Heat dissipation device

Abstract

The utility model discloses a heat dissipation device which comprises a vapor chamber, at least one second pipe body and a fin structure, the vapor chamber comprises a heat conduction shell and at least one first pipe body, and one end of the at least one first pipe body is connected to the heat conduction shell; the at least one second pipe body is arranged on the top surface of the heat conduction shell; the fin structure is arranged on the top surface of the heat conduction shell and covers the second pipe body; after absorbing heat, the heat conduction shell disperses the heat to the fin structure through the first pipe body and the second pipe body and then discharges the heat.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation device, especially a heat dissipation device using three-dimensional structure for multi-directional heat conduction. BACKGROUND

[0002] With the rapid development of information, artificial intelligence (AI), cloud computing, and high-speed computing are the top priorities to enhance user experience and efficiency, and have a profound impact on benefiting the general public. In particular, servers are increasingly widely used in image processing, scientific analysis, and high-speed computing. The most well-known AI function is ChatGPT. However, servers generate a large amount of heat during operation, which poses a significant risk to CPU and GPU chips, such as frequency reduction and burning, leading to unstable operation or shutdown of AI cloud computing performance. In addition, high internal temperatures in servers not only affect the performance of CPUs, GPUs, motherboards, and hard drives, but also can cause internal component damage and even system crashes and other serious consequences. How to ensure stable operation and prolong the service life of high-end servers has become a problem that needs to be solved.

[0003] According to the requirements of stable and efficient operation of servers, air-cooled heat dissipation modules are a suitable solution. Advantages include: 1. Lower cost: Compared to liquid cooling systems, air-cooled heat dissipation modules have relatively lower material and maintenance costs and longer service life. 2. Easy installation and maintenance: simple structure, easy installation, and convenient maintenance, without the need for regular replacement of cooling liquid. 3. High reliability: No liquid involved, avoiding the risk of hardware damage caused by water leakage or conductive liquid leakage in liquid cooling systems. 4. Lower energy consumption: High-efficiency design provides sufficient cooling effect while maintaining relatively low energy consumption. 5. Strong adaptability: can adapt to different server designs and environments without the need for server modification. 6. Plug and play: most air-cooled heat dissipation modules are plug-and-play solutions that do not require special configuration or additional cooling infrastructure. These advantages make air-cooled heat dissipation modules a common and economical choice for server cooling solutions, preventing server overheating, ensuring efficient operation of information equipment, improving overall system performance and reliability, and meeting the needs of the industry. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of heat dissipation device, to be able to help server to keep in lower operating temperature range by more effective heat dissipation, reduce overheating risk, improve system stability and life.

[0005] One embodiment of the utility model discloses a heat dissipation device, comprising:

[0006] The uniform temperature plate comprises a heat-conducting shell and at least one first pipe body, one end of the at least one first pipe body being connected to the heat-conducting shell;

[0007] at least one second pipe body disposed on the top surface of the heat-conductive shell;

[0008] a fin structure disposed on the top surface of the heat-conductive shell and covering the second pipe body;

[0009] wherein the heat-conductive shell absorbs heat and disperses the heat to the fin structure through the first pipe body and the second pipe body.

[0010] The heat dissipation device of claim 1, wherein the heat-conductive shell has an air-tight chamber, one end of the first pipe body communicates with the air-tight chamber, the air-tight chamber contains liquid cooling fluid, and the other end of the first pipe body penetrates the fin structure.

[0011] The heat dissipation device of claim 1, wherein the bottom of the fin structure has at least one accommodating channel corresponding to at least one second pipe body, and the second pipe body is correspondingly located in the accommodating channel.

[0012] The heat dissipation device of claim 1, wherein the fin structure comprises:

[0013] a first fin group disposed on the top surface of the heat-conductive shell, the bottom of the first fin group having at least one accommodating channel;

[0014] a second fin group disposed on the first fin group, the first fin group and the second fin group having at least one penetrating channel, and the other end of each first pipe body penetrating the penetrating channels of the first fin group and the second fin group at the same time.

[0015] The heat dissipation device of claim 1, wherein the top of the second fin group has a recess, and the first fin group is arranged in the recess.

[0016] The heat dissipation device of claim 1, wherein the fin channel of the first fin group and the fin channel of the second fin group have different mounting directions.

[0017] The heat dissipation device of claim 1, further comprising at least one reinforcing rib disposed on the bottom surface of the heat-conductive shell, and the bottom surface of the reinforcing rib is flush with the bottom surface of the heat-conductive shell.

[0018] The heat dissipation device of claim 1, wherein the bottom surface of the heat-conductive shell has a protruding portion as a core heat dissipation area, and the heat dissipation device further comprises a heat-conductive block disposed on the protruding portion.

