Wafer edge searching and thickness measuring platform

Abstract

The utility model relates to the technical field of wafer testing, and discloses a wafer edge searching and thickness measuring platform, which comprises a wafer bearing assembly, the wafer bearing assembly comprises a box body, a wafer placing table and an adsorption pump, the bottom side of the wafer placing table is fixedly connected to the top of the box body, the adsorption pump is arranged at the front end of the top side of the wafer placing table, and the top side of the wafer placing table is fixedly connected to the top of the box body. A wafer edge finder is arranged at the rear end of the top of the wafer bearing assembly, and a supporting mechanism is arranged at the bottom of the wafer bearing assembly. The wafer is stably adsorbed on the placement table through the adsorption pump, displacement of the wafer in the measurement process is effectively avoided, the wafer edge finder is arranged at the rear end of the top of the wafer bearing assembly, the edge position of the wafer can be accurately detected, key positioning information is provided for follow-up measurement and related operation, and meanwhile the wafer edge finder can accurately find the edge position of the wafer. A linear driving set, a sliding assembly and a supporting assembly which are arranged in the supporting mechanism cooperate to drive the spectrum confocal displacement sensor to move flexibly, so that the spectrum confocal displacement sensor can measure different positions of a wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer test technical field, concretely is wafer edge finding and measuring thickness platform. BACKGROUND

[0002] In semiconductor manufacturing, the conventional mechanical clamp is used to fix the wafer, which is easy to scratch the wafer and deteriorate the stability with the increase of the use time. When measuring, the wafer displacement will cause the measurement error. The conventional edge finding device is based on simple optical imaging, which cannot accurately lock the edge of the wafer with complex surface, seriously affecting the subsequent process precision and chip yield. In terms of thickness measurement, single-point or limited area measurement cannot grasp the overall thickness uniformity. Different size wafers need different devices, which is complicated to operate and high in cost. In addition, the edge finding and thickness measuring functions are scattered in different devices, the process is complicated, the wafer is easy to be damaged during transfer, and there is lack of cooperation between devices, which cannot meet the stringent requirements of current semiconductor manufacturing. SUMMARY

[0003] The utility model discloses a wafer edge finding and measuring thickness platform to solve the problem of the conventional wafer edge finding and thickness measuring functions being scattered and the lack of cooperation between devices.

[0004] The utility model discloses a wafer edge finding and measuring thickness platform to solve the problem of the conventional wafer edge finding and thickness measuring functions being scattered and the lack of cooperation between devices.

[0005] The wafer edge finding and measuring thickness platform comprises a wafer bearing assembly, the wafer bearing assembly comprises a box body, a wafer placing table and a suction pump, the bottom side of the wafer placing table is fixedly connected to the top of the box body, the suction pump is arranged at the top side front end of the wafer placing table, the top rear end of the wafer bearing assembly is provided with a wafer edge finder, the bottom of the wafer bearing assembly is provided with a supporting mechanism, the inside right side of the supporting mechanism is provided with a linear drive group, the front end of the linear drive group is fixedly connected with a sliding assembly, the bottom left end rear side of the sliding assembly is slidably connected to the front side of the supporting mechanism, the top end of the sliding assembly is fixedly connected with a supporting assembly, and the left side of the supporting assembly is installed with a spectral confocal displacement sensor.

[0006] Further, the wafer edge finder is arranged at the top side rear end of the wafer placing table, the top of the supporting mechanism is fixedly connected to the bottom end of the box body, the wafer body is placed on the wafer placing table of the wafer bearing assembly, and the wafer placing table is supported by the box body.

[0007] Further, the supporting mechanism comprises a bottom box and a track assembly, the rear side of the sliding assembly is slidably connected to the front side of the track assembly, the top end of the bottom box is arranged at the bottom end of the wafer bearing assembly, and the track assembly is arranged at the front side of the bottom box and slides on the sliding rail of the track assembly of the supporting mechanism.

[0008] Further, the track assembly comprises a connecting frame and a slide rail, the slide rail is arranged on the front side of the connecting frame, the rear side of the slide assembly is slidably connected to the front side of the slide rail, the slider of the slide assembly slides on the slide rail of the track assembly of the supporting mechanism, and the supporting assembly connected to the slide assembly moves synchronously with the movement of the slide assembly.

