Wafer chuck cooling mechanism and wafer testing machine

Abstract

The utility model relates to a wafer chuck cooling mechanism and a wafer testing machine. The wafer chuck cooling mechanism comprises a vortex tube and a cooling flow channel arranged on a wafer chuck, and the vortex tube is provided with a drainage port, a cold end outlet and a hot end outlet; the cold end outlet is communicated with the cooling flow channel, and the cooling flow channel is used for introducing cooling fluid of the cold end outlet so as to cool the wafer chuck. Compared with the prior art in which silicon wafer refrigeration chiller equipment is adopted to cool the wafer chuck, the cooling of the wafer chuck can be realized by matching the vortex tube with the cooling flow channel on the wafer chuck, and the vortex tube is smaller in size, so that the integration with the whole test equipment system is facilitated; and compared with silicon wafer refrigeration chiller equipment, the cost of the vortex tube is lower, so that the cooling cost of the wafer chuck can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of wafer cooling technology, and in particular to a wafer chuck cooling mechanism and a wafer testing machine. Background Technology

[0002] The domestic semiconductor industry is developing rapidly, with a wide variety of wafers. In order to test wafers in different temperature environments, it is necessary to heat or cool the wafer chuck. However, the current equipment for cooling requires silicon wafer cooling chillers, which are large in size, not conducive to integration with the entire testing equipment system, and have high costs. Utility Model Content

[0003] In view of this, the present invention provides a wafer chuck cooling mechanism and a wafer testing machine, the main technical problem to be solved being: how to reduce the cooling cost of the wafer chuck.

[0004] To achieve the above objectives, this utility model mainly provides the following technical solutions:

[0005] An embodiment of this utility model provides a wafer chuck cooling mechanism, which includes a vortex tube and a cooling channel disposed on the wafer chuck. The vortex tube has a flow inlet, a cold end outlet, and a hot end outlet. The cold end outlet is connected to the cooling channel, and the cooling channel is used to introduce cooling fluid from the cold end outlet to cool the wafer chuck.

[0006] In some embodiments, the cooling channel is a groove provided on the wafer chuck, and the cooling channel extends circumferentially along the wafer chuck.

[0007] In some embodiments, there are two or more cooling channels arranged sequentially along the radial direction of the wafer chuck; wherein each cooling channel introduces cooling fluid through the same inlet and exits cooling fluid through the same outlet.

[0008] In some embodiments, two adjacent cooling channels have a common sidewall, and the common sidewall has a connecting hole that connects the two adjacent cooling channels.

[0009] In some embodiments, each common sidewall is arc-shaped, and the center of each arc coincides with the center of the wafer chuck.

[0010] In some embodiments, the inlet is provided with a first a connector, and the cold end outlet is connected to each of the cooling channels through the first a connector;

[0011] And / or, the outlet is provided with a second a connector, through which cooling fluid is discharged from each of the cooling channels.

[0012] In some embodiments, the wafer chuck cooling mechanism further includes a temperature control box and a temperature sensor, the temperature sensor being used to detect the temperature of the wafer chuck;

[0013] The temperature control box contains a temperature controller and a gas supply channel. The gas supply channel is equipped with an electrically controlled valve. The temperature control box is equipped with a first connector, a second connector, a third connector, and a power connector. The temperature controller is electrically connected to the temperature sensor through the first connector. The temperature controller is also electrically connected to the electrically controlled valve and the power connector. The gas supply channel is connected to the drain port through the second connector. The gas supply channel introduces external compressed fluid through the third connector.

[0014] The temperature control box is detachable at the first connector, the second connector, the third connector, and the power connector.

[0015] This utility model also provides a wafer testing machine, which includes the wafer chuck cooling mechanism described in any one of the above-mentioned methods.

[0016] By employing the above technical solutions, the wafer chuck cooling mechanism and wafer testing machine of this utility model have at least the following beneficial effects:

[0017] 1. Compared with the existing technology that uses silicon wafer cooling chiller equipment to cool the wafer chuck, this utility model uses eddy current tubes in conjunction with the cooling channels on the wafer chuck to achieve cooling of the wafer chuck. The eddy current tubes are smaller in size, which is conducive to integration with the entire testing equipment system. Moreover, compared with silicon wafer cooling chiller equipment, the cost of eddy current tubes is also lower, which helps to reduce the cooling cost of the wafer chuck.

[0018] 2. The temperature control box is detachable, which makes it convenient to install and carry.

[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a wafer chuck cooling mechanism provided in one embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram illustrating the cooling channels on a wafer chuck, provided by one embodiment of the present invention.

