Sheet inserting machine

Abstract

The embodiment of the utility model provides a piece inserting machine which comprises a conveying unit, and the conveying unit comprises a working groove, a working table and a suction cup mechanism. The working table is arranged at a first position in the working groove, and a silicon wafer to be inserted is conveyed into the working groove; the sucker mechanism comprises a sucker and a first driving device for driving the sucker to move; the first driving device drives the suction cup to suck the silicon wafer from the working groove and transfer the silicon wafer to the workbench; the sheet pushing unit comprises a flower basket, a pushing plate and a second driving device, the pushing plate is arranged close to the workbench, and the flower basket is arranged on the side, opposite to the pushing plate, of the workbench; and the second driving device drives the push plate to move towards the flower basket so as to push the silicon wafers on the workbench into the flower basket. According to the embodiment of the invention, the silicon wafer is conveyed through the conveying unit, and under the condition that the silicon wafer is processed on the workbench, the silicon wafer is pushed into the flower basket; the silicon wafer is automatically inserted into the basket. The equipment is simple in structure and small in occupied space.

Description

Technical Field

[0001] This application relates to the field of photovoltaic cell technology, and more particularly to a cell insertion machine. Background Technology

[0002] Currently, in battery production workshops, the introduction and insertion of silicon wafers require corresponding automated equipment. Current automated equipment suffers from drawbacks such as complex structure, large size, high cost, and / or low efficiency.

[0003] Therefore, there is a need to provide a simple and intelligent silicon wafer insertion device to simplify the insertion process and improve work efficiency.

[0004] It should be noted that the above content is not necessarily prior art, nor is it intended to limit the scope of patent protection of this application. Utility Model Content

[0005] This application provides an inserter to solve or alleviate one or more of the technical problems mentioned above.

[0006] As one aspect of the embodiments of this application, this application provides a chip inserter, including:

[0007] The transfer unit includes a working slot, a worktable, and a suction cup mechanism. The worktable is positioned at a first location in the working slot, and the silicon wafer to be inserted is transferred into the working slot. The suction cup mechanism includes a suction cup and a first driving device for moving the suction cup. The first driving device drives the suction cup to pick up the silicon wafer from the working slot and transfer the silicon wafer to the worktable.

[0008] The wafer pushing unit includes a basket, a pusher plate, and a second drive device. The pusher plate is positioned close to the worktable, and the basket is positioned on the side of the worktable opposite to the pusher plate. The second drive device drives the pusher plate to move toward the basket to push the silicon wafer on the worktable into the basket.

[0009] In one embodiment, the first driving device includes a lead screw, a first rack, a first motor, a connecting block, and a telescopic cylinder; the lead screw and the first rack are arranged in parallel and are both mounted above the working groove, and the extension direction of the lead screw and the first rack is parallel to the extension direction of the working groove; the connecting block meshes with the lead screw, and the connecting block is connected between the telescopic cylinder and the first motor; the output shaft of the first motor meshes with the first rack; and the output end of the telescopic cylinder is fixedly connected to a suction cup.

[0010] In one embodiment, the pusher unit further includes a clamping member that clamps the pusher plate from both sides; a second driving device drives the clamping member to move; the second driving device includes a first connecting rod, a second connecting rod, and a third connecting rod; the first connecting rod and the second connecting rod are rotatably connected and rotatably connected to the clamping member; the second connecting rod is fixedly connected to the third connecting rod, and the third connecting rod is perpendicular to the extension line of the second connecting rod.

[0011] In one embodiment, the second drive device further includes a first transmission belt, a first roller, and a support rod; the support rod is fixedly connected to the working groove and extends in a direction perpendicular to the working groove; the first roller is mounted on the end of the support rod away from the working groove, and a third connecting rod passes through the support rod and is fixedly connected to the first roller; the first transmission belt is sleeved on the lead screw and the first roller.

[0012] In one embodiment, the pusher unit further includes a pusher platform; a pusher plate is located above the pusher platform and is slidably connected to the pusher platform.

[0013] In one embodiment, the pusher unit further includes a limiting plate; the limiting plate is fixedly installed above the pusher table; the limiting plate limits the height at which the pusher plate moves.

[0014] In one embodiment, the workbench includes a frame, a work panel, and two supports, which are mounted on the frame and support the work panel from opposite sides of the work panel.

