Glass substrate manufacturing equipment with glass defect inspection function
By introducing water ripple inspection and laser drilling technology into the glass substrate manufacturing process, the problem of timely detection of cracks in the core layer of the glass substrate during the mesolayer material addition process has been solved, achieving efficient defect detection and treatment, and reducing resource waste and production costs.
Patent Information
- Application Number
- CN202423298036.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing technologies make it difficult to detect cracks in the core layer of a glass substrate in a timely manner during the layering process of the interlayer material. This leads to cracks, copper ion migration, and breakage of the glass substrate in subsequent processes, resulting in waste of resources and processes.
Multilayer boards are formed using a layering device and a film pressing device. Water ripple inspection is performed using a first water washing tank and a water ripple inspection device. A laser drilling device forms through holes and removes adhesive residue. A chemical copper plating device forms a copper layer. Defects are checked again using the water ripple inspection device. Finally, drying, electroplating, and film stripping are performed to ensure the accuracy of defect detection.
This enables the immediate detection and handling of defects during the glass substrate manufacturing process, reducing processes and costs, and improving the production efficiency and quality of glass substrates.
Smart Images
Figure CN223778005U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a glass substrate inspection technology using a water ripple inspection method, and particularly to a glass substrate manufacturing equipment with glass defect inspection function. Background Technology
[0002] As semiconductor chip design shifts from traditional planar architectures to advanced packaging, glass substrates have become a focal point. Furthermore, advanced packaging requires higher integration density and finer line widths, and glass substrates, with their high rigidity, low coefficient of thermal expansion, and excellent dimensional stability, flatness, thermal stability, and electrical performance, have also become a key focus for both industry and academia.
[0003] In addition to using glass as the core layer, the glass substrate requires the continuous addition of interlayer materials (additional layers) above and below the core layer (glass) according to the stacking design of the glass substrate to form a multilayer board (such as an eight-layer board) with multiple layers. For example, an eight-layer board can be composed of three layers of interlayer material on top, two layers of glass (core layer) in the middle, and three layers of interlayer material on the bottom.
[0004] However, the layering process for mesolayer materials (such as ABF build-up films) requires high temperature and high pressure conditions. For example, the layering conditions for ABF build-up films (Ajinomoto build-up films) are a temperature of 100°C and a pressure of 10 kgf / cm². 2 (kgf / cm²), then bake at 180°C, and repeat this layering condition each time an additional layer of interlayer material is added, depending on the number of layers in the multilayer board.
[0005] Therefore, each addition of the interlayer material (addition film) causes the glass, which serves as the core layer, to be subjected to heat and pressure. This can lead to defects such as cracks in the glass substrate with through-glass vias (TGVs). Furthermore, cracks may cause copper ion migration in the electroplated TGVs, resulting in short circuits, or even breakage of the core layer (glass), causing the glass substrate to be scrapped during the process.
[0006] Furthermore, after the core layer (glass) is covered by the interlayer material, if cracks occur in the core layer (glass) during the interlayer material addition process but are not detected in time through inspection, and the cracks are only discovered through destructive testing such as cross-section analysis after all the processes and processing of the glass substrate are completed and electrical testing and reliability tests are performed on the glass substrate, resulting in wasted processes and damage to the glass substrate.
[0007] In addition, the various glass defect inspection methods currently available have the advantages and disadvantages described in [1] to [5].
[0008] [1] Infrared inspection method: The advantage is that cracks will cause hot spots to be generated inside the glass, so the hot spots of the glass can be detected by infrared instruments, thereby detecting the location of the crack in the glass; however, the disadvantage is that infrared equipment is expensive, and the core layer (glass) is covered by the interlayer material, which makes it impossible to accurately detect the location of defects in the core layer (glass).
[0009] [2] X-ray inspection method: The advantage is that it can detect some defects such as cracks that are not visible to the naked eye; however, the disadvantage is that X-ray has radiation safety issues and can only be inspected offline. Furthermore, X-ray will show the metal parts of the glass substrate (such as metal lines / copper layers), which can easily lead to misjudgment by inspectors.
[0010] [3] Automated Optical Inspection (AOI) method: The advantage is that it can automatically measure the entire surface of the glass substrate and point out the location of defects in the glass substrate; however, the disadvantage is that after the core layer (glass) is covered by the interlayer material, the defects of the core layer (glass) cannot be detected.