[0019] The heat dissipation device of claim 1, further comprising a fixing seat connected to the reinforcing rib by at least one first fixing member.

[0020] The heat dissipation device of claim 1, wherein the fixing seat comprises:

[0021] a top plate, mounted on the reinforcing rib through the first fixing member and having a top surface thereof abutting against a bottom surface of the reinforcing rib and a bottom surface of the heat-conducting shell;

[0022] a protective cover, mounted on a bottom surface of the top plate and covering the protruding portion and the heat-conducting block;

[0023] an intermediate plate, abutting against a bottom surface of the protective cover;

[0024] a mounting frame, mounted on a bottom surface of the intermediate plate;

[0025] a bottom plate, arranged at a lower portion of the mounting frame and connected to the first fixing member;

[0026] wherein the heat-conducting shell, the reinforcing rib, the top plate, the intermediate plate and the bottom plate are connected into an integrated whole through the first fixing member penetrating through the heat-conducting shell, the reinforcing rib, the top plate, the intermediate plate and the bottom plate.

[0027] The heat dissipation device described above, further comprising: a second fixing member, penetrating through the heat-conducting shell, the top plate, the intermediate plate and the mounting frame to connect the heat-conducting shell, the top plate, the intermediate plate and the mounting frame into an integrated whole.

[0028] The heat dissipation device described above, wherein one end of the second fixing member further penetrates through the first fin group.

[0029] The heat dissipation device according to the above-mentioned embodiments not only utilizes the phase change heat exchange of vapor to quickly and evenly distribute and dissipate heat, thereby improving the heat dissipation efficiency and being suitable for high-heat-density servers; at the same time, the three-dimensional structure effectively disperses high temperature, thereby keeping the temperature of the server uniform and reducing hot spots; in addition, compared with traditional heat dissipation modules, the heat dissipation device occupies less space, which is helpful for the compact design and weight control of the server system; furthermore, due to the high heat dissipation efficiency and compactness, the heat dissipation device is suitable for use in high-performance computing servers, data centers and edge computing devices and the like.

[0030] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the principle of the present application, and provide further explanation of the patent application scope of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a perspective view of a heat dissipation device according to the first embodiment of the present application from one angle.

[0032] Figure 2 is a perspective view of a heat dissipation device according to the first embodiment of the present application from another angle. is a perspective view of a heat dissipation device according to the first embodiment of the present application from another angle.

[0033] Figure 3 Fig. 1 is an exploded schematic view of a heat dissipation device according to a first embodiment of the present application. Figure 1

[0034] Figure 4 Fig. 2 is a schematic view of the heat dissipation device according to the first embodiment of the present application.

[0035] Figure 5 Fig. 3 is a partially exploded schematic view of the heat dissipation device according to the first embodiment of the present application. Figure 4

[0036] In the drawings, reference numerals:

[0037] Heat dissipation device: 1;

[0038] Vapor chamber: 11;

[0039] Thermally conductive shell: 111;

[0040] First pipe body: 112;

[0041] Second pipe body: 12;

[0042] Fin structure: 13;

[0043] First fin group: 131;

[0044] Second fin group: 132;

[0045] Accommodating passage: T1;

[0046] Through passage: T2;

[0047] Recess: C;

[0048] Fin passage: T3;

[0049] Mounting direction: F1;

[0050] Mounting direction: F2;

[0051] Stiffening rib: 14;

[0052] Protrusion: P;

[0053] Thermally conductive block: 15;

[0054] Fixing seat: 16;

[0055] Top plate: 161;

[0056] Protective cover: 162;

[0057] Intermediate plate: 163;

[0058] Mounting frame: 164;

[0059] Bottom plate: 165;​​

[0060] Opening: K;

[0061] First fastener: 17;

[0062] Second fastener: 18;

[0063] Elastic component: 19. Detailed Implementation

[0064] Please see Figures 1 to 3 . Figure 1 This is a perspective view of the heat dissipation device according to the first embodiment of the present invention. Figure 2 This is a perspective view of the heat dissipation device according to the first embodiment of the present invention. Figure 3 for Figure 1 An exploded view of the heat dissipation device. (See diagram below.) Figures 1 to 3 As shown, a heat dissipation device 1 of this utility model includes: a heat spreader 11, at least one second tube 12, and a fin structure 13. The heat spreader 11 includes: a heat-conducting shell 111 and at least one first tube 112, one end of the at least one first tube 112 being connected to the heat-conducting shell 111; at least one second tube 12 being mounted on the top surface of the heat-conducting shell 111; and the fin structure 13 being mounted on the top surface of the heat-conducting shell 111 and covering the second tube 12. The heat-conducting shell 111 absorbs heat and then disperses the heat to the fin structure 13 through the first tube 112 and the second tube 12 before dissipating it.

