Chip testing equipment

By introducing a rotatable clamping mechanism and multi-angle test probes into the chip testing equipment, the problem that traditional chip testing equipment can only test from a single angle is solved, and the flexibility and accuracy of multi-angle testing are achieved.

CN223796578UActive Publication Date: 2026-01-13HEFEI XINNENGYAN ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202423295758.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-31
Publication Date
2026-01-13
Estimated Expiration
2034-12-31

AI Technical Summary

Technical Problem

Traditional chip testing equipment can only perform tests from a fixed angle, which cannot meet the increasingly complex chip testing needs.

Method used

A chip testing device was designed, comprising a rotatable clamping mechanism, multi-angle test probes, and a vertical transmission mechanism, which can adjust the height and angle of the test probes to meet multi-angle testing requirements.

Benefits of technology

It enables multi-angle chip testing, improving testing flexibility and accuracy, and meeting the testing needs of complex chips.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a chip test device. The chip test device comprises a base; the clamping mechanism is arranged on the base and can rotate relative to the base, and the clamping mechanism can adjustably clamp and fix a chip to be tested; the testing mechanism is provided with at least two testing probes, and the testing probes can be in contact with the to-be-tested chip so as to test the to-be-tested chip; and the transmission mechanism is vertically arranged on the base and can drive the testing mechanism to do lifting motion so as to adjust the height of the testing probe relative to the chip to be tested. According to the utility model, the first test probe and the second test probe are arranged, so that the corresponding test probe can be selected as required to test the chip to be tested.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a chip testing device. Background Technology

[0002] Chip testing equipment verifies whether a chip's functionality, performance, and quality meet expectations by applying the necessary stimulus signals to its input pins and monitoring its output pins. This includes comprehensive testing of the chip's electrical characteristics, functionality, and reliability to ensure that each chip functions correctly.

[0003] However, traditional chip testing equipment typically only has a single-angle testing device. Although it can complete basic chip testing tasks, it cannot meet the increasingly complex chip testing needs because it can only evaluate the chip's functionality and efficiency from a fixed angle or using a specific method. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a chip testing device, comprising:

[0005] Base;

[0006] A clamping mechanism is disposed on the base and is rotatable relative to the base, and the clamping mechanism can adjust and clamp the chip under test.

[0007] A test mechanism having at least two test probes, wherein the test probes can contact the chip under test (DUT) to test the DUT; and

[0008] A transmission mechanism vertically mounted on the base is capable of driving the testing mechanism to move up and down, thereby adjusting the height of the testing probe relative to the chip under test.

[0009] Furthermore, the transmission mechanism includes a height plate and a motor, wherein:

[0010] The height plate is provided with a lifting groove, and a drive shaft and a driven shaft are respectively provided at both ends of the lifting groove. The drive shaft is provided with a drive pulley, and the driven shaft is provided with a driven pulley. The drive pulley and the driven pulley are connected to each other by a connecting belt.

[0011] The motor is located at the end of the height plate away from the base, and the motor is connected to the drive shaft.

[0012] Furthermore, the testing mechanism includes an interconnected lifting block and a testing platform, wherein:

[0013] The lifting block is fixed to the connecting belt, and the transmission motion of the connecting belt can drive the lifting block to move synchronously.

[0014] A test probe assembly is provided at the end of the test stand away from the lifting platform, and the test probe assembly is rotatably connected to the test stand via a mounting bracket.

[0015] Furthermore, the test bench is equipped with a servo motor, which, when powered on, can drive the mounting bracket to rotate, thereby causing the test probe assembly to rotate.

[0016] Furthermore, the test probe assembly includes a first test probe and a second test probe, both of which have a built-in voltage sensor, a voltmeter, and an ammeter.

[0017] Furthermore, the clamping mechanism includes a motor housing and a mounting platform, wherein the motor housing and the mounting platform are rotatably connected via a rotating shaft, wherein:

[0018] The motor housing is mounted on the base, and the motor housing contains a stepper motor. When the stepper motor is powered on, it can drive the rotating shaft to rotate, thereby causing the mounting platform to rotate synchronously.

[0019] The mounting platform is provided with fixed clamps and movable clamps at perpendicular intervals relative to the surface of the testing mechanism. The fixed clamps are disposed between the movable clamps. The chip under test is in contact with the fixed clamps and the movable clamps respectively. The movable clamps are capable of displacement along the length direction of the mounting platform.

[0020] Furthermore, the fixing clamp is located at the middle position along the length of the mounting platform; the surface of the mounting platform is provided with a mounting groove, and a screw extending to the end of the mounting platform is built into the mounting groove. The screw is slidably connected to a mounting block, and the thread on the surface of the screw matches the thread on the inner wall of the mounting block. The mounting block contacts the inner walls on both sides of the width direction of the mounting groove, and the movable clamp is fixedly connected to the mounting block.

