Novel integrated circuit multi-die bonding device

Abstract

The utility model relates to a novel integrated circuit multi-die bonding device in the technical field of integrated circuits, which comprises a suction nozzle body with a step structure and an opening angle; the cavity body is arranged in the suction nozzle body; the cavity body comprises a vacuum cavity and a vacuum hole which are communicated with each other. Compared with the prior art, the suction nozzle structure is deeply optimized, and compared with the prior art, the suction nozzle structure is optimized, so that the contraction angle of the suction nozzle is remarkably reduced, and the situation that the side edge of the suction nozzle is in contact with a die beside the suction nozzle when the suction nozzle is pressed down due to an overlarge field angle is effectively avoided; and meanwhile, a platform is added to prevent the whole suction nozzle from being slender to influence the stability after the contraction angle is reduced. According to the utility model, the chipping risk of a multi-die product caused by the collision of the suction nozzle is thoroughly eliminated, the potential quality customer complaint risk is greatly reduced, and the quality of the product is powerfully guaranteed. According to the optimized suction nozzle structure, the abrasion condition is successfully avoided, the service life is greatly prolonged, and the inter-material cost is saved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, and in particular to a novel multi-die bonding device for integrated circuits. Background Technology

[0002] In the process of multi-die bonding for integrated circuits, traditional bonding equipment has many limitations, especially for multi-die products with varying chip thicknesses and small die spacing. For example, conventional nozzles are prone to collisions during chip picking due to the aforementioned characteristics of multi-die products. This is particularly true when handling chips like D2, where the nozzle easily collides with the D1 edge, causing chipping and affecting chip quality and performance. It also leads to wear and tear on the nozzle itself, reducing its lifespan. Frequent collisions can also cause production interruptions, reduce efficiency, increase costs, and create potential customer complaints, hindering product promotion and application in the market. Utility Model Content

[0003] The purpose of this invention is to address the chipping risk in existing technologies by proposing a novel integrated circuit multi-die bonding device.

[0004] To achieve the above objectives, this utility model adopts the following technical solution: a novel integrated circuit multi-die die bonding device, comprising:

[0005] The nozzle body has a stepped structure and an opening angle;

[0006] A cavity body disposed inside the nozzle body;

[0007] The cavity body includes interconnected vacuum cavities and vacuum holes.

[0008] As a further description of the above technical solution:

[0009] The height of the suction nozzle body is a first height, which is 3.30mm ± 0.1mm.

[0010] As a further description of the above technical solution:

[0011] The diameter of the vacuum cavity is a first diameter, which is 1.56mm ± 0.05mm.

[0012] As a further description of the above technical solution:

[0013] The angle of the suction nozzle body is the first angle, which ranges from 30° to 60°.

[0014] As a further description of the above technical solution:

[0015] The first angle is preferably 45°.

[0016] As a further description of the above technical solution:

[0017] The inner diameter of the vacuum hole is a second diameter, which is 0.150mm ± 0.050mm.

[0018] As a further description of the above technical solution:

[0019] The outer diameter of the vacuum hole is a third diameter, which is 0.30mm ± 0.05mm.

[0020] As a further description of the above technical solution:

[0021] The diameter of the bottom of the nozzle body is the fourth diameter, which is 4mm ± 0.1mm.

[0022] This utility model has the following beneficial effects:

[0023] (1) The present invention has deeply optimized the nozzle structure. Compared with the previous nozzle design, the nozzle shrinkage angle has been significantly reduced, which effectively avoids the situation where the side of the nozzle touches the adjacent die during the pressing operation due to the excessive opening angle. This completely eliminates the chipping risk caused by nozzle collision in multi-die products, greatly reduces the potential quality complaint risk, and effectively guarantees the quality of the product.

[0024] (2) In the past, the suction nozzles would suffer severe wear when processing products. However, the optimized suction nozzle structure of this utility model successfully avoids such wear. The service life of this utility model has been greatly improved, and the material cost can be reduced by 50%, thereby reducing the production cost of enterprises and improving production efficiency. Attached Figure Description

[0025] Figure 1 This is a front cross-sectional view of the novel integrated circuit multi-die bonding device proposed in this utility model;

[0026] Figure 2 This is a top view of the novel integrated circuit multi-die bonding device proposed in this utility model;

[0027] Figure 3 This is a front cross-sectional view of the nozzle structure before optimization.

[0028] A schematic diagram of the slide rail.

[0029] Legend:

[0030] 1. Nozzle body; 2. Cavity body; 21. Vacuum cavity; 22. Vacuum hole; 3. First height; 4. First diameter; 5. First opening angle; 6. Second diameter; 7. Third diameter; 8. Fourth diameter. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] Example

[0033] Reference Figure 1 One embodiment of this utility model provides: a novel integrated circuit multidie die bonding device, comprising:

[0034] The nozzle body 1 has a stepped structure and an opening angle;

[0035] A cavity body 2 is disposed inside the nozzle body 1;

[0036] The cavity body 2 includes a vacuum cavity 21 and a vacuum hole 22 that are interconnected.

