Single-layer printed circuit board with multiple step grooves
By setting multiple conductive copper blocks on a single-layer printed circuit board and controlling their thickness, the problem of controlling the depth of the stepped groove is solved, realizing a multi-step groove design that balances stability and conductivity, suitable for single-layer printed circuit boards.
Patent Information
- Application Number
- CN202520046596.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-09
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2035-01-09
AI Technical Summary
Existing technologies make it difficult to effectively control different depths when setting stepped grooves on single-layer printed circuit boards, resulting in inconvenient operation and insufficient stability.
By setting multiple conductive copper blocks on a single-layer printed circuit board and controlling their thickness, the depth of the stepped groove can be adjusted. The conductive copper blocks are fixed by an adhesive layer and a connecting groove, thus avoiding the need to create stepped grooves of different depths.
It enables precise control of the stepped groove depth, facilitating component installation and improving the stability of single-layer printed circuit boards and the stability of conductive connections.
Smart Images

Figure CN223786243U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to printed wiring board technical field especially, relates to a single -layer printed wiring board of multiple ladder groove. BACKGROUND
[0002] The stepped circuit board is also called ladder groove circuit board, which is a special type of printed circuit board. Its design includes multiple slots of different depths to accommodate components of different heights in the slots. These slots are usually arranged in levels to accommodate components of different heights, hence the name "ladder groove". The design purpose of the ladder groove PCB is to solve the problem that all components on the traditional PCB are in the same plane, which causes interference or insufficient space when connecting or laying out some components. By arranging components on different levels, the ladder groove PCB can better utilize space, improve the interconnection density between components, and avoid interference and space shortage problems.
[0003] At present, the existing ladder groove on the printed wiring board is generally provided on a multi-layer circuit board. When a ladder groove is provided on a single-layer printed wiring board, the thickness of the circuit board is a problem, the opening of the ladder groove is troublesome, and the depth of different ladder grooves cannot be effectively controlled. Therefore, there is an urgent need to design a single-layer printed wiring board with multiple ladder grooves to solve the above problems. SUMMARY
[0004] The utility model aims at solving the shortcomings in the prior art and provides a single-layer printed wiring board with multiple ladder grooves. The advantage is that the depth of the multiple ladder grooves is controlled by controlling the thickness of the multiple conductive copper blocks, without the need to open ladder grooves of different depths on the single-layer printed wiring board, which facilitates more accurate control of the depth of the ladder grooves.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A single-layer printed wiring board with multiple ladder grooves, comprising a circuit board substrate, the bottom of the circuit board substrate is provided with an adhesive layer, and the bottom of the adhesive layer is bonded with a copper-clad plate, four ladder grooves are opened on the circuit board substrate, and a connecting groove corresponding to the position of the ladder groove is opened on the copper-clad plate, the inner wall of the connecting groove is respectively provided with a first conductive copper block, a second conductive copper block and a third conductive copper block inserted into the multiple ladder grooves, the first conductive copper block, the second conductive copper block and the third conductive copper block sequentially set the inside of the three ladder grooves into a first ladder groove, a second ladder groove and a third ladder groove, and the fourth ladder groove is designed as a fourth ladder groove.
[0007] Through the above technical scheme: without opening ladder grooves of different depths on the single-layer printed wiring board, it is convenient to control the depth of the ladder grooves more accurately.
[0008] The utility model further sets up, the thickness of first conductive copper block, the thickness of second conductive copper block and the thickness of third conductive copper block decrease gradually.
[0009] Through the above technical scheme: the depth of multiple ladder grooves is controlled by controlling the thickness of multiple conductive copper blocks.
[0010] The utility model further sets up, the outer wall bottom of first conductive copper block, the outer wall bottom of second conductive copper block and the outer wall bottom of third conductive copper block all are provided with strip adhesive layer with the four around inner walls of connecting groove.
[0011] Through the above technical scheme: multiple conductive copper blocks are fixed and installed on the copper-clad plate, guaranteeing the conductivity and the connection stability, thereby guaranteeing the stability of the whole single-layer printed circuit board.
[0012] The utility model further sets up, the bottom of copper-clad plate is provided with circuit line layer, and the bottom of copper-clad plate is also provided with covering bottom film.
[0013] The utility model further sets up, the top surface of circuit board substrate, the inner wall of first ladder groove, the inner wall of second ladder groove, the inner wall of third ladder groove and the inner wall of fourth ladder groove are provided with covering top film.
[0014] The utility model further sets up, the inside of first ladder groove, second ladder groove, third ladder groove and fourth ladder groove all are provided with multiple pin through holes through copper-clad plate, covering top film, first conductive copper block, second conductive copper block, third conductive copper block.
[0015] Through the above technical scheme: the pin of installation element is convenient.