[0011] [4] Microscopic inspection method: The advantage is that the magnification of the microscope can be used to clearly observe the cracks on the surface of the glass slide or the periphery of the glass through-hole (TGV); however, the disadvantage is that it can only be used to inspect and observe the glass slide locally at the magnification position of the microscope, and cannot inspect the entire surface of the glass slide, so it is not easy to quickly find defects.
[0012] [5] Visual inspection method: The advantage is that the surface of the glass sheet can be observed with the naked eye to find obvious cracks. It is fast and does not require additional equipment. However, the disadvantage is that it is only applicable to the surface of the glass sheet with obvious cracks and other defects. It is difficult to inspect and find tiny cracks.
[0013] Therefore, overcoming the various problems of the existing technologies has become a pressing issue that the industry urgently needs to address. Utility Model Content
[0014] In view of the various deficiencies of the prior art, this application provides a glass substrate manufacturing equipment with glass defect inspection function, comprising: a layering device and a lamination device, for performing layering and lamination operations on the glass core plate of the glass substrate to form a multilayer board including the glass core plate and the layering film; a first water washing tank and a first water ripple inspection device, wherein the first water washing tank contains the multilayer board including the glass core plate and the layering film, and the first water ripple inspection device performs a water ripple inspection operation on the multilayer board including the glass core plate and the layering film in the first water washing tank to detect whether the glass core plate of the multilayer board has defects or not; and a laser drilling device, wherein when the water ripple inspection operation of the first water ripple inspection device detects that the glass core plate of the multilayer board in the first water washing tank does not have defects, the laser drilling device performs a laser drilling operation on the glass core plate and / or the layering film of the multilayer board without defects to form through holes.
[0015] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a glue removal device. After the laser drilling device performs laser drilling on the glass core plate and / or add-layer film of the multilayer board without defects to form through holes, the glue removal device removes the glue residue at the through holes.
[0016] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a chemical copper plating device. After the laser drilling device performs laser drilling on the glass core plate and / or the addendum film of the multilayer board without defects to form through holes, the chemical copper plating device performs chemical copper plating on the glass substrate or its through holes to form a copper layer on the glass substrate.
[0017] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a chemical copper plating device and a film laminating device. The chemical copper plating device performs a chemical copper plating operation on the glass substrate or its through-holes to form a copper layer on the glass substrate, and the film laminating device performs a dry film laminating operation on the glass substrate or its copper layer.
[0018] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a film application device, an exposure device, and a developing device. The film application device applies a dry film to the glass substrate, and the exposure device and the developing device expose and develop the dry film on the glass substrate to form a patterned dry film.
[0019] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a film-applying device, a second water washing tank, and a second water ripple inspection device. The film-applying device applies a dry film to the glass substrate, and the second water washing tank holds the glass substrate including a glass core plate, an extension film, through-holes, and a dry film. The second water ripple inspection device then performs a water ripple inspection on the glass substrate in the second water washing tank, which includes the glass core plate, the extension film, through-holes, and the dry film, to detect whether the glass core plate of the glass substrate has defects or not.
[0020] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a drying device. When the water ripple inspection operation of the second water ripple inspection device detects that the glass core plate of the glass substrate in the second water washing tank is free of defects, the drying device performs a drying operation on the glass substrate, which includes the glass core plate, the extension film, the through-hole and the dry film.
[0021] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes an electroplating device, which performs electroplating operations on the glass substrate, including the glass core plate, the enhancement film and the through holes, to form the electroplated layer and conductive holes of the glass substrate.
[0022] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a film peeling device and a flash etching device, so that the film peeling device performs film peeling operation on the dry film of the glass substrate, and the flash etching device performs adhesive residue removal operation on the dry film.
[0023] The aforementioned glass substrate manufacturing equipment with glass defect inspection function also includes a solder resist device, which uses solder resist material to form a solder resist layer on the glass substrate.
[0024] As can be seen from the above, the glass substrate manufacturing equipment with glass defect inspection function described in this application can make good use of the layering device and the lamination device to perform layering and lamination operations on the glass core plate of the glass substrate, so as to efficiently form a multilayer board including the glass core plate and the layering film.
[0025] Furthermore, this application can make good use of the first water washing tank to hold the multilayer board including the glass core plate and the extension film, and then use the first water ripple inspection device to perform water ripple inspection on the multilayer board including the glass core plate and the extension film, so as to quickly and timely detect defects in the glass core plate.
