Nitrogen-sealed humidifying device for semiconductor machine

Abstract

The utility model discloses a nitrogen-sealed humidifying device used on a semiconductor machine table, which can adapt to different machine table specifications through a transparent hollow pipe body fixed on one side of the semiconductor machine table by a detachable fixing assembly, and has the effects of small volume, space saving, material saving, reagent consumption reduction and humidifying efficiency improvement. The first transparent plate and the second transparent plate are welded and fixed at the upper end opening and the lower end opening of the hollow pipe body, so that the sealing performance is ensured, and good chemical stability and transparency are achieved due to the fact that the first transparent plate and the second transparent plate are respectively made of PVC materials and PFA materials. The first transparent plate is provided with an air inlet pipe with an air inlet valve and a liquid inlet pipe with a liquid inlet valve, so that the flow control of gas and liquid can be realized; the nitrogen sealing effect can be achieved without being filled with water through the waste discharge port formed in the second transparent plate and the waste discharge pipe provided with the bent part.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor manufacturing, especially relates to a nitrogen sealing and humidifying device for semiconductor machine. BACKGROUND

[0002] In the semiconductor manufacturing process, the slurry supply system (SDS) and the central chemical supply system (CDS) are key components of the equipment. The SDS system is responsible for providing slurry for the chemical mechanical polishing (CMP) equipment, ensuring the stability and efficiency of the polishing process. The CDS system is used to provide high-purity chemical liquids for the production line. These systems usually include multiple storage barrels, mixing devices, delivery pipelines and control systems to ensure the accurate supply and mixing of chemical liquids.

[0003] In the existing semiconductor SDS&CDS system, the nitrogen sealing and humidifying device is mainly used to prevent chemical liquids from contacting with air, avoid volatilization and pollution, and ensure the humidity stability of chemical liquids. Common humidifying devices achieve humidification effect by introducing pure water (DIW) or high-purity nitrogen (PN2) into the chemical liquids, such as the bubble humidifying device in the Chinese utility model document with publication number CN219922773U. These devices are usually installed on the chemical liquid storage barrel or mixing device, and the flow of nitrogen and pure water into the drainage main pipe on the semiconductor machine is adjusted by manual or automatic control valve.

[0004] Although the existing nitrogen sealing and humidifying device meets the needs of semiconductor manufacturing to some extent, there are still some deficiencies and shortcomings:

[0005] 1. Large space occupation: Traditional nitrogen sealing and humidifying devices usually have large volume and occupy more space on the semiconductor machine, which is not conducive to the production environment with limited space.

[0006] 2. Material waste and large amount of reagent usage: The existing device may not be optimized in design, resulting in large amount of material usage and increasing production cost; and a large amount of pure water and high-purity nitrogen may be needed in the humidification process, increasing the usage cost of reagents.

[0007] 3. Unsatisfactory nitrogen sealing effect: Some devices need to be filled with water to ensure sealing, which not only increases the usage of water, but also may cause unstable pressure inside the device. INVENTION CONTENTS

[0008] To solve the problems existing in the prior art described above, the purpose of the present utility model is to provide a nitrogen sealing and humidifying device for semiconductor machine, which not only saves machine space and materials, but also reduces the usage of reagents for humidification, and the device can achieve nitrogen sealing effect without filling water inside, improving production efficiency and economic benefit.

[0009] To achieve the above object and other related objects, the utility model adopts the following technical scheme:

[0010] The utility model provides a nitrogen seal humidifying device for semiconductor machine table, including transparent hollow pipe body, the upper end port and the lower end port of hollow pipe body are fixed with first transparent plate and second transparent plate respectively, the hollow pipe body first transparent plate and second transparent plate all adopt PVC material,

[0011] The first transparent plate is fixed with the air inlet pipe and the liquid inlet pipe, the air inlet pipe is used for transporting high -purity nitrogen, be equipped with air inlet valve on the air inlet pipe, the liquid inlet pipe is used for transporting pure water, be equipped with liquid inlet valve on the liquid inlet pipe,

[0012] The second transparent plate is equipped with the waste outlet, the waste outlet is fixed with the waste pipe, the waste outlet is connected to the liquid discharge main pipe on the semiconductor machine table through the waste pipe, be equipped with waste hand valve on the waste pipe, is used for controlling the on -off of waste pipe, and, be equipped with the bending part at a certain height distance the liquid discharge main pipe on the waste pipe.