[0009] Further, the linear drive group comprises a motor and a screw rod, the rear side of the slide assembly is fixedly connected to the front side of the motor, the screw rod is movably connected to the right inner side of the supporting mechanism, the output end of the motor is movably connected to the right end of the screw rod, and the controller sends a control instruction to the motor of the linear drive group to control the movement of the motor.

[0010] Further, the slide assembly comprises a supporting frame and a slider, the top side of the slider is fixedly connected to the rear side of the supporting frame, the bottom end of the supporting assembly is fixedly connected to the top end of the supporting frame, and the front side of the linear drive group is fixedly connected to the rear side of the supporting frame, so that the supporting assembly connected to the slide assembly moves synchronously with the movement of the slide assembly.

[0011] Further, the supporting assembly comprises an upper support and a lower support, the upper support and the lower support are integrally formed, and the spectral confocal displacement sensor is provided with two groups of spectral confocal displacement sensors which are fixedly installed at the left ends of the upper support and the lower support respectively, so that the two groups of spectral confocal displacement sensors start to work when the supporting assembly moves to a suitable position.

[0012] Further, the top side of the wafer carrying assembly is adsorbed with a wafer body, the edge of the wafer body is located below the wafer edge finder, the left side of the wafer carrying assembly is provided with a controller, and the bottom of the supporting mechanism is fixedly connected with a base.

[0013] Compared with the prior art, the wafer edge finding and thickness measuring platform has the following beneficial effects:

[0014] The wafer edge finding and thickness measuring platform can stably adsorb the wafer on the placing table through the adsorption pump, effectively avoids the displacement of the wafer during the measurement process, and can accurately detect the edge position of the wafer by arranging the wafer edge finder at the top rear end of the wafer carrying assembly, so as to provide key positioning information for subsequent measurement and related operation. Meanwhile, the linear drive group, the slide assembly and the supporting assembly arranged in the supporting mechanism work cooperatively to drive the spectral confocal displacement sensor to move flexibly, so that the spectral confocal displacement sensor can measure different positions of the wafer, and thus comprehensive and accurate thickness detection can be realized. The linear drive group can drive the two spectral confocal displacement sensors to slide, and can be compatible with wafers of different sizes. The structure design makes the whole platform more efficient and accurate in wafer edge finding and thickness measuring operation, integrates the wafer edge finder and the thickness measuring component, and can work simultaneously to greatly improve the work efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the right side three-dimensional view of the whole structure outside structure and linear drive group structure of the utility model;

[0016] Figure 2 It is the left side three-dimensional view of the whole structure outside structure and support mechanism of the utility model;

[0017] Figure 3 It is the three-dimensional view of the wafer bearing assembly top structure of the utility model;

[0018] Figure 4 It is the three-dimensional view of the connection relationship between the track assembly and the sliding assembly of the utility model;

[0019] Figure 5 It is the three-dimensional view of the structure of the sliding assembly and the support assembly of the utility model.

[0020] In the drawing: 1, wafer bearing assembly; 101, box; 102, wafer placing table; 103, adsorption pump; 2, wafer edge finder; 3, support mechanism; 301, bottom box; 302, track assembly; 3021, connecting frame; 3022, sliding rail; 4, linear drive group; 401, motor; 402, screw rod; 5, sliding assembly; 501, support frame; 502, sliding block; 6, spectral confocal displacement sensor; 7, wafer body; 8, support assembly; 801, upper support; 802, lower support; 9, controller; 10, base. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model. Embodiment one:

[0022] As Figures 1-5As shown, the wafer edge finding and thickness measuring platform comprises a wafer carrying assembly 1, a wafer edge finder 2 arranged at the top rear end of the wafer carrying assembly 1, a support mechanism 3 arranged at the bottom of the wafer carrying assembly 1, a linear drive group 4 arranged at the inside right side of the support mechanism 3, a sliding assembly 5 fixedly connected at the front end of the linear drive group 4, the sliding assembly 5 being slidingly connected at the bottom left end rear side of the support mechanism 3, a support assembly 8 fixedly connected at the top end of the sliding assembly 5, a spectral confocal displacement sensor 6 mounted at the left side of the support assembly 8, a wafer body 7 adsorbed at the top side of the wafer carrying assembly 1, the edge of the wafer body 7 being located below the wafer edge finder 2, a controller 9 arranged at the left side of the wafer carrying assembly 1, and a base 10 fixedly connected at the bottom of the support mechanism 3.

