Double-layer heating and cooling suction cup

Abstract

The utility model particularly relates to a double-layer heating and cooling suction cup which comprises a porous ceramic upper plate, a ceramic lower plate, an insulating layer, a heat insulation plate and a base which are sequentially arranged from top to bottom. A blow-by gas path is arranged on the lower end surface of the porous ceramic upper plate; the upper end face and the lower end face of the ceramic lower plate are respectively provided with a cooling gas circuit and a first heating circuit layer, and the lower end face of the insulating layer is provided with a second heating circuit layer. A blow-by gas path is arranged on the lower end face of the porous ceramic upper plate, so that the gas resistance of the porous ceramic upper plate can be reduced; a cooling gas circuit is arranged on the upper end face of the lower ceramic plate, cooling gas can be introduced to cool the suction cup, and the cooling gas circuit can serve as an adsorption or positive pressure through hole and is beneficial to dredging of porous ceramic channels of the suction cup; and the sucker adopts a double-layer heating arrangement, so that the temperature uniformity can be improved. The double-layer heating and cooling sucker has double-layer heating and cooling functions, and is compact in structure, convenient to use, safe and reliable.

Description

Technical Field

[0001] This utility model relates to the field of suction cup technology, specifically to a double-layer heating and cooling suction cup. Background Technology

[0002] A vacuum chuck is a platform that uses vacuum adsorption to fix workpieces. Ceramic vacuum chucks are characterized by high strength, excellent wear resistance, and the hardness of ceramics, making them durable and resistant to scratches. During grinding, they remain deformation-free, ensuring uniform force distribution across the workpiece and reducing the risk of chipping and breakage. This has led to their widespread application in the manufacturing of high-value workpieces such as silicon, sapphire, and gallium arsenide semiconductor wafers. To prevent wafers from cracking due to sudden temperature rises or drops during processing, temperature control is often required, providing either cooling or heating functions. However, existing vacuum chucks typically use liquid cooling within the chuck base, lacking additional heating capabilities, resulting in limited functionality. Some vacuum chucks incorporate heating devices, but these often suffer from uneven temperature distribution and high air resistance during adsorption, requiring further improvement. Summary of the Invention

[0003] To overcome the shortcomings and deficiencies of existing technologies, the purpose of this utility model is to provide a double-layer heating and cooling suction cup. The double-layer heating and cooling suction cup has a porous ceramic upper plate, a ceramic lower plate, an insulating layer, and a heat insulation plate arranged from top to bottom above a base. The lower end face of the porous ceramic upper plate has a gas passage to reduce air resistance. The upper end face of the ceramic lower plate has a cooling gas passage, allowing cooling gas to be introduced to cool the suction cup. The cooling gas passage can also serve as an adsorption or positive pressure through-hole, helping to clear the porous ceramic channels of the suction cup. The suction cup uses a double-layer heating design, which helps improve temperature uniformity. It combines double-layer heating and cooling functions, has a compact structure, is easy to use, and is safe and reliable.

[0004] To achieve the above objectives, this utility model adopts the following technical solution: a double-layer heating and cooling suction cup, comprising a porous ceramic upper plate, a ceramic lower plate, an insulating layer, a heat insulation plate, and a base arranged sequentially from top to bottom; the lower end face of the porous ceramic upper plate is provided with a cross-flow air passage; the upper and lower end faces of the ceramic lower plate are respectively provided with a cooling air passage and a first heating circuit layer, and the lower end face of the insulating layer is provided with a second heating circuit layer; the first heating circuit layer is provided with a first positive electrode and a first negative electrode, and the second heating circuit layer is provided with a second positive electrode and a second negative electrode.

[0005] Furthermore, the outer periphery of the suction cup is provided with a plurality of spaced clamping blocks, which are used to fix the porous ceramic upper plate, ceramic lower plate, insulating layer and heat insulation plate to the base.

[0006] Furthermore, the porous ceramic upper plate is provided with a through-hole for air circulation, which is connected to an air circulation path. The air circulation path is distributed in a reciprocating manner on the lower end face of the porous ceramic upper plate, and the air circulation path is formed by an upward indentation on the lower end face of the porous ceramic upper plate.

