Integrated air duct structure

Abstract

The utility model belongs to the technical field of computer heat dissipation, and particularly relates to an integrated air duct structure which comprises a first box body and a second box body, the first box body is located at the top of the second box body, air inlet grooves are formed in the two sides of the second box body, the two sets of air inlet grooves are arranged at equal intervals, and a first installation frame is installed on the inner side of the second box body. The two first mounting frames correspond to each other, air inlet fans are arranged in the two first mounting frames, an exhaust groove is formed in the top of the second box body, a second mounting frame is mounted on the inner side of the second box body, an exhaust fan is mounted in the second mounting frame, a partition plate is mounted in the first box body, and the partition plate is located at the bottom of the exhaust fan. According to the integrated air duct structure, the air inlet fans of the CPU body and the GPU body are separated, each air inlet fan can independently suck external air into the first box body and the second box body and independently absorb heat generated by the CPU body and the GPU body, and the heat dissipation efficiency of the CPU body and the GPU body can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to computer heat dissipation technical field especially, relate to an integrated air duct structure. BACKGROUND

[0002] The integrated air duct structure in the computer interior refers to the design structure that fan, air duct, fin, radiator pipe and other elements in the computer are integrated together, and the computer interior needs heat dissipation, mainly because CPU, GPU and other components will generate a large amount of heat when working, if not heat dissipation in time, will influence the stability and life of computer, and the integrated air duct structure can make the air flow in the computer interior more stable and natural by integrating fan, air duct, fin and radiator pipe and other elements, reduce temperature, improve heat dissipation efficiency.

[0003] At present, the integrated air duct structure is generally through air inlet to enter external air when working, makes air flow through CPU and GPU, absorbs the heat of CPU and GPU, then hot air is discharged from the case by exhaust fan to realize heat dissipation, in practice, air inlet and air outlet are usually arranged on the same horizontal line, make air take out the heat generated by CPU and GPU from the case in turn, although this method is simple and fast, but the air is heated when passing through CPU or GPU in turn, so that the temperature of air is increased, and the heat interference caused by the heat of other hardware in the case is greater, thereby affecting the heat dissipation effect of the whole machine, therefore, it has the phenomenon of low heat dissipation efficiency, therefore, an integrated air duct structure is urgently needed to solve the above problems. UTILITY MODEL CONTENTS

[0004] In order to overcome the defects of the prior art pointed out above, the present inventors have made in-depth research, and after paying a lot of creative labor, the utility model is completed.

[0005] Specifically, the technical problem to be solved by the utility model is to provide an integrated air duct structure to solve the technical problem that the air is heated when passing through CPU or GPU in turn, so that the temperature of air is increased, and the heat dissipation efficiency is reduced.

[0006] To solve the above technical problems, the utility model provides the following technical scheme:

[0007] The utility model provides an integrated air duct structure, including first box body and second box body, first box body is located the top of second box body, both sides of second box body are provided with air inlet groove, two groups of air inlet groove are equidistantly arranged, the inboard of second box body is installed with first mounting frame, first mounting frame is equipped with two groups, and correspond mutually, two groups of first mounting frame all are equipped with air inlet fan in, the top of second box body is provided with air outlet groove, the inboard of second box body is installed with second mounting frame, the inside installation of second mounting frame has air outlet fan, the inside installation of first box body has the baffle, the baffle is located the bottom of air outlet fan.

[0008] As an improved technical solution, the inside of the first mounting frame is provided with a positioning bolt, the positioning bolt is equidistantly distributed at the four corners of the first mounting frame, and the first mounting frame is installed on the second box body through the positioning bolt.

[0009] As an improved technical solution, the top of the second box body is provided with a screw, the screws are equidistantly arranged, one end of the screw penetrates through the second box body and extends to the inside of the second mounting frame, and is screwed with it.

[0010] As an improved technical solution, the inside of the first box body is provided with a CPU body and a GPU body, the CPU body and the GPU body are respectively located on both sides of the baffle.