[0023] As shown in Figure 3 , the wafer carrying assembly 1 comprises a box body 101, a wafer placing table 102 and an adsorption pump 103, the wafer edge finder 2 is arranged at the top side rear end of the wafer placing table 102, the top of the support mechanism 3 is fixedly connected at the bottom end of the box body 101, the bottom side of the wafer placing table 102 is fixedly connected at the top of the box body 101, and the adsorption pump 103 is arranged at the top side front end of the wafer placing table 102. The adsorption pump 103 generates negative pressure to firmly adsorb the wafer body 7 on the table surface through the adsorption holes on the top side of the wafer placing table 102. Embodiment two:

[0024] As shown in Figure 2 , Figure 4 and Figure 5 , the support mechanism 3 comprises a bottom box 301 and a track assembly 302, the rear side of the sliding assembly 5 is slidingly connected to the front side of the track assembly 302, the top end of the bottom box 301 is arranged at the bottom end of the wafer carrying assembly 1, the top side of the base 10 is fixedly connected to the bottom of the bottom box 301, the track assembly 302 is arranged at the front side of the bottom box 301, the track assembly 302 comprises a connecting frame 3021 and a sliding rail 3022, the sliding rail 3022 is arranged at the front side of the connecting frame 3021, the rear side of the sliding assembly 5 is slidingly connected to the front side of the sliding rail 3022, the sliding assembly 5 comprises a support frame 501 and a sliding block 502, the top side of the sliding block 502 is fixedly connected to the rear side of the support frame 501, the bottom end of the support assembly 8 is fixedly connected to the top end of the support frame 501, the front side of the linear drive group 4 is fixedly connected to the rear side of the support frame 501, and the sliding block 502 of the sliding assembly 5 slides on the sliding rail 3022 of the track assembly 302 of the support mechanism 3, and the support assembly 8 connected thereto also moves synchronously with the movement of the sliding assembly 5.

[0025] As shown in Figure 1As shown, the linear drive group 4 includes a motor 401 and a lead screw 402, the rear side of the sliding assembly 5 is fixedly connected to the front side of the motor 401, the movable connection of the lead screw 402 is on the right side of the inside of the supporting mechanism 3, the output end of the motor 401 and the right end of the lead screw 402 are movably connected, the motor 401 in the linear drive group 4 is started, the output shaft of the motor 401 drives the lead screw 402 to rotate, and the rotary motion of the lead screw 402 is converted into the linear motion of the sliding assembly 5;

[0026] As shown in the figure, Figure 5 The support assembly 8 includes an upper bracket 801 and a lower bracket 802, the upper bracket 801 and the lower bracket 802 are integrally formed, and the spectral confocal displacement sensor 6 is provided with two groups of spectral confocal displacement sensors 6 which are respectively fixedly installed at the left ends of the upper bracket 801 and the lower bracket 802, when the support assembly 8 moves to the appropriate position, the two groups of spectral confocal displacement sensors 6 start to work.

[0027] Working principle: as shown in the figure, Figures 1-5 Wafer carrying and fixing: first, place the wafer body 7 on the wafer placing table 102 of the wafer carrying assembly 1, the wafer placing table 102 is supported by the box body 101, start the adsorption pump 103, the adsorption pump 103 generates negative pressure, and the wafer body 7 is firmly adsorbed on the table surface through the adsorption holes on the top side of the wafer placing table 102, so as to prevent the wafer from being displaced during the measurement process;

[0028] Wafer edge finding process: the wafer edge finder 2 is installed at the top side of the rear end of the wafer placing table 102, when the platform starts the edge finding function, the optical probe head of the wafer edge finder 2 emits a specific light beam, which irradiates to the edge of the wafer body 7, the laser beam is reflected at the edge of the wafer body 7, the reflected light is received by the detector in the edge finder 2, the detector converts the optical signal into an electrical signal, and transmits it to the signal processing unit of the edge finder 2, so as to determine the boundary information of the wafer;

[0029] Thickness measurement preparation: the motor 401 in the linear drive group 4 is started, the output shaft of the motor 401 drives the lead screw 402 to rotate, and the rotary motion of the lead screw 402 is converted into the linear motion of the sliding assembly 5;

