Self-cleaning punching equipment

Abstract

The utility model relates to the technical field of punching machining, in particular to self-cleaning punching equipment. The self-cleaning punching equipment comprises a punching mechanism, the punching mechanism comprises an upper die assembly and a lower die assembly which are matched in a die closing mode, the upper die assembly comprises an upper die plate, a liquid path plate and a punch, the liquid path plate is arranged on the side, facing the lower die assembly, of the upper die plate, the liquid path plate is provided with a containing hole and a liquid channel, and the liquid channel is communicated with the containing hole; the punch is connected to the upper die plate and penetrates through the containing hole. And the liquid supply mechanism is used for supplying liquid to the liquid channel, so that the liquid enters the accommodating hole to wash and clean the punch. According to the self-cleaning punching equipment, the punch can be automatically cleaned, and the punching machining yield is increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of punching processing, in particular to a self-cleaning punching device. BACKGROUND

[0002] Punching processing is a processing method for separating materials by using a die. The die is mainly used to cut and separate plates and other materials by applying pressure to drive a punch towards the plates and other materials. After the punch cuts the plates, it is easy to produce debris, and the debris is easy to stick to the punch. In the next punching, the punch moves with the debris, which can easily damage the plates and cause poor punching. CONTENT OF THE UTILITY MODEL

[0003] In view of the above, it is necessary to provide a self-cleaning punching device that can automatically clean the punch and improve the punching processing yield.

[0004] The embodiment of the present application provides a self-cleaning punching device, which comprises a punching mechanism, a liquid supply mechanism and a die assembly. The punching mechanism comprises a die assembly and a lower die assembly. The upper die assembly comprises an upper die plate, a liquid channel plate and a punch. The liquid channel plate is arranged on the side of the upper die plate facing the lower die assembly. The liquid channel plate is provided with a receiving hole and a liquid channel. The liquid channel is in communication with the receiving hole. The punch is connected to the upper die plate and penetrates the receiving hole. The liquid supply mechanism is used to supply liquid to the liquid channel so that the liquid enters the receiving hole and then washes and cleans the punch.

[0005] The self-cleaning punching device described above is provided with a liquid channel plate on the upper die assembly of the punching mechanism. The liquid channel plate is provided with a receiving hole and a liquid channel. The punch penetrates the receiving hole, and the liquid channel corresponds to the punch. The liquid supply mechanism can provide cleaning liquid so that the cleaning liquid enters the receiving hole through the liquid channel and then washes and cleans the punch. In this way, the debris, impurities and other foreign matters adhering to the punch can be effectively cleaned, avoiding the influence of the debris, impurities and other foreign matters on the punching and effectively improving the yield of the punching processing.

[0006] In some embodiments, the upper mold plate has a through hole arranged along the extension direction of the punch, the through hole corresponding to the receiving hole, and the cross-sectional area of ​​the through hole is smaller than the cross-sectional area of ​​the receiving hole; the liquid channel is opened on the side of the liquid channel plate near the upper mold plate; the upper mold assembly further includes: a guide sleeve disposed in the through hole, one end of the punch slidingly passing through the guide sleeve; and an adapter fixedly disposed in the receiving hole, the adapter having a cleaning hole and an adapter hole, the cleaning hole being arranged along the extension direction of the punch and communicating with the through hole, one end of the punch extending out of the guide sleeve passing through the cleaning hole, one end of the adapter hole communicating with the liquid channel, and the other end disposed in the middle of the inner wall of the cleaning hole, the adapter hole being used to receive liquid in the liquid channel to flush and clean the punch.

[0007] In some embodiments, the inner wall of the cleaning hole is provided with a slag discharge groove, and the extension direction of the slag discharge groove is the same as the extension direction of the cleaning hole.

[0008] In some embodiments, the liquid channel includes an inlet end and an outlet end disposed opposite to each other. The inlet end is disposed on the outer wall of the liquid circuit board, and the outlet end is disposed on the inner wall of the receiving hole, and the outlet end communicates with the adapter hole.

