Double-frequency continuous double-ring microstrip antenna

Abstract

The utility model discloses a double-frequency continuous double-ring microstrip antenna, relates to the technical field of satellite positioning antennas, and aims to provide a novel multimode satellite positioning antenna, which comprises a circuit board, and a feed pad, a first-stage connecting surface, a high-frequency radiation ring, a second-stage connecting surface and a low-frequency radiation ring which are arranged on the circuit board, the feed pad, the primary connecting surface, the high-frequency radiation ring, the secondary connecting surface and the low-frequency radiation ring are communicated in sequence, the antenna adopts an FR4 material double-sided copper-clad PCB with stable performance as a circuit board, metal radiation carriers are carried on the upper surface and the lower surface of the PCB, and the feed pad, the primary connecting surface, the high-frequency radiation ring, the secondary connecting surface and the low-frequency radiation ring are connected in sequence. And through the connection of a plurality of densely arranged copper-clad via holes, the effect of a similar snakelike line structure is achieved, and the area of two sides of the circuit board is fully utilized to achieve the miniaturization effect.

Description

Technical Field

[0001] This utility model relates to the field of satellite positioning antenna technology, and more specifically, it relates to a dual-frequency continuous dual-ring microstrip antenna. Background Technology

[0002] With the rapid development of satellite navigation technology, multi-mode satellite positioning antennas are playing an increasingly important role in various application scenarios. Currently, commercially available multi-mode satellite positioning antennas mainly use multilayer polytetrafluoroethylene glass cloth, high-frequency plastics, or alumina ceramics as substrate materials. These materials are widely used due to their excellent electrical and mechanical properties. Meanwhile, the radiating surface of the antenna is usually covered with metals such as silver or copper to improve its radiation efficiency and signal reception capability.

[0003] However, this traditional antenna manufacturing process and material selection have some inherent problems. First, while multilayer polytetrafluoroethylene glass cloth, high-frequency plastics, or alumina ceramics as substrate materials have good electrical and mechanical properties, their size and weight are relatively large, which is not conducive to the lightweighting and miniaturization of antennas. Second, while coating the surface with metals such as silver or copper can improve the antenna's radiation efficiency, the more metal covering there is, the higher the manufacturing cost of the antenna will be, which is difficult to meet the demand for low-cost manufacturing.

[0004] In view of the problems existing in the prior art, this utility model proposes a novel multimode satellite positioning antenna, which aims to achieve lightweight, miniaturized and low-cost manufacturing of the antenna. Utility Model Content

[0005] In view of the problems existing in the prior art, this utility model provides a dual-frequency continuous dual-loop microstrip antenna to solve the technical problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a dual-frequency continuous dual-ring microstrip antenna, comprising a circuit board, a feed pad, a primary connection surface, a high-frequency radiating ring, a secondary connection surface, and a low-frequency radiating ring. The primary connection surface is located in the middle of the bottom surface of the circuit board. The feed pad is located on the top surface of the circuit board and lies within the vertical projection of the primary connection surface. The feed pad is connected to the primary connection surface via a first copper via. The high-frequency radiating ring is located on the top surface of the circuit board, and its inner ring overlaps with the vertical projection of the primary connection surface. This overlapping area has a second copper via for connecting the high-frequency radiating ring and the primary connection surface. The low-frequency radiating ring is located on the top surface of the circuit board. The secondary connection surface is located on the bottom surface of the circuit board, and its inner ring is spaced a certain distance from the primary connection surface. The inner ring of the secondary connection surface overlaps with the vertical projection of the outer ring of the high-frequency radiating ring and is connected via a third copper via. The inner ring of the secondary connection surface overlaps with the vertical projection of the inner ring of the low-frequency radiating ring and is connected via a fourth copper via.

[0007] The present invention is further configured as follows: the dual-frequency continuous dual-ring microstrip antenna also includes a choke-coupled arc-shaped microstrip line, which is located at the outermost part of the top surface of the circuit board.

[0008] The present invention is further configured such that the choke-coupled arc-shaped microstrip line has several components.

[0009] The present invention is further configured such that the middle part of the choke-coupled arc-shaped microstrip line has a grounded copper via.

