Automatic transfer device for chip test verification test

Abstract

The utility model relates to the field of chip production detection equipment, and discloses an automatic transfer device for chip test verification test, which comprises a vertical driving mechanism and a limiting protection sleeve structure which correspond to each other up and down and are vertically fixed, and a deformable protection head is arranged at the lower end of the limiting protection sleeve structure. An adsorption head at the lower end of the chip adsorption mechanism is vertically arranged in the limiting protection sleeve structure, the upper end of the adsorption head is connected with the driving end of the vertical driving mechanism, and when the vertical driving mechanism drives the chip adsorption mechanism to move downwards, the vertical driving mechanism drives the protection head to deform to open the channel for the adsorption head and the adsorbed chip to pass through; and when the vertical driving mechanism drives the chip adsorption mechanism to move upwards until the chip adsorbed by the adsorption head is located in the limiting protection sleeve structure, the protection head resets along with the chip adsorption mechanism to protect and limit the side and the lower part of the chip adsorbed by the adsorption head. The operation fault tolerance and safety of chip transfer in the use process are effectively improved, and the influence of accidental falling factors of the chip on the test result is avoided.

Description

Technical Field

[0001] This utility model relates to the field of chip production and testing equipment, and in particular to an automated transfer device for chip testing and verification. Background Technology

[0002] In chip manufacturing, detailed performance testing of small batches of chip samples is often required to inform subsequent production decisions. During this testing, chips are typically transferred from a storage tray to testing equipment using an adsorption mechanism. However, automated transfer equipment, operating at high speeds and efficiency, can sometimes detach and fall from the adsorption mechanism due to unstable adsorption or pressure. These chips may fall onto the ground or into gaps in the testing equipment, potentially causing damage. If this fall isn't detected immediately, searching for these tiny chips later can be time-consuming. Because the testing is done in small batches, even damage to a single chip can significantly impact the overall test results. Utility Model Content

[0003] This invention provides an automated transfer device for chip testing and verification, which solves the technical problem that during long-term use of automated chip transfer equipment, chips may fall off the adsorption mechanism due to unstable chip adsorption or unstable adsorption gas pressure, thus affecting the test results, when conducting detailed tests on the performance of small batches of chip samples.

[0004] The technical solution adopted by this utility model to solve its technical problem is: an automated transfer device for chip testing and verification, including a vacuum mechanism, a chip adsorption mechanism connected to the vacuum mechanism, a vertical drive mechanism for driving the chip adsorption mechanism to move vertically, and a horizontal drive mechanism for driving the vertical drive mechanism to move horizontally. A vertical plate driven by the horizontal drive mechanism is vertically fixed on the horizontal drive mechanism. The vertical drive mechanism is vertically fixed on the vertical plate, and a limit protection sleeve structure is vertically fixed below the vertical drive mechanism on the vertical plate. A deformable protective head is provided at the lower end of the limit protection sleeve structure. The main body of the structure is vertically installed within the limiting protective sleeve structure, with its upper end connected to the drive end of the vertical drive mechanism. The lower end of the chip adsorption mechanism has an adsorption head located within the limiting protective sleeve structure and connected to a vacuum mechanism. When the vertical drive mechanism drives the chip adsorption mechanism downward within the limiting protective sleeve structure, it drives the protective head to deform and open a channel for the adsorption head and the adsorbed chip to pass through. When the vertical drive mechanism drives the chip adsorption mechanism upward within the limiting protective sleeve structure until the chip adsorbed by the adsorption head is inside the limiting protective sleeve structure, the protective head then resets to provide lateral and under-protection limiting for the chip adsorbed by the adsorption head. This prevents the chip from falling out of the transfer device during the transfer process, effectively improving the operational fault tolerance and safety of chip transfer during use, and avoiding the impact of accidental chip drops on test results.

[0005] Furthermore, the lower outer wall of the limiting protective sleeve structure is uniformly surrounded by multiple horizontal clearance holes extending into its interior. The protective head includes elastic rods of the same number as the clearance holes. The upper ends of the multiple elastic rods are fixed above the clearance holes on the limiting protective sleeve structure. The elastic rods and the clearance holes are respectively provided with driving protrusions extending into the limiting protective sleeve structure through the clearance holes. The lower ends of the multiple elastic rods are located below the limiting protective sleeve structure and are provided with anti-fall protrusions extending horizontally towards the axis of the limiting protective sleeve structure. The chip adsorption mechanism includes a driving rod and an adsorption rod that are connected vertically. The driving rod is cylindrical in shape and its outer diameter is larger than that of the adsorption rod. The vertical projection of the adsorption rod is located inside the vertical projection of the multiple driving protrusions. The outer side of the lower end of the driving rod corresponds to the vertical direction of the driving protrusions and is set as a smooth driving arc surface. During the rapid operation of automated equipment, even if the chip is detached from the adsorption head due to unstable adsorption or vacuum adsorption, it will be protected by the protective head to prevent it from falling and affecting the chip, thus providing good protection.

