendulum blade; 11. A fixed part; 12. A swinging part;

[0061] Liquid cooling heat dissipation module 2, flow channel device 21, flow channel 21a, flow channel layer 211, guide groove 2111,

[0062] Panel layer 212, panel 2121; through groove layer 2122, flow channel plate 2123, liquid inlet 213, liquid outlet 214, liquid injection port 215.

[0063] Power pump 22, pump chamber 22a, pump body 221, inlet 222, outlet 223, vibrating plate 224, excitation unit 2241, vibrating disc 2242, connecting part 2243, first fluid valve 225, second fluid valve 226, power valve 227, vibrating part 2271, valve inlet 2272; valve outlet 2273;

[0064] Cover plate 23,

[0065] Adhesion surface 3,

[0066] Swing component 4,

[0067] piezoelectric actuator 20,

[0068] Heat source 200. Detailed Implementation

[0069] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0070] The following is a reference appendix. Figure 1-36 A piezoelectric fan 100 according to an embodiment of the present invention is described.

[0071] The piezoelectric fan 100 according to an embodiment of the present invention may include: a blade assembly 10 and a piezoelectric actuation unit 20. Specifically, referring to... Figure 1 and Figure 2 As shown, the oscillating blade assembly 10 is connected to the heat source 200. The oscillating blade assembly 10 includes a liquid-cooled heat dissipation module 2 formed in a stacked structure. The oscillating blade assembly 10 has a fixed region 101 and an oscillating region 102. The fixed region 101 is fixed, and the oscillating region 102 is suspended and can oscillate back and forth. The piezoelectric actuation unit 20 is connected to the oscillating blade assembly 10 and provides power for the oscillation of the oscillating region 102.

[0072] Optionally, the frequency of the external periodic signal is the first-order resonant frequency of the piezoelectric fan 100 or a value near the first-order resonant frequency, which can increase the displacement of the reciprocating oscillation of the oscillating region 102. During the high-frequency oscillation of the oscillating region 102, it beats the surrounding air, which increases the airflow speed and forms vortices and turbulence locally. As a result, strong convective heat transfer is formed between the thermal boundary layer on the surface of the blade assembly 10 and the surrounding air. The air quickly sweeps away the heat from the surface of the blade assembly 10. The continuous reciprocating oscillation of the oscillating region 102 pushes the hot air far away, taking away the heat. At the same time, the heat source 200 continuously transfers heat to the blade assembly 10, thus forming efficient heat dissipation.

[0073] In view of this, the piezoelectric fan 100 according to the embodiment of the present invention, by providing a blade assembly 10 including a liquid cooling heat dissipation module 2 and a piezoelectric actuation unit 20, when the piezoelectric fan 100 is working, under the combined action of heat transfer from the blade assembly 10 and the circulation of the working fluid in the liquid cooling heat dissipation circuit of the liquid cooling heat dissipation module 2, the heat from the heat source 200 can be quickly and evenly distributed to the blade assembly 10. At the same time, the piezoelectric actuation unit 20 vibrates under the excitation of an external periodic electrical signal, driving the swing area 102 to swing back and forth, which can improve the heat dissipation efficiency. In addition, the structure is more compact, occupies less space, and can adapt to the heat dissipation needs of narrow spaces, thereby solving the problems of large system volume, low integration, complex structure, high manufacturing difficulty, and high cost in the prior art.

[0074] In some embodiments of the present invention, reference is made to... Figures 1-13 As shown, the oscillating blade assembly 10 also includes an oscillating blade 1. At least one of the oscillating blade 1 and the liquid cooling heat dissipation module 2 has a contact surface 3 formed on it, which is suitable for cooperating with the heat source 200. The contact surface 3 is formed as a single continuous type, or the contact surface 3 is formed as a discrete type. For example, the oscillating blade 1 is tightly attached to the heat source 200, such as the fixing part 11 of the oscillating blade 1 being tightly attached to the heat source 200. Figure 1-2 As shown, the oscillating part 12 of the oscillating blade 1 can also be in close contact with the heat source 200, such as... Figure 3-4 As shown, the fixed part 11 and the swing part 12 of the blade 1 can also be in close contact with the heat source, either continuously or away from it.

[0075] Optionally, the liquid cooling module 2 is connected to the oscillating blade 1, and at least one of the liquid cooling module 2 and the oscillating blade 1 is connected to the heat source 200. In other words, the liquid cooling module 2 can be connected to the heat source 200, or the oscillating blade 1 can be connected to the heat source 200, or both the liquid cooling module 2 and the oscillating blade 1 can be connected to the heat source 200. For example, refer to... Figures 19-24 As shown, the liquid cooling heat dissipation module 2 can be arranged on at least one side of the blade 1 in the thickness direction.

