Device for fully automatically measuring tin area on pin of electronic component

Abstract

The utility model discloses a device for full-automatically measuring a tin area on a pin of an electronic component, which comprises a fixing frame, a sliding block and probes, a sliding groove is arranged at the top of the fixing frame, the sliding block is arranged in the sliding groove, the probes are arranged at the top of the sliding block and the top of the fixing frame, and the probes respectively extend out from the bottom of the sliding block and the bottom of the fixing frame. A second guide groove is formed in the bottom of the sliding groove, when the movable sliding block drives the probe on the top of the movable sliding block to move, the probe moves in the guide groove, through the movable sliding block and the probe, whether the inductor pin is tinned or not can be detected on line, the tinning length can be synchronously detected, therefore, defective products are prevented from flowing out, and the working difficulty of subsequent procedures is reduced.

Description

Technical Field

[0001] This utility model relates to the field of inductor manufacturing technology, specifically to a fully automatic device for measuring the solder area on the pins of electronic components. Background Technology

[0002] An inductor is a component that converts electrical energy into magnetic energy and stores it. The structure of an inductor is similar to a transformer, but it has only one winding. An inductor has a certain inductance; it only impedes changes in current. If no current is flowing through the inductor, it will attempt to impede the current flow when the circuit is closed; if current is flowing through the inductor, it will attempt to maintain a constant current when the circuit is open. Inductors are also called chokes, reactors, or dynamic reactors.

[0003] Traditional pin soldering cannot be detected online and can only be inspected in subsequent processes, which affects the production efficiency of inductors. Utility Model Content

[0004] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0005] In view of the problems existing in the above and / or existing fully automatic measuring devices for the solder area on the pins of electronic components, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a device for fully automatic measurement of the solder area on the pins of electronic components. By opening a chute on the top of the fixed frame, a slider is set inside the chute, and probes are set on the top of the slider and the top of the fixed frame. The probes extend from the bottom of the slider and the bottom of the fixed frame, respectively. A guide groove is opened at the bottom of the chute. When the slider moves and drives the probe on its top to move, the probe moves inside the guide groove. This device can detect whether the inductor pins are soldered online by moving the slider and the probe, and can also detect the solder length simultaneously, thereby preventing defective products from flowing out and reducing the difficulty of subsequent processes.

[0007] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0008] An automated apparatus for measuring the solder area on the pins of electronic components, comprising:

[0009] A fixed frame, the top of which has a sliding groove, a motor installed on the side wall of the fixed frame, the output end of which extends into the sliding groove and is fitted with a threaded rod, and a guide groove is provided at the bottom of the sliding groove;

[0010] A slider is located inside the groove, and a threaded hole is provided on the side wall of the slider.

[0011] The probes are two in number, one of which penetrates the top of the bracket and extends from the bottom of the bracket, and the other probe penetrates the top of the slider and extends from the guide groove.

[0012] As a preferred embodiment of the device for automatically measuring the solder area of ​​electronic component pins according to the present invention, a guide rod is installed inside the slide groove, a guide hole is opened on the side wall of the slider, the guide rod passes through the guide hole, a second guide groove is opened at the bottom of the slide groove, and a guide block is installed at the bottom of the slider corresponding to the second guide groove.

[0013] As a preferred embodiment of the device for automatically measuring the solder area on the pins of electronic components according to the present invention, the top of the fixing frame is provided with a first through groove, the top of the slider is provided with a second through groove, one of the probes passes through the first through groove, and the other probe passes through the second through groove.

[0014] In a preferred embodiment of the fully automatic device for measuring the solder area on the pins of electronic components as described in this utility model, the side wall of the fixed frame is provided with a scale, and the side wall of the slider is equipped with a pointer.

[0015] As a preferred embodiment of the device for automatically measuring the solder area on the pins of electronic components according to the present invention, it further includes a fixing assembly. The fixing assembly consists of two parts, which are respectively disposed on the top of the fixing frame and the top of the slider. The fixing assembly includes two fixing plates symmetrically arranged and a clamping plate symmetrically located between the two fixing plates.

