Heat dissipation type circuit board

Abstract

The utility model relates to the field of circuit boards, and discloses a heat dissipation type circuit board which comprises a circuit board body, a piezoelectric fan is arranged in the middle of one side of the upper end of the circuit board body, a first connecting pipe is fixedly arranged on one side of the circuit board body, and a conveying mechanism is arranged on the other side of the upper end of the circuit board body. A heat dissipation flow channel is arranged in the circuit board body. According to the utility model, the piezoelectric fan can accelerate air flow and take away part of heat in time, meanwhile, the conveying mechanism drives the cooling liquid to circulate in the heat dissipation flow channel, fully absorb the heat of the circuit board and cool through an external cooling system so as to realize circulating heat dissipation, and the heat dissipation layer in the circuit board body is made of a graphene material with high thermal conductivity, so that the heat can be rapidly conducted; the reinforcing layer also assists in heat dissipation, through mutual cooperation of multiple heat dissipation modes, the temperature of the circuit board can be effectively reduced, performance reduction or element damage caused by overheating is avoided, and it is ensured that the circuit board is stable and reliable in long-time work.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and in particular to a heat dissipation type circuit board. Background Technology

[0002] A circuit board, also known as a printed circuit board, is a provider of electrical connections for electronic components. It uses an insulating board as a substrate on which printed circuits and components are fabricated according to a design. Circuit boards enable various electronic components to form predetermined circuit connections. They have the advantages of high assembly density, small size, and light weight, and are widely used in mobile phones, computers, televisions, and other electronic products. They are an indispensable and important component of electronic products.

[0003] Existing circuit boards mostly have relatively simple heat dissipation designs, mainly relying on natural heat dissipation or a few heat dissipation holes. However, with the increasing number of high-performance components integrated into circuit boards, the large amount of heat generated during operation cannot be dissipated in time. This problem of low heat dissipation efficiency leads to a continuous increase in circuit board temperature, which not only causes a significant drop in performance and accelerated component aging, but in severe cases, it can also cause system crashes or even component burnout, greatly affecting the stability and service life of the circuit board. Therefore, those skilled in the art have provided a heat dissipation circuit board to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a heat-dissipating circuit board. This circuit board utilizes multiple heat dissipation methods in combination to effectively reduce its temperature, preventing performance degradation or component damage due to overheating. This ensures the circuit board remains stable and reliable during long-term operation. Furthermore, the combination of a base layer, a reinforcing layer, and a protective layer allows the circuit board to adapt to different working environments, reducing damage from external factors, improving stability, extending its service life, and reducing operating costs.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A heat-dissipating circuit board includes a circuit board body, a piezoelectric fan is disposed in the middle of one side of the upper end of the circuit board body, a first connecting pipe is fixedly disposed on one side of the circuit board body, a conveying mechanism is disposed on the other side of the upper end of the circuit board body, and a heat dissipation channel is disposed inside the circuit board body.

[0007] The circuit board body includes a base layer, a heat dissipation layer is fixedly disposed on the inner surface of the base layer, a reinforcing layer is fixedly disposed on the outer surface of the base layer, a protective layer is fixedly disposed on the outer surface of the reinforcing layer, and the conveying mechanism includes a piezoelectric micropump, a conveying pipe is fixedly disposed on one output end of the piezoelectric micropump, and a second connecting pipe is fixedly disposed on the other output end of the piezoelectric micropump.

[0008] Furthermore, fixing holes are provided at the four corners of the upper end of the circuit board body, and a high-heat element is fixedly installed at the middle position of the upper end of the circuit board body.

[0009] Furthermore, one side of the second connecting tube is fixedly connected to the circuit board body.

[0010] Furthermore, the heat dissipation layer is made of graphene material, and the heat dissipation layer is connected to the base layer through thermally conductive silicone.

[0011] Furthermore, the base layer is made of fiberglass board and is connected by adhesive and reinforcing layer.

[0012] Furthermore, the reinforcing layer is made of aluminum alloy.

[0013] Furthermore, the protective layer is made of silicone coating and is applied to the outer surface of the reinforcing layer by a spraying process.