[0076] Reference Figures 19-24As shown, the piezoelectric actuation unit 20 is connected to the oscillating vane 1 and / or the liquid cooling module 2. In other words, the piezoelectric actuation unit 20 can be connected to the oscillating vane 1, or the piezoelectric actuation unit 2 can be connected to the liquid cooling module 2, or the piezoelectric actuation unit 20 can be connected to both the oscillating vane 1 and the liquid cooling module 2. The piezoelectric actuation unit 20 provides power for the oscillation of the oscillating region 102. For example, the piezoelectric actuation unit 20 includes at least one piezoelectric crystal. The piezoelectric actuation unit 20 vibrates when excited by an external periodic electrical signal, causing the oscillating region 102 to oscillate back and forth.

[0077] It is understood that the structure of the oscillating blade assembly 10 can have various configurations depending on the different structural forms of the fixed region 101 and the swinging region 102. Specifically, the structure of the fixed region 101 can be a continuous single fixed region 101 or a discrete multi-fixed region 101, and the structure of the swinging region 102 can be a continuous single swinging region 102 or a discrete multi-switching region 102. The configuration of the oscillating blade assembly 10 can be any combination of the above-mentioned structural forms of the fixed region 101 and the swinging region 102, such as... Figure 5-12 .

[0078] In some embodiments of the present invention, reference is made to... Figure 1 As shown, the oscillating blade 1 and the liquid cooling module 2 are a single unit. For example, the liquid cooling module 2 can even be formed as the oscillating blade 1. It is understood that the single-unit structure not only ensures the structural and performance stability of the oscillating blade 1 and the liquid cooling module 2, but also facilitates molding and simplifies manufacturing. Furthermore, it eliminates unnecessary assembly parts and connection processes, greatly improving the assembly efficiency of the oscillating blade 1 and the liquid cooling module 2, ensuring the reliability of their connection. Moreover, the single-unit structure has higher overall strength and stability, is easier to assemble, and has a longer lifespan. Of course, the invention is not limited to this; the oscillating blade 1 and the liquid cooling module 2 can also be separate units.

[0079] In some embodiments of the present invention, the liquid cooling heat dissipation module 2 is stacked and disposed on at least one side of the blade 1 in the thickness direction. In other words, the liquid cooling heat dissipation module 2 is stacked and disposed on one side of the blade 1 in the thickness direction, or the liquid cooling heat dissipation module 2 is stacked and disposed on both sides of the blade 1 in the thickness direction. Thus, the structure is simple, which is beneficial to increasing the contact area between the liquid cooling heat dissipation module 2 and the blade 1 and improving the heat transfer efficiency.

[0080] In some embodiments of the present invention, the swing region 102 and the fixed region 101 are integral components. It is understood that the integral component structure not only ensures the structural and performance stability of the swing region 102 and the fixed region 101, but also facilitates molding and manufacturing, eliminating unnecessary assembly parts and connection processes, greatly improving the assembly efficiency of the swing region 102 and the fixed region 101, ensuring the reliability of the connection between the swing region 102 and the fixed region 101. Furthermore, the integrally formed structure has higher overall strength and stability, is easier to assemble, and has a longer lifespan. Of course, the present invention is not limited to this; the swing region 102 and the fixed region 101 can also be separate components. For example, the swing region 102 and the fixed region 101 can be connected together by welding or other means. For example, the oscillating blade assembly 10 can be formed as a planar thin plate, an arc-shaped thin plate, or a combination of any shapes.

[0081] In some examples of the present invention, the blade 1 and / or the liquid cooling heat dissipation module 2 are made of thermally conductive metal, polymer, or other thermally conductive materials. It should be noted that when the material is metal, the heat can be spread to the blade assembly 10 more quickly and evenly, but the manufacturing difficulty will increase accordingly, and the overall flexibility will decrease. This is suitable for scenarios where the heating surface of the heat source 200 is relatively regular. When the material is polymer, the heat is spread to the blade assembly 10 quickly and evenly through the liquid cooling heat dissipation module 2. The manufacturing difficulty is low, the cost is low, and the overall form is easier to form a flexible patch, which is suitable for heat dissipation of the heat source 200 with complex heating surfaces.

[0082] Optionally, at least one of the oscillating blade 1 and the liquid cooling module 2 is provided with a thermally conductive film, the thermal conductivity of which is higher than that of the oscillating blade 1 and the liquid cooling module 2. For example, the thermally conductive film can be a superconducting metal film, a graphite film, or a graphene film. This can accelerate the heat transfer on the oscillating blade 1 and / or the liquid cooling module 2.

[0083] In some embodiments of the present invention, at least one of the oscillating blade 1 and the liquid cooling heat dissipation module 2 is provided with a concave-convex portion, wherein the concave-convex portion can be formed as a protrusion or a groove, or at least one of the oscillating blade 1 and the liquid cooling heat dissipation module 2 is provided with a heat-conducting fin, thereby facilitating further improvement of heat transfer and heat dissipation effects.