[0006] Furthermore, the corners of the upper and lower end faces on the inner side of the driving protrusion are both set as smooth arc surfaces. This facilitates the driving arc surfaces to drive the driving protrusion and avoids jamming during operation.

[0007] Furthermore, the drive rod and the adsorption rod are an integral structure with their axes aligned and are provided with air holes that connect vertically. The vacuum mechanism and the adsorption head are respectively connected to the air holes at the upper end of the drive rod and the lower end of the adsorption rod. The structure is simple and stable, with a low leakage failure rate.

[0008] Furthermore, the limiting protective sleeve structure includes an upper body and a lower body with threaded connections. Multiple clearance holes are evenly arranged around the outer wall of the lower body and horizontally extend into its interior. The upper ends of multiple elastic rods are fixed above the clearance holes on the lower body. If the lower body is damaged during long-term use, it can be directly replaced.

[0009] Furthermore, the upper surface of the anti-drop protrusion is provided with an elastic protective layer. This provides further protection for the chip if it is accidentally thrown off, effectively preventing the impact of bumps on the chip.

[0010] Furthermore, a pressure alarm device is installed at the air vent connecting the upper end of the drive rod to the vacuum mechanism. This allows for timely handling of chip detachment incidents, providing intelligent protection. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the external structure of the chip adsorption mechanism, vertical drive mechanism, limit protection sleeve structure, protective head and vertical plate from a first-person perspective.

[0012] Figure 2 This is a schematic diagram of the vertical cross-section of the chip adsorption mechanism in the limiting protective sleeve structure when it has not moved downward, from a second perspective.

[0013] Figure 3 This is a schematic diagram of the vertical cross-section of the chip adsorption mechanism after it moves downward in the limiting protective sleeve structure from a third-person perspective.

[0014] Figure 4 This is a schematic diagram of the vertical cross-section of the limiting protective sleeve structure from a fourth-person perspective.

[0015] The components in the diagram are labeled as follows: chip adsorption mechanism 100, drive rod 110, drive arc surface 111, adsorption rod 120, adsorption head 130, vertical drive mechanism 200, limiting protective sleeve structure 300, upper body 310, lower body 320, clearance hole 321, protective head 330, elastic rod 331, drive protrusion 332, anti-fall protrusion 333, elastic protective layer 334, and vertical plate 401. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0017] like Figure 1 and Figure 2An automated transfer device for chip testing and verification, as shown, includes a vacuum mechanism, a chip adsorption mechanism 100 connected to the vacuum mechanism, a vertical drive mechanism 200 that drives the chip adsorption mechanism 100 to move vertically, and a horizontal drive mechanism that drives the vertical drive mechanism 200 to move horizontally. A vertical plate 401 driven by the horizontal drive mechanism is vertically fixed on the horizontal drive mechanism. The vertical drive mechanism 200 is vertically fixed on the vertical plate 401, and a limit protection sleeve structure 300 is vertically fixed below the vertical drive mechanism 200 on the vertical plate 401. A deformable protective head 330 is provided at the lower end of the limit protection sleeve structure 300. The main body of the chip adsorption mechanism 100 is vertically mounted on the limit protection sleeve structure 300. The upper end of the sleeve structure 300 is connected to the driving end of the vertical driving mechanism 200. The lower end of the chip adsorption mechanism 100 is provided with an adsorption head 130 located inside the limiting protective sleeve structure 300 and connected to the vacuum mechanism. When the vertical driving mechanism 200 drives the chip adsorption mechanism 100 to move downward inside the limiting protective sleeve structure 300, it drives the protective head 330 to deform and open the channel for the adsorption head 130 and the adsorbed chip to pass through. When the vertical driving mechanism 200 drives the chip adsorption mechanism 100 to move upward inside the limiting protective sleeve structure 300 until the chip adsorbed by the adsorption head 130 is inside the limiting protective sleeve structure 300, the protective head 330 then resets to protect and limit the side and bottom of the chip adsorbed by the adsorption head 130.