[0023] Reference numerals: 1. Wafer chuck; 2. Cooling channel; 3. First a connector; 4. Second a connector; 5. Temperature control box; 6. Temperature controller; 7. Electrically controlled valve; 8. Eddy current tube; 9. Temperature sensor; 10. Wire; 11. Inlet; 12. Outlet; 13. Common sidewall; 14. Air supply channel; 51. First connector; 52. Second connector; 53. Third connector; 54. Power connector; 81. Drain port; 82. Hot end outlet; 83. Cold end outlet; 101. Connecting hole. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0027] like Figure 1-2As shown in the figure, one embodiment of the present invention provides a wafer chuck cooling mechanism, which includes a vortex tube 8 and a cooling channel 2 disposed on the wafer chuck 1. The vortex tube 8 has a flow inlet 81, a cold end outlet 83, and a hot end outlet 82. The cold end outlet 83 is connected to the cooling channel 2. The cooling channel 2 is used to introduce cooling fluid from the cold end outlet 83 to cool the wafer chuck 1.

[0028] In the above example, the vortex tube 8 introduces an external compressed fluid, such as compressed air, through the inlet 81. After entering the vortex tube 8, the compressed fluid is separated into a high-temperature fluid and a low-temperature fluid. The high-temperature fluid flows out from the hot end outlet 82, and the low-temperature fluid flows out from the cold end outlet 83 and flows into the cooling channel 2 on the wafer chuck 1. When the low-temperature fluid flows through the cooling channel 2, it can cool the wafer chuck 1, thereby achieving the purpose of cooling the wafer on the wafer chuck 1.

[0029] Compared to the existing technology that uses silicon wafer cooling chiller equipment to cool the wafer chuck 1, this utility model uses a vortex tube 8 in conjunction with the cooling channel 2 on the wafer chuck 1 to achieve cooling of the wafer chuck 1. The vortex tube 8 is smaller in size, which is conducive to integration with the entire testing equipment system; and compared with silicon wafer cooling chiller equipment, the cost of the vortex tube 8 is also lower, which helps to reduce the cooling cost of the wafer chuck 1.

[0030] In some embodiments, the aforementioned cooling channel 2 may be a groove provided on the wafer chuck 1, and the cooling channel 2 extends circumferentially along the wafer chuck 1.

[0031] In the above example, designing the cooling channel 2 as a groove has the advantage of facilitating processing. In addition, since the cooling channel 2 extends along the circumference of the wafer chuck 1, the wafer chuck 1 can be cooled circumferentially, resulting in better cooling effect of the wafer chuck 1.

[0032] In some implementations, such as Figure 2 As shown, the number of cooling channels 2 can be two or more, and they are arranged sequentially along the radial direction of the wafer chuck 1. Each cooling channel 2 introduces cooling fluid through the same inlet 11 and exits cooling fluid through the same outlet 12.

[0033] In the above example, by designing a greater number of cooling channels 2, the cooling effect on the wafer chuck 1 can be improved. Furthermore, since each cooling channel 2 introduces cooling fluid through the same inlet 11, this simplifies the cooling fluid introduction structure and reduces the cost of introducing the cooling fluid. Similarly, each cooling channel 2 exits cooling fluid through the same outlet 12, which simplifies the cooling fluid exit structure and reduces the cost of exiting the cooling fluid.

[0034] In some implementations, such as Figure 2 As shown, the two adjacent cooling channels 2 have a common sidewall 13, and the common sidewall 13 is provided with a connecting hole 101 that connects the two adjacent cooling channels 2.

[0035] In the above example, by providing a connecting hole 101 on the common sidewall 13, the cooling fluid in the two adjacent cooling channels 2 can complement each other, so that the cooling effect at various points on the wafer chuck 1 is more uniform.

[0036] In some embodiments, each of the aforementioned common sidewalls 13 is arc-shaped, and the center of each arc coincides with the center of the wafer chuck 1, which is beneficial for arranging each cooling channel 2 around the circumference of the wafer chuck 1.

[0037] In some implementations, such as Figure 2 As shown, a first a connector 3 may be provided at the aforementioned inlet 11, and the cold end outlet 83 is connected to each cooling channel 2 through the first a connector 3. A second a connector 4 may be provided at the aforementioned outlet 12, and each cooling channel 2 discharges cooling fluid through the second a connector 4.

[0038] In some implementations, such as Figure 1 As shown, the aforementioned wafer chuck cooling mechanism may further include a temperature control box 5 and a temperature sensor 9. The temperature sensor 9 is used to detect the temperature of the wafer chuck 1. The temperature sensor 9 can be a PT100 temperature probe, etc. The temperature control box 5 is equipped with a temperature controller 6 and an air supply channel 14. The temperature controller 6 can be a processor or a PLC logic temperature controller 6, etc. An electrically controlled valve 7 is provided on the air supply channel 14. This electrically controlled valve 7 can be a proportional valve, etc. The temperature control box 5 is equipped with a first connector 51, a second connector 52, a third connector 53, and a power connector 54. The temperature controller 6 is electrically connected to the temperature sensor 9 through the first connector 51, and the temperature controller 6 is electrically connected to the electrically controlled valve 7 and the power connector 54. The air supply channel 14 is connected to the drain port 81 through the second connector 52, and the air supply channel 14 introduces external compressed fluid through the third connector 53. The temperature control box 5 is detachable at the first connector 51, the second connector 52, the third connector 53, and the power connector 54, so that the temperature control box 5 is detachable.