[0026] In addition, this application will only perform laser drilling on the glass core plate and / or the overlay film of the multilayer board when the glass core plate is found to be free of defects by the water ripple inspection operation of the first water ripple inspection device, so as to effectively reduce or save the manufacturing process, manufacturing cost and valuable time of the glass substrate. Attached Figure Description
[0027] Figure 1 This is a block diagram of the glass substrate manufacturing equipment with glass defect inspection function described in this application.
[0028] Figure 2 This is a schematic diagram illustrating the process of the glass substrate manufacturing equipment with glass defect inspection function described in this application, which simultaneously inspects the defects of the glass core plate during the manufacturing of the glass substrate.
[0029] The reference numerals in the attached figures are explained as follows:
[0030] 1. Glass substrate fabrication equipment
[0031] 11. Layer-adding device
[0032] 12. Film pressing device
[0033] 13 First Washing Tank
[0034] 14 First Water Ripple Inspection Device
[0035] 15 Laser drilling device
[0036] 16. Desiccant Removal Device
[0037] 17. Chemical Copper Plating Equipment
[0038] 18. Chemical Copper Plating Materials
[0039] 19. Film application device
[0040] 20 Exposure apparatus
[0041] 21. Developing apparatus
[0042] 22 Second washing tank
[0043] 23 Second Water Ripple Inspection Device
[0044] 24 Drying device
[0045] 25 Electroplating equipment
[0046] 26. Film peeling device
[0047] 27 Flash Erosion Device
[0048] 28 Weld protection device
[0049] 29. Outgoing Inspection Device
[0050] 3 Glass substrate
[0051] 31 Glass core panel
[0052] 32. Thickened film
[0053] 33 Multilayer board
[0054] 34 Defects
[0055] 35 through hole
[0056] 36. Glue residue
[0057] 37 Copper Layer
[0058] 38 Dry film
[0059] 39 Electroplating layer
[0060] 40 conductive holes
[0061] 41. Glue residue
[0062] 42 Solder resist layer
[0063] Steps S1 to S10. Detailed Implementation
[0064] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and technical effects of this application from the content disclosed in this specification.
[0065] It should be understood that the structures, proportions, sizes, etc., shown in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the technical effects and objectives achieved by this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, the terms such as "above," "below," "one," "two," "first," and "second" used in this specification are merely for clarity of description and are not intended to limit the scope of implementation of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of implementation of this application.
[0066] Figure 1 This is a block diagram of the glass substrate fabrication equipment 1 with glass defect inspection function described in this application. Figure 2 This is a schematic diagram of the process by which the glass substrate manufacturing equipment 1 with glass defect inspection function described in this application simultaneously inspects the defects 34 of the glass core plate 31 during the manufacturing of the glass substrate 3.
[0067] like Figure 1As shown, the glass substrate manufacturing equipment 1 with glass defect inspection function may include a layering device 11, a film pressing device 12, a first washing tank 13, a first water ripple inspection device 14, a laser drilling device 15, a glue removal device 16, a chemical copper plating device 17, at least one chemical copper plating material 18, a film application device 19, an exposure device 20, a developing device 21, a second washing tank 22, a second water ripple inspection device 23, a drying device 24, an electroplating device 25, a film peeling device 26, a flash etching device 27, a solder resist device 28, and / or at least one (or more) shipping inspection device 29, etc. Furthermore, the term "at least one" in this application represents one or more (e.g., one, two, three, or four or more), and "more than" represents two or more (e.g., two, three, four, or ten or more).
[0068] In detail, the glass substrate manufacturing equipment 1 with glass defect inspection function can simultaneously have the function of manufacturing glass substrate 3 and the function of inspecting defects in glass core plate 31, so that the glass substrate 3 can be manufactured and the defects 34 of glass core plate 31 can be inspected quickly and simultaneously during the manufacturing process of glass substrate 3 and the inspection process of defects 34 of glass core plate 31.
[0069] like Figure 1 As shown, the glass substrate fabrication equipment 1 with glass defect inspection function can perform the following operations in sequence. Figure 2 The order of steps S1 to S10 and the number of steps (processes) can be adjusted and increased or decreased according to different needs.