[0007] Furthermore, the cooling air passage is distributed back and forth on the upper surface of the ceramic lower plate. The cooling air passage is formed by a downward indentation on the upper surface of the ceramic lower plate. The air inlet and air outlet of the cooling air passage are respectively connected to an air inlet hole and an air outlet hole. The air inlet hole and the air outlet hole pass through the ceramic lower plate, the insulating layer, the heat insulation plate and the base from top to bottom.

[0008] Furthermore, the routing paths of the cross-flow air path and the cooling air path are different, and the cross-flow air path and the cooling air path are staggered vertically.

[0009] Furthermore, the porous ceramic upper plate is a silicon carbide porous ceramic upper plate, and the ceramic lower plate is an alumina ceramic lower plate.

[0010] Furthermore, the insulating layer is an organic insulating layer.

[0011] Furthermore, the first heating circuit layer includes multiple first heating circuits, each of which has a first positive electrode and a first negative electrode at its beginning and end, respectively, and the first heating circuits are distributed in a reciprocating manner on the lower end surface of the ceramic lower plate.

[0012] Furthermore, the second heating circuit layer includes a second heating circuit that is folded back and forth on the lower end face of the insulating layer. The first and second ends of the second heating circuit are respectively provided with a second positive electrode and a second negative electrode, and both the second positive electrode and the second negative electrode are located in the middle of the lower end face of the insulating layer.

[0013] Furthermore, the insulation board is a mica sheet or a mullite fiberboard.

[0014] Furthermore, the double-layer heating and cooling suction cup is provided with a temperature measuring hole, which penetrates the porous ceramic upper plate, ceramic lower plate, insulation layer, heat insulation plate and base.

[0015] Furthermore, the upper surface of the porous ceramic upper plate is provided with a plurality of spaced insertion arm positions, which are formed by the downward indentation of the upper surface of the porous ceramic upper plate.

[0016] Furthermore, the cross-section of the base is circular or polygonal.

[0017] The beneficial effects of this utility model are as follows: The double-layer heating and cooling suction cup of this utility model has a porous ceramic upper plate, a ceramic lower plate, an insulating layer, and a heat insulation plate arranged from top to bottom above the base. The lower end face of the porous ceramic upper plate is provided with a gas passage, which can reduce the air resistance of the porous ceramic upper plate; the upper end face of the ceramic lower plate is provided with a cooling gas passage, which can be introduced to cool the suction cup. The cooling gas passage can also serve as an adsorption or positive pressure through hole, which helps to clear the porous ceramic channels of the suction cup; the suction cup adopts a double-layer heating arrangement, which helps to improve temperature uniformity. The first heating circuit layer and the second heating circuit layer are located on opposite sides of the insulating layer, respectively, improving the reliability of use. The double-layer heating and cooling suction cup of this utility model has both double-layer heating and cooling functions, a compact structure, is convenient to use, and is safe and reliable. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the double-layer heating and cooling suction cup of this utility model.

[0019] Figure 2 This is an exploded view of the double-layer heating and cooling suction cup of this utility model.

[0020] Figure 3 This is a top view of the double-layer heating and cooling suction cup of this utility model.

[0021] Figure 4 This is a schematic diagram of the gas passage structure of this utility model.

[0022] Figure 5 This is a schematic diagram of the cooling air path of this utility model.

[0023] Figure 6 This is a schematic diagram of the structure of the first heating circuit layer of this utility model.

[0024] Figure 7 This is a schematic diagram of the structure of the second heating circuit layer of this utility model.

[0025] Figure 8 This is a schematic diagram of the structure of the heat insulation board of this utility model.