[0084] For example, the surfaces of the liquid cooling module 2 and / or the oscillating blades 1 that come into contact with the air are formed with several protrusions or depressions to increase the contact area between the oscillating blades 1 and the air and accelerate heat dissipation. Alternatively, the surfaces of the liquid cooling module 2 and / or the oscillating blades 1 that come into contact with the air are integrally formed or fixedly connected with several heat-conducting fins to further improve the heat transfer and heat dissipation effect.

[0085] In some embodiments of the present invention, reference is made to... Figure 1 and Figure 2As shown, at least a portion of the piezoelectric actuation unit 20 is arranged on the swing region 102. For example, the swing blade 1 includes a fixed portion 11 and a swing portion 12. The fixed portion 11 corresponds to the fixed region 101, and the swing portion 12 corresponds to the swing region 102. At least a portion of the piezoelectric actuation unit 20 is arranged on the swing portion 12 of the swing blade 1. Alternatively, at least a portion of the piezoelectric actuation unit 20 is arranged on the liquid-cooled heat dissipation module 2 attached to the swing blade 1, and the attachment position corresponds to the swing portion 12 of the swing blade 1. This helps to ensure the reliability of the operation of the piezoelectric actuation unit 20.

[0086] It should also be noted that the number of piezoelectric actuation units 20 can be one or more. A single piezoelectric actuation unit 20 can be arranged on one side of the oscillating vane assembly 10, while multiple piezoelectric actuation units 20 can be arranged on one or both sides of the oscillating vane assembly 10. A single piezoelectric actuation unit 20 can provide power to a single oscillating region 102, or a single piezoelectric actuation unit 20 can provide power to multiple oscillating regions 102 simultaneously, or multiple piezoelectric actuation units 20 can provide power to a single oscillating region 102 simultaneously. When multiple oscillating regions 102 exist simultaneously in the structure, and each oscillating region 102 has a separate piezoelectric actuation unit 20 providing power to it, the oscillation directions of two adjacent oscillating regions 102 can be the same or opposite, or have a certain phase difference, such as... Figure 8 , 12 .

[0087] In some embodiments of the present invention, reference is made to... Figures 31-37 As shown, the liquid cooling module 2 includes a flow channel device 21 and a power pump 22. The flow channel device 21 has a flow channel 21a, and the power pump 22 is connected to the flow channel device 21 to drive the flow of the cooling medium in the flow channel 21a. For example, both the power pump 22 and the flow channel 21a are formed as patch structures. It can be understood that by connecting the power pump 22 to the flow channel device 21 to drive the flow of the cooling medium in the flow channel 21a, the heat exchange efficiency of the cooling medium in the flow channel 21a can be improved, which is beneficial to ensuring the heat dissipation capacity of the liquid cooling module 2.

[0088] In some embodiments of the present invention, reference is made to... Figure 33-35As shown, the power pump 22 includes: a pump body 221, a vibrating plate 224, a first fluid valve 225, and a second fluid valve 226. The pump body 221 has at least one pump chamber 22a. The pump body 221 also has an inlet 222 and an outlet 223 communicating with the pump chamber 22a. The inlet 222 and the outlet 223 are used to communicate with the flow channel 21a. The vibrating plate 224 covers the pump chamber 22a and is connected to the pump body 221. The vibrating plate 224 can generate reciprocating vibration under the drive of an alternating signal to change the volume of the pump chamber 22a. The first fluid valve 225 is located at the inlet 222 and is used to control the unidirectional flow of the cooling medium in the flow channel 21a into the pump chamber 22a. The second fluid valve 226 is located at the outlet 223 and is used to control the unidirectional flow of the cooling medium in the pump chamber 22a into the flow channel 21a.

[0089] See Figure 26 and 27 The specific working principle is as follows: the reciprocating motion of the vibrating plate 224 changes the volume of the pump chamber 22a and cooperates with the first fluid valve 225 and the second fluid valve 226 to make the fluid flow in a specific direction. The working process of the power pump 22 can be divided into two processes: suction and discharge. When the vibrating plate 224 bends upward, the volume of the pump chamber 22a increases and the pressure inside the chamber decreases. Under the action of the pressure difference on both sides, the first fluid valve 225 at the inlet 222 opens and the second fluid valve 226 at the outlet 223 closes, and the fluid flows into the pump chamber 22a from the fluid valve at the inlet 222, completing the fluid suction process. When the vibrating plate 224 bends downward, the volume of the pump chamber 22a decreases and the pressure inside the chamber increases. The second fluid valve 226 at the outlet 223 opens and the first fluid valve 225 at the inlet 222 closes, completing the fluid discharge process. When a continuous alternating signal is applied to the vibrating plate 224, the power pump 22 completes continuous suction and discharge, realizing unidirectional fluid flow. Therefore, the structure is simple and easy to implement.