[0016] In a preferred embodiment of the fully automatic device for measuring the solder area on the pins of electronic components according to this utility model, a knob is rotatably connected to the side wall of one of the fixed plates, and a threaded rod with positive and negative threads is installed on the side wall of the knob. The threaded rod with positive and negative threads extends between the two fixed plates. A second threaded hole is opened on the side wall of the clamping plate, and the threaded rod with positive and negative threads rotates through the second threaded hole. A second guide rod is installed between the two fixed plates, and a third guide groove is opened on the side wall of the clamping plate. The second guide rod passes through the third guide groove.

[0017] Compared with existing technologies: By opening a chute on the top of the fixed frame, and setting a slider inside the chute, with probes on the top of the slider and the top of the fixed frame, the probes extend from the bottom of the slider and the fixed frame respectively. A guide groove is opened at the bottom of the chute. When the slider moves and moves the probe on its top, the probe moves inside the guide groove. This device can detect whether the inductor pins are soldered online by moving the slider and the probe, and can also detect the length of soldering at the same time, thereby preventing defective products from flowing out and reducing the difficulty of subsequent processes. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0019] Figure 1 This is an overall structural diagram of a device for automatically measuring the solder area on the pins of electronic components according to this utility model;

[0020] Figure 2 This is a partial structural diagram of a device for automatically measuring the solder area on the pins of electronic components according to the present invention;

[0021] Figure 3 This is a schematic diagram of the slider structure of a device for automatically measuring the solder area on the pins of electronic components according to this utility model. Detailed Implementation

[0022] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0023] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views showing the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, in actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0025] This invention provides a fully automatic device for measuring the soldering area of ​​electronic component pins. A sliding groove is provided on the top of a fixed frame, and a slider is installed inside the groove. Probes are installed on the top of both the slider and the fixed frame, extending from the bottom of the slider and the fixed frame respectively. A guide groove is provided at the bottom of the sliding groove. When the slider is moved, causing the probe on its top to move, the probe moves within the guide groove. This device can detect whether inductor pins are soldered online by moving the slider and probes, and can simultaneously detect the soldering length, thereby preventing defective products from being shipped out and reducing the difficulty of subsequent processes.

[0026] Figure 1-3 The diagram shown is a structural schematic of one embodiment of the device for automatically measuring the solder area on the pins of electronic components according to this utility model. Please refer to [link / reference]. Figures 1-3 The device for automatically measuring the solder area on the pins of electronic components according to this embodiment includes a fixture 100, a slider 200, a probe 300, and a fixing assembly 400.

[0027] The top of the mounting bracket 100 has a sliding groove 110. A motor 120 is mounted on the side wall of the mounting bracket 100. The output end of the motor 120 extends into the sliding groove 110 and is fitted with a threaded rod 130. The bottom of the sliding groove 110 has a guide groove 140. The slider 200 is located inside the sliding groove 110. The side wall of the slider 200 has a threaded hole 210. There are two probes 300. One probe 300 penetrates the top of the mounting bracket 100 and extends out from the bottom of the mounting bracket 100. The other probe 300 penetrates the top of the slider 200 and extends out from the guide groove 140. A guide rod 150 is installed inside the sliding groove 110. The side wall of the slider 200 has a guide hole 220. The guide rod 150 passes through the guide hole 220. The bottom of the sliding groove 110 has a second guide groove 160. A guide block is installed at the bottom of the slider 200 corresponding to the second guide groove 160. The top of the mounting bracket 100 has a first through groove 170. The top of the slider 200 has a second through slot 230, through which one probe 300 passes through the first through slot 170 and the other probe 300 passes through the second through slot 230. The side wall of the fixed bracket 100 is provided with a scale 180, and the side wall of the slider 200 is equipped with a pointer 240. By fixing the fixed bracket 100 to the device, the motor 120 is started to drive the threaded rod 130 to rotate. When the threaded rod 130 rotates, the screw structure pushes the slider 200 to move the probe 300 on its top back and forth. The probe 300 slides inside the guide slot 140, and the position between the two probes 300 can be adjusted. The probes 300 are used to detect whether the inductor pin has been stripped and tinned. If it has not been stripped and tinned, the probe 300 cannot conduct. By adjusting the distance between the two probes 300, the length of the tinning can be measured. By observing the position of the pointer 240 on the second guide slot 160, the specific length of the tinning can be determined.