[0015] In one embodiment, the side of the work panel relative to the push plate is rotatably connected to the frame; the worktable also includes a rotating mechanism, which includes a rotating shaft and a third drive device; the support is rotatably connected to the rotating shaft; the rotating shaft is mounted on the frame; the third drive device drives the rotating shaft to rotate.

[0016] In one embodiment, the third drive device includes a second motor, a second roller, and a second transmission belt; the second transmission belt is sleeved on the rotating shaft and the second roller, and the second motor drives the second roller to rotate.

[0017] In one embodiment, the worktable further includes an alignment mechanism, which includes an alignment plate, a second rack, and a gear meshing with the second rack; a third roller of the gear is mounted on the frame, at least one end of the alignment plate is fixedly connected to the second rack, and the other end of the alignment plate is rotatably connected to the support.

[0018] In this embodiment, silicon wafers are transported via a conveying unit, and after the wafers have been processed on the worktable, they are pushed into a basket, thus completing the automatic insertion of the wafers into the basket. This device has a simple structure and occupies little space. Attached Figure Description

[0019] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0020] Figure 1 This is a schematic diagram of the chip inserter provided in an embodiment of this application.

[0021] Figure 2 This illustration shows another structural diagram of the chip inserter provided in an embodiment of this application.

[0022] Figure 3 This diagram illustrates the structure of a portion of the drive unit of the chip inserter provided in an embodiment of this application. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other. The application will now be described in detail with reference to the accompanying drawings and embodiments.

[0024] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0025] In this application, when numerical intervals (i.e., numerical ranges) are involved, unless otherwise specified, the distribution of selectable numerical values ​​within the numerical interval is considered continuous, and includes the two endpoints of the numerical interval (i.e., the minimum and maximum values), as well as every numerical value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that numerical interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints, which is equivalent to directly listing every integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be merged. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all subranges included therein. The "numerical value" in the numerical interval can be any quantitative value, such as a number, percentage, ratio, etc. The term "numerical interval" can be broadly included to include percentage intervals, ratio intervals, proportion intervals, etc.

[0026] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. It should be understood that these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein.

[0027] This application provides an inserter. Figure 1 This is a schematic diagram of the chip inserter provided in an embodiment of this application. Figure 2 This illustration shows another structural diagram of the chip inserter provided in an embodiment of this application. Figure 3 This diagram illustrates the structure of a portion of the drive unit for the chip inserter provided in an embodiment of this application. For example... Figures 1 to 3 As shown, the chip inserter includes a conveying unit and a chip pushing unit.

[0028] The transfer unit includes a working slot 110, a worktable 120, and a suction cup mechanism; the worktable 120 is mounted in a first position in the working slot 110, and the silicon wafer to be inserted is transferred into the working slot 110; the suction cup mechanism includes a suction cup 131 and a first driving device for driving the suction cup 131 to move; the first driving device drives the suction cup 131 to pick up the silicon wafer from the working slot 110 and transfer the silicon wafer to the worktable 120.

[0029] The working slot 110 is a slot with an opening, resembling a trough, for performing wafer insertion operations, so that silicon wafers can be manipulated and processed from above the working slot 110. The two sides of the working slot 110 extending in the direction of extension may be open for docking with a silicon wafer conveyor, allowing a conveyor belt to transport silicon wafers into the working slot 110.

[0030] In this embodiment, a suction cup 131 is used to pick up the silicon wafer, so as to pick up the silicon wafer in the working slot 110 onto the worktable 120.

[0031] The wafer pushing unit includes a basket (not shown in the figure), a pusher plate 210, and a second driving device. The pusher plate 210 is located close to the worktable 120, and the basket is located on the side of the worktable 120 opposite to the pusher plate 210. The second driving device drives the pusher plate 210 to move toward the basket to push the silicon wafer on the worktable 120 into the basket.

[0032] The flower basket is a device for receiving silicon wafers; the pusher plate 210 is positioned close to the worktable 120 to push the silicon wafers on the worktable 120 toward the flower basket and into the flower basket.

[0033] The workbench 120 can perform inspection on silicon wafers. Qualified silicon wafers are pushed into the basket, while unqualified silicon wafers are processed separately and are not pushed into the basket by the pusher plate 210.