[0016] The utility model further sets up, the position of pin through hole corresponds with the position of circuit line layer's connection contact point.
[0017] Through the above technical scheme: the pin of element and the connection contact point of circuit line layer are welded.
[0018] The utility model further sets up, and multiple installation base holes are provided on circuit board substrate and copper-clad plate.
[0019] Through the above technical scheme: the whole single-layer printed circuit board is installed.
[0020] The utility model has the advantages of:
[0021] 1. The utility model discloses a single -layer printed circuit board of multiple ladder groove which is convenient to constitute the whole single -layer printed circuit board structure with multiple ladder groove through the cooperation of the circuit board substrate, adhesive layer, copper clad plate, ladder through groove, circuit line layer, first conductive copper block, second conductive copper block, third conductive copper block and pin through hole etc.
[0022] 2. The utility model discloses a connecting groove and strip adhesive layer are set up can install multiple conductive copper block on copper clad plate, guarantee the conductivity, and also can guarantee the connection firmness, thereby guarantee the self firmness of whole single -layer printed circuit board. ACCURACY
[0023] Figure 1 A single -layer printed circuit board of multiple ladder groove is provided for the utility model, and the front view is shown in the figure A;
[0024] Figure 2 A single -layer printed circuit board of multiple ladder groove is provided for the utility model, and the front view is shown in the figure A;
[0025] Figure 3 The figure A enlarged structure schematic diagram is provided for the utility model;
[0026] Figure 4 The figure B enlarged structure schematic diagram is provided for the utility model;
[0027] Figure 5 The figure C enlarged structure schematic diagram is provided for the utility model;
[0028] Figure 6 The figure D enlarged structure schematic diagram is provided for the utility model;
[0029] Figure 7 A pin through hole structure schematic diagram of a single -layer printed circuit board of multiple ladder groove is provided for the utility model;
[0030] Figure 8 A connecting groove structure schematic diagram of a single -layer printed circuit board of multiple ladder groove is provided for the utility model.
[0031] In the figure: 1, circuit board substrate; 2, adhesive layer; 3, copper-clad plate; 4, mounting base hole; 5, cover top film; 6, first step groove; 7, second step groove; 8, third step groove; 9, fourth step groove; 10, circuit line layer; 11, cover bottom film; 12, first conductive copper block; 13, strip-shaped adhesive layer; 14, second conductive copper block; 15, third conductive copper block; 16, pin through hole; 17, connecting groove. DETAILED DESCRIPTION
[0032] The technical solutions of the present application will be described in further detail below in conjunction with specific embodiments.
[0033] Embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation of the present application.
[0034] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0035] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "setting" should be understood broadly, for example, it can be fixedly connected, set, or detachably connected, set, or integrally connected, set. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.
[0036] Reference Figures 1-8The utility model provides a single -layer printed wiring board of multiple ladder groove, including the printed wiring board substrate 1, the bottom of printed wiring board substrate 1 is provided with adhesive layer 2, and the bottom of adhesive layer 2 is bonded with copper-clad plate 3, the bottom of copper-clad plate 3 is provided with circuit line layer 10, and the bottom of copper-clad plate 3 is also provided with cover bottom film 11, four ladder through slots are set up on printed wiring board substrate 1, and the connecting groove 17 corresponding with the position of ladder through slot is set up on copper-clad plate 3, the inner wall of connecting groove 17 is provided with first conductive copper block 12, second conductive copper block 14 and third conductive copper block 15 inserted in multiple ladder through slots respectively, the thickness of first conductive copper block 12, the thickness of second conductive copper block 14 and the thickness of third conductive copper block 15 decrease gradually, first conductive copper block 12, second conductive copper block 14 and third conductive copper block 15 set up the inside of three ladder through slots into first ladder groove 6, second ladder groove 7 and third ladder groove 8 gradually, the fourth ladder through slot is designed as fourth ladder groove 9, the top surface of printed wiring board substrate 1, the inner wall of first ladder groove 6, the inner wall of second ladder groove 7, the inner wall of third ladder groove 8 and the inner wall of fourth ladder groove 9 are provided with cover top film 5, using the above-mentioned ladder through slot and multiple conductive copper block, only need to set up multiple ladder through slots on single -layer printed wiring board, the depth of multiple ladder groove is controlled by controlling the thickness of first conductive copper block 12, second conductive copper block 14 and third conductive copper block 15 and more conductive copper block, need not set up the ladder groove of different depth on single -layer printed wiring board, facilitate more accurate control of ladder groove depth.
[0037] In order to ensure the installation stability of the conductive copper block, referring to Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 8 , the outer wall bottom of the first conductive copper block 12, the outer wall bottom of the second conductive copper block 14 and the outer wall bottom of the third conductive copper block 15 are provided with a strip-shaped adhesive layer 13 around the inner wall of the connecting groove 17. The strip-shaped adhesive layer 13 is used to fix and install the multiple conductive copper blocks on the copper-clad plate 3, ensuring the conduction and connection stability, thereby ensuring the stability of the entire single-layer printed wiring board.
