Heat dissipation structure of plastic shell of notebook computer
By designing heat dissipation structures in the top shell, side shell, and bottom plate of the laptop casing, airflow channels are formed, solving the problem of poor heat dissipation in the laptop casing, achieving efficient heat dissipation of the motherboard, and improving the stability and lifespan of the device.
Patent Information
- Application Number
- CN202520349797.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-03-03
AI Technical Summary
Existing laptop casings are inefficient at dissipating heat, especially from the motherboard, which affects the stability and lifespan of the device.
A heat dissipation structure including a top shell, side shells and a bottom plate is designed. The top shell and side shells are provided with keyboard slots, touch slots, side air vents and cross air vents. The bottom plate is provided with a protrusion and an inverted platform-shaped top post. Together with the motherboard installation, they form an airflow channel for efficient heat dissipation.
It achieves efficient heat dissipation for the laptop motherboard, improving the stability and lifespan of the device, while its simple structure makes it easy to assemble.
Smart Images

Figure CN223784701U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to notebook computer technical field, concretely is a notebook computer plastic shell's heat radiation structure. BACKGROUND
[0002] The notebook computer shell is a component for assembling notebook computers, with the development of society and the progress of science and technology, the existing notebook computer shell already can not satisfy the need of people, people need a kind of can improve the heat dissipation performance of shell, can improve the stability of shell, so that the protective performance is better notebook computer shell;
[0003] In the application book with patent application number 202020021667.0, a notebook computer shell with heat dissipation structure is disclosed, which comprises an upper shell, a lower shell is arranged on the lower end outer surface of the upper shell, a heat dissipation plate is fixedly installed on the front end outer surface of the upper shell, a plurality of groups of cable jacks are arranged on the upper end outer surface of the upper shell, a side anti-collision beam is fixedly installed on the outer surface of one side of the lower shell, two groups of buffers are fixedly installed on the inner side outer surface of the side anti-collision beam, a fixing frame is fixedly installed on the inner bottom end outer surface of the lower shell, a placing table is fixedly installed on the upper end outer surface of the fixing frame, a fixed plate is fixedly installed on the inner side outer surface of the fixing frame, and a cooling pipe is arranged on the upper end outer surface of the fixed plate. The notebook computer shell with heat dissipation structure disclosed in the utility model is provided with a heat dissipation plate, a side anti-collision beam and a heat dissipation fan and other components, which can improve the heat dissipation performance of the shell, improve the stability of the shell, make the protective performance better, and bring better use prospect;
[0004] The above application file realizes corresponding heat dissipation through the arrangement of the inner structures, and the heat generating structures inside the existing notebook shell mainly include the mainboard and the CPU thereon. When the mainboard and the CPU work for a long time, the temperature rises. How to use the shell structure to efficiently dissipate heat has become a problem to be solved.
[0005] Therefore, we propose a notebook computer plastic shell heat dissipation structure. Utility model content
[0006] In view of the defects of the prior art, the utility model provides a notebook computer plastic shell heat dissipation structure, which solves the problem that the existing device cannot efficiently cool the notebook mainboard according to the demand.
[0007] To achieve the above purpose, the utility model realizes the following technical scheme: a notebook computer plastic shell heat dissipation structure, comprising a shell body assembled with a notebook mainboard, a bottom plate is clamped on the bottom side of the shell body;
[0008] The shell comprises a top shell and a side shell, the top shell is provided with a keyboard slot for accommodating keyboard keys, and the top shell is also provided with a touch slot for clamping a touch position;
[0009] The side shell is provided with a side air slot and a horizontal air slot, and the top of the bottom plate is press-fitted with a mainboard between the top shell and the shell.
[0010] As a preferred scheme of the utility model, the bottom of the bottom plate is fixedly installed with four groups of convex seats for supporting the bottom plate;
[0011] The convex seats are arranged to stably support the bottom plate and the shell from the bottom side, thereby ensuring the supporting effect.
[0012] As a preferred scheme of the utility model, the top of the bottom plate is fixedly installed with top columns in a filling shape, the top columns are inverted table-shaped columns, the top columns are made of rubber, and the top surface of the top column is press-fitted on the bottom surface of the mainboard.