[0014] This utility model has the following beneficial effects:

[0015] 1. The present invention proposes a heat-dissipating circuit board. The piezoelectric fan can accelerate airflow and remove some heat in time. At the same time, the conveying mechanism drives the coolant to circulate in the heat dissipation channel, fully absorb the heat of the circuit board and cool it through the external cooling system to achieve circulating heat dissipation. The heat dissipation layer inside the circuit board body is made of graphene material with high thermal conductivity, which can quickly conduct heat. The reinforcing layer also assists in heat dissipation. Through the cooperation of multiple heat dissipation methods, the temperature of the circuit board can be effectively reduced, avoiding performance degradation or component damage caused by overheating, and ensuring the stability and reliability of the circuit board during long-term operation.

[0016] 2. The heat-dissipating circuit board proposed in this utility model has a base layer made of fiberglass board, which has good insulation and mechanical properties. The aluminum alloy material of the reinforcing layer enhances the overall strength and heat dissipation capacity. The silicone coating of the protective layer can prevent external environmental corrosion. Through the cooperation of the base layer, reinforcing layer and protective layer, the circuit board can adapt to different working environments, reduce damage to it from external factors, improve stability, thereby extending the service life of the circuit board and reducing the cost of use. Attached Figure Description

[0017] Figure 1 This is a first axonometric view of the present invention;

[0018] Figure 2 This is a second axonometric view of the present invention;

[0019] Figure 3 This is a top sectional view of the present invention;

[0020] Figure 4This is a schematic diagram of the circuit board body structure of this utility model.

[0021] Legend:

[0022] 1. Circuit board body; 2. Piezoelectric fan; 3. Fixing hole; 4. First connecting pipe; 5. Conveying mechanism; 6. High-heat element; 7. Heat dissipation channel; 101. Heat dissipation layer; 102. Base layer; 103. Reinforcing layer; 104. Protective layer; 501. Conveying pipe; 502. Piezoelectric micropump; 503. Second connecting pipe. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Reference Figure 1-4 An embodiment of this utility model is provided: a heat dissipation circuit board, including a circuit board body 1, a piezoelectric fan 2 is provided in the middle of one side of the upper end of the circuit board body 1, a first connecting pipe 4 is fixedly provided on one side of the circuit board body 1, a conveying mechanism 5 is provided on the other side of the upper end of the circuit board body 1, a heat dissipation channel 7 is provided inside the circuit board body 1, a fixing hole 3 is provided at each of the four corners of the upper end of the circuit board body 1, and a high-heat element 6 is fixedly provided in the middle of the upper end of the circuit board body 1.

[0025] Specifically, the circuit board body 1 is the basic structure of the entire circuit board, the fixing hole 3 facilitates the installation and fixing of the circuit board, the piezo fan 2 can generate airflow, accelerate air flow, and assist in heat dissipation, the first connecting pipe 4 is connected to the external cooling system, and with the cooperation of the conveying mechanism 5, it can allow coolant or other heat dissipation medium to circulate in the heat dissipation channel 7, and the high-heat element 6 is the main heat-generating element of the circuit board.

[0026] Reference Figure 1 , Figure 4 The circuit board body 1 includes a base layer 102, a heat dissipation layer 101 fixedly disposed on the inner surface of the base layer 102, a reinforcing layer 103 fixedly disposed on the outer surface of the base layer 102, and a protective layer 104 fixedly disposed on the outer surface of the reinforcing layer 103. The heat dissipation layer 101 is made of graphene material and is connected to the base layer 102 by thermally conductive silicone. The base layer 102 is made of fiberglass board material and is connected to the reinforcing layer 103 by adhesive. The reinforcing layer 103 is made of aluminum alloy material. The protective layer 104 is made of silicone coating and is coated on the outer surface of the reinforcing layer 103 by spraying.

[0027] Specifically, in the circuit board body 1, the graphene material of the heat dissipation layer 101 has excellent thermal conductivity, which can quickly conduct the heat generated by the circuit board away. The thermally conductive silicone ensures good thermal conduction between the heat dissipation layer 101 and the base layer 102. The fiberglass board material of the base layer 102 has good insulation and mechanical properties. The aluminum alloy material of the reinforcing layer 103 enhances the overall strength and heat dissipation capacity of the circuit board. The silicone coating of the protective layer 104 can prevent the circuit board from being corroded by the external environment and improve the stability and service life of the circuit board.