[0028] Two fixing components 400 are respectively disposed on the top of the fixing frame 100 and the top of the slider 200. Each fixing component 400 includes two symmetrically arranged fixing plates 410 and a clamping plate 420 symmetrically located between the two fixing plates 410. A knob 430 is rotatably connected to the side wall of one of the fixing plates 410. A threaded rod 440 with both positive and negative threads is mounted on the side wall of the knob 430, extending between the two fixing plates 410. A second threaded hole 450 is formed on the side wall of the clamping plate 420, through which the threaded rod 440 rotatably passes. A second guide rod 460 is installed between the two fixing plates 410, and a third guide groove 470 is formed on the side wall of the clamping plate 420. The second guide rod 460 passes through the third guide groove 470. When the probe 300 needs to be replaced, the probe 300 is pulled out from inside the second through groove 230 and the first through groove 170. After replacing the probe 300 with a different model as needed, the probe 300 is inserted into the second through groove 230 and the first through groove 170 respectively. Rotating the knob 430 drives the threaded rod 440 to rotate. When the threaded rod 440 rotates, the screw structure pushes the two clamping plates 420 closer to each other and clamps the probe 300. Different models of probe 300 can be fixed inside the second through groove 230 and the first through groove 170, making it convenient to replace different models of probe 300.

[0029] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A fully automatic device for measuring the solder area on the pins of electronic components, characterized in that, include: A fixed frame (100) is provided with a sliding groove (110) on the top of the fixed frame (100), a motor (120) is installed on the side wall of the fixed frame (100), the output end of the motor (120) extends into the sliding groove (110) and is equipped with a threaded rod (130), and a guide groove (140) is provided at the bottom of the sliding groove (110). A slider (200) is located inside the groove (110), and a threaded hole (210) is provided on the side wall of the slider (200); The probe (300) consists of two probes, one of which penetrates the top of the fixture (100) and extends from the bottom of the fixture (100), and the other probe (300) penetrates the top of the slider (200) and extends through the guide groove (140).

2. The device for automatically measuring the solder area on the pins of electronic components according to claim 1, characterized in that, A guide rod (150) is installed inside the slide groove (110). A guide hole (220) is opened on the side wall of the slider (200). The guide rod (150) passes through the guide hole (220). A second guide groove (160) is opened at the bottom of the slide groove (110). A guide block is installed at the bottom of the slider (200) at a position corresponding to the second guide groove (160).

3. The device for automatically measuring the solder area on the pins of electronic components according to claim 2, characterized in that, The top of the fixing frame (100) is provided with a first through groove (170), and the top of the slider (200) is provided with a second through groove (230). One of the probes (300) passes through the first through groove (170), and the other probe (300) passes through the second through groove (230).

4. The device for automatically measuring the solder area on the pins of electronic components according to claim 3, characterized in that, The side wall of the fixed frame (100) is provided with a scale (180), and the side wall of the slider (200) is equipped with a pointer (240).

5. The device for automatically measuring the solder area on the pins of electronic components according to claim 4, characterized in that, It also includes two fixing components (400) respectively disposed on the top of the fixing frame (100) and the top of the slider (200). Each fixing component (400) includes two fixing plates (410) symmetrically arranged and a clamping plate (420) symmetrically located between the two fixing plates (410).

6. The apparatus for automatically measuring the solder area on the pins of electronic components according to claim 5, characterized in that, A knob (430) is rotatably connected to the side wall of one of the fixing plates (410). A threaded rod (440) is installed on the side wall of the knob (430). The threaded rod (440) extends between the two fixing plates (410). A second threaded hole (450) is opened on the side wall of the clamping plate (420). The threaded rod (440) rotates through the second threaded hole (450). A second guide rod (460) is installed between the two fixing plates (410). A third guide groove (470) is opened on the side wall of the clamping plate (420). The second guide rod (460) passes through the third guide groove (470).

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