[0065] The heat-conducting shell 111 has an airtight chamber S. One end of the first tube 112 is connected to the airtight chamber, which is used to contain liquid cooling fluid. The other end of the first tube 112 extends out of the fin structure 13. The bottom of the fin structure 13 has at least one receiving channel T1 corresponding to at least one second tube 12, and the second tube 12 is correspondingly located in the receiving channel T1.

[0066] Further, the fin structure 13 includes: a first fin group 131 and a second fin group 132. The first fin group 131 is mounted on the top surface of the heat-conducting shell 111, and the bottom of the first fin group 131 has at least one accommodating channel T1. The second fin group 132 is mounted on the first fin group 131, and the first fin group 131 and the second fin group 132 have at least one through channel T2. The other end of each of the first tubes 112 simultaneously passes through the through channel T2 of the first fin group 131 and the second fin group 132.

[0067] The second fin group 132 has a recessed portion C at its top, and the first fin group 131 is disposed in the recessed portion C.

[0068] It should be noted that in the embodiment, the mounting direction of the fin channels T3 of the first fin group 131 is different from the mounting direction of the fin channels T3 of the second fin group 132, and specifically, in the embodiment, the mounting direction F1 of the fin channels T3 of the first fin group 131 is perpendicular to the mounting direction F2 of the fin channels T3 of the second fin group 132, but the utility model is not limited thereto.

[0069] Further, the heat dissipation device 1 further comprises at least one reinforcing rib 14, the reinforcing rib 14 is arranged on the bottom surface of the heat conduction shell 111 and located at both sides of the heat conduction shell 111, the bottom surface of the reinforcing rib 14 is flush with the bottom surface of the heat conduction shell 111, in the embodiment, the reinforcing rib is connected to the bottom surface of the heat conduction shell 111 by welding, the reinforcing rib 14 is welded to enhance the rigidity of the bottom of the heat conduction shell 111, and the risk of bottom expansion is reduced; the bottom surface of the heat conduction shell 111 has a protruding part P as a core heat dissipation area, and the heat dissipation device further comprises a heat conduction block 15, the heat conduction block 15 is arranged on the protruding part P.

[0070] Please refer to Figures 4-5 . Figure 4 It is a perspective view of the heat dissipation device according to the second embodiment of the utility model. Figure 5 It is Figure 4 a partial exploded view of the heat dissipation device. As Figures 4-5 shown, the heat dissipation device 1 of the utility model further comprises a fixing seat 16 connected to the reinforcing rib 14 by at least one first fixing member 17.

[0071] The fixing seat 16 comprises a top plate 161, a protective cover 162, an intermediate plate 163, a mounting frame 164 and a bottom plate 165, the top plate 161 is arranged on the reinforcing rib 14 by the first fixing member 17, and the top surface of the top plate 161 is attached to the bottom surface of the reinforcing rib 14 and the bottom surface of the heat conduction shell 111; the protective cover 152 is arranged on the bottom surface of the top plate 161 and covers the protruding part P and the heat conduction block 15; the intermediate plate 163 is attached to the bottom surface of the protective cover 162; the mounting frame 164 is arranged on the bottom surface of the intermediate plate 163; the bottom plate 165 is arranged at the lower part of the mounting frame 164 and connected to the first fixing member 17; wherein the first fixing member 17 is threaded through the heat conduction shell 111, the reinforcing rib 14, the top plate 161, the intermediate plate 163 and the bottom plate 165 to connect the reinforcing rib 14, the top plate 161, the intermediate plate 163 and the bottom plate 165 into one body.

[0072] It is worth noting that in the present embodiment, the top plate 161 has an opening portion K through which the protruding portion P and the heat-conducting block 15 are exposed.

[0073] Further, the heat dissipation device 1 further comprises a second fixing member 18, which is threaded through the heat-conducting shell 111, the top plate 161, the intermediate plate 163 and the mounting frame 164 to connect the heat-conducting shell 111, the top plate 161, the intermediate plate 163 and the mounting frame 164 into an integrated whole, one end of the second fixing member 18 further passes through the first fin group 131, and specifically in the present embodiment, one end of the second fixing member 18 passes through the first fin group 131, the heat-conducting shell 111, the top plate 161 and the intermediate plate 163 on one side and is connected to the bottom plate 165, thereby connecting the heat-conducting shell 111, the top plate 161, the intermediate plate 163 and the mounting frame 164 into an integrated whole.

