Heat dissipation grinding wheel

By combining a cooling device and a semiconductor cooling chip, the heat dissipation system solves the problem of poor heat dissipation effect of existing high-heat-dissipation diamond grinding wheels after cleaning debris, achieving rapid heat dissipation and debris cleaning, and improving the heat dissipation efficiency and service life of the grinding wheel.

CN223790248UActive Publication Date: 2026-01-13NANCHANG RUIZHIJIE IND CO LTD
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Patent Information

Application Number
CN202520110856.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-01-17
Publication Date
2026-01-13
Estimated Expiration
2035-01-17

AI Technical Summary

Technical Problem

Existing high-heat-dissipation diamond grinding wheels still have poor heat dissipation performance after cleaning debris and cannot cool down quickly.

Method used

It combines a refrigeration unit with a semiconductor cooling chip, and uses an axial fan and a water spray head for heat dissipation. It is connected to an external water source via a water supply pipe, sprays water and discharges hot air through an air outlet, and uses a scraper to clean up waste.

Benefits of technology

It achieves rapid heat dissipation and effective cleaning of waste chips, improving the heat dissipation efficiency and service life of the grinding wheel.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223790248U_ABST
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Abstract

The heat dissipation grinding wheel comprises a protective shell, a grinding wheel body, an installation frame, an axial flow fan, a refrigerating device and a water supply pipe, one side of the protective shell is of an opening structure, a plurality of ventilation holes are formed in the two sides of the protective shell, the grinding wheel body is arranged in the protective shell, the installation frame is fixedly connected to the two sides of the protective shell, and the axial flow fan is arranged in the installation frame. The refrigerating device is arranged on the side, away from the protective shell, in the mounting frame, the water supply pipe is fixedly connected to the periphery outside the protective shell, and water spraying heads are evenly distributed on the inner side of the protective shell and communicate with the water supply pipe. Compared with the prior art, the cooling device has the advantages that the cooling device is arranged on the side, away from the protective shell, in the mounting frame, and the cooling device is matched with a semiconductor cooling piece in the cooling device to generate cold air to cool the two sides of the grinding wheel at the same time.
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Description

Technical Field

[0001] This utility model relates to the field of heat dissipation grinding wheel. Background Technology

[0002] As a grinding tool, grinding wheels play an increasingly important role in the industrial field. They are used for rough grinding, semi-finish grinding, finish grinding, grooving, and cutting of the surfaces of metal or non-metal workpieces. Because they are rotating at high speeds, they need to withstand significant impact forces, thus requiring grinding wheels to possess high strength, impact resistance, heat resistance, and corrosion resistance.

[0003] A high-heat-dissipation diamond grinding wheel, disclosed in announcement number CN207155594U, includes a recovery box, a connecting water pipe, a heat-conducting pipe, a circulating pump, a condensate storage tank, a housing, a rotating rod, a long brush, and a short brush. The recovery box is installed on the lower side of the housing, the connecting water pipe is installed on the annular side of the housing, the heat-conducting pipe is installed on the left end face of the housing, the circulating pump is fixed on the upper side of the housing, the condensate storage tank is installed on the right side of the circulating pump, and the housing is installed on the outer side of the grinding wheel body. This design solves the problem of poor heat dissipation of the original diamond grinding wheel. The rotating rod is fixed on the inner side of the support plate, the long brush is fixed on the upper side of the rotating rod, and the short brush is fixed on the inner side of the long brush.

[0004] Existing high-heat-dissipation diamond grinding wheels have the following drawbacks: While existing technologies incorporate brush cleaning, the accumulation of debris on the grinding wheel surface takes a considerable amount of time. Simply cleaning the debris cannot quickly cool the grinding wheel, resulting in poor heat dissipation.

[0005] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0006] The technical problem to be solved by this utility model is to overcome the above-mentioned technical defects and provide a heat-dissipating grinding wheel.

[0007] To solve the above problems, the technical solution of this utility model is: a heat dissipation grinding wheel, including a protective shell, one side of which is an open structure, and several ventilation holes are provided on both sides of the protective shell;

[0008] A grinding wheel, wherein the grinding wheel is disposed inside the protective housing;

[0009] Mounting frame, which is fixedly connected to both sides of the protective shell;

[0010] An axial flow fan, wherein the axial flow fan is disposed within a mounting frame;

[0011] A refrigeration device, wherein the refrigeration device is located inside the mounting frame on the side away from the protective shell;

[0012] A water supply pipe is fixedly connected to the outside of the protective shell. Water spray heads are evenly distributed on the inside of the protective shell and are connected to the water supply pipe.

[0013] Furthermore, the cooling device includes a semiconductor cooling chip and a power supply device. The semiconductor cooling chip is located on the side of the mounting frame away from the protective shell, and the power supply device is located on the outside of the mounting frame.

[0014] Furthermore, the top of the protective shell has several air vents evenly distributed, and the bottom of the protective shell has drainage holes evenly distributed.

[0015] Furthermore, scrapers are fixedly connected to both sides of the opening of the protective shell.

[0016] Furthermore, one end of the water supply pipe is equipped with a water source connector, and the water spray head does not contact the grinding wheel.