[0034] In this embodiment, silicon wafers are transported via a conveying unit, and after the wafers have been processed on the workbench 120, they are pushed into the basket, thus completing the automatic insertion of the silicon wafers into the basket. This device has a simple structure and occupies little space.

[0035] In one embodiment, the first driving device includes a lead screw 132, a first rack 133, a first motor 134, a connecting block 135, and a telescopic cylinder 136. Figure 1 and Figure 2 As shown, the lead screw 132 and the first rack 133 are arranged in parallel and both are mounted above the working groove 110, and the extension directions of the lead screw 132 and the first rack 133 are parallel to the extension direction of the working groove 110. The connecting block 135 meshes with the lead screw 132 and is connected between the telescopic cylinder 136 and the first motor 134. The output shaft of the first motor 134 meshes with the first rack 133, and the output end of the telescopic cylinder 136 is fixedly connected to the suction cup 131.

[0036] The first motor 134 starts, and its output shaft rotates. Based on its meshing with the first rack 133, the first motor 134 moves along the extension direction of the first rack 133. The first motor 134 is connected to the connecting block 135, so that the first motor 134 drives the connecting block 135 to move. The connecting block 135 is fixed to the telescopic cylinder 136, which drives the telescopic cylinder 136 to move. The telescopic cylinder 136 is fixedly connected to the suction cup 131. The telescopic cylinder 136 can adjust the height of the suction cup 131 so that the movement of the telescopic cylinder 136 can drive the suction cup 131 to move, and adjust the height of the suction cup 131 so that the suction cup 131 can pick up the silicon wafer from the working slot 110 and then place the silicon wafer onto the worktable 120.

[0037] In one example, the suction cup 131 can be a pneumatic suction cup. When suction is applied, the suction cup 131 picks up the silicon wafer, and when the suction is released, the suction cup 131 releases the silicon wafer. The suction cup 131 picks up the silicon wafer and, driven by the first motor 134, moves the silicon wafer along the working groove 110 to the worktable 120.

[0038] In one embodiment, the pusher unit further includes a clamping member 220, which clamps the pusher plate 210 from both sides; a second driving device drives the clamping member 220 to move; the second driving device includes a first connecting rod 231, a second connecting rod 232 and a third connecting rod 233; the first connecting rod 231 and the second connecting rod 232 are rotatably connected and rotatably connected to the clamping member 220; the second connecting rod 232 is fixedly connected to the three-bar linkage, and the third connecting rod 233 is perpendicular to the extension line of the second connecting rod 232.

[0039] The pusher plate 210 requires a second drive unit to move it, thus pushing the silicon wafer off the worktable 120 and onto the basket.

[0040] By clamping the push plate 210 from both sides, the drive clamp 220 can drive the push plate 210. The clamp 220 is fixedly connected to the push plate 210, and exemplarily, it can be fixed to the end of the push plate 210 opposite to the worktable 120.

[0041] The external structure of the clamping member 220 can be adapted to the second drive device.

[0042] In the second drive unit, such as Figure 1 and Figure 2 As shown, the rotation of the third link 233 drives the second link 232 to perform circular motion. Simultaneously, the circular motion of the second link 232 drives the first link 231 to reciprocate along the pushing direction of the push plate 210, thereby driving the clamping member 220 to reciprocate. During the reciprocating motion of the clamping member 220, as it moves towards the worktable 120, it drives the push plate 210 to move towards the worktable 120, pushing the silicon wafer out and into the basket. The height of the push plate 210 is adapted to the height of the worktable 120.

[0043] In this embodiment, the rotation of the third link 233 drives the clamping member 220 to move, thereby moving the push plate 210. This is achieved through mechanical drive, which is simple, consumes little power, requires no large mechanical parts, and makes the mechanical operation readily apparent.

[0044] In one embodiment, the second drive unit further includes a first transmission belt 234 ( Figure 1(omitted), first roller 235 and support rod 236; support rod 236 is fixedly connected to working groove 110 and extends in a direction perpendicular to working groove 110; first roller 235 is mounted on the end of support rod 236 away from working groove 110, and third connecting rod 233 passes through support rod 236 and is fixedly connected to first roller 235; first conveyor belt 234 is sleeved on lead screw 132 and first roller 235.