[0013] The top columns are arranged to correspondingly support the mainboard from the bottom side, and the bottom side of the mainboard is reserved with an airflow channel to transmit the high-temperature hot air outward, thereby realizing efficient heat dissipation and cooling.
[0014] As a preferred scheme of the utility model, the side shell of the shell is an inwardly inclined rectangular shell, and the side wall of the shell is provided with a plug sleeve matched with the position specification of the mainboard connector.
[0015] The plug sleeve is arranged to ensure the connection effect of the mainboard, so that the mainboard can normally work.
[0016] As a preferred scheme of the utility model, the side wall of the side shell of the shell is provided with side air slots in an inclined and spaced distribution, and the lower half of the side air slots is located between the mainboard and the bottom plate.
[0017] The side air slots are arranged to output the high-temperature hot air from both sides, thereby ensuring the heat dissipation effect.
[0018] As a preferred scheme of the utility model, the front and rear walls of the side shell of the shell are provided with horizontal air slots in a vertical and spaced distribution, and the lower half of the horizontal air slots is located between the mainboard and the bottom plate.
[0019] The horizontal air slots are arranged to efficiently output the high-temperature airflow inside from the front and rear sides, thereby further ensuring the heat dissipation effect.
[0020] The utility model provides a notebook computer plastic shell's heat dissipation structure. Have the following beneficial effects:
[0021] The notebook computer plastic shell heat dissipation structure, through the setting of the shell and the bottom plate structure, is convenient for outputting the high-temperature airflow generated by the long-time work of the motherboard between them, so that the high-efficiency heat dissipation and cooling effect of the motherboard on the inner side is achieved, and meanwhile, the structure is simple and suitable for assembly, and the problem that the existing device is difficult to efficiently cool the notebook motherboard according to the requirement is solved. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a structure schematic view of the utility model;
[0023] Figure 2 It is a structure schematic view of the bottom side of the utility model;
[0024] Figure 3 It is a structure schematic view of the shell of the utility model;
[0025] Figure 4 It is a structure schematic view of the bottom plate of the utility model.
[0026] In the drawing: 1, shell; 2, bottom plate; 21, boss; 22, top column; 11, keyboard slot; 12, touch slot; 13, side wind slot; 14, horizontal wind slot; 15, plug sleeve. DETAILED DESCRIPTION
[0027] The technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.
[0028] Please refer to Figures 1-4 The utility model embodiment provides a kind of technical scheme: a notebook computer plastic shell heat dissipation structure, including the shell 1 of assembly notebook motherboard, the bottom plate 2 of the bottom side of shell 1 is clamped;Shell 1 includes top shell and edge shell, top shell is equipped with keyboard slot 11 of keyboard key position, and top shell is also provided with the touch slot 12 for clamping touch position;Edge shell is equipped with side wind slot 13 and horizontal wind slot 14, and the top of bottom plate 2 is pressed and equipped with motherboard between it and the top shell of shell 1;
[0029] Wherein, the notebook computer plastic shell heat dissipation structure, through the setting of shell 1 and bottom plate 2 structure, it is convenient for outputting the high-temperature airflow generated by the long-time work of the motherboard between them, so that the high-efficiency heat dissipation and cooling effect of the motherboard on the inner side is achieved, and meanwhile, the structure is simple and suitable for assembly, and the problem that the existing device is difficult to efficiently cool the notebook motherboard according to the requirement is solved.
[0030] Embodiment 2:
[0031] The bottom of the bottom plate 2 is fixedly provided with four groups of convex seats 21 for supporting the bottom plate 2; the convex seats 21 are arranged to stably support the bottom plate 2 and the shell 1 from the bottom side, and ensure the supporting effect.
[0032] The top of the bottom plate 2 is fixedly provided with top columns 22 arranged in a filling manner, the top columns 22 are inverted table-shaped columns, the top columns 22 are made of rubber, and the top surfaces of the top columns 22 are press-fitted on the bottom surface of the main plate; the top columns 22 are arranged to correspondingly support the main plate from the bottom side, and the airflow channels are reserved on the bottom side of the main plate, the high-temperature hot air in the airflow channels is transmitted outward, and efficient heat dissipation and cooling are realized.
