Bead bead with uniformly distributed diamonds
By cold-pressing metal powder and diamond particles in layers within a mold to form a uniform, equally spaced layered distribution, and by setting through grooves on the surface of the metal matrix, the problem of uneven diamond particle distribution is solved, thereby improving the cutting stability and efficiency of the diamond wire saw.
Patent Information
- Application Number
- CN202522567877.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-03
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-12-03
AI Technical Summary
In existing technologies, diamond particles are randomly and disorderly distributed in the metal matrix, resulting in uneven load and affecting the cutting stability and effect of diamond wire saws.
By cold-pressing metal powder and diamond particles in layers in a mold, a uniform, equally spaced layered distribution is formed, and through grooves are set on the surface of the metal matrix to store coolant and remove chips, thereby controlling the degree of diamond particle exposure.
This achieves uniform load on the diamond particles, improves cutting stability and efficiency, enhances cooling effect, and reduces wear and shedding of diamond particles.
Smart Images
Figure CN223777479U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of cutting tool technology, and in particular to a diamond evenly distributed beaded system. Background Technology
[0002] A diamond wire saw consists of a wire rope, diamond beads, and spacers. The spacers and diamond beads are fitted around the outer circumference of the wire rope, and the spacers are positioned between adjacent diamond beads. The diamond beads are in direct contact with the material being cut, achieving grinding and cutting through the superior hardness of the diamond particles. Diamond wire saws are widely used in stone processing and construction engineering for cutting large stone and concrete structures.
[0003] The mainstream production processes for diamond beads include powder metallurgy hot pressing and sintering, electroplating, and brazing.
[0004] When making diamond beads using powder metallurgy hot pressing sintering, diamond particles are first carefully selected and then mixed with metal matrix powders such as cobalt powder, iron powder, and tungsten powder. Subsequently, the diamond particles and metal matrix powders (such as cobalt and iron) are mixed evenly by mechanical means and then filled through a mold. After that, the diamond bead blank is initially shaped by hot pressing to obtain the diamond bead blank. Finally, the mold containing the blank is placed in a hot pressing sintering device. Under high temperature and high pressure, the metal matrix powder diffuses and combines to form a dense metal matrix, which firmly embeds the diamond particles to form the final diamond beads.
[0005] In existing technologies, metal powder and diamond particles are mechanically mixed and then directly filled into a mold, resulting in most diamond particles being randomly distributed within the metal powder. After the diamond beads are sintered, the diamond particles are randomly and disorderly distributed within the metal matrix. This disordered distribution of diamonds within the metal matrix easily leads to "rich areas" and "poor areas" of diamond particles, resulting in uneven load distribution on different diamond particles. Consequently, some diamond particles are prone to wear and detachment, affecting the stability and cutting effect of diamond wire sawing. Utility Model Content
[0006] To improve the stability and cutting effect of diamond bead cutting materials, this application provides a uniformly distributed diamond bead.
[0007] This application provides a diamond evenly distributed beaded string, employing the following technical solution:
[0008] A diamond bead assembly includes a steel matrix, a metal matrix, and diamond particles. The metal matrix is fixed to the outer periphery of the steel matrix by hot-pressing and sintering. The diamond particles are embedded in the metal matrix. The metal powder of the metal matrix and the diamond particles are cold-pressed in layers in a mold, so that a plurality of diamond particles are evenly distributed on the axial end face of the metal matrix, and the plurality of diamond particles on the axial end face of the metal matrix form a diamond particle layer. The diamond particle layer is arrayed along the central axis of the metal matrix, and each layer of diamond particles is equally spaced along the central axis of the metal matrix.
[0009] By adopting the above technical solution, and by limiting the position of diamond particles in the metal matrix, the diamond particles in the diamond bead working layer (axial end face of the metal matrix) are transformed from a random state to a neat arrangement, and the diamond particles on the cylindrical surface of the metal matrix are distributed in layers with equal spacing.
[0010] Therefore, when the surface of the metal matrix wears down to expose the diamond particles, the diamond particles are evenly distributed on the surface of the metal matrix, making the load on the diamond particles more uniform. This makes the diamond beads cut materials more smoothly, improving the cutting effect of the diamond beads and reducing uneven consumption caused by local concentration or sparseness of diamond particles.
[0011] Optionally, the diamond particles are evenly distributed in an equilateral triangle on the axial end face of the metal matrix.
[0012] By adopting the above technical solution, diamond particles are evenly distributed on the surface of the metal matrix, making the load on each diamond particle more uniform and the diamond wire saw more stable when cutting materials.
[0013] Optionally, the surface of the metal matrix is provided with a through groove, which is disposed between adjacent diamond particles.