[0039] In the above example, temperature sensor 9 sends the temperature of wafer chuck 1 to temperature controller 6. Temperature controller 6 controls the opening of electronic control valve 7 according to the temperature of wafer chuck 1 to adjust the flow rate of compressed fluid flowing into vortex tube 8, thereby achieving the purpose of controlling the temperature of wafer chuck 1.

[0040] The temperature control box 5 described above is detachable, which facilitates its installation and carrying.

[0041] In some implementations, such as Figure 1As shown, the temperature sensor 9 is connected to a wire 10. The end of the wire 10 facing away from the temperature sensor 9 is connected to another connector. This other connector is plugged into and mates with the aforementioned first connector 51 to electrically connect the thermostat 6 to the temperature sensor 9. One of the other connector and the first connector 51 can be a female connector and the other can be a male connector.

[0042] The second connector 52 and the third connector 53 mentioned above can both be cylinder quick connectors, which are reliable and safe to connect, have a long service life and high stability.

[0043] This invention also provides a wafer testing machine, which may include the wafer chuck cooling mechanism described above. Because the wafer testing machine employs the aforementioned wafer chuck cooling mechanism, compared to the prior art which uses silicon wafer cooling chillers to cool the wafer chuck 1, this invention uses a vortex tube 8 in conjunction with the cooling channel 2 on the wafer chuck 1 to achieve cooling of the wafer chuck 1. The vortex tube 8 is smaller in size, which facilitates integration with the entire testing equipment system; furthermore, compared to silicon wafer cooling chillers, the cost of the vortex tube 8 is also lower, which helps reduce the cooling cost of the wafer chuck 1.

[0044] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A wafer chuck cooling mechanism, characterized by, The wafer chuck cooling mechanism comprises a vortex tube (8) and a cooling flow channel (2) arranged on the wafer chuck (1), the vortex tube (8) has a flow inlet (81), a cold end outlet (83) and a hot end outlet (82), the cold end outlet (83) is communicated with the cooling flow channel (2), and the cooling flow channel (2) is used for introducing a cooling fluid into the cold end outlet (83) to cool the wafer chuck (1). The wafer chuck cooling mechanism further comprises a temperature control box (5) and a temperature sensor (9) for detecting the temperature of the wafer chuck (1), the temperature control box (5) is provided with a temperature controller (6) and a gas supply channel (14), the gas supply channel (14) is provided with an electric control valve (7), the temperature control box (5) is provided with a first joint (51), a second joint (52), a third joint (53) and a power supply joint (54), the temperature controller (6) is electrically connected with the temperature sensor (9) through the first joint (51), and the temperature controller (6) is electrically connected with the electric control valve (7) and the power supply joint (54); the gas supply channel (14) is communicated with the flow inlet (81) through the second joint (52), and the gas supply channel (14) introduces external compressed fluid through the third joint (53); wherein the temperature control box (5) is detachable at the first joint (51), the second joint (52), the third joint (53) and the power supply joint (54), so that the temperature control box (5) is detachable. The temperature sensor (9) is connected with a wire (10), one end of the wire (10) away from the temperature sensor (9) is connected with another joint, the other joint and the first joint (51) are inserted and matched with each other to electrically connect the temperature controller (6) with the temperature sensor (9); one of the other joint and the first joint (51) is a female connector, and the other is a male connector; the second joint (52) and the third joint (53) are both air cylinder quick connectors.

2. The wafer chuck cooling mechanism according to claim 1, wherein the cooling flow channel (2) is a groove arranged on the wafer chuck (1), and the cooling flow channel (2) extends along the circumference of the wafer chuck (1).

3. The wafer chuck cooling mechanism according to claim 2, wherein the number of the cooling flow channels (2) is more than two, and the cooling flow channels (2) are arranged in sequence along the radial direction of the wafer chuck (1); wherein each cooling flow channel (2) introduces the cooling fluid through the same inlet (11) and discharges the cooling fluid through the same outlet (12).

4. The wafer chuck cooling mechanism according to claim 3, wherein the two adjacent cooling flow channels (2) have a common side wall (13), and the common side wall (13) is provided with a communication hole (101) for communicating the two adjacent cooling flow channels (2).

5. The wafer chuck cooling mechanism according to claim 4, wherein each common side wall (13) is in the shape of a circular arc, and the center of each circular arc coincides with the center of the wafer chuck (1). ​ ​ ​ ​ 6. The wafer chuck cooling mechanism according to any one of claims 3-5, wherein, a first a connector (3) is arranged at the inlet (11), and the cold end outlet (83) is communicated with each of the cooling channels (2) through the first a connector (3); and / or, a second a connector (4) is arranged at the outlet (12), and each of the cooling channels (2) discharges the cooling fluid through the second a connector (4).

7. A wafer testing machine characterized by, A wafer chuck cooling mechanism according to any one of claims 1-6.

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