[0011] As an improved technical solution, the top of the CPU body and the GPU body is provided with a heat dissipation fin, the heat dissipation fins are equidistantly arranged, the inside of the heat dissipation fin is provided with a heat conducting rod, the heat conducting rods are equidistantly distributed at the four corners of the heat dissipation fin, and the two ends of the heat conducting rods are penetrated through the heat dissipation fins.

[0012] As an improved technical solution, the top of the heat dissipation fin and the heat conducting rod is provided with a third mounting frame, the inside of the third mounting frame is provided with a heat dissipation fan.

[0013] As an improved technical solution, one side of the first box body is provided with a dust screen.

[0014] After adopting the above technical scheme, the beneficial effects of the utility model are:

[0015] 1. The utility model discloses a baffle separates the CPU body from the GPU body, so that two air inlet fans can independently suck external air into the first box body and the second box body, and independently absorb the heat generated by the CPU body and the GPU body, thereby improving the heat dissipation efficiency of the CPU body and the GPU body.

[0016] 2. The utility model discloses, through the setting of integrated air duct, the air flow performance in the first box body and the second box body is optimized to the maximum extent, and then improves the heat dissipation effect, and also can be convenient for the maintenance and replacement of the air inlet fan and the exhaust fan.

[0017] 3. The utility model discloses, can eliminate the situation of sharing a cooling fan under the noise of cooling fan, and the noise is bigger, reduces the noise level of whole system, makes the use more comfortable. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed in the embodiment description will be briefly introduced, and obviously, the drawings in the following description are only some embodiments of the utility model, and for the ordinary skilled in the art, other drawings can be obtained according to these drawings without the creative labor. Wherein:

[0019] Figure 1 It is the whole structure schematic diagram of the utility model integrated air duct structure.

[0020] Figure 2 It is the whole explosion structure schematic diagram of the utility model integrated air duct structure.

[0021] Figure 3 It is the section structure schematic diagram of the utility model integrated air duct structure.

[0022] Figure 4 It is the second box body and the air inlet fan related explosion structure schematic diagram of the utility model.

[0023] Figure 5 It is the CPU body and the cooling fin related explosion structure schematic diagram of the utility model.

[0024] BRIEF DESCRIPTION OF DRAWINGS

[0025] 1, the first box body;2, the second box body;3, the air inlet groove;4, the first installation frame;5, the air inlet fan;6, the exhaust groove;7, the second installation frame;8, the exhaust fan;9, the positioning bolt;10, the screw;11, the partition;12, the CPU body;13, the GPU body;14, the cooling fin;15, the heat conduction rod;16, the third installation frame;17, the cooling fan;18, the dust screen. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications also change accordingly.

[0028] Meanwhile, "and / or" or "and / or" appearing in the entire text means that three schemes are included, taking "A and / or B" as an example, including A scheme, or B scheme, or A and B schemes are satisfied at the same time.

[0029] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person skilled in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0030] As Figures 1 to 5 As shown in the drawings, the embodiment provides an integrated air duct structure, which comprises a first box body 1 and a second box body 2, the first box body 1 is located at the top of the second box body 2, the second box body 2 is provided with an air inlet groove 3 on both sides, the two groups of air inlet grooves 3 are arranged at equal intervals, a first mounting frame 4 is mounted on the inner side of the second box body 2, the first mounting frame 4 is provided with two groups, and the two groups correspond to each other, an air inlet fan 5 is arranged in the two groups of first mounting frames 4, the first mounting frame 4 and the air inlet groove 3 are opposite to each other, so that the air inlet fan 5 can better suck external air into the second box body 2, and the first mounting frame 4 can facilitate the installation of the air inlet fan 5;

[0031] An air outlet groove 6 is formed in the top of the second box body 2, a second mounting frame 7 is mounted on the inner side of the second box body 2, and an air outlet fan 8 is mounted in the second mounting frame 7, so as to facilitate the discharge of the air after absorbing heat;

[0032] The first enclosure 1 has a partition 11 installed inside. The partition 11 is located at the bottom of the exhaust fan 8. The partition 11 can separate the CPU body 12 and the GPU body 13, so that the two can use their own heat dissipation structures. The partition 11 can also form an air duct between the first enclosure 1 and the second enclosure 2, preventing the outside air from getting hot directly, thereby improving the heat dissipation efficiency.