[0014] By adopting the above technical solution, the through groove is beneficial for chip removal and improving the cooling efficiency of the diamond evenly distributed beads.
[0015] Optionally, the cross-section of the through groove is a V-shaped section.
[0016] By adopting the above technical solution, the cross-section of the through groove is V-shaped, which is beneficial to improving the cooling efficiency of the diamond evenly distributed beads.
[0017] Optionally, the through grooves are distributed in a spiral shape on the side of the metal body.
[0018] By adopting the above technical solution, the through groove is distributed in a spiral shape, which is conducive to continuously conveying the cutting debris outward and reducing the accumulation of debris in the through groove.
[0019] Optionally, the diamond particles are arranged in a ring array with the central axis of the metal matrix as the array center point to form a diamond particle layer.
[0020] By adopting the above technical solution, the diamond particles on the axial end face of the metal matrix are arranged in a ring array, so that the diamond particles are evenly distributed in the metal matrix.
[0021] Optionally, the surface of the metal matrix is worn to expose the diamond particles. When the actual exposed height of the diamond particles is consistent with the designed exposed height of the diamond particles, the wear thickness of the metal matrix is the groove depth of the through groove.
[0022] By adopting the above technical solution, the groove depth is comparable to the designed wear thickness of the metal matrix; that is, by controlling the groove depth, the exposure degree and speed of the diamond particles can be controlled, so as to give full play to the cutting effect of the diamond particles on the material and improve the cutting efficiency of the diamond wire saw.
[0023] Optionally, the diamond particle annular array has at least two rows.
[0024] By adopting the above technical solution, multiple diamond particles are arranged along the radial direction of the metal matrix to improve the cutting effect of the uniformly distributed diamond beads on the material.
[0025] In summary, this application includes at least one of the following beneficial technical effects:
[0026] 1. By limiting the position of diamond particles in the metal matrix, the diamond particles in the diamond bead working layer are transformed from a random state to a neat arrangement, and the diamond particles on the cylindrical surface of the metal matrix are distributed in layers with equal spacing. As a result, when the surface of the metal matrix is worn to expose the diamond particles, the diamond particles are evenly distributed on the surface of the metal matrix, making the load on the diamond particles more uniform. The diamond beads cut the material more smoothly, improving the cutting effect of the diamond beads on the material and reducing the uneven consumption caused by local concentration or sparseness of diamond particles.
[0027] 2. When diamond beads are evenly distributed and cutting materials, the grooves on the surface of the metal matrix can simultaneously store cooling water and contain cutting chips. In other words, the grooves facilitate chip removal and improve the cooling efficiency of the evenly distributed diamond beads.
[0028] 3. The groove depth is comparable to the designed wear thickness of the metal matrix; that is, by controlling the groove depth, the exposure degree and speed of the diamond particles are controlled, which is conducive to the wear of the surface layer of the metal matrix to the designed wear thickness, so as to give full play to the cutting effect of the diamond particles on the material and improve the cutting efficiency of the diamond wire saw. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the diamond beads evenly distributed in Example 1.
[0030] Figure 2 yes Figure 1 Sectional view at point AA.
[0031] Figure 3 yes Figure 1 Sectional view at point BB.
[0032] Figure 4 This is a cross-sectional view of an existing diamond bead string.
[0033] Figure 5 This is a cross-sectional view of the diamond beads evenly distributed in Example 2.
[0034] Figure 6 This is a schematic diagram of the diamond beads evenly distributed in Example 3.
[0035] Figure 7 This is a cross-sectional view of the diamond beads evenly distributed in Example 3.
[0036] Figure 8 yes Figure 7 Enlarged view of point C in the middle.
[0037] Figure 9 This is a schematic diagram of the structure after wear on the surface of the diamond evenly distributed beads in Example 3.
[0038] Figure 10 This is a schematic diagram of the diamond beads evenly distributed in Example 4.
[0039] Explanation of reference numerals in the attached drawings: 1. Steel substrate; 2. Metal matrix; 21. Through groove; 3. Diamond particles; 4. Diamond particle layer. Detailed Implementation
[0040] The following is in conjunction with the appendix Figure 1 -10 provides further details regarding this application. Example 1
[0041] This application discloses a uniformly distributed diamond bead system. The uniformly distributed diamond bead system is used in a diamond wire saw, which is used to cut large materials (stone, concrete, etc.). In this embodiment, the uniformly distributed diamond bead system is used to cut stone (e.g., marble, granite, etc.).