[0026] The attached figures are labeled as follows: 1. Porous ceramic upper plate; 101. Insertion arm position; 102. Gas passage; 103. Gas vent; 2. Ceramic lower plate; 201. Cooling gas passage; 3. Insulation layer; 4. Heat insulation plate; 5. Base; 6. First heating circuit layer; 61. Central heating circuit; 62. Outer peripheral heating circuit; 7. Second heating circuit layer; 8. Temperature measuring hole; 9. Clamping block; 11. Air inlet; 12. Air outlet; 13. First positive electrode; 14. First negative electrode; 15. Second positive electrode; 16. Second negative electrode; 17. First positive electrode hole; 18. First negative electrode hole; 19. Second positive electrode hole; 21. Second negative electrode hole. Detailed Implementation

[0027] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0028] like Figure 1-8 As shown, a double-layer heating and cooling suction cup includes a porous ceramic upper plate 1, a ceramic lower plate 2, an insulating layer 3, a heat insulation plate 4, and a base 5 arranged sequentially from top to bottom; the lower end face of the porous ceramic upper plate 1 is provided with a cross-flow air passage 102; the upper and lower end faces of the ceramic lower plate 2 are respectively provided with a cooling air passage 201 and a first heating circuit layer 6; the lower end face of the insulating layer 3 is provided with a second heating circuit layer 7; the first heating circuit layer 6 is provided with a first positive electrode 13 and a first negative electrode 14; the second heating circuit layer 7 is provided with a second positive electrode 15 and a second negative electrode 16.

[0029] In this embodiment, the dual-layer heating and cooling suction cup has a porous ceramic upper plate 1, a ceramic lower plate 2, an insulating layer 3, and a heat insulation plate 4 arranged from top to bottom above the base 5. The lower end face of the porous ceramic upper plate 1 has a gas passage 102 to reduce air resistance and adsorption time. The upper end face of the ceramic lower plate 2 has a cooling gas passage 201, which allows cooling gas to be introduced to cool the suction cup. This passage can also serve as an adsorption or positive pressure through-hole, helping to clear the porous ceramic channels of the suction cup. The suction cup uses a dual-layer heating design, which helps improve temperature uniformity. Furthermore, the first heating circuit layer 6 and the second heating circuit layer 7 are located on opposite sides of the insulating layer 3, ensuring safe and reliable use. This dual-layer heating and cooling suction cup combines dual-layer heating and cooling functions, has a compact structure, is easy to use, and is highly practical.

[0030] Furthermore, the outer periphery of the suction cup is provided with multiple spaced clamping blocks 9, which are used to fix the porous ceramic upper plate 1, ceramic lower plate 2, insulating layer 3, and heat insulation plate 4 to the base 5. In this embodiment, multiple clamping blocks 9 are used to connect the porous ceramic upper plate 1, ceramic lower plate 2, insulating layer 3, and heat insulation plate 4 to the base 5, making the connection of the porous ceramic upper plate 1, ceramic lower plate 2, insulating layer 3, and heat insulation plate 4, as well as the connection of the air passage 102 and the cooling air passage 201, more stable. In this embodiment, the multiple clamping blocks 9 can be set to the same size or to different sizes. The upper end face of the base 5 is provided with a receiving groove, and the insulating layer 3 and heat insulation plate 4 are disposed in the receiving groove, resulting in a compact structure and a stable connection.

[0031] Furthermore, the porous ceramic upper plate 1 is provided with a through-hole 103, which communicates with a through-hole 102. The through-hole 103 is distributed in a reciprocating pattern on the lower end face of the porous ceramic upper plate 1, and is formed by an upward indentation from the lower end face of the porous ceramic upper plate 1. The through-hole 102 is located on the porous ceramic upper plate 1, which helps to reduce the air resistance of the porous ceramic upper plate 1 and reduce the adsorption time. The through-hole 102 includes multiple rings of through-hole segments arranged radially from the inside to the outside and connected sequentially along the porous ceramic upper plate 1.