[0017] The advantages of this invention compared to existing technologies are as follows: the cooling device is located inside the mounting frame on the side away from the protective shell, and works with the semiconductor cooling chip in the cooling device to generate cold air to simultaneously dissipate heat from both sides of the grinding wheel. It is connected to an external water source through a water supply pipe and sprays water onto the grinding wheel through a spray nozzle to further dissipate heat. Attached Figure Description

[0018] Figure 1 This is the three-dimensional structure of the present invention. Figure 1 .

[0019] Figure 2 This is a structural diagram of the axial flow fan position of this utility model.

[0020] Figure 3 This is the internal structure of the protective shell of this utility model. Figure 1 .

[0021] Figure 4 This is the internal structure of the protective shell of this utility model. Figure 2 .

[0022] As shown in the figure: 1. Protective shell; 2. Ventilation hole; 3. Grinding wheel; 4. Mounting frame; 5. Axial flow fan; 6. Refrigeration device; 601. Semiconductor cooling chip; 602. Power supply device; 7. Water supply pipe; 8. Spray head; 9. Air outlet; 10. Drain hole; 11. Scraper; 12. Water source connector. Detailed Implementation

[0023] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals.

[0024] It should be noted that the terms “front,” “back,” “left,” “right,” “up,” and “down” used in the following description refer to the directions shown in the attached diagram, while the terms “inside” and “outside” refer to the directions toward or away from the geometric center of a specific component, respectively.

[0025] To make the content of this utility model easier to understand, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0026] like Figures 1 to 4 As shown, a heat-dissipating grinding wheel includes a protective shell 1, a grinding wheel 3, a mounting frame 4, an axial fan 5, a cooling device 6, and a water supply pipe 7. The protective shell 1 has an open side and several ventilation holes 2 on both sides. The grinding wheel 3 is located inside the protective shell 1. The mounting frame 4 is fixedly connected to both sides of the protective shell 1. The axial fan 5 is located inside the mounting frame 4, which is used to mount the axial fan 5. The through holes 2 on both sides of the protective shell 1 allow for heat dissipation while preventing foreign objects from entering the protective shell 1 during grinding and colliding with the axial fan 5, causing damage. The cooling device 6 is located on the side of the mounting frame 4 away from the protective shell 1 and, in conjunction with a semiconductor cooling chip, generates cool air to simultaneously dissipate heat from both sides of the grinding wheel. A power supply device 602 is located on the outside of the mounting frame 4 and supplies power to the semiconductor device. A water supply pipe 7 is fixedly connected to the outside of the protective shell 1. Water nozzles 8 are evenly distributed on the inside of the protective shell 1. The water nozzles 8 are connected to the water supply pipe 7. One end of the water supply pipe 7 is equipped with a water source connector 12. The water nozzles 8 do not contact the grinding wheel 3. The water supply pipe 7 is connected to an external water source and the water nozzles 8 spray onto the grinding wheel 3 to further dissipate heat. Several air vents 9 are evenly distributed on the top of the protective shell 1, and drainage holes 10 are evenly distributed on the bottom of the protective shell 1. The hot air generated during the heat dissipation process of the axial fan 5 and the semiconductor cooling chip 601 is dissipated from the protective shell 1 through the air vents 9. The liquid sprayed by the water nozzles 8 dissipates from the protective shell 1 through the drainage holes 10 after dissipating heat from the grinding wheel 3. Scrapers 11 are fixedly connected to both sides of the opening of the protective shell 1. The scrapers 11 can scrape off the waste on both sides of the grinding wheel 3 during use.

[0027] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0029] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A heat-dissipating grinding wheel, characterized in that: It includes a protective shell (1), one side of which is an open structure, and several ventilation holes (2) are provided on both sides of the protective shell (1); A grinding wheel (3) is disposed inside the protective shell (1); Mounting frame (4), which is fixedly connected to both sides of the protective shell (1); Axial flow fan (5), wherein the axial flow fan (5) is disposed within the mounting frame (4); A refrigeration device (6) is located inside the mounting frame (4) on the side away from the protective shell (1); Water supply pipe (7) is fixedly connected to the outside of the protective shell (1). Spray nozzles (8) are evenly distributed on the inside of the protective shell (1). The spray nozzles (8) are connected to the water supply pipe (7).

2. The heat-dissipating grinding wheel according to claim 1, characterized in that: The cooling device (6) includes a semiconductor cooling chip (601) and a power supply device (602). The semiconductor cooling chip (601) is located inside the mounting frame (4) on the side away from the protective shell (1), and the power supply device (602) is located outside the mounting frame (4).

3. The heat-dissipating grinding wheel according to claim 1, characterized in that: The protective shell (1) has several air vents (9) evenly distributed on its top and drainage holes (10) evenly distributed on its bottom.

4. The heat-dissipating grinding wheel according to claim 1, characterized in that: Scrapers (11) are fixedly connected to both sides of the opening of the protective shell (1).

5. A heat-dissipating grinding wheel according to claim 1, characterized in that: The water supply pipe (7) is provided with a water source connector (12) at one end, and the water spray head (8) does not contact the grinding wheel (3).

Citation Information

Patent Citations

  • High heat dissipation diamond grinding wheel

    CN207155594U