[0010] The present invention is further configured such that the circuit board is a double-sided copper-clad PCB made of FR4 material.

[0011] The present invention is further configured such that the power feeding pads are of several kinds, and are all arranged at equal intervals along the circumference of the circuit board on the top surface of the circuit board.

[0012] The present invention is further configured such that the third copper-clad via is provided in a plurality of manner, and each of them corresponds one-to-one with a plurality of power-feed pads.

[0013] The present invention is further configured such that the circuit board has integrated fixing through holes for fixing the circuit board.

[0014] The present invention is further configured such that the circuit board has a spare power supply via.

[0015] Compared with the prior art, this utility model provides a dual-frequency continuous dual-loop microstrip antenna, which has the following beneficial effects:

[0016] 1. The antenna uses a stable FR4 material double-sided copper-clad PCB as the circuit board. Metal radiating carriers are mounted on the top and bottom sides. The primary connection surface is connected to the high-frequency radiation ring, and the secondary connection surface is connected to the low-frequency radiation ring through multiple densely arranged copper-clad vias to achieve a serpentine line structure effect, making full use of the area on both sides of the circuit board to achieve miniaturization.

[0017] 2. The high-frequency radiation ring and the secondary connection surface are connected by a small number of copper vias distributed at the same angle as the power feed pad, achieving a similar power feed point effect. This effectively reduces the need for additional power feed point settings while increasing bandwidth.

[0018] 3. Multiple grounded choke-coupled arc-shaped microstrip lines are set at the outermost position of the circuit board and are close to the low-frequency radiation ring. While achieving a certain degree of resistance to multipath effects, they are coupled with the low-frequency radiation ring to increase the bandwidth.

[0019] 4. The primary connecting surface, the high-frequency radiation ring, the secondary connecting surface, and the low-frequency radiation ring all have overlapping portions in their vertical projection areas, achieving a similar tight coupling effect and further increasing the antenna bandwidth. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the top surface structure of the circuit board in this utility model;

[0021] Figure 2 This is a schematic diagram of the bottom structure of the centerline plate of this utility model;

[0022] Figure 3 This is a simulated return loss diagram for this application;

[0023] Figure 4 This is a simulation gain diagram of this application;

[0024] Figure 5 This is the simulated shaft ratio diagram for this application.

[0025] In the diagram: 1. Circuit board; 2. Power supply pad; 21. First copper-clad via; 3. Primary connection surface; 31. Second copper-clad via; 4. High-frequency radiation ring; 41. Third copper-clad via; 5. Secondary connection surface; 51. Fourth copper-clad via; 6. Low-frequency radiation ring; 7. Choke-coupled arc-shaped microstrip line; 71. Grounding copper-clad via; 8. Integrated fixed through-hole; 9. Spare power supply via. Detailed Implementation

[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0027] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0028] In this utility model, unless otherwise stated, the orientations used, such as "up" and "down", usually refer to the direction shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" usually refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not used to limit this utility model.

[0029] A dual-frequency continuous dual-loop microstrip antenna includes a circuit board 1, a feed pad 2, a primary connection surface 3, a high-frequency radiating loop 4, a secondary connection surface 5, a low-frequency radiating loop 6, and several choke-coupled arc-shaped microstrip lines 7. The primary connection surface 3 is located in the center of the bottom surface of the circuit board 1 and is made of a double-sided copper-clad PCB board of FR4 material. The feed pad 2 is located on the top surface of the circuit board 1 and lies within the vertical projection of the primary connection surface 3. The feed pad 2 is connected to the primary connection surface 3 through a first copper-clad via 21. The high-frequency radiating loop 4 is located on the top surface of the circuit board 1, and its inner ring portion overlaps with the vertical projection portion of the primary connection surface 3. This overlapping area has a function for... A second copper via 31 connects the high-frequency radiation ring 4 and the primary connection surface 3. The low-frequency radiation ring 6 is located on the top surface of the circuit board 1, and the secondary connection surface 5 is located on the bottom surface of the circuit board 1. Its inner ring is spaced a certain distance from the primary connection surface 3. The inner ring portion of the secondary connection surface 5 overlaps with the vertical projection portion of the outer ring of the high-frequency radiation ring 4 and is connected through the third copper via 41. The inner ring portion of the secondary connection surface 5 overlaps with the vertical projection portion of the inner ring of the low-frequency radiation ring 6 and is connected through the fourth copper via 51. Several choke-coupled arc-shaped microstrip lines 7 are located on the outermost part of the top surface of the circuit board 1, and the middle part of the choke-coupled arc-shaped microstrip lines 7 has a grounded copper via 71.