[0045] In the example above, driving the third link 233 to rotate enables the pusher plate 210 to automatically push the silicon wafer into the basket. It can be seen that the rotation of the third link 233 can be achieved using a motor.

[0046] In this embodiment, instead of using a motor to drive the third link 233 to rotate, the second drive device is driven by the driving force of the first drive device. This reduces the number of motors and energy consumption, while also achieving synchronous cooperation between the suction cup 131 and the push plate 210.

[0047] The third link 233 is fixedly connected to the first roller 235. When the first motor 134 is started, the connecting block 135 drives the lead screw 132 to rotate. The first conveyor belt 234 is started under the drive of the lead screw 132 and drives the first roller 235 to rotate, thereby realizing the rotation of the third link 233.

[0048] In one example, the lead screw 132 is threaded, and the pitch, the length of the second connecting rod 232, the length of the first connecting rod 231, and the stroke of the push plate 210 are coordinated so that when the suction cup 131 moves from the working slot 110 to the worktable 120, the push plate 210 just returns to the position close to the wafer pusher; the suction cup 131 continues to move toward the working slot 110, and the push plate 210 pushes the silicon wafer forward; the suction cup 131 retracts and returns to the initial position, and the push plate 210 returns to the position of pushing out the silicon wafer after one or an integer number of reciprocations; the suction cup 131 moves again to the middle of the worktable 120, and the push plate 210 moves away from the worktable 120 until one end of the push plate 210 away from the clamping member 220 is close to the worktable 120, the suction cup 131 drops the silicon wafer into the worktable 120, and continues to move forward, so that the push plate 210 pushes out the silicon wafer.

[0049] In this embodiment, the third link 233 is driven by the cooperation of mechanical components, which reduces energy consumption. Furthermore, based on the cooperation of the parameters of the mechanical components, the suction cup 131 and the push plate 210 are synchronized. It is not necessary to determine the timing of the push plate 210's ejection by receiving signals or sending commands, which reduces communication control and further saves costs.

[0050] In one embodiment, the pusher unit further includes a pusher table 240; a pusher plate 210 is located above the pusher table 240 and is slidably connected to the pusher table 240.

[0051] In this embodiment, the pusher plate 210 is disposed on the pusher table 240 and is slidably connected to the pusher table 240, so that the pusher plate 210 has a stable height and pushes the silicon wafer more smoothly and stably. The height of the pusher table 240 can be adapted to the height of the worktable 120, thus avoiding the need for adjusting the height of the pusher plate 210.

[0052] In one embodiment, the pusher unit further includes a limiting plate (not shown in the figure); the limiting plate is fixedly installed above the pusher table 240; the limiting plate limits the height at which the pusher plate 210 moves.

[0053] The limiting plate is set above the push plate 210 and is fixedly installed on the push table 240. The limiting plate limits the height of the push plate 210, which can prevent dust from falling on the push plate 210 and affecting the cleanliness of the silicon wafer. At the same time, it can prevent the push plate 210 from being too high and making it difficult to contact the silicon wafer.

[0054] In one embodiment, the workbench 120 includes a frame 121, a work panel 122, and two support tables 123. The two support tables 123 are mounted on the frame 121 and support the work panel 122 from opposite sides of the work panel 122.

[0055] In this embodiment, the surface of the work panel 122 forms the surface of the worktable 120, and the silicon wafer is placed on the surface of the work panel 122 when it is placed into the worktable 120. The work panel 122 is supported by two support platforms 123 on both sides. The two support platforms 123 are distributed along the extension direction of the work slot 110, supporting the work panel 122 from both sides. The support platform 123 frame 121 is mounted on the platform 121 for fixation.

[0056] This embodiment of the application uses two support platforms 123 to lift the work panel 122 from both sides, which allows the work panel 122 to be disassembled and replaced, preventing damage to the silicon wafer in the event of breakage of the work panel 122. This improves the service life of the wafer insertion machine.

[0057] The two support platforms 123 can be plate-shaped, with their length direction parallel to the direction in which the pusher plate 210 pushes out the silicon wafer.