[0042] Reference Figure 1 and Figure 2The diamond bead set comprises a steel matrix 1, a metal matrix 2, and diamond particles 3. The metal matrix 2 is formed by hot pressing and sintering a mixture of metal powders such as cobalt powder, iron powder, and tungsten powder. The metal matrix 2 is fixed to the outer periphery of the steel matrix 1 through hot pressing and sintering. The diamond particles 3 are embedded in the metal matrix 2. The surface of the metal matrix 2 is worn to expose the diamond particles 3, thereby utilizing the hard diamond particles 3 to cut the stone.
[0043] In this embodiment, both the steel substrate 1 and the metal matrix 2 are hollow cylinders. In this document, the term "axial end face" refers to a plane perpendicular to the central axis of the steel substrate 1 and the metal matrix 2.
[0044] Reference Figure 2 and Figure 3 In this embodiment, the metal powder of the metal matrix 2 and the diamond particles 3 are cold-pressed in layers in a mold so that a plurality of diamond particles 3 are evenly distributed on the axial end face of the metal matrix 2. The plurality of diamond particles 3 on the axial end face of the metal matrix 2 constitute a diamond particle layer 4, and the axial end face of the metal matrix 2 containing the diamond particle layer 4 is the working layer of the diamond evenly distributed beads.
[0045] Reference Figure 2 In this embodiment, the diamond particles 3 are evenly distributed in an equilateral triangle pattern on the axial end face of the metal matrix 2. When the surface of the metal matrix 2 is worn down to expose the diamond particles 3, the diamond particles 3 are evenly distributed on the surface of the metal matrix 2.
[0046] Reference Figure 3 Since the metal powder of the metal matrix 2 is cooled in layers between the diamond particles 3 and the mold, the diamond particle layer 4 is arranged in an array along the central axis of the metal matrix 2, and each layer of diamond particle layer 4 is distributed at equal intervals along the central axis of the metal matrix 2.
[0047] Workers can fill a mold with a layer of metal powder, allowing the template with precision holes to place diamond particles 3 one by one into predetermined positions, and then fill the diamond particles 3 with metal powder; thereby achieving the purpose of uniformly distributing the diamond particles 3 on the axial end face of the metal matrix 2. In this embodiment, the improvement of the positional relationship of the diamond particles 3 in the metal matrix 2 through the production process should be understood as a limitation on the positional relationship of the uniformly distributed diamond beads, that is, an improvement on the structure of the uniformly distributed diamond beads.
[0048] Reference Figure 4In existing technology, metal powder and diamond particles 3 of the metal matrix 2 are mechanically mixed and then directly filled into a mold, resulting in most diamond particles 3 being randomly distributed within the metal powder. After the diamond beads are sintered, the diamond particles 3 are randomly and disorderly distributed within the metal matrix 2. This disorderly distribution of diamonds within the metal matrix 2 easily leads to "rich areas" and "poor areas" of diamond particles 3. Consequently, the load on different diamond particles 3 is uneven, causing some diamond particles 3 to wear and fall off easily, affecting the stability and cutting effect of the diamond wire saw.
[0049] The implementation principle of a uniformly distributed diamond bead string in this application embodiment is as follows:
[0050] Reference Figure 2 and Figure 3 By limiting the position of diamond particles 3 in the metal matrix 2, the diamond particles 3 in the diamond bead working layer (axial end face of the metal matrix 2) are arranged from a random state to an orderly state, and the diamond particles 3 on the cylindrical surface of the metal matrix 2 are distributed in layers with equal spacing.
[0051] Reference Figure 2 and Figure 3 Thus, when the surface of the metal matrix 2 is worn down to expose the diamond particles 3, the diamond particles 3 are evenly distributed on the surface of the metal matrix 2, making the load on the diamond particles 3 more uniform, making the diamond beads cut the material more stable, improving the cutting effect of the diamond beads on the material, and reducing the uneven consumption caused by the local concentration or sparseness of the diamond particles 3. Example 2
[0052] The difference between Example 2 and Example 1 is as follows:
[0053] Reference Figure 5 Diamond particles 3 are arranged in a ring array with the central axis of the metal matrix 2 as the array center point to form a diamond particle layer 4. The number of rows in the ring array of diamond particles 3 is at least two, so as to improve the cutting effect of the uniformly distributed diamond beads on the material.
[0054] The implementation principle of a uniformly distributed diamond bead string in this application embodiment is as follows:
[0055] Reference Figure 5 The diamond particles 3 on the axial end face of the metal matrix 2 are arranged in a ring array, so that the diamond particles 3 are evenly distributed in the metal matrix 2, thereby improving the cutting stability of the diamond beads and the cutting effect of the material. Example 3
[0056] The difference between Example 3 and Example 1 is as follows:
[0057] Reference Figure 6 and Figure 7 The surface of the metal matrix 2 is provided with a through groove 21, which is located between adjacent diamond particles 3. The cross-section of the through groove 21 is a V-shaped cross-section.