[0070] like Figure 1 and Figure 2 As shown in step S1, a glass core plate 31 for a glass substrate 3 is provided. The quality of the glass core plate 31 for the glass substrate 3 can also be preliminarily inspected by inspectors or relevant personnel (such as whether there are defects 34), and various materials (raw materials) for the glass substrate 3 are cut into pieces.
[0071] In one embodiment, the glass substrate 3 may be a glass encapsulation substrate or an encapsulation substrate having a glass core plate 31. The glass core plate 31 may be referred to as a glass core layer, that is, glass is used as the core plate or core layer of the glass substrate 3.
[0072] [1] Layering device 11 and pressing device 12: such as Figure 1 and Figure 2 As shown in step S2, the build-up film 32 is added and laminated (such as vacuum lamination / pressing) is performed on the glass core plate 31 of the glass substrate 3 by the build-up film 32, and the lamination device 11 and the lamination device 12 to form a multilayer board 33 including the glass core plate 31 and the build-up film 32.
[0073] In one embodiment, it can be performed at high temperatures (e.g., 100°C to 180°C) and high pressures (e.g., 10 kgf / cm²). 2 Under the conditions described above, the layering device 11 and the lamination device 12 respectively use layering and lamination processes to perform layering and lamination operations on the upper and / or lower surfaces of the glass core plate 31 of the glass substrate 3 to form a multilayer board 33 of the glass substrate 3. For example, the layering device 11 first coats or sprays an layering material (such as an interlayer material) to form a layering film 32 on the glass core plate 31, and then the lamination device 12 presses the glass core plate 31 and the layering film 32 together to tightly bond them into a multilayer board 33.
[0074] In one embodiment, the layering device 11 can be a laminating or film-applying layering device, etc., and the laminating device 12 can be a laminating machine, a pressing machine, a vacuum laminating machine, a composite material laminating machine, etc. The layering film 32 can be an ABF layering film (Ajinomoto layering film), an insulating layering film, an interlayer material (interlayer material layering), etc., and the multilayer board 33 can be at least a two-layer board (such as a two-layer board, a three-layer board, a four-layer board, a six-layer board, an eight-layer board, etc.).
[0075] In different embodiments, the lamination device 11 and the lamination device 12 may be different devices, but they may also be integrated into a single lamination / lamination device that has both lamination and lamination functions. Therefore, the lamination device 11 and the lamination device 12 may represent different devices or the same device.
[0076] [2] First washing tank 13 and first water ripple inspection device 14: such as Figure 1 and Figure 2 As shown in step S3, at the pressure station, the multilayer board 33, including the glass core plate 31 and the extension film 32, is contained in the first water washing tank 13. Then, the first water ripple inspection device 14 performs the first water ripple inspection on the multilayer board 33, including the glass core plate 31 and the extension film 32, in the first water washing tank 13 to detect whether the glass core plate 31 of the multilayer board 33 has defects 34 or does not have defects 34.
[0077] In one embodiment, the water ripple inspection method of the first water ripple inspection device 14 is as follows: at the defect 34 (such as cracks / breakage / dents) of the glass core plate 31, the water ripples in the first water washing tank 13 will spread from the inside to the outside, and the water ripples will radiate outward around the crack source of the glass core plate 31. That is, the glass substrate 3 after the layering is placed in the first water washing tank 13. The first water washing tank 13 can be a vibration device that combines water washing and ultrasonic waves, and the first water ripple inspection device 14 can have an image recorder (not shown) to detect and sense the abnormality of the water ripples (such as abnormal position), so that the first water ripple inspection device 14 can effectively locate or track the position of the defect 34 (such as cracks / breakage / dents) of the glass substrate 3 or its glass core plate 31 through the abnormality of the water ripples.
[0078] In one embodiment, the first water washing tank 13 is a water washing container, the first water ripple inspection device 14 is a water ripple inspection instrument, and the defect 34 of the glass core plate 31 may include cracks, breaks, dents, etc.
[0079] To explain, under normal circumstances where the glass substrate 3 does not have defects 34, the glass core plate 31 of the glass substrate 3 typically has a very flat surface, and the extension film 32 has an ultra-thin thickness (such as a film several micrometers thick) to cover (such as press / apply) the surface of the glass core plate 31. Therefore, when the glass substrate 3 has defects 34 (such as cracks / breakage / dents), the surface of the extension film 32 will change accordingly or slightly with the defects 34 (such as cracks / breakage / dents) of the glass core plate 31. Thus, even if the glass core plate 31 is covered by the extension film 32, the first water ripple inspection device 14 can use the water ripple inspection method to detect the location of the defects 34 of the glass core plate 31 covered by the extension film 32.