[0090] like Figure 33-36 As shown, in some embodiments of the present invention, the flow channel device 21 includes: a flow channel layer 211, which includes a substrate and a guide groove 2111 formed on the substrate; and a panel layer 212, which includes at least one panel 2121, which covers the guide groove 2111. A flow channel 21a is defined between the guide groove 2111 and the panel layer 212. The panel layer 212 is provided with an inlet hole 213 and an outlet hole 214 suitable for communication with the power pump 22. Thus, the power pump 22 and the flow channel device 21 communicate to form a sealed whole filled with working fluid, which helps to ensure the reliability of the piezoelectric fan 100.

[0091] In some embodiments of the present invention, a liquid injection port 215 communicating with the flow channel 21a is provided on the panel layer 212, and the liquid injection port 215 is sealed by a cover plate 23. This facilitates the addition of cooling medium into the liquid cooling module 2 and helps to ensure the reliable operation of the liquid cooling module 2.

[0092] The following is a reference appendix. Figure 1-36 The specific structure of the piezoelectric fan 100 according to an embodiment of the present invention will be described in detail below. It is understood that the following description is intended to explain the present invention and should not be construed as limiting it.

[0093] Example 1

[0094] Reference Figures 1-12 As shown, the piezoelectric fan 100 provided in this embodiment includes a blade assembly 10 and a piezoelectric actuation unit 20 fixedly mounted on the blade assembly 10. At least one liquid cooling heat dissipation module 2 is formed on the blade assembly 10 in a stacked structure. The blade assembly 10 has a fixed area 101 and a swing area 102. At the same time, a contact surface 3 is formed on the surface of the blade assembly 10. The blade assembly 10 is in close contact with the heat source 200 through the contact surface 3. The swing area 102 is suspended and can swing back and forth. The piezoelectric actuation unit 20 is arranged on the blade assembly 10 to provide power for the swing of the swing area 102. During operation, the heat source 200 continuously generates heat. Heat transfer occurs between the heat source 200 and the oscillating blade assembly 10 via the contact surface 3. Under the combined action of heat transfer from the oscillating blade assembly 10 and the circulation of the working fluid in the liquid cooling circuit of the liquid cooling module 2, the heat from the heat source 200 can be quickly and evenly distributed onto the oscillating blade assembly 10. Simultaneously, the piezoelectric actuation unit 20 vibrates under the excitation of an external periodic electrical signal, causing the oscillating region 102 to oscillate back and forth at the frequency of the periodic signal. Preferably, the frequency of the external periodic signal is the first-order resonant frequency or the first-order resonant frequency of the piezoelectric fan 100. The frequency of the swing region 102 is near the value of the swing frequency, thereby increasing the displacement of the swing region 102. During the high-frequency swing of the swing region 102, it beats the surrounding air, which increases the air velocity and forms vortices and turbulence in the local area. As a result, strong convective heat transfer is formed between the thermal boundary layer on the surface of the swing blade assembly 10 and the surrounding air. The air quickly sweeps away the heat from the surface of the swing blade assembly 10. The continuous reciprocating swing of the swing region 102 pushes the hot air far away and takes away the heat. At the same time, the heat source 200 continuously transfers heat to the swing blade assembly 10, thus forming efficient heat dissipation.

[0095] The oscillating vane assembly 10 also includes an oscillating vane 1. The oscillating vane 1 and the liquid cooling heat dissipation module 2 are integrated into one piece. At least one of the oscillating vane 1 and the liquid cooling heat dissipation module 2 has a contact surface 3 formed on it, which is suitable for cooperating with the heat source 200. The contact surface 3 is formed as a single continuous type, or the contact surface 3 is formed as a discrete type. For example, the oscillating vane 1 can be tightly fitted to the heat source 200, such as the fixing part 11 of the oscillating vane 1 being tightly fitted to the heat source 200. Figure 1-2As shown, the oscillating part 12 of the oscillating blade 1 can also be in close contact with the heat source 200, such as... Figure 3-4 As shown, the fixed part 11 and the swing part 12 of the blade 1 can also be in close contact with the heat source, either continuously or away from it.

[0096] The structure of the oscillating leaf assembly 10 has various configurations depending on the different structural forms of the fixed area 101 and the oscillating area 102.

[0097] Specifically, the fixed region 101 can be a continuous single fixed region 101 or a discrete multi-fixed region 101. The swing region 102 can be a continuous single swing region 102 or a discrete multi-switch region 102. The configuration of the pendulum assembly 10 can be any combination of the above-mentioned fixed region 101 and swing region 102 structural forms, such as... Figure 5-12 .