[0013] As a preferred technical scheme, the bending part includes two consecutive circular bends.

[0014] As a preferred technical scheme, the air inlet valve includes first hand valve and first knob adjusting valve, the liquid inlet valve includes second hand valve and second knob adjusting valve,

[0015] The first hand valve is used for manually controlling the on -off of the gas in the air inlet pipe, and the first knob adjusting valve is used for adjusting the gas flow of the air inlet pipe,

[0016] The second hand valve is used for manually controlling the on -off of the liquid in the liquid inlet pipe, and the second knob adjusting valve is used for adjusting the liquid flow of the liquid inlet pipe.

[0017] As a preferred technical scheme, the first transparent plate and the second transparent plate are welded and fixed to the upper end port and the lower end port of the hollow pipe body respectively.

[0018] As a preferred technical scheme, the lower end port of the hollow pipe body is inclined, so that the second transparent plate is inclined, and the waste outlet is located at the lowest part of the inclined surface.

[0019] As a preferred technical scheme, the diameter of the hollow pipe body is 100mm, and the length range is 20cm-25cm, and the bending part is located at the height of about 40cm from the liquid discharge main pipe on the waste pipe.

[0020] Preferably, the gas inlet pipe and the liquid inlet pipe are both PFA pipes.

[0021] Further, the PFA pipe has an outer diameter of 1 / 2 inch and an inner diameter of 3 / 8 inch.

[0022] Further, the installation ring has a sliding block fixed to the back side, and the track frame has a sliding groove with a shape matched with the sliding block.

[0023] Further, the installation ring has a sliding block fixed to the back side, and the track frame has a sliding groove with a shape matched with the sliding block.

[0024] As described above, the nitrogen sealing and humidifying device has the following advantages:

[0025] (1) The nitrogen sealing and humidifying device for the semiconductor machine has a compact design, uses a PVC transparent pipe with a diameter of 100 mm and a length range of 20-25 cm as the hollow pipe body, reduces the device material and the device volume, thereby saving the use space of the semiconductor machine; and through the slender hollow pipe body design and the welding of the upper and lower openings of the transparent pipe through the transparent plate, leakage can be effectively prevented, the use amount of reagent is reduced, and DIW and N2 are saved; in addition, through the design of the nitrogen sealing and humidifying device, the nitrogen sealing effect can be achieved without filling water in the nitrogen sealing and humidifying device, and the pressure inside the device is kept stable.

[0026] (2) The nitrogen sealing and humidifying device for the semiconductor machine can adapt to different specifications and sizes of different semiconductor machines and different pipeline positions through the detachable fixing assembly, has flexibility and adaptability, ensures the stability and operation convenience of the nitrogen sealing and humidifying device, and is convenient to disassemble and store when not in use. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 is a pipeline connection structure schematic view when the nitrogen sealing and humidifying device in the utility model is connected to the main liquid discharge pipe of the semiconductor machine.

[0028] Figure 2 is a schematic view when the hollow pipe body of the nitrogen sealing and humidifying device in the utility model is fixed to the semiconductor machine through the detachable fixing assembly.

[0029] Figure 3 is Figure 2 the sectional view of A-A in

[0030] Figure 4 is Figure 3 Structure schematic diagram when provided with the gasket.