[0018] In practice, the vacuum mechanism is a commercially available vacuum device, which is connected to the chip adsorption mechanism 100 via a gas guide pipe and a pressure control valve. The horizontal drive mechanism is a combination of a transverse horizontal drive mechanism and a longitudinal horizontal drive mechanism. Both the transverse and longitudinal horizontal drive mechanisms are linear motors. The vertical drive mechanism 200 is a high-precision, stroke-controllable cylinder. In actual implementation, the horizontal drive mechanism can also be an independent linear motor or a stroke-controllable cylinder, and the vertical drive mechanism 200 can also be a linear motor or a linear drive mechanism.

[0019] When transferring and picking up a chip: The horizontal drive mechanism drives the vertical drive mechanism 200 to move to a position where the chip adsorption mechanism 100 is directly above the chip to be picked up. The vertical drive mechanism 200 drives the chip adsorption mechanism 100 to move downward, and the chip adsorption mechanism 100 drives the protective head 330 to deform and open the channel. Before the adsorption head 130 passes through the protective head 330, the protective head 330 has opened a channel large enough for the adsorption head 130 and the chip to pass through. As the chip adsorption mechanism 100 is driven to continue moving downward, the lower end of the chip adsorption mechanism 100 moves down to below the limiting protective sleeve structure 300, and continues to move downward until the vacuum mechanism generates an adsorption force to adsorb the chip after the adsorption head 130 contacts the chip. Then the vertical drive mechanism 200 drives the chip adsorption mechanism 100 to move upward. After the adsorption head 130 and the chip enter the inner cavity of the lower end of the limiting protective sleeve structure 300, the protective head 330 continues to move upward with the chip adsorption mechanism 100 and resets to limit and protect the chip from below and to the side.

[0020] During chip transfer and placement: The horizontal drive mechanism drives the vertical drive mechanism 200 to move above the corresponding chip placement position. The vertical drive mechanism 200 drives the chip adsorption mechanism 100 to move downward. The chip adsorption mechanism 100 then drives the protective head 330 to deform and open the channel. Before the adsorption head 130 passes through the protective head 330, the protective head 330 has already opened a channel large enough for the adsorption head 130 and the chip to pass through. As the chip adsorption mechanism 100 continues to move downward, its lower end moves down to below the limiting protective sleeve structure 300. When it continues to move downward to the placement position, the vacuum mechanism generates a force to cancel the adsorption and provides a slight reverse pressure to make the chip fall off to the corresponding position. After the chip is placed, the vertical drive mechanism 200 drives the chip adsorption mechanism 100 to move upward. After the adsorption head 130 enters the inner cavity of the lower end of the limiting protective sleeve structure 300, the protective head 330 continues to move upward and reset with the chip adsorption mechanism 100.

[0021] When the adsorption head 130 is adsorbing and picking up the chip, the lower end is located below the protective head 330, and there is a certain distance between the two. This distance can be determined according to the actual situation. When picking up and placing the chip in the concave acupoint, the protective head 330 does not cause obstruction.

[0022] During the transfer process, if the chip accidentally falls from the adsorption head 130, it is intercepted and limited by the protective head 330 to prevent it from falling completely out of the transfer device. This effectively improves the fault tolerance and safety of chip transfer during use and avoids the impact of accidental chip drops on the test results.

[0023] Based on the above, such as Figures 1 to 4As shown, the lower outer wall of the limiting protective sleeve structure 300 is uniformly surrounded by a plurality of horizontally penetrating clearance holes 321. The protective head 330 includes elastic rods 331 in the same number as the clearance holes 321. The upper ends of the plurality of elastic rods 331 are fixed above the clearance holes 321 on the limiting protective sleeve structure 300. A driving protrusion 332 is provided at the position corresponding to the clearance hole 321 on each elastic rod 331, extending through the clearance hole 321 into the limiting protective sleeve structure 300. The lower ends of the plurality of elastic rods 331 are... Below the limiting protective sleeve structure 300, there is an anti-falling protrusion 333 extending horizontally toward the axis of the limiting protective sleeve structure 300. The chip adsorption mechanism 100 includes a driving rod 110 and an adsorption rod 120 that are connected vertically. The driving rod 110 is cylindrical in shape and its outer diameter is larger than that of the adsorption rod 120. The vertical projection of the adsorption rod 120 is located inside the vertical projection of multiple driving protrusions 332. The outer side of the lower end of the driving rod 110 corresponds to the vertical direction of the driving protrusions 332 and is set as a smooth driving arc surface 111.