[0030] In practical applications, refer to Figure 1 , Figure 2 The top surface of the circuit board 1 is provided with a power feeding pad 2. The power feeding pad 2 is connected to the primary connection surface 3 through a first copper via 21. The primary connection surface 3 is connected to the high-frequency radiation ring 4 through multiple densely distributed second copper vias 31. The high-frequency radiation ring 4 is connected to the secondary connection surface 5 through a third copper via 41 with the same angle as the power feeding pad 2. The secondary connection surface 5 is connected to the low-frequency radiation ring 6 through multiple densely distributed fourth copper vias 51. Multiple choke-coupled arc-shaped microstrip lines 7 are provided at the periphery of the circuit board 1. Grounding copper vias 71 are provided on the choke-coupled arc-shaped microstrip lines 7.

[0031] In this embodiment, there are several power supply pads 2, which are all arranged at equal intervals along the circumference of the circuit board 1 on the top surface of the circuit board 1. There are several third copper vias 41, which correspond one-to-one with several power supply pads 2.

[0032] In this embodiment, the circuit board 1 has an integrated fixing through hole 8 for fixing the circuit board 1.

[0033] In this embodiment, the circuit board 1 has a spare power supply via 9.

[0034] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this utility model. The scope of this utility model is defined by the appended claims and their equivalents.

Claims

1. A dual-frequency continuous dual-loop microstrip antenna, characterized in that, It includes a circuit board (1), a power supply pad (2), a primary connection surface (3), a high-frequency radiation ring (4), a secondary connection surface (5), and a low-frequency radiation ring (6), among which, The primary connection surface (3) is located in the middle of the bottom surface of the circuit board (1). The power supply pad (2) is located on the top surface of the circuit board (1) and within the vertical projection of the primary connection surface (3). The power supply pad (2) is connected to the primary connection surface (3) through the first copper via (21). The high-frequency radiation ring (4) is located on the top surface of the circuit board (1). Its inner ring portion overlaps with the vertical projection portion of the primary connection surface (3), and the overlapping area has a second copper via (31) for connecting the high-frequency radiation ring (4) and the primary connection surface (3). The low-frequency radiation ring (6) is located on the top surface of the circuit board (1). The secondary connection surface (5) is located on the bottom surface of the circuit board (1). Its inner ring is spaced a certain distance from the primary connection surface (3). The inner ring of the secondary connection surface (5) overlaps with the vertical projection of the outer ring of the high-frequency radiation ring (4) and is connected through the third copper via (41). The inner ring of the secondary connection surface (5) overlaps with the vertical projection of the inner ring of the low-frequency radiation ring (6) and is connected through the fourth copper via (51).

2. The dual-frequency continuous dual-loop microstrip antenna according to claim 1, characterized in that, It also includes a choke-coupled arc-shaped microstrip line (7), which is located on the outermost part of the top surface of the circuit board (1).

3. A dual-frequency continuous dual-loop microstrip antenna according to claim 2, characterized in that, The choke-coupled arc-shaped microstrip line (7) has a grounded copper via (71) in the middle.

4. A dual-frequency continuous dual-loop microstrip antenna according to claim 1, characterized in that, The circuit board (1) has an integrated fixing through hole (8) for fixing the circuit board (1).

5. A dual-frequency continuous dual-loop microstrip antenna according to claim 1, characterized in that, The circuit board (1) has a spare power supply via (9).

6. A dual-frequency continuous dual-loop microstrip antenna according to claim 1, characterized in that, The power feeding pads (2) are numerous and are arranged at equal intervals along the circumference of the circuit board (1) on the top surface of the circuit board (1).

7. A dual-frequency continuous dual-loop microstrip antenna according to claim 6, characterized in that, The third copper via (41) is provided in several parts, and each part corresponds to a certain number of power feeding pads (2).

Images