[0031] Wherein, the reference signs are specifically explained as follows: 1, semiconductor machine table; 11, liquid discharge main pipe; 2, track frame; 3, mounting ring; 31, gasket; 4, hollow pipe body; 5, first transparent plate; 51, air inlet pipe; 52, air inlet valve; 521, first hand valve; 522, first knob adjusting valve; 53, liquid inlet pipe; 54, liquid inlet valve; 541, second hand valve; 542, second knob adjusting valve; 6, second transparent plate; 61, waste pipe; 611, bending part; 612, waste hand valve. DETAILED DESCRIPTION

[0032] In order to better understand the purpose, structure and function of the utility model, the technical solutions in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0033] In the description of the utility model, it should be explained that the position relationship indicated in the specification such as "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is the position relationship based on the position relationship shown in the drawings, which is only for the convenience of describing the embodiments of the utility model and simplifying the description, and cannot be understood as the limitation of the utility model that the indicated or implied device or element must have a specific orientation, be constructed and operated in a specific direction.

[0034] EMBODIMENT

[0035] As Figure 1 shown, the embodiment provides a nitrogen sealing and humidifying device for a semiconductor machine table 1, which comprises a transparent hollow pipe body 4, the position of the hollow pipe body 4 is determined according to the liquid discharge main pipe 11 on the semiconductor machine table 1 and the surface obstacle of the semiconductor machine table 1, so that the hollow pipe body 4 is located above the liquid discharge main pipe 11 and avoids the obstacle, and maintains a proper distance with the liquid discharge main pipe 11, so as to ensure the liquid sealing and humidifying effect; and the length of the hollow pipe body 4 is determined according to the height of the semiconductor machine table 1, in the embodiment, the diameter of the hollow pipe body 4 is 100mm, and the length range is 20cm-25cm.

[0036] The upper end port and the lower end port of the hollow tube body 4 are respectively fixed with a first transparent plate 5 and a second transparent plate 6, which are respectively welded to the upper end port and the lower end port of the hollow tube body 4 to prevent leakage. By welding, the leakage of liquid and gas can be effectively prevented, ensuring the sealing of the humidifying device, and playing a physical blocking role. At the same time, combined with the transparent characteristics of the first transparent plate 5, the second transparent plate 6 and the hollow tube body 4, the operator can also observe the inside of the hollow tube body 4 to facilitate monitoring and maintenance. In another embodiment, the lower end port of the hollow tube body 4 is inclined, so that the second transparent plate 6 is inclined, and the waste outlet is located at the lowest part of the inclined surface, ensuring that the mixed liquid inside the device can be smoothly discharged and finally flow into the main liquid discharge pipe 11.

[0037] The first transparent plate 5 is fixed with an air inlet pipe 51 for communicating with PN2 and a liquid inlet pipe 53 for communicating with DIW, and the air inlet pipe 51 is provided with an air inlet valve 52; the liquid inlet pipe 53 is provided with a liquid inlet valve 54; in a further preferred embodiment, the air inlet valve 52 comprises a first hand valve 521 and a first knob adjusting valve 522; the liquid inlet valve 54 comprises a second hand valve 541 and a second knob adjusting valve 542; the first hand valve 521 is used to manually control the on-off of the gas in the air inlet pipe 51; the second hand valve 541 is used to manually control the on-off of the liquid in the liquid inlet pipe 53; the first knob adjusting valve 522 is used to adjust the gas flow of the air inlet pipe 51; the second knob adjusting valve 542 is used to adjust the liquid flow of the liquid inlet pipe 53; through the first knob adjusting valve 522 and the second knob adjusting valve 542, the gas flow and the liquid flow can be finely adjusted and controlled.

[0038] The second transparent plate 6 is provided with a waste outlet, and the waste outlet is fixedly connected with a waste discharge pipe 61, and the waste outlet is connected to the main liquid discharge pipe 11 of the semiconductor machine 1 through the waste discharge pipe 61, the waste discharge pipe 61 is provided with a waste discharge hand valve 612 for controlling the on-off of the waste discharge pipe 61; and the waste discharge pipe 61 is provided with a bending part 611 at a height of about 40 cm from the main liquid discharge pipe 11, the inlet end of the waste discharge pipe 61 is fixedly connected with the waste outlet vertically upward, and the outlet end of the waste discharge pipe 61 is connected with the main liquid discharge pipe 11 vertically downward. In this embodiment, the bending part 611 comprises two consecutive circular bends; in other embodiments, the bending part 611 comprises two consecutive U-shaped bends.