[0021] Furthermore, the screw extending to the end of the mounting platform is fitted with a handle. Rotating the handle causes the mounting block to slide relative to the mounting groove to adjust the distance between the movable clamping plate and the fixed clamping plate.

[0022] Furthermore, the base includes a fixing mechanism and casters, wherein:

[0023] The movable wheels are fixed to the bottom of the base and in contact with the ground;

[0024] The fixing mechanism includes an anti-slip block, which is capable of telescopic movement and contacts the ground through the anti-slip block.

[0025] Furthermore, the fixing mechanism includes a miniature cylinder and a fixing platform. The fixing platform is fixed to the base by the miniature cylinder, and the anti-slip block is provided on the contact surface between the fixing platform and the ground.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] This invention, by setting a first test probe and a second test probe, allows for the selection of the appropriate test probe to test the chip under test as needed. Attached Figure Description

[0028] Figure 1 This is a side view of the overall structure disclosed in the embodiment of this utility model;

[0029] Figure 2 This is a cross-sectional view of the overall structure disclosed in the embodiment of this utility model;

[0030] Figure 3 This is a partial structural schematic diagram of the transmission mechanism and testing mechanism disclosed in the embodiments of this utility model;

[0031] Figure 4 This is a side view of the clamping mechanism disclosed in an embodiment of the present utility model;

[0032] Figure 5 The circuit diagrams of the first and second test probes disclosed in this embodiment of the present invention are shown.

[0033] In the picture:

[0034] 100. Base; 111. Casters; 121. Mounting platform; 122. Anti-slip block; 123. Miniature cylinder;

[0035] 200. Transmission mechanism; 211. Height plate; 212. Motor; 213. Lifting groove; 214. Drive shaft; 215. Drive pulley; 216. Driven shaft; 217. Driven pulley; 218. Connecting belt;

[0036] 300. Clamping mechanism; 311. Motor housing; 312. Rotating shaft; 313. Mounting platform; 314. Fixed clamping plate; 315. Movable clamping plate; 316. Mounting slot; 317. Screw; 318. Mounting block; 319. Handle;

[0037] 400. Testing mechanism; 411. Lifting block; 412. Testing platform; 413. Mounting bracket; 414. First test probe; 415. Second test probe; 416. Servo motor. Detailed Implementation

[0038] To make the technical solutions and effects of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments.

[0039] The present invention aims to provide a chip testing device that overcomes the shortcomings of existing chip testing devices that only have single-angle testing capabilities.

[0040] Please see Figure 1 The chip testing equipment mainly includes a base 100, a transmission mechanism 200, a clamping mechanism 300, and a testing mechanism 400.

[0041] First, the base 100 in this embodiment will be described.

[0042] Please see Figure 2 The base 100 includes a fixing mechanism and casters 111.

[0043] The movable wheels 111 are fixed to the bottom of the base 100 and in contact with the ground, making it easy for the tester to move and transport the equipment.

[0044] The fixing mechanism includes a fixing platform 121, an anti-slip block 122, and a miniature cylinder 123. The fixing mechanism is capable of telescopic movement and contacts the ground through the anti-slip block 122.

[0045] The fixed platform 121 is fixed to the base 100 by a miniature cylinder 123, and the contact surface between the fixed platform 121 and the ground is provided with an anti-slip block 122.

[0046] The miniature cylinder 123 performs a telescopic movement, pushing the fixed platform 121. The anti-slip block 122 at the bottom of the fixed platform 121 contacts the ground to prevent the test equipment from moving during the chip testing process.

[0047] Next, the transmission mechanism 200 in this embodiment will be described.

[0048] Please see Figure 3 The transmission mechanism 200 is vertically mounted on the base 100. The transmission mechanism 200 can drive the test mechanism 400 to perform lifting and lowering movements to adjust the height of the test probe relative to the chip under test.

[0049] The transmission mechanism 200 includes a height plate 211, a motor 212, a lifting groove 213, a drive shaft 214, a drive pulley 215, a driven shaft 216, a driven pulley 217, and a connecting belt 218.

[0050] Specifically, the height plate 211 is provided with a lifting groove 213, and the two ends of the lifting groove 213 are respectively provided with a drive shaft 214 and a driven shaft 216.

[0051] The drive shaft 214 is equipped with a drive pulley 215, and the driven shaft 216 is equipped with a driven pulley 217. The drive pulley 215 and the driven pulley 217 are connected to each other by a connecting belt 218.

[0052] The motor 212 is located at the end of the height plate 211 away from the base 100, and the motor 212 is connected to the drive shaft 214.