[0030] The sliding block 502 of the sliding assembly 5 slides on the slide rail 3022 of the track assembly 302 of the supporting mechanism 3, and the supporting assembly 8 connected thereto also moves synchronously with the movement of the sliding assembly 5;

[0031] Thickness measurement execution: when the support assembly 8 moves to the appropriate position, the two groups of spectral confocal displacement sensors 6 start to work;

[0032] The light source of the spectral confocal displacement sensor 6 emits light containing different wavelengths, which is split by the light splitting element and focused on the upper and lower surfaces of the wafer body 7 by the objective lens, so as to measure the thickness of the wafer body 7;

[0033] Overall control and coordination: the controller 9 as the control core of the platform, responsible for the control and coordination of the whole measurement process, the controller 9 sends control instructions to the motor 401 of the linear drive group 4, controls the movement of the motor 401, thereby adjusts the position of the spectral confocal displacement sensor 6, realizes the thickness measurement of different positions of the wafer body 7.

Claims

1. A wafer edge finding and thickness measuring platform comprising a wafer carrying assembly (1), characterized in that: The wafer carrying assembly (1) comprises a box (101), a wafer placing table (102) and a suction pump (103), the bottom side of the wafer placing table (102) is fixedly connected to the top of the box (101), and the suction pump (103) is arranged at the top side front end of the wafer placing table (102); The top rear end of the wafer carrying assembly (1) is provided with a wafer edge finder (2), the bottom of the support mechanism (3) is provided with a linear drive group (4) at the right side, the front end of the linear drive group (4) is fixedly connected with a sliding assembly (5), the bottom left end rear side of the sliding assembly (5) is slidingly connected to the front side of the support mechanism (3), and the top end of the sliding assembly (5) is fixedly connected with a support assembly (8), and the left side of the support assembly (8) is provided with a spectral confocal displacement sensor (6).

2. The wafer edge finding and thickness measuring platform of claim 1, wherein: The wafer edge finder (2) is arranged at the top rear end of the wafer placing table (102), and the top of the support mechanism (3) is fixedly connected to the bottom end of the box (101).

3. The wafer edge finding and thickness measuring platform of claim 1, wherein: The support mechanism (3) comprises a bottom box (301) and a track assembly (302), the rear side of the sliding assembly (5) is slidingly connected to the front side of the track assembly (302), the top end of the bottom box (301) is arranged at the bottom end of the wafer carrying assembly (1), and the track assembly (302) is arranged at the front side of the bottom box (301).

4. The wafer edge finding and thickness measuring platform of claim 3, wherein: The track assembly (302) comprises a connecting frame (3021) and a sliding rail (3022), the sliding rail (3022) is arranged at the front side of the connecting frame (3021), and the rear side of the sliding assembly (5) is slidingly connected to the front side of the sliding rail (3022).

5. The wafer edge finding and thickness measuring platform of claim 1, wherein: The linear drive group (4) comprises a motor (401) and a lead screw (402), the rear side of the sliding assembly (5) is fixedly connected to the front side of the motor (401), the lead screw (402) is movably connected to the right side inside of the support mechanism (3), and the output end of the motor (401) and the right end of the lead screw (402) are movably connected.

6. The wafer edge finding and thickness measuring platform of claim 1, wherein: The sliding assembly (5) comprises a support frame (501) and a sliding block (502), the top side of the sliding block (502) is fixedly connected to the rear side of the support frame (501), the bottom end of the support assembly (8) is fixedly connected to the top end of the support frame (501), and the front side of the linear drive group (4) is fixedly connected to the rear side of the support frame (501).

7. The wafer edge finding and thickness measuring platform of claim 1, wherein: The support assembly (8) comprises an upper support (801) and a lower support (802), the upper support (801) and the lower support (802) are integrally formed, and the spectral confocal displacement sensor (6) is provided with two groups of fixing installations at the left ends of the upper support (801) and the lower support (802).

8. The wafer edge finding and thickness measuring platform of claim 1, wherein: The top side of the wafer bearing assembly (1) is adsorbed with a wafer body (7), the edge of the wafer body (7) is located below the wafer edge finder (2), the left side of the wafer bearing assembly (1) is provided with a controller (9), and the bottom of the supporting mechanism (3) is fixedly connected with a base (10).

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