[0024] In this specific embodiment, there are eight clearance holes 321 and eight elastic rods 331, which are evenly arranged. In specific implementation, the number of clearance holes 321 and elastic rods 331 depends on the actual situation. Six and eight are preferred. When the number is small, the structure of the elastic rods 331 is larger, and more force needs to be applied during operation, which is inconvenient to operate and the elastic deformation and recovery durability are not good enough. When the number is too large, the structure is too complicated, which is inconvenient to process and the cost increases significantly.

[0025] In specific operation, when the vertical drive mechanism 200 drives the drive rod 110 to move downward, the drive arc surface 111 at the lower end of the drive rod 110 first contacts the drive protrusion 332, causing the drive protrusion 332 to move outward elastically. The elastic rod 331 then deforms outward, and the anti-fall protrusion 333 at the lower end of the elastic rod 331 moves outward away from the position corresponding to the lower section of the inner cavity of the limiting protective sleeve structure 300. As the drive rod 110 continues to move downward, the lower end of the adsorption rod 120 and the adsorption head 130 at the lower end of the adsorption rod 120 can be moved down to below the limiting protective sleeve structure 300 and the anti-fall protrusion 333 to facilitate the picking and placing of chips.

[0026] When the vertical drive mechanism 200 drives the drive rod 110 to move upward, the lower end of the adsorption rod 120 and the adsorption head 130 at the lower end of the adsorption rod 120 move upward above the lower end of the limiting protective sleeve structure 300 and the anti-falling boss 333. The drive rod 110 continues to move upward, and the drive arc surface 111 at the lower end of the drive rod 110 gradually disengages from the drive protrusion 332. The elastic rod 331 gradually resets, and the anti-falling boss 333 resets to below the limiting protective sleeve structure 300, which can limit and protect the chip in the cavity of the lower limiting protective sleeve structure 300.

[0027] During the chip transfer process, the chip is located inside the cavity of the limiting protective sleeve structure 300. During the rapid operation of the automated equipment, even if the chip is thrown off from the adsorption head 130 due to unstable adsorption or unstable vacuum adsorption, it will be limited and protected by the protective head 330 to prevent it from falling and affecting the chip, thus providing good protection.

[0028] Based on the above, such as Figure 2 , Figure 3 and Figure 4 As shown, the corners of the upper and lower end faces of the inner side of the driving protrusion 332 are both set as smooth arc surfaces. This facilitates the driving arc surface 111 to drive the driving protrusion 332 and avoids jamming during operation.

[0029] Based on the above, such as Figure 2 and Figure 3 As shown, the drive rod 110 and the adsorption rod 120 are an integral structure with their axes coincident and are provided with air holes that connect vertically. The vacuum mechanism and the adsorption head 130 are respectively connected to the air holes at the upper end of the drive rod 110 and the lower end of the adsorption rod 120. The structure is simple and stable, with a low air leakage failure rate.

[0030] Based on the above, such as Figures 2 to 4 As shown, the limiting protective sleeve structure 300 includes an upper body 310 and a lower body 320 with upper and lower threads connected together. Multiple clearance holes 321 are evenly arranged around the outer wall of the lower body 320 and horizontally extend into the interior of the lower body 320. The upper ends of multiple elastic rods 331 are fixed above the clearance holes 321 on the lower body 320, corresponding to each other. If the lower body 320 is damaged during long-term use, it can be directly replaced.

[0031] Based on the above, such as Figure 4 As shown, the upper surface of the anti-drop protrusion 333 is provided with an elastic protective layer 334. This provides further protection for the chip if it is accidentally thrown off, effectively avoiding the impact of bumps on the chip.

[0032] Based on the above, such as Figure 2 and Figure 3As shown, a pressure alarm device is installed at the air vent at the upper end of the drive rod 110, which connects to the vacuum mechanism. In specific implementation, the pressure alarm device is a commercially available pressure detection device used to monitor the pressure in the air vent of the drive rod 110 in real time. During the adsorption and transfer process, when the chip falls off the adsorption head 130, the pressure in the air vent will change drastically. When the pressure detection device detects the drastic change in pressure, it feeds back to the control mechanism. The control mechanism promptly stops the transfer of the chip and issues an alarm to the operator, preventing the chip from being bumped or knocked within the protective limit space of the protective head 330 after accidentally falling off the adsorption head 130. This allows personnel to handle the chip detachment situation in a timely manner, providing intelligent protection.