[0009] In some embodiments, the liquid channel has multiple outlet ends, each of which is located on the inner wall of the receiving hole. The adapter has multiple adapter holes, each of which is connected to one of the multiple outlet ends.

[0010] In some embodiments, the lower mold assembly includes: a lower mold plate, which is molded and adapted to the liquid channel plate; and a lower mold base, which is disposed on the side of the lower mold plate away from the liquid channel plate, and the side of the lower mold base facing the lower mold plate is provided with a first liquid collection tank for collecting waste liquid.

[0011] In some embodiments, the bottom of the first liquid collection tank is provided with a first drain hole; the lower mold assembly further includes a liquid collection plate, which is disposed on the side of the lower mold base away from the lower mold plate, and a second liquid collection tank is provided on the side of the liquid collection plate facing the lower mold base. The second liquid collection tank is provided with a liquid receiving groove portion opposite to the first drain hole, and the second liquid collection tank is used to receive the liquid discharged through the first liquid collection tank.

[0012] In some embodiments, the second liquid collection tank is further provided with a second drain hole; the self-cleaning punching device further includes a liquid collection mechanism, which is connected to the second drain hole.

[0013] In some embodiments, the liquid supply mechanism includes a liquid supply assembly and a liquid supply pipe. The liquid supply assembly includes a liquid supply tank and a liquid supply pump. The liquid supply tank is used to store and supply liquid. The liquid supply pump is connected to the liquid supply tank. The two ends of the liquid supply pipe are respectively connected to the liquid supply pump and the liquid inlet of the liquid channel. The liquid supply pump is used to supply the liquid in the liquid supply tank to the liquid circuit board through the liquid supply pipe.

[0014] In some embodiments, the liquid supply tank is provided with an observation window for observing the liquid level in the liquid supply tank; the liquid supply assembly further includes a movable frame for accommodating the liquid supply tank and the liquid supply pump. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the self-cleaning punching and cutting equipment provided in the embodiments of this application.

[0016] Figure 2 for Figure 1 The diagram shows the structural schematic of the punching mechanism of the self-cleaning punching equipment.

[0017] Figure 3 for Figure 2 The diagram shows an exploded view of the upper die assembly of the punching mechanism.

[0018] Figure 4 for Figure 2 The diagram shows the cross-sectional structure of the punching mechanism during punching.

[0019] Figure 5 for Figure 3 Another angle view of the adapter of the punching mechanism shown.

[0020] Figure 6 for Figure 2 The diagram shows the structure of the lower die assembly of the punching mechanism.

[0021] Explanation of main component symbols: Self-cleaning punching and cutting equipment 100, punching and cutting mechanism 10, upper die assembly 11, upper template 111, through hole 1111, liquid channel plate 112, receiving hole 1121, liquid channel 1122, liquid inlet end 1122a, liquid outlet end 1122b, punch 113, guide sleeve 114, adapter 115, cleaning hole 1151, adapter hole 1152, slag discharge groove 1153, lower die assembly 12, lower... Template 121, lower mold base 122, first liquid collection tank 1221, first liquid drain hole 1222, liquid collection plate 123, second liquid collection tank 1231, liquid receiving tank 1232, second liquid drain hole 1233, liquid supply mechanism 20, liquid supply component 21, liquid supply tank 211, observation window 2111, liquid supply pump 212, liquid supply pipe 22, moving frame 23, liquid collection mechanism 30, waste liquid tank 31, waste liquid pipe 32, material 200. Detailed Implementation

[0022] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0023] In the description of this application, it should be understood that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, it should be noted that "a plurality of" means two or more, unless otherwise explicitly specified.

[0024] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] The embodiments of this application will be further described below with reference to the accompanying drawings.

[0026] Please see Figure 1 This application provides a self-cleaning punching and cutting device 100 for punching and cutting materials 200, which can be in the form of plates, strips, etc. The self-cleaning punching and cutting device 100 includes a punching and cutting mechanism 10 and a liquid supply mechanism 20.