[0039] In the embodiment, the hollow pipe body 4, the first transparent plate 5 and the second transparent plate 6 are all made of PVC material, which has good chemical stability and transparency, so that the conditions inside the device can be seen at a glance; the air inlet pipe 51 and the liquid inlet pipe 53 are both made of PFA pipe with an outer diameter of 1 / 2 inch and an inner diameter of 3 / 8 inch, and the PFA material has excellent chemical resistance and high temperature resistance.

[0040] As shown in Figure 2 and Figure 3 The nitrogen sealing humidification device also includes a detachable fixing assembly, the hollow pipe body 4 is fixed to one side of the semiconductor machine 1 through the detachable fixing assembly, and the nitrogen sealing humidification device can adapt to different specifications and sizes of different semiconductor machines 1 and different pipe positions through the detachable fixing assembly, which has flexible adaptability, ensures the stability and operation convenience of the nitrogen sealing humidification device, and is convenient to disassemble and store when not in use.

[0041] The detachable fixing assembly includes a track frame 2 fixed to one side of the semiconductor machine 1 and a mounting ring 3 clamped on the hollow pipe body 4, the mounting ring 3 is movably connected with the track frame 2 and is locked and fixed on the track frame 2 through a second fastener, specifically, the mounting ring 3 is fixed with a sliding block on the back side, the track frame 2 is provided with a sliding groove with a shape matched with the sliding block, the sliding groove is provided with a threaded hole and is provided with a second fastener, so that the hollow pipe body 4 can move along the sliding groove direction of the track frame 2 with the mounting ring 3 and be fixed, thereby realizing the adjustment of the position of the hollow pipe body 4 and facilitating the connection of the pipe. In the embodiment, the back side of the track frame 2 is closely combined with one side of the semiconductor machine 1 and is locked and fixed on the semiconductor machine 1 through a first fastener, thereby improving the fixing stability of the nitrogen sealing humidification device and facilitating the arrangement of the pipes on the nitrogen sealing humidification device; and the number of the mounting ring 3 is two, the two mounting rings 3 are clamped on the upper end and the lower end of the hollow pipe body 4 respectively, and the two mounting rings 3 are locked and fixed on the track frame 2 through the second fastener. In other embodiments, as shown in Figure 4 The gasket 31 is arranged between the inner side wall of the mounting ring 3 and the outer side wall of the hollow pipe body 4, thereby effectively increasing the friction.

[0042] In actual work, the specific use method of the utility model is as follows:

[0043] First, by detachable fixed assembly nitrogen seal humidification device is installed and fixed in semiconductor machine table 1 one side. Specifically, first according to the current layout of drain main pipe 11 and semiconductor machine table 1, the longitudinal position of nitrogen seal humidification device is determined, and the track frame 2 is fixed on semiconductor machine table 1 using first fastener, to ensure that nitrogen seal humidification device is located above the drain main pipe 11 and avoid the obstacles on the side wall of semiconductor machine table 1;Then, the slider on the mounting ring 3 is inserted into the sliding slot of the track frame 2, and the second fastener is tightened to preliminarily fix the hollow pipe body 4, then the pipelines are connected, and the position of the hollow pipe body 4 is adjusted after loosening the second fastener, and the pipelines are arranged.

[0044] Then, open the first hand valve 521 and the second hand valve 541, so that PN2 enters through the inlet pipe 51, and DIW enters through the inlet pipe 53;Subsequently, open the waste hand valve 612 at the bottom, so that the mixed liquid enters the waste pipe 61 from the waste outlet;Adjust the PN2 inlet amount and the DIW inlet amount by adjusting the first knob valve 522 and the second knob valve 542, so as to realize the continuous humidification effect, and the nitrogen sealing effect can be realized without filling water in the device.

