Display device

Abstract

The utility model discloses a display device. The display device comprises a backlight module, an array substrate, an opposite substrate, a first bonding piece and a buffer assembly; the backlight module comprises a back plate, the back plate comprises a bottom plate, side plates and a top plate, and the top plate is connected with the bottom plate through the side plates; the array substrate is arranged on one side of the backlight module and comprises a display part and a binding part, and the binding part is connected with the top plate; the opposed substrate is arranged on one side, far away from the backlight module, of the array substrate; the first bonding piece is connected with the top plate, and at least one part of the first bonding piece is connected with the binding part; the buffer assembly is arranged between the top plate and the array substrate, and the buffer assembly is located on one side of the first bonding piece; wherein, in a top view of the display device, the facing substrate and the display unit overlap each other. The array substrate has the advantage that the problem of fragment of the array substrate of the display device can be solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically to a display device. Background Technology

[0002] During laptop manufacturing, a heavy-object impact test is required to assess the laptop's shock resistance. In this test, the impact force on a typical laptop is transmitted through the foam adhesive to the back panel, and then from the back panel to the array substrate. Because the opposing substrate of the laptop does not cover the bonding area of ​​the array substrate, it is difficult for the opposing substrate to provide adequate support, leading to the array substrate being prone to breakage. Utility Model Content

[0003] Embodiments of this application provide a display device to improve the problem of fragmentation of the array substrate of the display device.

[0004] In a first aspect, embodiments of this application provide a display device, comprising:

[0005] A backlight module, the backlight module including a back plate, the back plate including a bottom plate, a side plate and a top plate, the top plate being connected to the bottom plate through the side plate;

[0006] The display panel is disposed on one side of the backlight module. The display panel includes an array substrate and an opposing substrate. The array substrate is disposed on one side of the backlight module. The array substrate includes a display portion and a bonding portion. The bonding portion is connected to the top plate. The opposing substrate is disposed on the side of the array substrate away from the backlight module.

[0007] A first adhesive element is connected to the top plate, and at least a portion of the first adhesive element is connected to the binding portion.

[0008] A buffer assembly is disposed between the top plate and the array substrate, and the buffer assembly is located on one side of the first adhesive member;

[0009] In the top view of the display device, the opposing substrate overlaps with the display section.

[0010] Furthermore, the buffer assembly includes a bending member and a first horizontal member. The bending member is connected to the first horizontal member and the top plate. The first horizontal member extends toward the first adhesive member, and the distance from the first horizontal member to the display part is less than the distance from the first adhesive member to the display part.

[0011] Furthermore, there is a first gap between the first horizontal member and the top plate, and the first gap is not greater than the thickness of the first adhesive member.

[0012] Furthermore, in the top view of the display device, at least a portion of the first horizontal member overlaps with a portion of the display portion.

[0013] Furthermore, the buffer assembly includes a connector and a second horizontal member. The connector is connected to the second horizontal member and the top plate. The second horizontal member extends in a direction away from the first adhesive member, and the distance from the second horizontal member to the display part is less than the distance from the first adhesive member to the display part.

[0014] Furthermore, the buffer assembly includes a buffer member connected to the top plate and the binding part, and the distance from the buffer member to the display part is greater than the distance from the first adhesive member to the display part.

[0015] Furthermore, the buffer is a second adhesive component, and the hardness of the second adhesive component is less than the hardness of the first adhesive component.

[0016] Furthermore, in the top view of the display device, the buffer overlaps with at least a portion of the bonding portion, and at least a portion of the first adhesive overlaps with a portion of the display portion.

[0017] Furthermore, the buffer assembly includes a buffer cavity, and the distance from the edge of the buffer cavity to the display part is greater than the distance from the first adhesive to the display part, wherein the buffer cavity is the area enclosed by the binding part, the side plate and the first adhesive.

[0018] Furthermore, in the top view of the display device, the edge of the buffer cavity is located within the bonding portion, and at least a portion of the first adhesive overlaps with a portion of the display portion.