[0027] Specifically, please see Figure 2 , Figure 3 and Figure 4The punching mechanism 10 includes an upper die assembly 11 and a lower die assembly 12 that are adapted to the die. The upper die assembly 11 includes an upper template 111, a hydraulic channel plate 112 and a punch 113. The hydraulic channel plate 112 is disposed on the side of the upper template 111 facing the lower die assembly 12. The hydraulic channel plate 112 has a receiving hole 1121 and a liquid channel 1122. The liquid channel 1122 communicates with the receiving hole 1121. The punch 113 is connected to the upper template 111 and passes through the receiving hole 1121.

[0028] The upper die assembly 111's upper platen 111 provides stable support for the punch 113. The upper platen 111 is also connected to an external power unit (not shown) to allow the upper platen 111 and punch 113 to move towards or away from the lower die assembly 12. The lower die assembly 12 is fitted to the upper die assembly 11. The lower die assembly 12 has a clearance hole (not shown) corresponding to the punch 113 at a position opposite to the punch 113, allowing the punch 113 to be positioned and the portion of the material 200 cut off to fall through the clearance hole. The hydraulic plate 112 is fixedly connected to the side of the upper platen 111 facing the lower die assembly 12.

[0029] Please see also Figure 1 The liquid supply mechanism 20 supplies liquid to the liquid channel 1122, allowing the liquid to enter the receiving hole 1121 and thus rinse and clean the punch 113. In this embodiment, the liquid can be stamping oil, which can rinse and clean the punch 113, and also act as a lubricant, reducing friction and wear between the punch 113 and the hydraulic circuit plate 112, while also cooling the mold. By providing liquid to the liquid channel 1122 of the hydraulic circuit plate 112 in the punching mechanism 10 through the liquid supply mechanism 20, the liquid enters the receiving hole 1121 along the liquid channel 1122, and then directly rinses and cleans the punch 113 that passes through the receiving hole 1121. By automatically cleaning the punch 113 during or after the punching operation, the cleaning efficiency is greatly improved, avoiding the problem of impurities and debris adhering to the punch 113 after long-term use, which affects the punching accuracy and effect.

[0030] The self-cleaning punching equipment 100 provided in this application embodiment has a hydraulic channel plate 112 provided in the upper die assembly 11 of the punching mechanism 10. The hydraulic channel plate 112 has a receiving hole 1121 and a liquid channel 1122. The punch 113 passes through the receiving hole 1121, and the liquid channel 1122 corresponds to the punch 113. The liquid supply mechanism 20 can provide cleaning liquid, so that the cleaning liquid enters the receiving hole 1121 through the liquid channel 1122, thereby rinsing and cleaning the punch 113. In this way, the debris, impurities and other foreign objects adhering to the punch 113 can be effectively cleaned, avoiding the debris, impurities and other foreign objects from affecting the punching, and effectively improving the yield of the punching process.

[0031] In some embodiments, seeFigure 2 , Figure 3 and Figure 4 The upper template 111 has a through hole 1111 provided along the extension direction of the punch 113. The through hole 1111 corresponds to the receiving hole 1121, and the cross-sectional area of ​​the through hole 1111 is smaller than the cross-sectional area of ​​the receiving hole 1121. The liquid channel 1122 is opened on the side of the liquid channel plate 112 near the upper template 111. The upper mold assembly 11 also includes a guide sleeve 114 and an adapter 115. The guide sleeve 114 is disposed in the through hole 1111. One end of the punch 113 slides through the guide sleeve 114. The adapter 115 is fixedly disposed in the receiving hole 1121. The adapter 115 is provided with a cleaning hole 1151 and an adapter hole 1152. The cleaning hole 1151 is disposed along the extension direction of the punch 113 and communicates with the through hole 1111. One end of the punch 113 extending out of the guide sleeve 114 passes through the cleaning hole 1151. One end of the adapter hole 1152 is connected to the liquid channel 1122. The other end of the adapter hole 1152 is disposed in the middle of the inner wall of the cleaning hole 1151. The adapter hole 1152 is used to receive liquid in the liquid channel 1122 so that the liquid can rinse and clean the punch 113.