[0098] It should also be noted that the number of piezoelectric actuation units 20 can be one or more. A single piezoelectric actuation unit 20 can be arranged on one side of the oscillating vane assembly 10, while multiple piezoelectric actuation units 20 can be arranged on one or both sides of the oscillating vane assembly 10. A single piezoelectric actuation unit 20 can provide power to a single oscillating region 102, or a single piezoelectric actuation unit 20 can provide power to multiple oscillating regions 102 simultaneously, or multiple piezoelectric actuation units 20 can provide power to a single oscillating region 102 simultaneously. When multiple oscillating regions 102 exist simultaneously in the structure, and each oscillating region 102 has a separate piezoelectric actuation unit 20 providing power to it, the oscillation directions of two adjacent oscillating regions 102 can be the same or opposite, or have a certain phase difference, such as... Figure 8 , 12 .

[0099] Example 2

[0100] like Figure 13 As shown, the structure of this embodiment is basically the same as that of Embodiment 1. The difference is that the bonding surface 3 formed on the blade assembly 10 is a discrete multi-bonding surface, which is suitable for heat dissipation away from the heat source.

[0101] Example 3

[0102] like Figure 14-16 As shown, this embodiment is basically the same as the structure of embodiments one and two. The difference is that the shape of the bonding surface 3 formed on the oscillating blade assembly 10 is a curved surface, a spatial hybrid type of at least one plane and a curved surface, or a spatial multifaceted type with multiple planes.

[0103] It should be noted that there are no specific restrictions on the shape of the bonding surface 3 here. The bonding surface 3 of the fixed area 101 is constructed according to the geometry of the heating surface of the heat source 200 of the applicable object, in order to facilitate processing and molding and maximize the bonding area.

[0104] Example 4

[0105] like Figure 17-18 As shown, this embodiment is basically the same as the structure of embodiments one to three. The difference is that a swing element 4 or more is fixedly connected to the swing blade assembly 10 and / or the piezoelectric actuation unit 20 to increase the number of swing areas 102 and / or the swing length, increase the displacement, increase the directional air volume, and improve the heat dissipation effect.

[0106] Example 5

[0107] like Figure 19-21 As shown, this embodiment is basically the same as the structure of embodiments one to four. The difference is that at least one separate liquid cooling heat dissipation module 2 is also fixedly provided on the surface of the oscillating blade assembly 10. The single liquid cooling heat dissipation module 2 is arranged on one side of the oscillating blade assembly 10, and multiple liquid cooling heat dissipation modules 2 are arranged on one or both sides of the oscillating blade assembly 10.

[0108] A single piezoelectric actuation unit 20 is partially or entirely arranged on the side of the swing region 102 of the oscillating blade assembly 10 near the fixed region 101, providing power for the reciprocating bending oscillation of the swing region 102.

[0109] The bonding surface 3 is formed on the swing blade 1 and / or fixed on the liquid cooling heat dissipation module 2 on the swing blade 1. The bonding surface 3 is in close contact with the heat source 200. The bonding surface 3 can be a single continuous type or multiple discrete types.

[0110] Example 6

[0111] like Figure 22-24 As shown, the structure of this embodiment is basically the same as that of embodiment five. The difference is that the oscillating blade 1 and the liquid cooling heat dissipation module 2 are not integrated components. The liquid cooling heat dissipation module 2 is stacked and disposed on at least one side of the thickness direction of the oscillating blade 1. A single liquid cooling heat dissipation module 2 is arranged on one side of the oscillating blade 1, and multiple liquid cooling heat dissipation modules 2 are arranged on one or both sides of the oscillating blade 1.

[0112] The bonding surface 3 is formed on the swing blade 1 and / or fixed on the liquid cooling heat dissipation module 2 on the swing blade 1. The bonding surface 3 is in close contact with the heat source 200. The bonding surface 3 can be a single continuous type or multiple discrete types.

[0113] Example 7

[0114] like Figure 25-37 As shown, this embodiment mainly focuses on the design of the liquid cooling heat dissipation module 2 to form different forms of louvered blade assembly 10.

[0115] Specifically, such as Figure 25 As shown, the liquid cooling heat dissipation module 2 of this embodiment includes a flow channel device 21 and at least one power pump 22. The flow channel device 21 has a flow channel 21a to form a heat dissipation circuit. The power pump 22 is connected to the flow channel device 21 to drive the flow of cooling working fluid in the flow channel 21a. Both the power pump 22 and the flow channel 21a are formed as patch structures.