[0053] When the motor 212 is powered on, it starts and drives the drive shaft 214 to rotate. The drive shaft 214 drives the drive pulley 215 to move synchronously. The drive pulley 215 drives the driven pulley 217 to move synchronously through the connecting belt 218, and the connecting belt 218 is also driven.

[0054] Next, the clamping mechanism 300 in this embodiment will be described.

[0055] Please see Figure 4 The clamping mechanism 300 is disposed on the base 100 and is rotatable relative to the base 100. The clamping mechanism 300 is adjustable to clamp and fix the chip under test.

[0056] The clamping mechanism 300 includes a motor housing 311 and a mounting platform 313, and the motor housing 311 and the mounting platform 313 are rotatably connected by a rotating shaft 312.

[0057] The motor housing 311 is located on the base 100, and the motor housing 311 has a built-in stepper motor. When the stepper motor is powered on, it can drive the rotating shaft 312 to rotate, thereby driving the mounting platform 313 to rotate synchronously.

[0058] The mounting platform 313 is vertically spaced between the test mechanism 400 and the fixed clamping plate 314 and the movable clamping plate 315. The fixed clamping plate 314 is positioned between the movable clamping plates 315. The chip under test contacts the fixed clamping plate 314 and the movable clamping plate 315 respectively. The movable clamping plate 315 can be moved along the length of the mounting platform 313.

[0059] The fixed clamp 314 is located at the middle position along the length of the mounting platform 313; the surface of the mounting platform 313 is provided with a mounting groove 316, and a screw 317 extending to the end of the mounting platform 313 is built into the mounting groove 316. The screw 317 is slidably connected to the mounting block 318, and the thread on the surface of the screw 317 matches the thread on the inner wall of the mounting block 318. The mounting block 318 contacts the inner walls on both sides of the width direction of the mounting groove 316, and the movable clamp 315 is fixedly connected to the mounting block 318.

[0060] A handle 319 is fitted onto the screw 317 extending to the end of the mounting platform 313. Rotating the handle 319 causes the mounting block 318 to slide relative to the mounting groove 316 to adjust the distance between the movable clamping plate 315 and the fixed clamping plate 314.

[0061] The movable clamping plate 315 and the fixed clamping plate 314 clamp and fix the chip under test from both sides.

[0062] In use, the tester turns the handle 319, which drives the screw 317 to rotate. The thread on the surface of the screw 317 matches the thread on the inner wall of the mounting block 318. The mounting block 318 is limited by the mounting groove 316, which matches its shape and size. Therefore, the mounting block 318 slides along the mounting groove 316 and adjusts the distance between the movable clamping plate 315 and the fixed clamping plate 314.

[0063] Finally, the testing mechanism 400 in this embodiment will be described.

[0064] Please see Figure 1 The testing unit 400 has at least two test probes, and the test probes can contact the chip under test to test the chip under test.

[0065] The testing mechanism 400 includes a lifting block 411 and a testing table 412 connected to each other, wherein:

[0066] The lifting block 411 is fixed to the connecting belt 218, and the transmission motion of the connecting belt 218 can drive the lifting block 411 to move synchronously.

[0067] A test probe assembly is provided at the end of the test stand 412 away from the lifting platform. The test probe assembly is rotatably connected to the test stand 412 via a mounting bracket 413.

[0068] The test bench 412 is equipped with a servo motor 416. When the servo motor 416 is powered on, it can drive the mounting bracket 413 to rotate, thereby rotating the test probe assembly and adjusting the test probe.

[0069] The test probe assembly includes a first test probe 414 and a second test probe 415, both of which have built-in voltage sensors, voltmeters, and ammeters.

[0070] Please see Figure 5 One end of the voltage sensor Vs is connected to the positive terminal of the voltmeter, and the negative terminal of the voltmeter is grounded. The other end of the voltage sensor Vs is connected to one end of the ammeter, and the other end of the ammeter is grounded.

[0071] When using this embodiment:

[0072] The tester turns the handle 319, which drives the screw 317 to rotate. The thread on the surface of the screw 317 matches the thread on the inner wall of the mounting block 318. The mounting block 318 is limited by the mounting groove 316, which matches its shape and size. Therefore, the mounting block 318 slides along the mounting groove 316 and adjusts the distance between the fixed clamping plate 314 and the movable clamping plate 315.

[0073] When the stepper motor is powered on, it starts and drives the rotating shaft 312 to rotate, adjusting the orientation of the chip fixed on the clamping mechanism 300.

[0074] When the motor 212 is powered on, it starts and drives the drive shaft 214 to rotate. The drive shaft 214 drives the drive pulley 215 to move synchronously. The drive pulley 215 drives the driven pulley 217 to move synchronously through the connecting belt 218. The connecting belt 218 also drives the lifting block 411 to move synchronously during the transmission process. The lifting block 411 drives the test platform 412 to move synchronously, thereby adjusting the height of the test probe.