[0032] The liquid channel 1122 is located on the side of the liquid channel plate 112 near the upper template 111, which facilitates the machining of the liquid channel 1122 on the liquid channel plate 112 and reduces the machining difficulty of the liquid channel plate 112. After the liquid channel plate 112 is fixedly connected to the upper template 111, the upper template 111 cooperates with the liquid channel plate 112 to seal the upper side of the liquid channel 1122. One end of the punch 113 is slidably inserted into the guide sleeve 114 so that the guide sleeve 114 can guide the movement direction of the punch 113 and improve the movement stability of the punch 113. The through hole 1111 in the upper template 111 is used to accommodate the guide sleeve 114. It can be understood that the cross-sectional area of ​​the guide sleeve 114 is larger than that of the punch 113. If the liquid channel 1122 is directly aligned with the punch 113, the upper side of the liquid channel 1122 opposite to the through hole 1111 will be exposed, causing liquid to overflow from the through hole 1111 and affecting the rinsing and cleaning effect. By providing the adapter 115, liquid can be guided from the side of the liquid channel plate 112 near the upper template 111 to the middle. The adapter 115 corresponds to the through hole 1111 and is connected to the liquid channel 1122 through the adapter hole 1152, thereby guiding the vertical flow trajectory of the liquid. That is, when the liquid flows in the liquid channel 1111 to a position near the through hole 1111, it flows into the cleaning hole 1151 through the adapter hole 1152, preventing liquid from overflowing from the through hole 1111.

[0033] In some embodiments, see Figure 3 , Figure 4 and Figure 5The inner wall of the cleaning hole 1151 is provided with a slag discharge groove 1153, and the extension direction of the slag discharge groove 1153 is the same as the extension direction of the cleaning hole 1151. There can be one or more slag discharge grooves 1153, such as four, eight, or twelve. By setting the slag discharge grooves 1153, liquid, debris, and impurities can flow out of the cleaning hole 1151 from the slag discharge grooves 1153 when the liquid flushes the punch 113. Multiple slag discharge grooves 1153 can be evenly distributed on the inner wall of the cleaning hole 1151 to facilitate the timely discharge of debris and impurities from various locations within the cleaning hole 1151.

[0034] In some embodiments, see Figure 2 and Figure 3 The liquid channel 1122 includes an inlet end 1122a and an outlet end 1122b disposed opposite to each other. The inlet end 1122a is disposed on the outer wall of the liquid channel plate 112, and the outlet end 1122b is disposed on the inner wall of the receiving hole 1121, and the outlet end 1122b communicates with the transition hole 1152. In this way, liquid can enter the liquid channel 1122 from the inlet end 1122a located on the outer wall of the liquid channel plate 112, and flow into the transition hole 1152 from the outlet end 1122b.

[0035] In some embodiments, see Figure 2 and Figure 3 The liquid channel 1122 has multiple outlet ends 1122b, all of which are located on the inner wall of the receiving hole 1121. The adapter 115 has multiple adapter holes 1152, each corresponding to and connected to one of the outlet ends 1122b. There can be two, three, or four outlet ends 1122b, and the number and position of the adapter holes 1152 on the adapter 115 correspond to and are connected to the number and position of the outlet ends 1122b. The multiple outlet ends 1122b and adapter holes 1152 can correspond to multiple sides of the punch 113, thereby rinsing and cleaning the punch 113 from multiple directions to further improve the cleaning effect. If the upper mold assembly 11 is provided with multiple punches 113, the upper mold assembly 11 may also be provided with multiple adapters 115 corresponding to the punches 113, and the liquid outlet end 1122b of the liquid channel 1122 is connected to multiple adapters 115 respectively, thereby rinsing and cleaning the multiple punches 113.

[0036] In some embodiments, see Figure 2 and Figure 6 The lower mold assembly 12 includes a lower mold plate 121 and a lower mold base 122. The lower mold plate 121 is molded and adapted to the liquid channel plate 112. The lower mold base 122 is located on the side of the lower mold plate 121 away from the liquid channel plate 112. A first liquid collection tank 1221 is provided on the side of the lower mold base 122 facing the lower mold plate 121 for collecting waste liquid.