[0045] It should be noted that in the embodiment, each valve on each pipeline of the nitrogen sealing humidification device is connected with an external PLC controller signal, and the opening and closing of the valve is realized by the PLC controller. At the same time, the PLC controller receives the signal from the liquid level sensor and controls the start and stop of the first pneumatic valve. The above functions belong to the prior art, not the improvement of the PLC program itself, so they will not be described again.

[0046] The above only describes the preferred embodiments of the present application, and does not limit the present application. Any changes or equivalent replacements of the features and embodiments known by those skilled in the art without departing from the spirit and scope of the present application can be made. In addition, the features and embodiments can be modified to adapt to specific conditions and materials without departing from the spirit and scope of the present application. Therefore, the present application is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are within the scope of the present application.

Claims

1. A nitrogen-sealed humidification device for use on a semiconductor machine, characterized in that, The utility model relates to a kind of semiconductor cleaning device, including transparent hollow tube body (4), the upper end port and the lower end port of the hollow tube body (4) are fixed with first transparent plate (5) and second transparent plate (6) respectively;The hollow tube body (4), the first transparent plate (5) and the second transparent plate (6) are all PVC material; First transparent plate (5) is fixed with inlet pipe (51) and liquid inlet pipe (53) through;The inlet pipe (51) is used to connect high-purity nitrogen, and inlet valve (52) is equipped on the inlet pipe (51);The liquid inlet pipe (53) is used to connect pure water, and liquid inlet valve (54) is equipped on the liquid inlet pipe (53); Second transparent plate (6) is equipped with waste outlet, and waste pipe (61) is fixedly connected in the waste outlet, and the waste outlet is connected to the main pipe (11) of semiconductor machine (1) by waste pipe (61), and waste hand valve (612) is equipped on the waste pipe (61), for controlling the on-off of waste pipe (61);And, waste pipe (61) is equipped with bending portion (611) at a certain height from main pipe (11).

2. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 1, wherein The bending portion (611) includes two consecutive circular bends.

3. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 1, wherein The inlet valve (52) includes a first hand valve (521) and a first knob adjusting valve (522), and the liquid inlet valve (54) includes a second hand valve (541) and a second knob adjusting valve (542). The first hand valve (521) is used for manually controlling the on-off of the gas in the inlet pipe (51), and the first knob adjusting valve (522) is used for adjusting the gas flow of the inlet pipe (51). The second hand valve (541) is used for manually controlling the on-off of the liquid in the liquid inlet pipe (53), and the second knob adjusting valve (542) is used for adjusting the liquid flow of the liquid inlet pipe (53).

4. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 1, wherein The first transparent plate (5) and the second transparent plate (6) are respectively welded and fixed to the upper end port and the lower end port of the hollow tube body (4).

5. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 1, wherein The lower end port of the hollow tube body (4) is inclined, so that the second transparent plate (6) is an inclined slope, and the waste outlet is located at the lowest part of the slope.

6. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 1, wherein The diameter of the hollow tube body (4) is 100 mm, and the length ranges from 20 cm to 25 cm; the bending portion (611) is located at a height of about 40 cm from the main pipe (11) on the waste pipe (61).

7. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 1, wherein The inlet pipe (51) and the liquid inlet pipe (53) are both PFA pipes.

8. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 7, wherein, The outer diameter of the PFA pipe is 1 / 2 inch, and the inner diameter is 3 / 8 inch.

9. The nitrogen sealing and humidifying device for use in a semiconductor machine according to any one of claims 1-8, wherein, Further comprising a detachable fixing assembly, the hollow tube body (4) is installed and fixed on one side of the semiconductor machine (1) through the detachable fixing assembly, the detachable fixing assembly comprises a track frame (2) fixed on one side of the semiconductor machine (1) and a mounting ring (3) fixed on the hollow tube body (4), the mounting ring (3) is movably connected with the track frame (2) and locked and fixed on the track frame (2) through a second fastener.

10. The nitrogen sealing and humidifying device for use in a semiconductor machine according to claim 9, wherein, The mounting ring (3) is fixed with a sliding block on the back side, and the track frame (2) is provided with a sliding groove with a shape matched with the sliding block.

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