[0080] When the first water ripple inspection device 14 detects that the glass core plate 31 does not have defect 34 (e.g., defect 34 is not found), the glass substrate manufacturing equipment 1 with glass defect inspection function can continue to execute subsequent steps / processes (e.g., step S4). Conversely, when the first water ripple inspection device 14 detects that the glass core plate 31 has defect 34 (e.g., defect 34 has been found), the glass substrate manufacturing equipment 1 with glass defect inspection function will stop executing subsequent steps / processes (e.g., step S4) to scrap or otherwise process the glass core plate 31 with defect 34.
[0081] [3] Laser drilling device 15 and adhesive residue removal device 16: such as Figure 1 and Figure 2As shown in step S4, when the water ripple inspection operation of the first water ripple inspection device 14 detects that the glass core plate 31 of the multilayer board 33 in the first water washing tank 13 does not have a defect 34, the laser drilling device 15 performs laser drilling operation on the glass core plate 31 and / or the layering film 32 of the multilayer board 33 that does not have a defect 34 to form a through hole 35, and then the adhesive residue removal device 16 performs adhesive residue removal operation (such as adhesive residue removal cleaning operation) on the adhesive residue 36 at the through hole 35.
[0082] In one embodiment, a laser drilling device 15 may use a laser drilling process to perform laser drilling on a glass substrate 3 (a multilayer board 33 including a glass core plate 31 and an add-on film 32) to form at least one (or more) through-holes 35. This laser drilling operation by the laser drilling device 15 will create or leave adhesive residue 36 at the through-holes 35 of the glass substrate 3 (a multilayer board 33 including a glass core plate 31 and an add-on film 32). Then, an adhesive residue removal device 16 may use an adhesive residue removal process (such as an adhesive residue cleaning process) to remove the adhesive residue 36 at the through-holes 35 of the glass substrate 3 (a multilayer board 33 including a glass core plate 31 and an add-on film 32).
[0083] In one embodiment, the laser drilling device 15 can be a laser drilling machine, a laser micro-hole processing machine, etc., the adhesive residue removal device 16 can be an adhesive residue removal machine, a plasma adhesive residue removal device, etc., and the through hole 35 can be an opening, a via, a through hole, a blind hole, a groove, etc.
[0084] [4] Electroless copper plating apparatus 17, electroless copper plating material 18 and film application device 19: such as Figure 1 and Figure 2 As shown in step S5, after the laser drilling device 15 performs laser drilling on the glass core plate 31 and / or the add-layer film 32 of the multilayer board 33 without defects 34 to form through holes 35, the chemical copper plating device 17 uses chemical copper plating material 18 to perform chemical copper plating (referred to as "chemical copper") on the glass substrate 3 or its through holes 35 to form a copper layer 37 on the glass substrate 3, and then the film laminating device 19 performs a dry film laminating operation on the glass substrate 3 or its copper layer 37.
[0085] In one embodiment, a chemical copper plating apparatus 17 may use a chemical copper plating material 18 and a chemical copper plating process to perform a chemical copper plating (referred to as "chemical copper plating") operation on a glass substrate 3 (a multilayer board 33 including a glass core plate 31 and an addendum film 32) or its through-holes 35 to form a copper layer 37 on the glass substrate 3. Then, a film laminating apparatus 19 may use a film laminating process to perform a dry film 38 lamination operation (such as lamination or covering operation) on the glass substrate 3 or its copper layer 37.
[0086] In one embodiment, the electroless copper plating apparatus 17 can be an electroless copper plating device, an electroless copper plating system, etc., the electroless copper plating material 18 can be an electroless copper plating solution, etc., and the film application apparatus 19 can be an (automatic) film application machine, an (automatic) film pressing machine, etc. The copper layer 37 can be a copper foil, copper wire, copper circuit layer, etc., and the dry film 38 can be a photoresist layer, dry film photoresist, photoresist dry film, etch resist, negative photoresist dry film, negative water-soluble dry film photoresist, etc.