[0037] The first liquid collection tank 1221 can be an annular groove, surrounding the lower template 121. The lower mold base 122 has the first liquid collection tank 1221 surrounding the lower template 121 on the side facing it, allowing waste liquid flowing from the punching mechanism 10 during the cleaning process of the punch 113 to be collected by the first liquid collection tank 1221. The first liquid collection tank 1221 serves to collect waste liquid, preventing overflow and maintaining the cleanliness of the equipment and working environment, while also facilitating subsequent waste liquid treatment. In this way, waste liquid in the first liquid collection tank 1221 can be transferred and subsequently treated in a unified manner, instead of needing to clean waste liquid from every corner of the equipment, thus improving the efficiency of waste liquid treatment.

[0038] In some embodiments, see Figure 2 and Figure 6 The first liquid collecting tank 1221 has a first drain hole 1222 at its bottom. The lower mold assembly 12 also includes a liquid collecting plate 123, which is located on the side of the lower mold base 122 away from the lower mold plate 121. A second liquid collecting tank 1231 is provided on the side of the liquid collecting plate 123 facing the lower mold base 122. The second liquid collecting tank 1231 has a liquid receiving groove 1232 opposite to the first drain hole 1222. The second liquid collecting tank 1231 is used to receive the liquid discharged from the first liquid collecting tank 1221. The second liquid collecting tank 1231 can be an annular groove, surrounding the lower mold base 122. By providing the first drain hole 1222, the waste liquid in the first liquid collecting tank 1221 can flow out and flow to the liquid receiving groove 1232 of the second liquid collecting tank 1231. By setting up a second collection tank 1231, all waste liquid discharged from the first collection tank 1221 can be collected, preventing waste liquid from remaining on the equipment surface or the ground, and helping to keep the environment around the equipment clean.

[0039] In some embodiments, see Figure 1 , Figure 2 and Figure 6 The second collection tank 1231 is also provided with a second drain hole 1233. The self-cleaning punching and cutting equipment 100 also includes a liquid collection mechanism 30, which includes a waste liquid tank 31 and a waste liquid pipe 32. The two ends of the waste liquid pipe 32 are respectively connected to the second drain hole 1233 and the waste liquid tank 31. In this way, all waste liquid can be collected into the waste liquid tank 31 through the waste liquid pipe 32, which not only effectively controls the random discharge of waste liquid, but also facilitates the centralized treatment of waste liquid.

[0040] In some embodiments, see Figure 1 , Figure 2 and Figure 3The liquid supply mechanism 20 includes a liquid supply assembly 21 and a liquid supply pipe 22. The liquid supply assembly 21 includes a liquid supply tank 211 and a liquid supply pump 212. The liquid supply tank 211 is used to store and supply liquid, providing a stable liquid source for the cleaning function of the entire self-cleaning punching equipment 100. The liquid supply pump 212 is connected to the liquid supply tank 211. The two ends of the liquid supply pipe 22 are respectively connected to the liquid supply pump 212 and the liquid inlet 1122a of the liquid channel 1122. The liquid supply pump 212 is used to supply the liquid in the liquid supply tank 211 to the liquid circuit board 112 through the liquid supply pipe 22. The liquid supply assembly 21 also includes a pressure regulating valve (not shown in the figure), which can adjust the liquid supply pressure as needed. The liquid supply pump 212 is connected to both the liquid supply tank 211 and the liquid supply pipe 22, playing a role in power transmission, and can supply the liquid in the liquid supply tank 211 to the liquid circuit board 112 through the liquid supply pipe 22 at a certain pressure and flow rate. By controlling the parameters of the liquid supply pump 212, the supply speed and pressure of the cleaning liquid can be precisely adjusted, thereby ensuring that the liquid can effectively clean the punch 113. The liquid supply tank 211 can also be connected to multiple liquid supply pumps 212, such as two, three or four liquid supply pumps 212. Each liquid supply pump 212 can supply liquid to one punching mechanism 10, so that multiple punching mechanisms 10 can be self-cleaned through one liquid supply mechanism 20.