[0033] The first mounting frame 4 is equipped with positioning bolts 9 inside. The positioning bolts 9 are evenly distributed at the four corners of the first mounting frame 4. The first mounting frame 4 is installed on the second housing 2 by the positioning bolts 9. The positioning bolts 9 can be bolts or other locking structures, which facilitates the installation and disassembly of the first mounting frame 4, and thus facilitates the maintenance of the intake fan 5.

[0034] The top of the second housing 2 is provided with screws 10. The screws 10 are arranged at equal intervals. One end of the screw 10 passes through the second housing 2 and extends into the interior of the second mounting frame 7 and is threadedly connected to it, so as to facilitate the installation and disassembly of the second mounting frame 7, and thus facilitate the maintenance of the exhaust fan 8.

[0035] The first enclosure 1 houses the CPU unit 12 and the GPU unit 13, which are located on opposite sides of the partition 11. This separation prevents external air from carrying away the heat generated by the CPU unit 12 and the GPU unit 13. The one-to-one cooling method improves the heat dissipation efficiency of both units. In addition, this method eliminates the noise caused by sharing a cooling fan, which would otherwise result in greater noise. This reduces the overall noise level of the system and makes it more comfortable to use.

[0036] Both the CPU body 12 and the GPU body 13 are equipped with heat sinks 14 on their tops. The heat sinks 14 are arranged at equal intervals, and heat conduction rods 15 are installed inside the heat sinks 14. The heat conduction rods 15 are evenly distributed at the four corners of the heat sinks 14, and the two ends of the multiple sets of heat conduction rods 15 pass through the multiple sets of heat sinks 14. The evenly arranged heat sinks 14 are connected by four sets of heat conduction rods 15. The arrangement of the two can concentrate the heat generated by the CPU body 12 and the GPU body 13, so as to facilitate the heat dissipation of the two.

[0037] A third mounting frame 16 is installed on top of the heat dissipation fins 14 and the heat conduction rod 15. A cooling fan 17 is installed inside the third mounting frame 16 to facilitate the dissipation of concentrated heat. Figure 5 As shown, heat insulation rods are installed at the four corners of the third mounting frame 16 and are connected to the heat conduction rods 15 through the heat insulation rods, which facilitates the installation of the third mounting frame 16.

[0038] The first box body 1 is provided with a dust screen 18 on one side, which facilitates the air circulation between the first box body 1 and the second box body 2.

[0039] In use, the heat generated by the CPU body 12 and the GPU body 13 is transferred to the uppermost heat dissipation fins 14 through the heat dissipation fins 14 and the heat conduction rods 15, so that the heat generated by the CPU body 12 and the GPU body 13 can be concentrated, and the concentrated heat can be dissipated by starting the heat dissipation fan 17, and the external air is sucked into the first box body 1 and the second box body 2 by starting the two groups of air inlet fans 5, at this time, the external air can absorb the heat and be discharged out of the first box body 1 and the second box body 2 through the air outlet fan 8, in this process, the partition plate 11 can prevent the heat generated by the CPU body 12 and the GPU body 13 from mixing, and can prevent the external air from taking away the heat in turn, which can cause the phenomenon of low heat dissipation efficiency.

[0040] The CPU body 12 and the GPU body 13 are separated by the partition plate, so that the two groups of air inlet fans 5 can independently suck the external air into the first box body 1 and the second box body 2, and independently absorb the heat generated by the CPU body 12 and the GPU body 13, which can improve the heat dissipation efficiency of the CPU body 12 and the GPU body 13, and the hot air is discharged through the common air outlet fan 8, so that the entire case and the internal electronic devices are more stable and reliable.