[0038] In order to facilitate the installation of components, referring to Figure 1 、 Figure 7 and Figure 8The inside of the first stepped groove 6, the second stepped groove 7, the third stepped groove 8 and the fourth stepped groove 9 is provided with a plurality of pin through holes 16 penetrating the copper clad plate 3, the cover top film 5, the first conductive copper block 12, the second conductive copper block 14 and the third conductive copper block 15, and the position of the pin through hole 16 corresponds to the position of the connecting contact of the circuit line layer 10. The pin through hole 16 is used for installing the element, the element is placed in the stepped groove, and the pin is installed through the pin through hole 16.
[0039] In order to facilitate the installation of the entire printed circuit board, referring to Figure 1 The circuit board substrate 1 and the copper clad plate 3 are provided with a plurality of installation base holes 4, and the installation base hole 4 is used for facilitating the installation of the entire single-layer printed circuit board.
[0040] Working principle: the circuit board substrate 1, the adhesive layer 2, the copper clad plate 3, the stepped through groove, the circuit line layer 10, the first conductive copper block 12, the second conductive copper block 14, the third conductive copper block 15 and the pin through hole 16 are matched to facilitate the composition of the entire single-layer printed circuit board structure with multiple stepped grooves. At this time, a plurality of stepped through grooves are provided on the single-layer printed circuit board, then a plurality of conductive copper blocks are inserted into the stepped through grooves, the thickness of the conductive copper block is controlled to control the depth of the multiple stepped grooves, and there is no need to open stepped grooves with different depths on the single-layer printed circuit board. When the element is installed, the element is placed in the stepped groove, and the pin is installed through the pin through hole 16.
[0041] The above is only a preferred embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A single-layer printed wiring board having a plurality of stepped slots, comprising a wiring board substrate (1), characterized by, The bottom of the circuit board substrate (1) is provided with an adhesive layer (2), and the bottom of the adhesive layer (2) is bonded with a copper-clad plate (3). Four stepped through grooves are formed in the circuit board substrate (1), and a connecting groove (17) corresponding to the position of the stepped through groove is formed in the copper-clad plate (3). The inner wall of the connecting groove (17) is respectively provided with a first conductive copper block (12), a second conductive copper block (14) and a third conductive copper block (15) inserted into the plurality of stepped through grooves. The first conductive copper block (12), the second conductive copper block (14) and the third conductive copper block (15) sequentially form a first stepped groove (6), a second stepped groove (7) and a third stepped groove (8) in the inside of the three stepped through grooves. The fourth stepped through groove is designed as a fourth stepped groove (9).
2. The single-layer printed wiring board of claim 1, wherein The thickness of the first conductive copper block (12), the thickness of the second conductive copper block (14) and the thickness of the third conductive copper block (15) decrease in turn.
3. The single-layer printed wiring board of claim 2, wherein the plurality of stepped slots are formed in the first and second insulating layers. The outer wall bottom of the first conductive copper block (12), the outer wall bottom of the second conductive copper block (14) and the outer wall bottom of the third conductive copper block (15) are respectively provided with a strip-shaped adhesive layer (13) on the inner wall of the connecting groove (17).
4. The single-layer printed wiring board of claim 3, wherein the plurality of stepped slots are formed in the first and second insulating layers. The bottom of the copper-clad plate (3) is provided with a circuit line layer (10), and the bottom of the copper-clad plate (3) is further provided with a covering bottom film (11).
5. The single-layer printed wiring board of claim 4, wherein the plurality of stepped slots are formed in the first and second insulating layers. The top surface of the circuit board substrate (1), the inner wall of the first stepped groove (6), the inner wall of the second stepped groove (7), the inner wall of the third stepped groove (8) and the inner wall of the fourth stepped groove (9) are provided with a covering top film (5).
6. The single-layer printed wiring board of claim 5, wherein The first stepped groove (6), the second stepped groove (7), the third stepped groove (8) and the fourth stepped groove (9) are respectively provided with a plurality of pin through holes (16) passing through the copper-clad plate (3), the covering top film (5), the first conductive copper block (12), the second conductive copper block (14) and the third conductive copper block (15).
7. The single-layer printed wiring board of claim 6, wherein the plurality of stepped slots are formed in the first and second insulating layers. The position of the pin through hole (16) corresponds to the position of the connecting contact of the circuit line layer (10).
8. The single-layer printed wiring board of claim 1, wherein, A plurality of mounting base holes (4) are provided on the circuit board substrate (1) and the copper-clad plate (3).