[0075] When the servo motor 416 is powered on, it starts and drives the mounting bracket 413 to rotate, thereby adjusting the test probe.

[0076] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip testing device, characterized in that, include: Base (100); A clamping mechanism (300) is disposed on the base (100) and rotatable relative to the base (100), the clamping mechanism (300) being adjustable to clamp and fix the chip under test; A test mechanism (400) having at least two test probes, the test probes being able to contact the chip under test to test the chip under test; as well as A transmission mechanism (200) is vertically mounted on the base (100). The transmission mechanism (200) can drive the test mechanism (400) to perform lifting and lowering movements to adjust the height of the test probe relative to the chip under test.

2. The chip testing equipment according to claim 1, characterized in that, The transmission mechanism (200) includes a height plate (211) and a motor (212), wherein: The height plate (211) is provided with a lifting groove (213). The lifting groove (213) is provided with a drive shaft (214) and a driven shaft (216) at both ends. The drive shaft (214) is provided with a drive pulley (215), and the driven shaft (216) is provided with a driven pulley (217). The drive pulley (215) and the driven pulley (217) are connected to each other by a connecting belt (218). The motor (212) is located at the end of the height plate (211) away from the base (100), and the motor (212) is connected to the drive shaft (214).

3. The chip testing equipment according to claim 2, characterized in that, The testing mechanism (400) includes a lifting block (411) and a testing platform (412) connected to each other, wherein: The lifting block (411) is fixed to the connecting belt (218), and the transmission movement of the connecting belt (218) can drive the lifting block (411) to move synchronously; The test platform (412) is provided with a test probe assembly at the end away from the lifting platform. The test probe assembly is rotatably connected to the test platform (412) via a mounting bracket (413).

4. The chip testing equipment according to claim 3, characterized in that, The test bench (412) is equipped with a servo motor (416). When the servo motor (416) is powered on, it can drive the mounting frame (413) to rotate, thereby driving the test probe assembly to rotate.

5. The chip testing equipment according to claim 3, characterized in that, The test probe assembly includes a first test probe (414) and a second test probe (415), both of which have built-in voltage sensors, voltmeters and ammeters.

6. The chip testing equipment according to claim 1, characterized in that, The clamping mechanism (300) includes a motor housing (311) and a mounting platform (313), wherein the motor housing (311) and the mounting platform (313) are rotatably connected by a rotating shaft (312), wherein: The motor housing (311) is disposed on the base (100), and the motor housing (311) contains a stepper motor. When the stepper motor is powered on, it can drive the rotating shaft (312) to rotate so as to drive the mounting platform (313) to rotate synchronously. The mounting platform (313) is provided with a fixed clamping plate (314) and a movable clamping plate (315) at a vertical interval relative to the surface of the testing mechanism (400). The fixed clamping plate (314) is disposed between the movable clamping plates (315). The chip under test is in contact with the fixed clamping plate (314) and the movable clamping plate (315) respectively. The movable clamping plate (315) can be displaced along the length direction of the mounting platform (313).

7. The chip testing equipment according to claim 6, characterized in that, The fixed clamp (314) is located at the middle position of the mounting platform (313) in the length direction; the mounting platform (313) is provided with a mounting groove (316) on its surface, and a screw (317) extending to the end of the mounting platform (313) is built into the mounting groove (316). The screw (317) is slidably connected to a mounting block (318), and the thread on the surface of the screw (317) matches the thread on the inner wall of the mounting block (318). The mounting block (318) contacts the inner walls on both sides of the width direction of the mounting groove (316), and the movable clamp (315) is fixedly connected to the mounting block (318).

8. The chip testing equipment according to claim 7, characterized in that, The screw (317) extending to the end of the mounting platform (313) is fitted with a handle (319). Rotating the handle (319) causes the mounting block (318) to slide relative to the mounting groove (316) to adjust the distance between the movable clamping plate (315) and the fixed clamping plate (314).

9. The chip testing equipment according to claim 1, characterized in that, The base (100) includes a fixing mechanism and casters (111), wherein: The movable wheel (111) is fixed to the bottom of the base (100) and in contact with the ground; The fixing mechanism includes a block slider (122), which is capable of telescopic movement and contacts the ground through the block slider (122).

10. The chip testing equipment according to claim 9, characterized in that, The fixing mechanism includes a miniature cylinder (123) and a fixing platform (121). The fixing platform (121) is fixed to the base (100) by the miniature cylinder (123). The contact surface between the fixing platform (121) and the ground is provided with the anti-slip block (122).