[0032] Furthermore, the cooling air passage 201 is distributed in a reciprocating pattern on the upper surface of the ceramic lower plate 2. The cooling air passage 201 is formed by a downward indentation from the upper surface of the ceramic lower plate 2. The inlet and outlet ends of the cooling air passage 201 are respectively connected to an inlet hole 11 and an outlet hole 12. Both the inlet hole 11 and the outlet hole 12 pass through the ceramic lower plate 2, the insulating layer 3, the heat insulation plate 4, and the base 5 sequentially from top to bottom. The inlet hole 11 is connected to an external cooling gas pipe or cooling gas equipment. Cooling gas enters the cooling air passage 201 through the inlet hole 11, which can cool the ceramic lower plate 2 and can also serve as an adsorption or positive pressure through-hole to help the porous ceramic suction cup clear its channels and reduce air resistance. The cooling air passage 201 includes multiple rings of cooling air passages arranged radially from the inside to the outside and connected sequentially.

[0033] Furthermore, the routing paths of the cross-flow gas path 102 and the cooling gas path 201 are different, and they are staggered vertically. Specifically, the cross-flow gas path 102 includes multiple interconnected cross-flow gas channel segments, and the cooling gas path 201 includes multiple interconnected cooling gas channel segments. The cross-flow gas channel segments are staggered from the cooling gas channel segments and are not located directly above them. The staggered arrangement of the cooling gas path 201 and the porous cross-flow gas path 102 allows the cooling gas path 201 to both cool the porous ceramic upper plate 1 and connect to a vacuum pump to promote the adsorption of the wafer by the porous ceramic upper plate 1.

[0034] Furthermore, the porous ceramic upper plate 1 is a silicon carbide porous ceramic upper plate 1, and the ceramic lower plate 2 is an alumina ceramic lower plate 2. The insulating layer 3 is an organic insulating layer 3. The alumina ceramic lower plate 2 is a dense component and can be used to introduce cooling gas to cool the porous ceramic upper plate 1.

[0035] Furthermore, the first heating circuit layer 6 includes multiple first heating circuits, each with a first positive electrode 13 and a first negative electrode 14 at its beginning and end, respectively. The first heating circuits are distributed in a zigzag pattern on the lower surface of the ceramic lower plate 2. In this embodiment, the first heating circuit layer 6 includes two central heating circuits 61 and two peripheral heating circuits 62. The two central heating circuits 61 are located in the middle of the lower surface of the ceramic lower plate 2 and are symmetrical to each other. The two peripheral heating circuits 62 surround the two central heating circuits 61 and are symmetrical to each other. Preferably, the routing path of the central heating circuits 61 is semi-circular or approximately semi-circular, and the routing path of the peripheral heating circuits 62 is fan-shaped or approximately fan-shaped. In this embodiment, each first heating circuit is provided with a first positive electrode 13 and a first negative electrode 14, allowing for independent temperature control and ensuring temperature uniformity.

[0036] Furthermore, the second heating circuit layer 7 includes a second heating circuit that is folded back and forth on the lower end face of the insulating layer 3. A second positive electrode 15 and a second negative electrode 16 are respectively provided at the beginning and end of the second heating circuit, and both the second positive electrode 15 and the second negative electrode 16 are located in the middle of the lower end face of the insulating layer 3. The first heating circuit layer 6 and the second heating circuit layer 7 can be heated simultaneously, or one of the heating circuit layers can be heated individually, making it convenient and flexible to use.

[0037] Furthermore, the double-layer heating and cooling suction cup is provided with a first positive electrode hole 17, a first negative electrode hole 18, a second positive electrode hole 19, and a second negative electrode hole 21. The first positive electrode hole 17 and the first negative electrode hole 18 penetrate the insulating layer 3, the heat insulation plate 4, and the base 5 from top to bottom, respectively, and are used for the corresponding first positive electrode 13 and first negative electrode 14 to pass through. The second positive electrode hole 19 and the second negative electrode hole 21 penetrate the heat insulation plate 4 and the base 5 from top to bottom, respectively, and are used for the corresponding second positive electrode 15 and second negative electrode 16 to pass through.

[0038] Furthermore, the heat insulation board 4 is made of mica sheets or mullite fiberboard. Both mica sheets and mullite fiberboard are refractory materials, which are lightweight and have good heat insulation effect, and can effectively reduce the temperature of the base 5.