[0019] The beneficial effects of this application are:

[0020] This application provides a display device in which a first adhesive member is connected to a top plate, and at least a portion of the first adhesive member is connected to a bonding portion. A buffer assembly is disposed between the top plate and the array substrate, and the buffer assembly is located on one side of the first adhesive member. When the display device is subjected to a heavy object impact test, the stress area of ​​the array substrate can be closer to one side of the display portion, thereby reducing the bending moment arm of the array substrate and reducing the bending stress of the array substrate corresponding to the edge area of ​​the opposing substrate, thus improving the problem of fragmentation of the array substrate of the display device. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a conventional display device undergoing a heavy object impact test;

[0022] Figure 2 This is a schematic diagram showing the deformation of a conventional display device when subjected to a heavy object impact test.

[0023] Figure 3 This is a schematic diagram of the first structure of the display device of this application;

[0024] Figure 4 This is a schematic diagram of a second structure of the display device of this application;

[0025] Figure 5 This is a schematic diagram of a third structure of the display device of this application;

[0026] Figure 6 This is a schematic diagram of the fourth structure of the display device of this application;

[0027] Figure 7 yes Figure 6 The diagram shows the deformation of the display device during a heavy object impact test.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100-Backlight module; 110-Back plate; 111-Bottom plate; 112-Side plate; 113-Top plate; 200-Display panel; 210-Array substrate; 211-Display part; 212-Bonding part; 220-Opposing substrate; 300-First adhesive component; 400-Buffer assembly; 410-Bending component; 420-First horizontal component; 430-Connector; 440-Second horizontal component; 450-Buffer component; 460-Buffer cavity.

[0030] 101-Foam adhesive; 102-Back plate; 103-Array substrate; 1031-Bonding part; 104-Opposing substrate; 105-Weight. Detailed Implementation

[0031] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings. The technical solutions described below are for illustrative purposes only and should not be construed as limiting the scope of protection of this application.

[0032] Furthermore, the terms "first," "second," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different technical features. The terms "multiple" and similar words indicate two or more unless otherwise expressly specified.

[0033] The first embodiment of this application provides a display device, referencing... Figure 3 The system includes a backlight module 100, a display panel 200, a first adhesive component 300, and a buffer assembly 400. The backlight module 100 includes a back plate 110, which comprises a bottom plate 111, a side plate 112, and a top plate 113. The top plate 113 is connected to the bottom plate 111 via the side plate 112. The display panel 200 is disposed on one side of the backlight module 100 and includes an array substrate 210 and an opposing substrate 220. The array substrate 210 is disposed on one side of the backlight module 100 and includes a display portion 211 and a bonding portion 212, which is connected to the top plate 113. The opposing substrate 220 is disposed on the side of the array substrate 210 away from the backlight module 100. The first adhesive component 300... The first adhesive member 300 is connected to the top plate 113, and at least a portion of the first adhesive member 300 is connected to the bonding portion 212; the buffer assembly 400 is disposed between the top plate 113 and the array substrate 210, and the buffer assembly 400 is located on one side of the first adhesive member 300; wherein, in the top view of the display device, the opposing substrate 220 overlaps with the display portion 211; specifically, the buffer assembly 400 includes a bending member 410 and a first horizontal member 420, the bending member 410 is connected to the first horizontal member 420 and the top plate 113, the first horizontal member 420 extends toward the first adhesive member 300, and the distance from the first horizontal member 420 to the display portion 211 is less than the distance from the first adhesive member 300 to the display portion 211.

[0034] When the laptop was subjected to a 105mm impact test, reference Figure 1 , Figure 2The impact force received by a conventional laptop is transmitted to the back panel 102 through the foam adhesive 101, and then to the array substrate 103 through the back panel 102. Since the opposing substrate 104 of the laptop does not cover the area of ​​the bonding portion 1031 of the array substrate 103, the opposing substrate 104 cannot provide support for the bonding portion 1031 of the array substrate 103. The edge area of ​​the array substrate 103 corresponding to the opposing substrate 104 is subjected to greater stress, which makes the array substrate 103 of the laptop prone to breakage. The technical solution of this application involves connecting the first adhesive member 300 to the top plate 113, with at least a portion of the first adhesive member 300 connected to the bonding portion 212, and placing the buffer assembly 400 between the top plate 113 and the array substrate 210. The buffer assembly 400 is located on one side of the first adhesive member 300. The buffer assembly 400 includes a bending member 410 and a first horizontal member 420. The bending member 410 is connected to the first horizontal member 420 and the top plate 113. The first horizontal member 420 extends towards the first adhesive member 300, and the distance from the first horizontal member 420 to the display portion 211 is less than the distance from the first adhesive member 300 to the display portion 211. When the display device is subjected to a heavy object 105 impact test, the force-bearing area of ​​the array substrate 210 can be close to one side of the display portion 211 to reduce the bending arm of the array substrate 210, thereby reducing the bending stress of the array substrate 210 corresponding to the edge area of ​​the opposing substrate 220, and thus improving the problem of fragmentation of the array substrate 210 of the display device.