[0041] In some embodiments, see Figure 1 , Figure 2 and Figure 3 The liquid supply tank 211 is equipped with an observation window 2111 for observing the liquid level in the tank. The observation window 2111 can be made of transparent materials, such as glass or transparent plastic. By providing the observation window 2111, operators can directly obtain real-time liquid level information from the liquid supply tank 211, facilitating the monitoring of remaining liquid during equipment operation. This effectively prevents liquid depletion, ensuring the continuity of the cleaning operation of the flushing head 113 and avoiding damage to the liquid supply pump 212 from dry running. It is understood that a liquid level sensor can also be installed in the liquid supply tank 211 to monitor the liquid level.

[0042] The liquid supply assembly 21 also includes a movable frame 23, which houses the liquid supply tank 211 and the liquid supply pump 212. By providing the movable frame 23, the liquid supply tank 211 and the liquid supply pump 212 can be accommodated, facilitating the movement and placement of the entire liquid supply assembly 21. This allows for easy adjustment of the liquid supply assembly 21's position during initial installation and commissioning, as well as subsequent relocation due to changes in production layout. Furthermore, it makes the overall arrangement of the liquid supply assembly 21 more organized and facilitates centralized management and maintenance. It also makes it easier for operators to inspect and maintain the liquid supply tank 211 and the liquid supply pump 212 during daily work, improving the convenience and efficiency of equipment use and maintenance. Multiple casters can also be installed on the underside of the movable frame 23 to facilitate its movement.

[0043] The working process of the self-cleaning punching and cutting equipment 100 provided in this application embodiment is roughly as follows:

[0044] First, during the punching operation, the upper die plate 111 in the upper die assembly 11 drives the hydraulic plate 112 and the punch 113 to move downwards and match with the lower die assembly 12. The punch 113 then performs a punching operation on the corresponding material 200.

[0045] When the punching operation is completed or during the interval between punching operations, the liquid supply mechanism 20 is activated, and the liquid supply pump 212 in the liquid supply assembly 21 starts working, drawing out the liquid stored in the liquid supply tank 211 and delivering it to the liquid channel 1122 of the liquid circuit plate 112 through the liquid supply pipe 22. The liquid flows along the liquid channel 1122 from the liquid inlet end 1122a to the liquid outlet end 1122b, and then enters the receiving hole 1121 of the liquid circuit plate 112. The liquid reaches the cleaning hole 1151 through the adapter hole 1152 on the adapter 115, thereby rinsing and cleaning the punch 113 that passes through the cleaning hole 1151. Impurities, debris, etc. on the surface of the punch 113 are washed off. The waste liquid generated during cleaning flows to the lower die plate 121 of the lower die assembly 12 under the combined action of gravity and the liquid supply pressure of the liquid supply pump 212.

[0046] The waste liquid then flows into the first liquid collection tank 1221 arranged around the lower mold plate 121 on the lower mold base 122, and then flows into the second liquid collection tank 1231 on the liquid collection plate 123 with a liquid collection tank portion 1232 that is opposite to the first liquid collection hole 1222 of the first liquid collection tank 1221.

[0047] Finally, the waste liquid in the second collection tank 1231 flows through the second drain hole 1233 and the waste liquid pipe 32 into the waste liquid tank 31 of the liquid collection mechanism 30 for unified collection and storage, completing the entire self-cleaning and waste liquid collection and treatment process. After that, the self-cleaning punching and cutting equipment 100 can continue to carry out the next round of punching and cleaning operation cycle.

