Radiator with tin overflow groove

Abstract

The utility model relates to the technical field of radiators, and discloses a radiator with a tin overflow groove, which comprises a radiating plate and radiating fins, the top of the radiating plate is provided with a storage groove, the bottom of each radiating fin is positioned in the storage groove at the top of the radiating plate, and the top of each radiating fin is in the shape of a plurality of fins. Through holes extending to the bottoms of the fins are formed in the two ends of the tops of the fins on the cooling fins, through openings are formed in the cooling plate, the number of the through openings is the same as that of the fins on the tops of the cooling fins, openings in the two ends of each through opening extend to the bottoms of the containing grooves, and a U-shaped cooling pipe is fixedly connected into each through opening in an inserted mode. A plurality of heat dissipation pipes are inserted into the heat dissipation plate and the heat dissipation fins in a penetrating mode, the heat dissipation pipes are communicated together through a plurality of communicating pipes, finally, cooling liquid is continuously injected into the heat dissipation pipes through water pipes, and heat on the heat dissipation plate and the heat dissipation fins can be rapidly driven through flowing of the cooling liquid; therefore, the heat dissipation effect of the heat dissipation plate and the heat dissipation fins can be greatly improved.

Description

Technical Field

[0001] This utility model belongs to the field of heat sink technology, specifically a heat sink with a solder overflow groove. Background Technology

[0002] With the continuous improvement of people's living standards, the types of home appliances are becoming more and more diverse. Many home appliances generate heat during use. Therefore, the emergence of radiators provides a good operating environment for electrical appliances, greatly improving their service life and safety. In addition, for the sake of aesthetics in soldering, a solder overflow groove is set at the solder joint to prevent molten solder from flowing freely. Existing radiators usually use a heat sink plate with heat dissipation fins installed to dissipate heat from the appliance through heat conduction. However, the heat dissipation effect of radiators with solder overflow grooves is limited. The heat dissipation cannot be completed quickly by the heat sink plate and heat sink fins themselves. Therefore, this application proposes a radiator with a solder overflow groove. Utility Model Content

[0003] To address the problems mentioned in the background art, this utility model provides the following technical solution: a heat sink with a solder overflow groove, comprising a heat sink plate and heat sink fins. The top of the heat sink plate has a storage groove, and the bottom of the heat sink fins is located in the storage groove at the top of the heat sink plate. The top of the heat sink fins is configured with multiple fins. Each fin on the heat sink fins has through holes extending to its bottom at both ends of its top. The heat sink plate has the same number of openings as the top fins of the heat sink fins inside. The openings at both ends of each opening extend to the bottom of the storage groove. A U-shaped heat sink tube is fixedly inserted into each opening. The vertical part of each heat sink tube is inserted through the corresponding through hole at the bottom of the heat sink fin. The top of each heat sink tube extends from the top of the through hole. A connecting pipe is installed between the tops of two adjacent heat sink tubes at the same end in an alternating manner. A water pipe is connected to one end of the top of each heat sink tube on both sides.

[0004] Furthermore, each connecting pipe is threaded with a threaded ring at its connection point with the water pipe and the heat dissipation pipe, and the outer diameters of the connecting pipe, the water pipe and the heat dissipation pipe are all the same.

[0005] Furthermore, the top of the heat sink and the four corners of the storage slot are provided with solder overflow grooves, and limit posts are fixedly installed in the four solder overflow grooves. Connecting plates are fixedly installed on the sides of the four corners of the heat sink. The ends of the four connecting plates away from the heat sink are located in the corresponding solder overflow grooves, and an opening is provided at one end of each of the four connecting plates. The openings on the four connecting plates are respectively movably fitted onto the corresponding limit posts.

[0006] Furthermore, when the threaded ring is threaded onto the top of the heat pipe, the bottom of the threaded ring rests against the top of the heat sink.

[0007] Furthermore, the length and width of the bottom of the heat sink are matched with the length and width of the storage slot on the top of the heat sink.

[0008] Furthermore, the heat dissipation pipes, connecting pipes, and water pipes are all made of copper.

[0009] Compared with the prior art, the beneficial effects of this utility model are:

[0010] By inserting multiple heat pipes inside the heat sink and heat fins, and connecting these heat pipes together through multiple connecting pipes, and finally continuously injecting coolant into the heat pipes through water pipes, the flow of coolant can quickly dissipate heat from the heat sink and heat fins, thereby greatly improving the heat dissipation effect of the heat sink and heat fins. Attached Figure Description

[0011] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0013] Figure 2 This is a schematic diagram of the structure of the heat dissipation plate, heat dissipation pipe, connecting pipe and water pipe connection of this utility model;

[0014] Figure 3 This is a schematic diagram of the structure of the heat sink of this utility model;

[0015] Figure 4 This is a schematic diagram of the structure connecting the heat dissipation pipe, the connecting pipe, and the water pipe of this utility model;

[0016] Figure 5 This is a schematic diagram of the structure of the heat sink of this utility model;