[0074] Further, the heat dissipation device 1 further comprises a plurality of elastic members 19, which are respectively sleeved on the first fixing member 17 and the second fixing member 18.

[0075] In another embodiment of the present application, the first pipe body is provided with a first capillary structure and / or the second pipe body is provided with a first capillary structure.

[0076] In still another embodiment of the present application, the heat-conducting shell is provided with a third capillary structure, and specifically, in the process of processing the vapor chamber 11, the heat-conducting shell 111 is filled with powder to the joint of the first pipe body 112, the powder of the pipe wall of the first pipe body 112 is connected, and then the heat-conducting shell 111 is welded and connected with the first pipe body 112.

[0077] According to the heat dissipation device of the above-mentioned embodiments, the three-dimensional structure is used to effectively disperse the heat from the heat source to each structure of the heat dissipation module, so that the heat dissipation module is uniformly heated, the heat source is uniformly transmitted, the internal temperature of the server is uniform and not overheated, and it is especially suitable for solving the heat dissipation demand of 1350W and above.

[0078] Although the present application is disclosed as above with the above-mentioned embodiments, it is not intended to limit the present application, and any person skilled in the art can make some changes and decorations without departing from the spirit and scope of the present application, so the patent protection scope of the present application should be defined by the protection scope of the claims attached to the present application.

Claims

1. A heat dissipating device, characterized by, A heat sink includes a heat-conductive shell and at least one first pipe body, one end of the at least one first pipe body being connected to the heat-conductive shell; at least one second pipe body being arranged on a top surface of the heat-conductive shell; a fin structure being arranged on the top surface of the heat-conductive shell and covering the second pipe body; wherein the heat-conductive shell absorbs heat and then disperses the heat to the fin structure through the first pipe body and the second pipe body, and the bottom of the fin structure has at least one accommodating channel corresponding to the at least one second pipe body, and the second pipe body is correspondingly located in the accommodating channel. The heat-conductive shell has an airtight chamber, one end of the first pipe body being communicated with the airtight chamber, the airtight chamber being used to contain liquid cooling fluid, and the other end of the first pipe body penetrating the fin structure. The fin structure includes a first fin group arranged on the top surface of the heat-conductive shell, the bottom of the first fin group having at least one accommodating channel; and a second fin group arranged on the first fin group, the first fin group and the second fin group having at least one penetrating channel, and the other end of each first pipe body penetrating the penetrating channels of the first fin group and the second fin group at the same time. The top of the second fin group has a recess, and the first fin group is arranged in the recess. The fin channels of the first fin group and the fin channels of the second fin group have different mounting directions.

2. The heat dissipating device of claim 1, wherein The heat sink further includes at least one reinforcing rib arranged on the bottom surface of the heat-conductive shell, and the bottom surface of the reinforcing rib is flush with the bottom surface of the heat-conductive shell.

3. The heat dissipating device of claim 2, wherein The bottom surface of the heat-conductive shell has a protruding part as a core heat dissipation area, and the heat dissipation device further includes a heat-conductive block arranged on the protruding part. The heat sink further includes a fixing seat connected to the reinforcing rib through at least one first fixing member. The fixing seat includes a top plate arranged on the reinforcing rib through the first fixing member and having a top surface abutting the bottom surface of the reinforcing rib and the bottom surface of the heat-conductive shell; a protection cover arranged on the bottom surface of the top plate and covering the protruding part and the heat-conductive block; an intermediate plate abutting the bottom surface of the protection cover; a mounting frame arranged on the bottom surface of the intermediate plate; and a bottom plate arranged at the lower part of the mounting frame and connected to the first fixing member; wherein the first fixing member penetrates the heat-conductive shell, the reinforcing rib, the top plate, the intermediate plate, and the bottom plate to connect the heat-conductive shell, the reinforcing rib, the top plate, the intermediate plate, and the bottom plate into one body.

4. The heat dissipating device of claim 3, wherein The heat sink further includes a second fixing member penetrating the heat-conductive shell, the top plate, the intermediate plate, and the mounting frame to connect the heat-conductive shell, the top plate, the intermediate plate, and the mounting frame into one body.

5. The heat dissipating device of claim 3, wherein One end of the second fixing member further penetrates the first fin group.

6. The heat dissipating device of claim 3, wherein ​ 7. The heat dissipating device of claim 6, wherein ​ 8. The heat dissipating device of claim 7, wherein ​ 9. The heat dissipating device of claim 8, wherein ​ ​ ​ ​ ​ ​ ​ 10. The heat dissipating device of claim 9, wherein ​ ​ 11. The heat dissipating device of claim 10, wherein ​

Images