[0116] In this embodiment, the power pump 22 includes: a pump body 221, a vibrating plate 224, a first fluid valve 225, and a second fluid valve 226. The pump body 221 has at least one pump chamber 22a, and also has an inlet 222 and an outlet 223 communicating with the pump chamber 22a. The inlet 222 and outlet 223 are used to communicate with the flow channel 21a. The vibrating plate 224 covers the pump chamber 22a and is connected to the pump body 221. The vibrating plate 224 can generate reciprocating vibration under the drive of an alternating signal to change the volume of the pump chamber 22a. The first fluid valve 225 is located at the inlet 222 and is used to control the unidirectional flow of the cooling medium in the flow channel 21a into the pump chamber 22a. The second fluid valve 226 is located at the outlet 223 and is used to control the unidirectional flow of the cooling medium in the pump chamber 22a into the flow channel 21a. See [link to relevant documentation]. Figure 26 and 27 The specific working principle is as follows: the reciprocating motion of the vibrating plate 224 changes the volume of the pump chamber 22a and cooperates with the fluid valve to make the fluid flow in a specific direction. The working process of the power pump 22 can be divided into two processes: suction and discharge. When the vibrating plate 224 bends upward, the volume of the pump chamber 22a increases and the pressure inside the chamber decreases. Under the action of the pressure difference on both sides, the first fluid valve 225 at the inlet 222 opens and the second fluid valve 226 at the outlet 223 closes. The fluid flows into the pump chamber 22a from the first fluid valve 225 at the inlet 222, completing the fluid suction process. When the vibrating plate 224 bends downward, the volume of the pump chamber 22a decreases and the pressure inside the chamber increases. The second fluid valve 226 at the outlet 223 opens and the first fluid valve 225 at the inlet 222 closes, completing the fluid discharge process. When a continuous alternating signal is applied to the vibrating plate 224, the power pump 22 completes continuous suction and discharge, realizing unidirectional fluid flow. Therefore, the structure is simple and easy to implement.

[0117] Specifically, the structure of the vibrating plate 224 in this embodiment can be integral or separate, such as... Figure 28 As shown, the excitation unit 2241 and the vibrating plate 2242 of the integral vibrating plate 224 are tightly fitted together. The excitation unit 2241 drives the vibrating plate 2242 to produce up-and-down reciprocating deformation, as shown in the figure. Figure 29As shown, the excitation unit 2241 and the vibrating plate 2242 of the separate vibrating plate 224 are connected by the connecting part 2243. Specifically, one end of the excitation unit 2241 is fixed, and the other end is hinged to the vibrating plate 2242 through the connecting part 2243. A periodic alternating current signal is applied to the excitation unit 2241, causing the end of the excitation unit 2241 connected to the vibrating plate 2242 to undergo periodic upward and downward deformation, thereby driving the vibrating plate 2242 to undergo reciprocating deformation, which in turn causes the volume of the pump cavity 22a to change periodically.

[0118] It should be noted that the power pump 22 in this embodiment can be a single-chamber pump or a multi-chamber pump, for example... Figure 30 The example shown is an integral dual-chamber pump, and also... Figure 31 The image shows a combined dual-chamber pump.

[0119] In this embodiment, the power pump 22 is preferably a miniature piezoelectric diaphragm pump. The miniature piezoelectric diaphragm pump can be highly integrated with the heat transfer and heat dissipation functional module and the flow channel 21a. It does not require a separate heat exchanger (liquid tank) and external pipelines. The structure is compact and adaptable to the use requirements of small heat dissipation spaces.

[0120] In this embodiment, the first fluid valve 225 and the second fluid valve 226 are preferably cantilever beam check valves, but other valve bodies of different types can also be used, for example... Figure 32 The illustrated power valve 227 may have a valve inlet 2272, a valve outlet 2273, and a vibrating part 2271, as long as it can control the unidirectional flow of fluid, there is no limitation on this. Of course, the fluid valve may be designed as one or more depending on different control methods, there is also no limitation on this.

[0121] like Figure 33-36 As shown, the flow channel device 21 of this embodiment includes: a flow channel layer 211, which includes a substrate and a guide groove 2111 formed on the substrate; and a panel layer 212, which includes at least one panel 2121, which covers the guide groove 2111. A flow channel 21a is defined between the guide groove 2111 and the panel layer 212. The panel layer 212 is provided with an inlet hole 213 and an outlet hole 214 suitable for communication with the power pump 22. Thus, the power pump 22 and the flow channel device 21 communicate to form a sealed whole filled with working fluid, which helps to ensure the reliability of the piezoelectric fan 100.

[0122] It should be noted that there is at least one flow guide trough 2111 in this embodiment. When there are multiple flow guide troughs 2111, the multiple flow guide troughs 2111 can be interconnected and configured with a set of liquid cooling heat dissipation flow paths. The multiple flow guide troughs 2111 can also be independent of each other, with a set of liquid cooling heat dissipation flow paths configured on each flow guide trough 2111. As long as the heat dissipation function can be achieved, the specific layout method is not limited.