[0037] Vacuum hole 22 is used to pick up the product, thereby enabling the device to pick up the product.

[0038] The height of the nozzle body 1 is the first height 3, which is 3.30mm ± 0.05mm.

[0039] The diameter of the vacuum chamber 21 is a first diameter 4, which is 1.56mm ± 0.05mm.

[0040] The opening angle of the nozzle body 1 is the first opening angle 5, which is 45°.

[0041] The inner diameter of the vacuum hole 22 is the second diameter 6, which is 0.150mm ± 0.050mm.

[0042] The outer diameter of the vacuum hole 22 is the third diameter 7, which is 0.30mm ± 0.05mm.

[0043] The diameter of the bottom of the nozzle body 1 is the fourth diameter 8, which is 4mm ± 0.1mm.

[0044] In the embodiments of this utility model, the stepped structure of the nozzle body 1 plays a crucial and unique role. Its stepped design is specifically customized for multi-die products with varying chip thicknesses and small die spacing. This structure allows the nozzle to be flexibly adjusted vertically according to the thickness of different chips. When processing such complex products, the stepped nozzle with a specific angle (45°) exhibits excellent precision positioning capabilities. Thanks to its optimized structural design, this nozzle can stably and accurately descend slowly towards the target chip under the precise control of the robotic arm. During the descent, the suction force generated through the vacuum hole 22 gradually acts on the chip surface. In this case, the vacuum chamber 21 serves as a key space for vacuum generation and storage. Its specific diameter can effectively control the distribution and transmission of vacuum. When the vacuum system is started, air is drawn out from the vacuum hole 22 and a stable negative pressure environment is formed in the vacuum chamber 21. The inner and outer diameters of the vacuum hole 22 further determine the concentration and range of the suction force. The vacuum suction force generated by this synergistic effect is just right. While ensuring that the chip is reliably adsorbed and fixed at the bottom of the nozzle, it will not damage the chip surface due to excessive suction force, affecting the integrity of the chip, nor will it cause unstable phenomena such as chip slippage or displacement during the pick-up or handling process due to insufficient suction force.

[0045] The design of the nozzle body 1 with a bottom diameter of 4 mm, after in-depth research and repeated testing, has been found to provide sufficient support area and stability for the nozzle during high-speed, frequent pick-up operations. It also effectively reduces the risk of collisions caused by shaking or displacement when faced with minor external interference or small vibrations during robotic arm movement. This not only ensures the safety of the chip during pick-up and handling but also greatly improves the efficiency and product quality of the entire production process. For example, on large-scale integrated circuit production lines, each chip pick-up and placement operation needs to be completed in a very short time with extremely high accuracy and stability. The nozzle structure in this embodiment, through its unique design, successfully meets these stringent production requirements, significantly improving the yield rate on the production line and effectively guaranteeing production efficiency. This lays a solid foundation for the company's efficient production and enhanced competitiveness.

[0046] Comparative Example

[0047] Reference Figure 1 The present invention provides a comparative example: the suction nozzle structure before optimization, comprising:

[0048] The nozzle body 1 has an opening angle;

[0049] The cavity body 2 is located inside the nozzle body 1.

[0050] The cavity body 2 includes a vacuum cavity 21 and a vacuum hole 22 that are interconnected.

[0051] The height of the nozzle body 1 is the first height 3, which is 3.30mm ± 0.05mm.

[0052] The opening angle of the nozzle body 1 is the first opening angle 5, which is 40°.

[0053] The diameter of the vacuum chamber 21 is a first diameter 4, which is 1.6mm ± 0.05mm.

[0054] The inner diameter of the vacuum hole 22 is the second diameter 6, which is 0.150mm ± 0.050mm.

[0055] The outer diameter of the vacuum hole 22 is the third diameter 7, which is 0.30mm ± 0.05mm.

[0056] In the original nozzle structure (i.e., the comparative example), although it also includes basic components such as nozzle body 1, cavity body 2, vacuum cavity 21, and vacuum hole 22, its structural design has many shortcomings, leading to a series of problems in practical applications. First, the nozzle body 1 has an opening angle of only 40°. This relatively small opening angle is severely inadequate when dealing with complex situations involving differences in chip thickness and small die spacing. In actual operation scenarios, when the nozzle approaches the chip layout area, its narrow opening angle makes it easier for the nozzle to interfere with the adjacent die during descent. Especially when picking up chips such as D2, due to its special positional relationship and the close arrangement of surrounding chips, this nozzle structure almost inevitably and frequently collides with the edge of D1, causing chipping problems in the chip. This may lead to serious performance failures or reliability issues, directly affecting the quality and yield of the product.