[0041] In addition, the heat dissipation area of the CPU body 12 and the GPU body 13 can be expanded by the heat dissipation fins 14 and the heat dissipation fan 17, the heat dissipation effect of the CPU body 12 and the GPU body 13 can be enhanced, and the hardware temperature can be reduced;

[0042] By the arrangement of the air inlet fan 5 and the air outlet fan 8, fresh air can quickly enter the first box body 1 and the second box body 2, and hot air can be quickly discharged out of the first box body 1 and the second box body 2, so that the air flow is maintained unobstructed;

[0043] By the arrangement of the partition plate 11, the heat dissipation spaces of the CPU body 12 and the GPU body 13 can be separated, so that interference and influence between them can be avoided.

[0044] In summary, by the arrangement of the integrated air duct, the air circulation performance in the first box body 1 and the second box body 2 is optimized to the greatest extent, and the heat dissipation effect is improved.

[0045] It should be understood that the use of these embodiments is only for the purpose of illustrating the present application and is not intended to limit the protection scope of the present application. In addition, it should also be understood that after reading the technical content of the present application, those skilled in the art can make various modifications, modifications and / or variations to the present application, and all these equivalent forms also fall within the protection scope defined by the claims attached hereto.

Claims

1. An integrated air duct structure, characterized by: The utility model relates to a double -bank CPU and GPU cooling device, including first box body (1) with second box body (2), first box body (1) is located the top of second box body (2), both sides of second box body (2) are all set up with air inlet groove (3), two groups of air inlet groove (3) are all arranged at equal intervals, the inboard of second box body (2) is installed with first mounting frame (4), first mounting frame (4) is equipped with two groups, and mutually corresponds, two groups first mounting frame (4) all are equipped with air inlet fan (5) in, The top of the second box body (2) is provided with an air outlet slot (6), and the inner side of the second box body (2) is provided with a second mounting frame (7), and the inside of the second mounting frame (7) is provided with an exhaust fan (8); The inside of the first box body (1) is provided with a partition plate (11), and the partition plate (11) is located at the bottom of the exhaust fan (8).

2. The integrated air duct structure of claim 1, wherein: The inside of the first mounting frame (4) is provided with a positioning bolt (9), the positioning bolt (9) is distributed at equal intervals at the four corners of the first mounting frame (4), and the first mounting frame (4) is installed on the second box body (2) through the positioning bolt (9).

3. The integrated plenum structure of claim 2, wherein: The top of the second box body (2) is provided with a screw (10), the screw (10) is arranged at equal intervals, one end of the screw (10) penetrates the second box body (2) and extends to the inside of the second mounting frame (7), and is in threaded connection with it.

4. The integrated plenum structure of claim 3, wherein: The inside of the first box body (1) is provided with a CPU body (12) and a GPU body (13), the CPU body (12) and the GPU body (13) are located on the two sides of the partition plate (11) respectively.

5. The integrated plenum structure of claim 4, wherein: The top of the CPU body (12) and the GPU body (13) is provided with a heat dissipation fin (14), the heat dissipation fin (14) is arranged at equal intervals, the inside of the heat dissipation fin (14) is provided with a heat conduction rod (15), the heat conduction rod (15) is distributed at equal intervals at the four corners of the heat dissipation fin (14), and the two ends of the heat conduction rod (15) penetrate the heat dissipation fin (14).

6. The integrated plenum structure of claim 5, wherein: The top of the heat dissipation fin (14) and the heat conduction rod (15) is provided with a third mounting frame (16), and the inside of the third mounting frame (16) is provided with a heat dissipation fan (17).

7. The integrated air duct structure of claim 1, wherein: One side of the first box body (1) is provided with a dust screen (18).

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