[0123] According to one embodiment of the flow channel device 21 of the present invention, see Figure 33 The flow channel 2111 is a through channel. The panel layer 212 includes a first panel and a second panel. The flow channel layer 211 is disposed between the first panel and the second panel, and the first panel, the second panel, and the through channel cooperate to form a flow channel device 21. Specifically, the flow channel device 21 is a basic flow channel formed by sequentially stacking and bonding three thin plates. The first panel, the flow channel layer 211, and the second panel are respectively the upper plate of the flow channel, the through channel layer 2122, and the lower plate of the flow channel. The upper plate of the flow channel is provided with an inlet hole 213, an outlet hole 214, an injection port 215, and a cover plate 23. The through channel layer 2122 has a completely through-through groove. The lower plate of the flow channel is a thin plate without any features. The working fluid is injected into the flow channel 21a through the injection port 215, and then sealed with the cover plate 23. The power pump 22 is connected to the flow channel 21a to form a closed whole filled with the working fluid.

[0124] According to another embodiment of the flow channel device 21 of the present invention, see Figure 34 The guide groove 2111 is a recess, and the panel layer 212 includes a panel 2121. The panel 2121 and the recess cooperate to form a flow channel 21a. The flow channel device 21 is a basic flow channel formed by sequentially stacking and bonding the panel 2121 and the flow channel layer 211. The panel 2121 and the flow channel layer 211 are respectively the upper plate of the flow channel and the channel groove plate 2123. The upper plate of the flow channel is provided with an inlet hole 213, an outlet hole 214, an injection port 215, and a cover plate 23. The channel groove plate 2123 is provided with a connected groove of a certain depth. The working fluid is injected into the flow channel 21a through the injection port 215, and then sealed with the cover plate 23. The power pump 22 is connected to the flow channel device 21 to form a closed whole filled with the working fluid.

[0125] Of course, in this embodiment, the two flow channel device structures 21 can also be combined, which can also play a role in guiding flow. For example Figure 35 As shown, the mixing channel 21a is a basic channel 21a formed by sequentially stacking and bonding three thin plates. The three thin plates are a channel upper plate, a through groove layer 2122, and a channel groove plate 2123. The channel upper plate is provided with an inlet hole 213, an outlet hole 214, an injection port 215, and a cover plate 23. A connected groove of a certain depth may or may not be provided on the side near the through groove layer 2122. The shape of the groove is consistent with the groove of the through groove layer 2122. The through groove layer 2122 has a completely through connected groove. The channel groove plate 2123 is provided with a connected groove of a certain depth. The shape of the groove is consistent with the groove of the through groove layer 2122.

[0126] Of course, such as Figure 36As shown, the flow channel 21a can also be arranged as a composite of multiple basic flow channels.

[0127] In this embodiment, the substrate and / or panel 2121 is a thin plate or film. The thin plate or film can be made of metal, polymer, or composite materials, with polymer materials being preferred, such as PP, PPS, and PET. When polymer materials are used in communication equipment or electromagnetic products, they can effectively avoid interference and shielding of communication and electromagnetic signals, which is in line with the current application environment of 5G signal transmission. Compared with metal materials, it is more in line with the development trend and design concept of lightweight products. At the same time, it is easy to handle the heat dissipation surface morphology, such as setting flanges or fins on the heat dissipation surface to increase the heat dissipation area, thereby obtaining heat dissipation performance comparable to or even better than that of metal heat sinks.

[0128] Preferably, the external dimensions of the power pump 22 do not exceed 40mm × 40mm × 10mm (length × width × thickness).

[0129] Preferably, the equivalent diameter of the flow channel 21a is 10 μm to 3 mm.

[0130] As can be seen from the above, the power pump 22 and the flow channel 21a in this embodiment can both be designed as a stacked structure, which is beneficial to the miniaturization design of the product.

[0131] Example 8:

[0132] like Figure 37 As shown, in this embodiment, the flow channel device 21 of the liquid cooling heat dissipation module 2 is formed as a flexible stacked structure.

[0133] Specifically, when the piezoelectric fan 100 is working, the heat source 200 continuously generates heat. Heat transfer occurs between the heat source 200 and the oscillating blade 1 and / or the liquid-cooled heat dissipation module 2 fixedly mounted on the oscillating blade 1 via the contact surface 3. The heat reaching the vicinity of the heat source 200 on the oscillating blade 1 and / or the liquid-cooled heat dissipation module 2 is rapidly dispersed onto the surface of the oscillating blade 1 and / or the liquid-cooled heat dissipation module 2 under the combined action of heat transfer within the structure of the oscillating blade 1 and / or the working fluid circulation in the liquid cooling circuit. The piezoelectric actuation unit 20 vibrates under periodic electrical signal excitation, causing the oscillating area to... Under the action of the piezoelectric actuator 20, the area 102 oscillates back and forth at high frequency, striking the surrounding air, which increases the airflow speed and forms vortices and turbulence in a localized area. As a result, strong convective heat transfer is formed between the thermal boundary layer on the surface of the swing blade 1 and / or the liquid cooling heat dissipation module 2 fixed on the swing blade 1 and the surrounding air. The air quickly sweeps away the heat from the surface of the swing blade 1 and / or the liquid cooling heat dissipation module 2 fixed on the swing blade 1. The continuous reciprocating oscillation of the swing area 102 pushes the hot air far away, carrying away the heat. At the same time, the heat source 200 continuously transfers heat to the swing blade 1 and / or the liquid cooling heat dissipation module 2 fixed on the swing blade 1, thus forming efficient heat dissipation.