[0058] Reference Figure 7 and Figure 8 In this embodiment, when the actual exposed height of the diamond particle 3 is consistent with the designed exposed height of the diamond particle 3, the wear thickness of the metal matrix 2 is the groove depth of the through groove 21.
[0059] Reference Figure 6 In this embodiment, the through groove 21 is a long strip structure; the length direction of the through groove 21 is parallel to the central axis of the metal matrix 2 to facilitate the processing of the through groove 21. In other embodiments, the through groove 21 can also be an annular groove, with the annular through groove 21 disposed between adjacent diamond particle layers 4. In other embodiments, the through groove 21 can also be spirally disposed on the surface of the metal matrix 2.
[0060] The implementation principle of a uniformly distributed diamond bead string in this application embodiment is as follows:
[0061] Reference Figure 6 and Figure 7 When diamond beads are used to cut materials, the grooves 21 on the surface of the metal matrix 2 can simultaneously store cooling water and accommodate cutting debris. In other words, the grooves 21 are beneficial for chip removal and improving the cooling efficiency of the diamond beads.
[0062] Reference Figure 7 and Figure 8 The cross-section of the through groove 21 is V-shaped and the through groove 21 is spirally distributed. This is beneficial for continuously conveying the cutting debris outward and reducing the accumulation of debris in the through groove 21. The spiral through groove 21 is also beneficial for the flow of cooling water, so as to improve the cooling efficiency of the cooling water on the diamond beads.
[0063] Reference Figures 7 to 9 The exposure degree and speed of diamond particles 3 are controlled by controlling the groove depth of the through groove 21, which is conducive to the wear of the surface of the metal matrix 2 to the designed wear thickness, so that the diamond particles 3 are evenly distributed on the surface of the metal matrix 2, so as to give full play to the cutting effect of diamond particles 3 on the material and improve the cutting efficiency of diamond wire saw on the material. Example 4
[0064] The difference between Example 4 and Example 3 is as follows:
[0065] Reference Figure 10 In this embodiment, the through groove 21 is spirally distributed on the side of the metal body 2.
[0066] The implementation principle of a uniformly distributed diamond bead string in this application embodiment is as follows:
[0067] Reference Figure 10 In this embodiment, the through grooves 21 are spirally distributed; this facilitates the continuous outward transport of the cut chips, reducing chip accumulation in the through grooves 21; and the spiral through grooves 21 facilitate the flow of cooling water, thereby improving the cooling efficiency of the cooling water on the diamond evenly distributed beads.
[0068] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A diamond beaded string with evenly distributed diamonds, characterized in that: The device includes a steel matrix (1), a metal matrix (2), and diamond particles (3). The metal matrix (2) is fixed to the outer periphery of the steel matrix (1) by hot pressing and sintering. The diamond particles (3) are embedded in the metal matrix (2). The metal powder of the metal matrix (2) and the diamond particles (3) are cold-pressed in layers in a mold so that a number of diamond particles (3) are evenly distributed on the axial end face of the metal matrix (2). The number of diamond particles (3) on the axial end face of the metal matrix (2) constitutes a diamond particle. The diamond particle layer (4) is arrayed along the central axis of the metal matrix (2), and each diamond particle layer (4) is distributed at equal intervals along the central axis of the metal matrix (2); the surface of the metal matrix (2) is provided with a through groove (21), and the through groove (21) is provided between adjacent diamond particles (3); the surface of the metal matrix (2) is worn to expose the diamond particles (3), and when the actual exposed height of the diamond particles (3) is consistent with the designed exposed height of the diamond particles (3), the wear thickness of the metal matrix (2) is the groove depth of the through groove (21).
2. The diamond evenly distributed beads according to claim 1, characterized in that: On the axial end face of the metal matrix (2), the diamond particles (3) are arranged in an equilateral triangle.
3. The diamond evenly distributed beads according to claim 1, characterized in that: The cross-section of the through groove (21) is V-shaped.
4. The diamond evenly distributed beads according to claim 1, characterized in that: The through groove (21) is spirally distributed on the side of the metal body (2).
5. The diamond evenly distributed beads according to claim 1, characterized in that: The diamond particles (3) are arranged in a ring array with the central axis of the metal matrix (2) as the center point to form a diamond particle layer (4).
6. The diamond evenly distributed beads according to claim 5, characterized in that: The number of rows in the annular array of diamond particles (3) is at least two.