[0058] In one embodiment, the side of the work panel 122 relative to the push plate 210 is rotatably connected to the frame 121; the worktable 120 also includes a rotating mechanism, which includes a rotating shaft 124 and a third driving device; the support 123 is rotatably connected to the rotating shaft 124; the rotating shaft 124 is mounted on the frame 121; the third driving device drives the rotating shaft 124 to rotate.

[0059] The work panel 122 is rotatably connected to the frame 121, and the support platform 123 is rotatably connected to the frame 121. When the support platforms 123 on both sides rotate downwards, the work panel 122 loses its support and forms a slope, causing the silicon wafers on the work panel 122 to slide down the slope to the bottom of the push table 240.

[0060] In one example, the pusher 240 and the box-type structure have an opening on the side facing the worktable 120, allowing the silicon wafer sliding down the work panel 122 to slide into the bottom plate 241 of the box.

[0061] In one example, a detection device for detecting whether silicon wafers are qualified is provided on or below the work panel 122. If the detection device detects that the silicon wafer is qualified, the push plate 210 pushes the silicon wafer out to the basket; if the detection device detects that the silicon wafer is unqualified, the support platform 123 rotates downward, the work panel 122 forms a ramp, and the silicon wafer slides down into the box to collect the unqualified silicon wafer.

[0062] In one example, a perforation 1201 can be provided on the working panel 122, and the detection device can be disposed within the perforation 1201 and kept flush with the working panel 122; or the detection device can be disposed below the working panel 122 and collect information based on the orientation of the perforation 1201 toward the silicon wafer to detect whether the silicon wafer is qualified.

[0063] The wafer insertion machine provided in this application embodiment can perform wafer insertion and can also accommodate unqualified silicon wafers. It has a simple structure, requires no extra energy consumption, and does not occupy extra space. The wafer insertion machine has comprehensive functions and can handle a full range of tasks.

[0064] In one embodiment, the third drive device includes a second motor (not shown), a second roller 1252, and a second transmission belt 1251; the second transmission belt 1251 is sleeved on the rotating shaft 124 and the second roller 1252, and the second motor drives the second roller 1252 to rotate.

[0065] The second motor starts, driving the second roller 1252 to rotate, which in turn drives the second conveyor belt 1251 to rotate. The second conveyor belt 1251 drives the rotating shaft 124 to rotate, thereby causing the support platform 123 to rotate downwards, so that the working panel 122 forms a slope.

[0066] The second motor can be started manually or according to a control command. Upon receiving the detection result from the detection device, a control command is issued to make the second motor rotate.

[0067] In one embodiment, the worktable 120 further includes an alignment mechanism, which includes an alignment plate 1261, a second rack 1262, and a gear 1263 meshing with the second rack 1262; a third roller 1264 of the gear 1263 is mounted on the frame 121; at least one end of the alignment plate 1261 is fixedly connected to the second rack 1262; and the other end of the alignment plate 1261 is rotatably connected to the support table 123.

[0068] Gear 1263 can be driven by a third motor, which, when rotating, drives the rack to move along the direction extending from the working groove 110. At least one end of the alignment plate 1261 is fixedly connected to the second rack 1262. The alignment plate 1261 can be fixed to the side of the rack flush with it, i.e., the side that does not mesh with the gear 1263. The fixed connection between the alignment plate 1261 and the rack can be achieved through other intermediate parts, so that the alignment plate 1261 is positioned appropriately above the support 123. The other end of the alignment plate 1261 is rotatably connected to the support 123. This rotatable connection can be a horizontal rotation, i.e., it does not affect the rotation of the alignment plate 1261 as it moves with the second rack 1262.

[0069] The alignment plates 1261 on both sides of the working panel 122 rotate to face each other, so that the position of the silicon wafer on the working panel 122 is aligned with the basket, which facilitates the pusher plate 210 to push out the silicon wafer. The height of the alignment plate 1261 can be in contact with the working panel 122, or it can be at the same height as the working panel 122 but not in contact, but the height difference is less than half the thickness of the silicon wafer.

[0070] In one example, the central portion of the alignment plate 1261 protrudes beyond the sides, allowing the central portion to push the silicon wafer to maintain alignment, while the side portions are recessed inward to avoid affecting the rotation of the work panel 122. The work panel 122 is mounted on the stage 123 and may not extend beyond the side portions of the alignment plate 1261 to prevent the side portions from obstructing the rotation of the work panel 122. The work panel 122 is mounted on the stage 123 and may extend beyond the central portion of the alignment plate 1261 so that the central portion can be on the work panel 122 to process the silicon wafer.