[0087] [5] Exposure device 20 and developing device 21: as follows Figure 1 and Figure 2 As shown in step S6, the exposure apparatus 20 and the developing apparatus 21 perform exposure and developing operations on the dry film 38 of the glass substrate 3 to form a patterned dry film 38. That is, the exposure apparatus 20 first performs an exposure process on the dry film 38 of the glass substrate 3, and then the developing apparatus 21 performs a developing process on the dry film 38 of the glass substrate 3 to form a patterned dry film 38.
[0088] In one embodiment, the exposure device 20 may be an (automatic) exposure machine or the like, and the developing device 21 may be an (automatic) developing machine, a photoresist developing machine or the like.
[0089] In different embodiments, the exposure device 20 and the developing device 21 may be different devices, but they may also be integrated into a single exposure and developing device that has both exposure and developing functions. Therefore, the exposure device 20 and the developing device 21 may represent different devices or the same device.
[0090] [6] Second washing tank 22 and second water ripple inspection device 23: as follows Figure 1 and Figure 2 As shown in step S7, the glass substrate 3, including the glass core plate 31, the extension film 32, the through hole 35, the copper layer 37 and the dry film 38, is placed in the second water washing tank 22. Then, the second water ripple inspection device 23 performs a second water ripple inspection on the glass substrate 3, including the glass core plate 31, the extension film 32, the through hole 35, the copper layer 37 and the dry film 38, in the second water washing tank 22 to detect whether the glass core plate 31 of the glass substrate 3 has a defect 34 or does not have a defect 34.
[0091] In one embodiment, the water ripple inspection method of the second water ripple inspection device 23 is as follows: at the defect 34 (such as cracks / breakage / dents) of the glass core plate 31, the water ripples in the second water washing tank 22 will spread from the inside to the outside, and the water ripples will radiate outward around the crack source of the glass core plate 31, so that the second water ripple inspection device 23 can effectively locate or track the position of the defect 34 of the glass core plate 31. That is, the glass substrate 3 is placed in the second water washing tank 22, which can be a vibration device combining water washing and ultrasonic waves, and the second water ripple inspection device 23 can have an image recorder (not shown) to detect and sense abnormalities in the water ripples (such as abnormal positions), so that the second water ripple inspection device 23 can effectively locate or track the position of the defect 34 (such as cracks / breakage / dents) of the glass substrate 3 or its glass core plate 31 through the abnormalities in the water ripples.
[0092] In one embodiment, the second washing tank 22 is a washing container, etc., and the second water ripple inspection device 23 is a water ripple inspection instrument, etc. The defects 34 of the glass core plate 31 may include cracks, breaks, dents, etc. However, in different embodiments, the first washing tank 13 and the second washing tank 22 may be integrated into the same washing tank, and the first water ripple inspection device 14 and the second water ripple inspection device 23 may be integrated into the same water ripple inspection device.
[0093] [7] Drying device 24 and electroplating device 25: such as Figure 1 and Figure 2 As shown in step S8, when the water ripple inspection operation of the second water ripple inspection device 23 detects that the glass core plate 31 of the glass substrate 3 in the second water washing tank 22 does not have a defect 34, the drying device 24 uses a drying process to dry the glass substrate 3 including the glass core plate 31, the layering film 32, the through hole 35, the copper layer 37 and the dry film 38 to dry the glass substrate 3. Then, the electroplating device 25 uses an electroplating process to electroplat the glass substrate 3 including the glass core plate 31, the layering film 32, the through hole 35, the copper layer 37 and the dry film 38 (such as a hole filling electroplating process) to form the electroplated layer 39 and the conductive hole 40 of the glass substrate 3.
[0094] In one embodiment, the drying device 24 may be an air drying device, a hot air oven, an infrared drying device, a hot plate drying device, etc., the electroplating device 25 may be a substrate electroplating device, etc., the electroplating layer 39 may be an electroplated gold layer or an electroplated copper layer, etc., and the conductive hole 40 may be a conductive through hole or a conductive blind hole, etc.
[0095] [8] Stripping device 26 and flash etching device 27: as shown Figure 1 and Figure 2As shown in step S9, the film stripping device 26 uses a film stripping process to strip the dry film 38 of the glass substrate 3, and then the flash etching device 27 uses flash etching material to remove the adhesive residue 41 of the dry film 38 in a fast etching manner (such as adhesive residue removal cleaning operation).
[0096] Because the stripping device 26 will form or leave adhesive residue 41 on the dry film 38 of the glass substrate 3 after stripping the film, the flash etching device 27 is required to remove the adhesive residue 41 (such as adhesive residue cleaning). At the same time, the flash etching device 27 can also perform flash etching (micro-etching) on the surface of the glass substrate 3 to clean or remove oxides, stains, grease, etc. on the surface of the glass substrate 3.