[0057] Working principle:

[0058] The working principle of this novel integrated circuit multi-die bonding device is based on the vacuum adsorption principle and consists of the following stages:

[0059] Vacuum generation and preparation stage:

[0060] When the device starts running, the connected vacuum system is activated and establishes a communication path with the vacuum chamber 21 and vacuum hole 22 inside the nozzle body 1. The vacuum system quickly extracts the air from the vacuum chamber 21 and vacuum hole 22, thereby creating a negative pressure environment inside the vacuum hole 22. At the same time, under the precise control of the external drive device (such as a robotic arm), the nozzle body 1 begins to gradually approach the location of the target chip. During this process, all components of the device are in a coordinated preparation state, laying the foundation for the upcoming chip adsorption operation.

[0061] Chip adsorption stage:

[0062] As the nozzle body 1 gradually approaches the target chip, a significant pressure difference is generated between the chip surface and the vacuum hole 22 due to the negative pressure already formed in the vacuum hole 22. Under the strong action of this pressure difference, the chip will be firmly adsorbed to the bottom of the nozzle body 1. In this stage, the stepped structure and specific angle (such as 45°) of the nozzle body 1 play a crucial role. Its stepped structure can be adaptively adjusted according to the thickness difference of the chip to ensure the best fit between the bottom of the nozzle and the chip surface, so as to ensure the stability of the adsorption. The 45° angle design has been carefully optimized so that the nozzle can cleverly avoid the adjacent dies during the descent adsorption process, effectively preventing the side collision problem caused by the excessive angle. For example, when processing multi-die products with different chip thicknesses and small die spacing, this structural design can allow the nozzle to accurately position the target chip and avoid any interference or damage to the surrounding chips, thereby ensuring the safety and accuracy of the entire adsorption process.

[0063] Chip handling stage:

[0064] After the chip is successfully adsorbed onto the bottom of the nozzle body 1, the external drive device moves the nozzle along with the adsorbed chip smoothly to the designated position according to the pre-set program and path. During this process, the design of the bottom diameter of the nozzle body 1 (4) and the overall structural stability are particularly critical. The appropriate diameter of the bottom of the nozzle can provide a stable support surface for the chip, preventing the chip from shaking or shifting during transportation. At the same time, the structural stability of the entire nozzle body 1, including the reasonable layout of its internal cavity body 2 and the tight cooperation between various components, ensures that the nozzle can always maintain a stable state during high-speed and frequent transportation operations, so that the chip can be safely and accurately transported to the target position, making full preparation for the subsequent die bonding operation.

[0065] Chip placement stage:

[0066] Once the nozzle carrying the chip arrives at the designated placement position, the vacuum supply system will stop working according to the instruction. At this time, the negative pressure environment in the vacuum hole 22 gradually disappears, and the pressure difference between the chip and the vacuum hole 22 also disappears. Under the action of gravity, the chip will naturally detach from the nozzle body 1 and be accurately placed on the predetermined die bonding position. Subsequently, the chip can be further bonded by other auxiliary devices (such as heating and pressurizing equipment, depending on the specific die bonding process requirements), thereby completing the entire workflow of the integrated circuit multi-die die bonding device. Throughout the process, the precise cooperation between the various components of the device and the rationality of the structural design effectively solve many problems that traditional nozzles are prone to when processing multi-die products, such as collisions, wear, and unstable adsorption, greatly improving production efficiency and product quality.

[0067] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel integrated circuit multi-die die bonding device, characterized by: Comprising: a nozzle body (1) having a stepped structure and having an opening angle; a cavity body (2) arranged inside the nozzle body (1); the cavity body (2) comprises a vacuum cavity (21) and a vacuum hole (22) which are in communication with each other.

2. The novel integrated circuit multidie die bonding device of claim 1, wherein: The height of the nozzle body (1) is a first height (3), and the first height (3) is 3.30 mm ± 0.1 mm.

3. The novel integrated circuit multidie die bonding device of claim 1, wherein: The diameter of the vacuum cavity (21) is a first diameter (4), and the first diameter (4) is 1.56 mm ± 0.05 mm.

4. The novel integrated circuit multidie die bonding device of claim 1, wherein: The opening angle of the nozzle body (1) is a first opening angle (5), and the first opening angle (5) ranges from 30° to 60°.

5. The novel integrated circuit multidie die bonding device of claim 4, wherein: The first opening angle (5) is 45°.

6. The novel integrated circuit multidie die bonding device of claim 1, wherein: The inner diameter of the vacuum hole (22) is a second diameter (6), and the second diameter (6) is 0.150 ± 0.050 mm.

7. The novel integrated circuit multidie die bonding device of claim 1, wherein: The outer diameter of the vacuum hole (22) is a third diameter (7), and the third diameter (7) is 0.30 mm ± 0.05 mm.

8. The novel integrated circuit multidie die bonding device of claim 1, wherein: The diameter of the bottom of the nozzle body (1) is a fourth diameter (8), and the fourth diameter (8) is 4 mm ± 0.1 mm.

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