[0071] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0072] For ease of description, directional terms such as "front, back, up, down, left, right," "horizontal, vertical, horizontal," and "top, bottom" generally indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are used solely for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner or outer contours relative to the components themselves. For example, if a device in the drawings is inverted, a device described as "above" or "on top of" other devices or structures will subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0073] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0074] Unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0075] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0076] It should also be noted that the terms "one embodiment," "another embodiment," or "embodiment" used in this specification refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this application.

[0077] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0078] It should also be noted that the above are merely preferred embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A chip inserter, characterized in that, include: The conveying unit includes a working slot, a worktable, and a suction cup mechanism; The workbench is positioned at a first location within the work slot, and the silicon wafer to be inserted is conveyed into the work slot; the suction cup mechanism includes a suction cup and a first driving device for moving the suction cup. The first driving device drives the suction cup to pick up the silicon wafer from the working slot and transfer the silicon wafer to the working table; The wafer pushing unit includes a basket, a pusher plate, and a second driving device. The pusher plate is disposed near the worktable, and the basket is disposed on the side of the worktable opposite to the pusher plate. The second driving device drives the pusher plate to move toward the basket to push the silicon wafer on the worktable into the basket.

2. The chip inserter according to claim 1, characterized in that, The first driving device includes a lead screw, a first rack, a first motor, a connecting block, and a telescopic cylinder; the lead screw and the first rack are arranged in parallel and are both mounted above the working groove, and the extension direction of the lead screw and the first rack is parallel to the extension direction of the working groove; the connecting block meshes with the lead screw, and the connecting block is connected between the telescopic cylinder and the first motor; the output shaft of the first motor meshes with the first rack; and the output end of the telescopic cylinder is fixedly connected to the suction cup.

3. The inserter according to claim 2, characterized in that, The pusher unit further includes a clamping member that clamps the pusher plate from both sides; the second driving device drives the clamping member to move; the second driving device includes a first connecting rod, a second connecting rod, and a third connecting rod; the first connecting rod and the second connecting rod are rotatably connected and rotatably connected to the clamping member; the second connecting rod is fixedly connected to the third connecting rod, and the third connecting rod is perpendicular to the extension line of the second connecting rod.

4. The inserter according to claim 3, characterized in that, The second drive device further includes a first conveyor belt, a first roller, and a support rod; the support rod is fixedly connected to the working groove and extends in a direction perpendicular to the working groove; the first roller is mounted on the end of the support rod away from the working groove, and the third connecting rod passes through the support rod and is fixedly connected to the first roller; the first conveyor belt is sleeved on the lead screw and the first roller.

5. The inserter according to claim 3, characterized in that, The pusher unit also includes a pusher platform; the pusher plate is located above the pusher platform and is slidably connected to the pusher platform.

6. The chip inserter according to claim 5, characterized in that, The pusher unit also includes a limiting plate; the limiting plate is fixedly installed above the pusher platform; the limiting plate limits the height at which the pusher moves.

7. The chip inserter according to claim 1, characterized in that, The workbench includes a frame, a work panel, and two support platforms. The two support platforms are mounted on the frame and support the work panel from opposite sides of the work panel.

8. The inserter according to claim 7, characterized in that, The side of the work panel relative to the push plate is rotatably connected to the frame; the worktable also includes a rotating mechanism, which includes a rotating shaft and a third driving device; the support is rotatably connected to the rotating shaft; the rotating shaft is mounted on the frame; the third driving device drives the rotating shaft to rotate.

9. The inserter according to claim 8, characterized in that, The third driving device includes a second motor, a second roller, and a second transmission belt; the second transmission belt is sleeved on the rotating shaft and the second roller, and the second motor drives the second roller to rotate.

10. The inserter according to claim 7, characterized in that, The worktable also includes an alignment mechanism, which includes an alignment plate, a second rack, and a gear meshing with the second rack; the third roller of the gear is mounted on the frame, at least one end of the alignment plate is fixedly connected to the second rack, and the other end of the alignment plate is rotatably connected to the support.

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