[0097] In one embodiment, the film stripping device 26 may be a film stripping machine, an automatic film stripping machine, a dry film stripping agent, etc., the flash etching device 27 may be a glue residue removal device, a micro-etching device, etc., and the flash etching material may be a flash etching solution, etc.
[0098] [9] Weld prevention device 28 and outgoing inspection device 29: such as Figure 1 and Figure 2 As shown in step S10, the solder resist device 28 uses solder resist material to form the solder resist layer 42 of the glass substrate 3, and then the shipment inspection device 29 performs the shipment inspection operation of the finished product (product) of the glass substrate 3.
[0099] For example, the outgoing inspection device 29 can perform electrical and / or reliability tests on the glass substrate 3 to confirm whether the finished glass substrate 3 (product) is ready for shipment. When the outgoing inspection device 29 passes the inspection (if the inspection is successful), the shipping personnel can ship the finished glass substrate 3 (product). Conversely, when the outgoing inspection device 29 fails the inspection (if the inspection fails), the shipping personnel can scrap the finished glass substrate 3 (product) or perform other disposal methods.
[0100] In one embodiment, the solder resist device 28 may be a solder resist printing machine, the shipment inspection device 29 may be an electrical inspection device, a reliability inspection device, etc., the solder resist layer 42 may be a solder resist layer, an insulating protective layer, etc., and the solder resist material may be a solder resist flux, a solder resist agent, a polymer coating, etc.
[0101] It should be emphasized that the glass substrate 3 is not the subject of this application. Therefore, this application does not illustrate or limit the actual product, structure, composition, components, materials, features or functions of the glass substrate 3, but only describes the basic components or common components of the glass substrate 3 (such as glass core plate 31, layering film 32, multilayer board 33, through hole 35, copper layer 37, dry film 38, electroplated layer 39, conductive hole 40, etc.).
[0102] Furthermore, in practical applications, the glass substrate 3 described in this application may include various different products, structures, compositions, components, materials, features, or functions, and is not limited to this application. Figure 1 The basic components or common elements of the glass substrate 3 shown (such as glass core plate 31, layering film 32, multilayer board 33, through hole 35, copper layer 37, dry film 38, electroplated layer 39, conductive hole 40, etc.) are described.
[0103] In summary, the glass substrate manufacturing equipment 1 with glass defect inspection function described in this application has at least the following features, advantages or technical effects.
[0104] 1. This application can make good use of the layering device 11 and the lamination device 12 to perform layering and lamination operations on the glass core plate 31 of the glass substrate 3, so as to efficiently form a multilayer board 33 including the glass core plate 31 and the layering film 32.
[0105] Second, this application can make good use of the first water washing tank 13 to accommodate the multilayer board 33 including the glass core plate 31 and the extension film 32, and then the first water ripple inspection device 14 located in the first water washing tank 13 can simultaneously perform water washing and water ripple inspection on the multilayer board 33 including the glass core plate 31 and the extension film 32, so as to facilitate the rapid and timely detection of defects 34 in the glass core plate 31.
[0106] Third, this application will only perform laser drilling on the glass core plate 31 and / or the addendum film 32 of the multilayer board 33 when the glass core plate 31 is found to be free of defects 34 by the water ripple inspection operation of the first water ripple inspection device 14, so as to effectively reduce or save the manufacturing process, manufacturing cost and valuable time of the glass substrate 3.
[0107] Fourth, after the layering device 11 and the lamination device 12 perform the layering and lamination operations on the glass core plate 31 of the glass substrate 3 to form a multilayer board 33, this application can quickly or immediately inspect the defects 34 of the glass core plate 31, so as to avoid continuing to carry out subsequent processes or processing operations on the glass substrate 3 that has failed due to defects 34, thereby effectively reducing or saving the manufacturing cost and valuable time of the glass substrate 3.
[0108] Fifth, this application can directly add a water ripple inspection device 14 to the first water washing tank 13 of the original water washing process to inspect the defects 34 of the glass core plate 31, which is beneficial to the offline inspection of the glass core plate 31 without the need to add a glass substrate 3 (multilayer board 33).