[0048] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A self-cleaning punching and cutting device, characterized in that, include: A punching mechanism includes an upper die assembly and a lower die assembly for mold fitting. The upper die assembly includes an upper template, a hydraulic manifold plate, and a punch. The hydraulic manifold plate is disposed on the side of the upper template facing the lower die assembly. The hydraulic manifold plate has a receiving hole and a liquid channel, the liquid channel communicating with the receiving hole. The punch is connected to the upper template and passes through the receiving hole. A liquid supply mechanism is used to supply liquid to the liquid channel so that liquid enters the receiving hole and thereby flushes and cleans the punch.

2. The self-cleaning punching and cutting equipment as described in claim 1, characterized in that, The upper template has a through hole arranged along the extension direction of the punch, the through hole corresponds to the receiving hole, and the cross-sectional area of ​​the through hole is smaller than the cross-sectional area of ​​the receiving hole; The liquid channel is located on the side of the liquid channel plate near the upper template; The upper mold assembly also includes: A guide sleeve is disposed in the through hole, and one end of the punch slides through the guide sleeve; and An adapter is fixedly disposed in the receiving hole. The adapter is provided with a cleaning hole and a connecting hole. The cleaning hole is disposed along the extension direction of the punch and communicates with the through hole. One end of the punch extending out of the guide sleeve passes through the cleaning hole. One end of the connecting hole is connected to the liquid channel, and the other end is disposed in the middle of the inner wall of the cleaning hole. The connecting hole is used to receive liquid in the liquid channel so that the liquid can rinse and clean the punch.

3. The self-cleaning punching and cutting equipment as described in claim 2, characterized in that, The inner wall of the cleaning hole is provided with a slag discharge groove, and the extension direction of the slag discharge groove is the same as the extension direction of the cleaning hole.

4. The self-cleaning punching and cutting equipment as described in claim 2, characterized in that, The liquid channel includes an inlet end and an outlet end arranged opposite to each other. The inlet end is located on the outer wall of the liquid circuit plate, and the outlet end is located on the inner wall of the receiving hole, and the outlet end is connected to the adapter hole.

5. The self-cleaning punching and cutting equipment as described in claim 4, characterized in that, The liquid channel has multiple outlet ends, each located on the inner wall of the receiving hole. The adapter has multiple adapter holes, each corresponding to and connected to one of the outlet ends.

6. The self-cleaning punching and cutting equipment as described in claim 1, characterized in that, The lower mold assembly includes: The lower template is adapted to fit the hydraulic circuit board during molding; and A lower mold base is disposed on the side of the lower mold plate away from the liquid circuit plate, and a first liquid collection tank is provided on the side of the lower mold base facing the lower mold plate for collecting waste liquid.

7. The self-cleaning punching and cutting equipment as described in claim 6, characterized in that, The bottom of the first liquid collection tank is provided with a first drain hole; The lower mold assembly also includes a liquid collection plate, which is disposed on the side of the lower mold base away from the lower mold plate. A second liquid collection groove is provided on the side of the liquid collection plate facing the lower mold base. The second liquid collection groove is provided with a liquid receiving groove portion opposite to the first liquid discharge hole. The second liquid collection groove is used to receive the liquid discharged through the first liquid collection groove.

8. The self-cleaning punching and cutting equipment as described in claim 7, characterized in that, The second liquid collection tank is also provided with a second drain hole; The self-cleaning punching and cutting equipment also includes a liquid collection mechanism, which is connected to the second drain hole.

9. The self-cleaning punching and cutting equipment as described in claim 4, characterized in that, The liquid supply mechanism includes a liquid supply component and a liquid supply pipe. The liquid supply component includes a liquid supply tank and a liquid supply pump. The liquid supply tank is used to store and supply liquid. The liquid supply pump is connected to the liquid supply tank. The two ends of the liquid supply pipe are respectively connected to the liquid supply pump and the liquid inlet of the liquid channel. The liquid supply pump is used to supply the liquid in the liquid supply tank to the liquid circuit board through the liquid supply pipe.

10. The self-cleaning punching and cutting equipment as described in claim 9, characterized in that, The liquid supply tank is equipped with an observation window, which is used to observe the liquid level in the liquid supply tank; The liquid supply assembly also includes a movable frame for accommodating the liquid supply tank and the liquid supply pump.

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