[0028] Reference Figure 1 , Figure 2 The conveying mechanism 5 includes a piezoelectric micropump 502. A conveying pipe 501 is fixedly installed on one output end of the piezoelectric micropump 502, and a second connecting pipe 503 is fixedly installed on the other output end of the piezoelectric micropump 502. One side of the second connecting pipe 503 is fixedly connected to the circuit board body 1.

[0029] Specifically, in the conveying mechanism 5, the conveying pipe 501 is connected to the external cooling system. The piezoelectric micropump 502, which serves as the power source, can drive the flow of coolant or heat dissipation medium. After the coolant flows into the piezoelectric micropump 502 through the conveying pipe 501, it enters the heat dissipation channel 7 of the circuit board body 1 through the second connecting pipe 503 to absorb the heat generated by the circuit board.

[0030] Working principle: After the circuit board starts working, it generates heat. At this time, the piezoelectric fan 2 runs rapidly, accelerating airflow and promptly removing some of the heat generated by the high-heat component 6. Simultaneously, the piezoelectric micropump 502 starts working, drawing coolant from the external cooling system through the delivery pipe 501, and then delivering it to the heat dissipation channel 7 of the circuit board body 1 via the second connecting pipe 503. The coolant continuously circulates in the heat dissipation channel 7, constantly absorbing the heat generated by the circuit board. Subsequently, the coolant that has absorbed heat flows out of the circuit board body 1 through the first connecting pipe 4. Since the first connecting pipe 4 is connected to the external coolant circulation system, the outflowing coolant... The coolant returns to the cooling system for cooling. Once the coolant temperature has decreased, the piezoelectric micropump 502 draws it back in through the delivery pipe 501 and sends it back into the heat dissipation channel 7 of the circuit board body 1, forming a complete circulating heat dissipation process. This cycle repeats, effectively meeting the heat dissipation needs of the circuit board. Inside the circuit board body 1, the heat dissipation layer 101 rapidly conducts heat thanks to the high thermal conductivity of graphene, the reinforcing layer 103 assists in heat dissipation, further improving heat dissipation efficiency, while the protective layer 104 constructs a protective barrier for the circuit board, protecting it from external environmental interference and ensuring that the circuit board is always in good working condition and operates stably.

[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat-dissipating circuit board, comprising a circuit board body (1), characterized in that: A piezoelectric fan (2) is provided in the middle of one side of the upper end of the circuit board body (1), a first connecting pipe (4) is fixedly provided on one side of the circuit board body (1), a conveying mechanism (5) is provided on the other side of the upper end of the circuit board body (1), and a heat dissipation channel (7) is provided inside the circuit board body (1). The circuit board body (1) includes a base layer (102), a heat dissipation layer (101) is fixedly disposed on the inner surface of the base layer (102), a reinforcing layer (103) is fixedly disposed on the outer surface of the base layer (102), a protective layer (104) is fixedly disposed on the outer surface of the reinforcing layer (103), and the conveying mechanism (5) includes a piezoelectric micropump (502), a conveying pipe (501) is fixedly disposed on one output end of the piezoelectric micropump (502), and a second connecting pipe (503) is fixedly disposed on the other output end of the piezoelectric micropump (502).

2. The heat-dissipating circuit board according to claim 1, characterized in that: Fixing holes (3) are provided at the four corners of the upper end of the circuit board body (1), and a high-heat element (6) is fixedly installed at the middle position of the upper end of the circuit board body (1).

3. The heat-dissipating circuit board according to claim 1, characterized in that: The second connecting tube (503) is fixedly connected to the circuit board body (1) on one side.

4. A heat-dissipating circuit board according to claim 1, characterized in that: The heat dissipation layer (101) is made of graphene material and is connected to the base layer (102) by thermally conductive silicone.

5. A heat-dissipating circuit board according to claim 1, characterized in that: The base layer (102) is made of fiberglass board and is connected by adhesive and reinforcing layer (103).

6. A heat-dissipating circuit board according to claim 1, characterized in that: The reinforcing layer (103) is made of aluminum alloy.

7. A heat-dissipating circuit board according to claim 1, characterized in that: The protective layer (104) is made of silicone coating and is applied to the outer surface of the reinforcing layer (103) by spraying.

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