[0039] Furthermore, the double-layer heating and cooling suction cup is provided with a temperature measuring hole 8, which penetrates the porous ceramic upper plate 1, the ceramic lower plate 2, the insulating layer 3, the heat insulation plate 4, and the base 5. Due to the above structure, it is convenient to use a temperature measuring device to measure the temperature of the porous ceramic upper plate 1, the ceramic lower plate 2, the insulating layer 3, the heat insulation plate 4, and the base 5, which is beneficial for controlling the temperature of the suction cup.

[0040] Furthermore, the upper surface of the porous ceramic upper plate 1 is provided with a plurality of spaced insertion arm positions 101. Each insertion arm position 101 is a groove on the upper surface of the porous ceramic upper plate 1, with one end extending to the edge of the porous ceramic upper plate 1. The insertion arm positions 101 facilitate the positioning of external components onto the suction cup, improving ease of use. In this embodiment, there are four insertion arm positions 101 arranged in a rectangular array.

[0041] Furthermore, the cross-section of the base 5 is circular or polygonal. Preferably, in this embodiment, the porous ceramic upper plate 1, ceramic lower plate 2, insulating layer 3, heat insulation plate 4, and base 5 are all circular, and the wiring paths of the first heating circuit layer 6 and the second heating circuit layer 7 are circular, which facilitates processing and use.

[0042] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this utility model are within the protection scope of this utility model.

Claims

1. A double-layer heating and cooling suction cup, characterized in that: The device includes, from top to bottom, a porous ceramic upper plate, a ceramic lower plate, an insulating layer, a heat insulation plate, and a base; the lower end face of the porous ceramic upper plate is provided with a cross-flow air passage; the upper and lower end faces of the ceramic lower plate are respectively provided with a cooling air passage and a first heating circuit layer; the lower end face of the insulating layer is provided with a second heating circuit layer; the first heating circuit layer is provided with a first positive electrode and a first negative electrode, and the second heating circuit layer is provided with a second positive electrode and a second negative electrode.

2. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The suction cup has multiple spaced clamping blocks on its outer periphery, which are used to fix the porous ceramic upper plate, ceramic lower plate, insulating layer and heat insulation plate to the base.

3. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The porous ceramic upper plate is provided with a through-hole for air circulation, which is connected to an air circulation path. The air circulation path is distributed in a reciprocating manner on the lower end face of the porous ceramic upper plate, and the air circulation path is formed by an upward indentation on the lower end face of the porous ceramic upper plate.

4. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The cooling air passage is distributed back and forth on the upper surface of the ceramic lower plate. The cooling air passage is formed by a downward indentation on the upper surface of the ceramic lower plate. The air inlet and air outlet of the cooling air passage are respectively connected to an air inlet hole and an air outlet hole. The air inlet hole and the air outlet hole pass through the ceramic lower plate, the insulation layer, the heat insulation plate and the base from top to bottom.

5. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The routing paths of the cross-flow air path and the cooling air path are different, and the cross-flow air path and the cooling air path are staggered vertically.

6. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The porous ceramic upper plate is a silicon carbide porous ceramic upper plate, and the ceramic lower plate is an alumina ceramic lower plate; the insulating layer is an organic insulating layer.

7. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The first heating circuit layer includes multiple first heating circuits. Each first heating circuit has a first positive electrode and a first negative electrode at its beginning and end, respectively. The first heating circuits are distributed by folding back and forth on the lower end surface of the ceramic lower plate.

8. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The second heating circuit layer includes a second heating circuit that is folded back and forth on the lower end face of the insulating layer. The first and second ends of the second heating circuit are respectively provided with a second positive electrode and a second negative electrode. The second positive electrode and the second negative electrode are both located in the middle of the lower end face of the insulating layer.

9. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The suction cup is provided with a temperature measuring hole, which penetrates the ceramic lower plate, the insulating layer, the heat insulation plate and the base.

10. The double-layer heating and cooling suction cup according to claim 1, characterized in that: The upper surface of the porous ceramic upper plate is provided with multiple spaced insertion arm positions.

Images