[0134] In summary, compared with the prior art, the piezoelectric fan 100 of the present invention has the following beneficial effects:

[0135] (1) The oscillating blade 1, the liquid cooling heat dissipation module 2, and the piezoelectric actuation unit 20 are all formed in a stacked structure. The oscillating blade 1 and / or the liquid cooling heat dissipation module 2 fixed on the oscillating blade 1 are tightly attached to the heat source 200 through the bonding surface 3. This changes the previous structure of the heat dissipation components and the heat source 200 being arranged separately. The structure is more compact, occupies less space, and can adapt to the heat dissipation needs of a small space.

[0136] (2) The number and shape of the mating surface 3 match the heating surface of the heat source, which is suitable for continuous heat sources and heat sources away from the heat source. It is suitable for planar heat sources, curved heat sources, volume heat sources, etc., and has a wide range of applications.

[0137] (3) The liquid cooling heat dissipation module 2 is integrally formed with the swing blade 1 or fixedly set on the swing blade 1, so that the heat can be dispersed from the heat source 200 to the surface of the swing blade 1 and / or the liquid cooling heat dissipation module 2 more quickly and evenly. At the same time, the swing area 102 swings at high frequency, beats the surrounding air, forms vortex and turbulence, strengthens the convective heat transfer between the thermal boundary layer and the surrounding air, and pushes the hot air far away to carry away the heat, resulting in high heat dissipation efficiency.

[0138] (4) The piezoelectric actuator 20 has low energy consumption, operates at high frequency, and has low or no noise, making it energy-saving and environmentally friendly.

[0139] Other configurations and operations of the piezoelectric fan 100 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0140] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0141] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0142] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A piezoelectric fan, characterized in that, include: A swaying blade assembly is connected to a heat source. The surface of the swaying blade assembly has a contact surface, and the swaying blade assembly is in close contact with the heat source through the contact surface. The swaying blade assembly includes a liquid cooling heat dissipation module formed in a stacked structure. The liquid cooling heat dissipation module includes a flow channel device and a power pump. The flow channel device has a flow channel, and the power pump is connected to the flow channel device to drive the flow of the cooling working fluid in the flow channel. The swaying blade assembly has a fixed area and a swinging area. The fixed area is fixed, and the swinging area is suspended and can swing back and forth. A piezoelectric actuation unit is connected to the oscillating blade assembly, and the piezoelectric actuation unit provides power for the oscillation of the oscillating region; The liquid cooling heat dissipation module is formed as a louvered blade; The blade has a fixed part and a swinging part, the fixed part corresponds to the fixed area, the swinging part corresponds to the swinging area, and at least a portion of the piezoelectric actuation unit is arranged on the swinging part of the blade.

2. The piezoelectric fan according to claim 1, characterized in that, The blades have a contact surface formed to cooperate with the heat source. The contact surface is formed as a single continuous type, or the contact surface is formed as a discrete type.

3. The piezoelectric fan according to claim 2, characterized in that, The blades are provided with a thermally conductive film, and the thermal conductivity of the thermally conductive film is higher than that of the liquid cooling heat dissipation module.

4. The piezoelectric fan according to claim 2, characterized in that, The oscillating blade has concave and convex portions, or the oscillating blade has heat-conducting fins.

5. The piezoelectric fan according to claim 1, characterized in that, The power pump includes: The pump body has at least one pump chamber, and the pump body also has an inlet and an outlet communicating with the pump chamber, the inlet and the outlet being used to communicate with the flow channel; A vibrating plate covers the pump cavity and is connected to the pump body. The vibrating plate can generate reciprocating vibration under the drive of an alternating signal to change the volume of the pump cavity. A first fluid valve is disposed at the liquid inlet and is used to control the unidirectional flow of the cooling medium in the flow channel into the pump chamber. A second fluid valve is disposed at the liquid outlet and is used to control the unidirectional flow of the cooling medium in the pump chamber into the flow channel.

6. The piezoelectric fan according to claim 1, characterized in that, The flow channel device includes: A flow channel layer, the flow channel layer including a substrate and flow guide grooves formed on the substrate; The panel layer includes at least one panel, which covers the flow channel and defines the flow channel between the flow channel and the panel layer. The panel layer is provided with an inlet hole and an outlet hole suitable for communication with the power pump.

7. The piezoelectric fan according to claim 6, characterized in that, The panel layer is provided with an injection port that communicates with the flow channel, and the injection port is sealed by a cover plate.

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