[0017] In the diagram: 1. Heat sink; 2. Storage slot; 3. Through opening; 4. Heat pipe; 5. Heat sink fin; 6. Through hole; 7. Connecting pipe; 8. Water pipe; 9. Threaded ring; 10. Solder overflow tray; 11. Limiting post; 12. Connecting plate. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0019] Depend on Figure 1-5 The present invention includes a heat sink 1 and a heat sink 5. The top of the heat sink 1 is provided with a storage groove 2. The bottom of the heat sink 5 is located in the storage groove 2 at the top of the heat sink 1. The top of the heat sink 5 is configured as multiple fins. Each fin of the heat sink 5 has through holes 6 extending to its bottom at both ends of its top. The heat sink 1 has the same number of openings 3 as the top fins of the heat sink 5. The openings at both ends of each opening 3 extend to the bottom of the storage groove 2. A U-shaped heat sink 4 is fixedly inserted into each opening 3. The vertical part of each heat sink 4 is inserted through the corresponding through hole 6 at the bottom of the heat sink 5. The top of each heat sink 4 extends out from the top of the through hole 6. A connecting pipe 7 is installed between the tops of two adjacent heat sink 4 at the same end in an alternating manner. One end of the top of each heat sink 4 on both sides is connected to a water pipe 8.

[0020] like Figure 2 and Figure 4 As shown, each connecting pipe 7 is threaded with a threaded ring 9 at the joint with the water pipe 8 and the heat dissipation pipe 4, and the outer diameters of the connecting pipe 7, the water pipe 8 and the heat dissipation pipe 4 are the same. In this way, the connecting pipe 7, the water pipe 8 and the heat dissipation pipe 4 can be connected by the threaded ring 9.

[0021] like Figure 1 and Figure 5 As shown, the top of the heat sink 1 and the four corners of the storage slot 2 are provided with solder overflow slots 10. Limiting posts 11 are fixedly installed in the four solder overflow slots 10. Connecting plates 12 are fixedly installed on the sides of the four corners of the heat sink 5. The ends of the four connecting plates 12 away from the heat sink 5 are located in the corresponding solder overflow slots 10. An opening is provided at one end of the four connecting plates 12. The openings on the four connecting plates 12 are movably fitted onto the corresponding limiting posts 11. By fitting one end of the connecting plate 12 onto the limiting post 11 in the corresponding solder overflow slot 10 and then soldering, the bottom end of the heat sink 5 can be stably installed in the storage slot 2 at the top of the heat sink 1.

[0022] like Figure 1 As shown, when the threaded ring 9 is threaded onto the top of the heat sink 4, the bottom of the threaded ring 9 rests against the top of the heat sink 5. In this way, the connecting pipe 7 and the water pipe 8 can be stably connected to the top of the heat sink 4 through the threaded ring 9.

[0023] like Figure 1 As shown, the length and width of the bottom of the heat sink 5 are adapted to the length and width of the top storage groove 2 of the heat sink 1, so that the bottom of the heat sink 5 can be stably installed in the storage groove 2 at the top of the heat sink 1.

[0024] like Figure 4As shown, heat dissipation pipe 4, connecting pipe 7 and water pipe 8 are all made of copper. Copper has good thermal conductivity, which enables the heat dissipation of heat inside heat sink 1 and heat sink 5 to be completed quickly.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat sink with a solder overflow groove, comprising a heat sink plate (1) and heat sink fins (5), characterized in that: The top of the heat sink (1) is provided with a storage groove (2). The bottom of the heat sink (5) is located in the storage groove (2) at the top of the heat sink (1). The top of the heat sink (5) is set as multiple fins. Each fin on the heat sink (5) has through holes (6) extending to its bottom at both ends. The heat sink (1) has the same number of openings (3) as the top fins of the heat sink (5). The openings at both ends of each opening (3) extend to the bottom of the storage groove (2). A U-shaped heat sink tube (4) is fixedly inserted into each opening (3). The vertical part of each heat sink tube (4) is inserted through the corresponding through hole (6) at the bottom of the heat sink (5). The top of each heat sink tube (4) extends out from the top of the through hole (6). A connecting pipe (7) is installed between the tops of two adjacent heat sink tubes (4) in an alternating manner. A water pipe (8) is connected to one end of the top of the heat sink tubes (4) on both sides.

2. A heat sink with a solder overflow groove according to claim 1, characterized in that: Each of the connecting pipes (7) and the water pipes (8) and heat dissipation pipes (4) is threaded with a threaded ring (9), and the outer diameters of the connecting pipes (7), water pipes (8) and heat dissipation pipes (4) are the same.

3. A heat sink with a solder overflow groove according to claim 1, characterized in that: The top of the heat sink (1) and the four corners of the storage slot (2) are provided with solder overflow slots (10). Limiting posts (11) are fixedly installed in the four solder overflow slots (10). Connecting plates (12) are fixedly installed on the sides of the four corners of the heat sink (5). The ends of the four connecting plates (12) away from the heat sink (5) are located in the corresponding solder overflow slots (10). Openings are provided at one end of the four connecting plates (12). The openings on the four connecting plates (12) are respectively movably sleeved on the corresponding limiting posts (11).

4. A heat sink with a solder overflow groove according to claim 2, characterized in that: When the threaded ring (9) is threaded onto the top of the heat sink (4), the bottom of the threaded ring (9) rests against the top of the heat sink (5).

5. A heat sink with a solder overflow groove according to claim 1, characterized in that: The length and width of the bottom of the heat sink (5) are adapted to the length and width of the top storage slot (2) of the heat sink (1).

6. A heat sink with a solder overflow groove according to claim 1, characterized in that: The heat dissipation pipe (4), the connecting pipe (7) and the water pipe (8) are all made of metal copper pipe.

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