[0033] The middle side shell of the shell 1 is an inwardly inclined rectangular shell, and the side wall of the shell 1 is provided with plug sleeves 15 matched with the connection head position specifications of the main plate; the plug sleeves 15 are arranged to ensure the connection effect of the main plate, so that the main plate can normally work.
[0034] The side wall of the middle side shell of the shell 1 is provided with side air grooves 13 arranged in an inclined and spaced manner, and the lower half of the side air grooves 13 is located between the main plate and the bottom plate 2; the side air grooves 13 are arranged to output the high-temperature hot air from both sides, and ensure the heat dissipation effect.
[0035] The front and rear walls of the middle side shell of the shell 1 are provided with horizontal air grooves 14 arranged in a vertical and spaced manner, and the lower half of the horizontal air grooves 14 is located between the main plate and the bottom plate 2; the horizontal air grooves 14 are arranged to efficiently output the high-temperature airflow in the horizontal air grooves 14 from the front and rear sides, and further ensure the heat dissipation effect.
[0036] The working principle and use process of the utility model are as follows: when the device needs to work, the main plate is placed on the top side of the top columns 22 in the bottom plate 2, and the shell 1 is clamped on the main plate, the protective assembly of the main plate is realized, when the device works, due to the arrangement of the top columns 22, the corresponding airflow channels are formed on the bottom side of the main plate, and the arrangement of the side air grooves 13 and the horizontal air grooves 14 on the upper side of the middle side shell of the shell 1 can efficiently output the high-temperature airflow, so that efficient heat dissipation of the notebook main plate is realized.
[0037] The basic principle and main features of the present application and the advantages of the present application are shown and described above, for those skilled in the art, obviously the present application is not limited to the details of the above exemplary embodiments, and can be realized in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, the scope of the present application is defined by the appended claims rather than the above description, therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be considered as limiting the claims involved.
[0038] In addition, it should be understood that, although the present application is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that those skilled in the art can understand.
Claims
1. A heat dissipation structure for a laptop computer's plastic casing, characterized in that: Includes a housing (1) on which a notebook motherboard is assembled, and a base plate (2) is snapped onto the bottom side of the housing (1); The housing (1) includes a top shell and a side shell. The top shell has a keyboard slot (11) for mounting keyboard keys and a touch slot (12) for mounting touch positions. The side shell is provided with a side air groove (13) and a cross air groove (14), and the top of the bottom plate (2) is press-fitted with a main plate located between it and the top shell in the housing (1).
2. The heat dissipation structure for a laptop plastic casing according to claim 1, characterized in that: The bottom of the base plate (2) is fixedly equipped with four sets of bosses (21) for supporting it.
3. The heat dissipation structure for a laptop plastic casing according to claim 2, characterized in that: The top of the base plate (2) is fixedly installed with top columns (22) distributed in a filling pattern. The top columns (22) are inverted platform columns. The top columns (22) are made of rubber, and the top surface of the top columns (22) is pressed onto the bottom surface of the main plate.
4. The heat dissipation structure for a laptop plastic casing according to claim 1, characterized in that: The housing (1) has an inwardly inclined rectangular shell as the side shell, and the side wall of the housing (1) is provided with a socket (15) that is compatible with the position and specifications of the motherboard connector.
5. The heat dissipation structure for a laptop plastic casing according to claim 4, characterized in that: The sidewall of the shell (1) is provided with side air grooves (13) that are distributed in an inclined manner, and the lower half of the side air grooves (13) is located between the main plate and the bottom plate (2).
6. The heat dissipation structure for a laptop plastic casing according to claim 5, characterized in that: The shell (1) has vertically spaced horizontal wind grooves (14) on the front and rear walls of the side shell, and the lower half of the horizontal wind grooves (14) is located between the main plate and the bottom plate (2).
Citation Information
Patent Citations
Notebook computer shell with heat dissipation structure
CN211529039U