[0109] VI. The defect inspection method of the glass core plate 31 of the glass substrate 3 in this application will not prevent the inspection of defects 34 of the glass core plate 31 due to the covering of the enhancement film 32.
[0110] 7. Even if the glass substrate 3 of this application has formed a multilayer structure (such as a multilayer board 33 including a glass core plate 31 and an extension film 32), the defects 34 of the glass core plate 31 can be effectively detected by the water ripple inspection operation of the first water ripple inspection device 14.
[0111] 8. The first water ripple inspection device 14 or the second water ripple inspection device 23 of this application can be effectively used at the defects 34 (such as cracks / breakage / dents) of the glass core plate 31. The water ripples in the first water washing tank 13 or the second water washing tank 22 will spread from the inside to the outside, and the water ripples will spread outward in a radial pattern around the crack source of the glass core plate 31, so that the first water ripple inspection device 14 or the second water ripple inspection device 23 can effectively locate or track the position of the defects 34 of the glass core plate 31.
[0112] The above embodiments are merely illustrative of the principles and technical effects of this application and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the concept and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. A glass substrate manufacturing device with glass defect inspection function, characterized in that, The glass substrate manufacturing apparatus comprises: a layering device and a film pressing device, the layering device and the film pressing device performing layering and film pressing on a glass core plate of a glass substrate to form a multi-layer plate comprising the glass core plate and a layering film; a first water washing tank and a first water ripple inspection device, the first water washing tank containing the multi-layer plate comprising the glass core plate and the layering film, and the first water ripple inspection device performing water ripple inspection on the multi-layer plate comprising the glass core plate and the layering film in the first water washing tank to determine whether the glass core plate of the multi-layer plate has defects or not; and a laser drilling device, when the water ripple inspection of the first water ripple inspection device determines that the glass core plate of the multi-layer plate in the first water washing tank does not have defects, the laser drilling device performing laser drilling on the glass core plate and / or the layering film of the multi-layer plate without defects to form a through hole.
2. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further comprises a residue removing device, after the laser drilling device performs laser drilling on the glass core plate and / or the layering film of the multi-layer plate without defects to form the through hole, the residue removing device performing residue removing on the residue at the through hole.
3. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further comprises a chemical copper plating device, after the laser drilling device performs laser drilling on the glass core plate and / or the layering film of the multi-layer plate without defects to form the through hole, the chemical copper plating device performing chemical copper plating on the glass substrate or the through hole thereof to form a copper layer of the glass substrate.
4. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further comprises a chemical copper plating device and a film pasting device, the chemical copper plating device performing chemical copper plating on the glass substrate or the through hole thereof to form a copper layer of the glass substrate, and the film pasting device performing dry film pasting on the glass substrate or the copper layer thereof.
5. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further comprises a film pasting device, an exposure device and a developing device, the film pasting device performing dry film pasting on the glass substrate, and the exposure device and the developing device performing exposure and developing on the dry film of the glass substrate to form a patterned dry film.
6. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further comprises a film pasting device, a second water washing tank and a second water ripple inspection device, the film pasting device performing dry film pasting on the glass substrate, the second water washing tank containing the glass substrate comprising the glass core plate, the layering film, the through hole and the dry film, and the second water ripple inspection device performing water ripple inspection on the glass substrate comprising the glass core plate, the layering film, the through hole and the dry film in the second water washing tank to determine whether the glass core plate has defects or not.
7. The glass substrate manufacturing apparatus of claim 6, wherein, The glass substrate manufacturing apparatus further comprises a drying device, when the water ripple inspection of the second water ripple inspection device determines that the glass core plate in the second water washing tank does not have defects, the drying device performing drying on the glass substrate comprising the glass core plate, the layering film, the through hole and the dry film.
8. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further comprises an electroplating device, the electroplating device performing electroplating on the glass substrate comprising the glass core plate, the layering film and the through hole to form an electroplated layer and a conductive hole of the glass substrate.
9. The glass substrate production apparatus according to claim 4 or 5, wherein The glass substrate manufacturing apparatus further includes a film stripping device and a flash etching device. The film stripping device is used to perform a film stripping operation on the dry film of the glass substrate. The flash etching device is used to perform a residue removing operation on the residue of the dry film.
10. The glass substrate manufacturing apparatus of claim 1, wherein, The glass substrate manufacturing apparatus further includes an anti-welding device. An anti-welding material is used to form an anti-welding layer of the glass substrate.