[0033] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automated transfer device for chip testing and verification, comprising a vacuum mechanism, a chip adsorption mechanism (100) connected to the vacuum mechanism, a vertical drive mechanism (200) for driving the chip adsorption mechanism (100) to move vertically, and a horizontal drive mechanism for driving the vertical drive mechanism (200) to move horizontally, characterized in that: A vertical plate (401) driven by the horizontal drive mechanism is vertically fixed on the horizontal drive mechanism. The vertical drive mechanism (200) is vertically fixed on the vertical plate (401), and a limiting protective sleeve structure (300) is vertically fixed below the vertical drive mechanism (200) on the vertical plate (401). A deformable protective head (330) is provided at the lower end of the limiting protective sleeve structure (300). The main body of the chip adsorption mechanism (100) is vertically arranged inside the limiting protective sleeve structure (300), and its upper end is connected to the drive end of the vertical drive mechanism (200). A limiting protective sleeve structure is provided at the lower end of the chip adsorption mechanism (100). The adsorption head (130) is located inside the cylindrical structure (300) and connected to the vacuum mechanism. When the vertical drive mechanism (200) drives the chip adsorption mechanism (100) to move downward inside the limiting protective sleeve structure (300), it drives the protective head (330) to deform and open the channel for the adsorption head (130) and the adsorbed chip to pass through. When the vertical drive mechanism (200) drives the chip adsorption mechanism (100) to move upward inside the limiting protective sleeve structure (300) until the chip adsorbed by the adsorption head (130) is located inside the limiting protective sleeve structure (300), the protective head (330) then resets to protect and limit the side and bottom of the chip adsorbed by the adsorption head (130).

2. The automated transfer device for chip testing and verification according to claim 1, characterized in that: The lower outer wall of the limiting protective sleeve structure (300) is uniformly surrounded by a plurality of horizontally penetrating clearance holes (321). The protective head (330) includes elastic rods (331) in the same number as the clearance holes (321). The upper ends of the plurality of elastic rods (331) are fixed one-to-one above the clearance holes (321) on the limiting protective sleeve structure (300). The elastic rods (331) and the clearance holes (321) are provided with driving protrusions (332) extending through the clearance holes (321) into the limiting protective sleeve structure (300) at the corresponding positions. The lower ends of the plurality of elastic rods (331) are... Below the limiting protective sleeve structure (300) and provided with a horizontally extending anti-falling boss (333) towards the axis of the limiting protective sleeve structure (300), the chip adsorption mechanism (100) includes a drive rod (110) and an adsorption rod (120) connected vertically. The drive rod (110) is cylindrical in shape and its outer diameter is larger than that of the adsorption rod (120). The vertical projection of the adsorption rod (120) is located inside the vertical projection of multiple drive protrusions (332). The outer side of the lower end of the drive rod (110) corresponds to the vertical direction of the drive protrusions (332) and is set as a smooth drive arc surface (111).

3. The automated transfer device for chip testing and verification according to claim 2, characterized in that: The corners of the upper and lower end faces inside the drive protrusion (332) are all set as smooth arc surfaces.

4. The automated transfer device for chip testing and verification according to claim 2, characterized in that: The drive rod (110) and the adsorption rod (120) are an integral structure with their axes overlapping and are provided with air holes that are connected vertically. The vacuum mechanism and the adsorption head (130) are respectively connected to the air holes at the upper end of the drive rod (110) and the lower end of the adsorption rod (120).

5. The automated transfer device for chip testing and verification according to claim 2, characterized in that: The limiting protective sleeve structure (300) includes an upper body (310) and a lower body (320) with upper and lower threads connected together. A plurality of clearance holes (321) are evenly arranged around the outer wall of the lower body (320) and horizontally penetrate into the interior of the lower body (320). The upper ends of a plurality of elastic rods (331) are fixed above the clearance holes (321) on the lower body (320) one by one.

6. The automated transfer device for chip testing and verification according to claim 2, characterized in that: An elastic protective layer (334) is provided on the upper surface of the anti-fall protrusion (333).

7. The automated transfer device for chip testing and verification according to claim 4, characterized in that: A pressure alarm device is installed at the air hole at the upper end of the drive rod (110) that is connected to the vacuum mechanism.

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