[0035] In this embodiment, the display device includes a laptop computer.

[0036] In this embodiment, reference Figure 3 The first horizontal member 420 and the top plate 113 have a first gap 'a', which is not greater than the thickness of the first adhesive member 300. By providing a first gap 'a' between the first horizontal member 420 and the top plate 113, where the first gap 'a' is not greater than the thickness of the first adhesive member 300, the first gap between the first horizontal member 420 and the top plate 113 can form a buffer space, thereby further improving the problem of fragmentation of the array substrate 210 of the display device.

[0037] In this embodiment, reference Figure 3In the top view of the display device, at least a portion of the first horizontal member 420 overlaps with a portion of the display portion 211. By setting at least a portion of the first horizontal member 420 to overlap with a portion of the display portion 211, the force on the back plate 110 can be transmitted towards the area of ​​the display portion 211 closer to the array substrate 210, reducing the bending stress on the bonding portion 212 of the array substrate 210, thereby improving the problem of fragmentation of the array substrate 210 of the display device.

[0038] In this embodiment, reference Figure 3 In the top view of the display device, a portion of the first horizontal member 420 overlaps with a portion of the display section 211, and another portion of the first horizontal member 420 overlaps with a portion of the binding section 212. By setting a portion of the first horizontal member 420 to overlap with a portion of the display section 211 and another portion of the first horizontal member 420 to overlap with a portion of the binding section 212, on the one hand, the force on the back plate 110 can be transferred towards the area of ​​the display section 211 closer to the array substrate 210, reducing the bending stress on the binding section 212 of the array substrate 210; on the other hand, it can prevent the portion of the first horizontal member 420 located in the display section 211 from being too long, thus affecting the display effect of the display device.

[0039] In this embodiment, in the top view of the display device, the first horizontal member 420 overlaps with a portion of the display portion 211. By setting the first horizontal member 420 to overlap with a portion of the display portion 211, that is, the second horizontal member 440 is entirely located within the display portion 211, the stress-bearing area of ​​the array substrate 210 can be completely located within the display portion 211, thereby further reducing the bending stress on the bonding portion 212 of the array substrate 210.

[0040] In this embodiment, reference Figure 3 The first horizontal component 420, the bent component 410, and the top plate 113 are integrally formed.

[0041] A second embodiment of this application provides a display device, referencing... Figure 4The system includes a backlight module 100, a display panel 200, a first adhesive component 300, and a buffer assembly 400. The backlight module 100 includes a back plate 110, which comprises a bottom plate 111, a side plate 112, and a top plate 113. The top plate 113 is connected to the bottom plate 111 via the side plate 112. The display panel 200 is disposed on one side of the backlight module 100 and includes an array substrate 210 and an opposing substrate 220. The array substrate 210 is disposed on one side of the backlight module 100 and includes a display portion 211 and a bonding portion 212, which is connected to the top plate 113. The opposing substrate 220 is disposed on the side of the array substrate 210 away from the backlight module 100. The first adhesive component 300... The first adhesive member 300 is connected to the top plate 113, and at least a portion of the first adhesive member 300 is connected to the bonding portion 212; the buffer assembly 400 is disposed between the top plate 113 and the array substrate 210, and the buffer assembly 400 is located on one side of the first adhesive member 300; wherein, in the top view of the display device, the opposing substrate 220 overlaps with the display portion 211; specifically, the buffer assembly 400 includes a connector 430 and a second horizontal member 440, the connector 430 is connected to the second horizontal member 440 and the top plate 113, the second horizontal member 440 extends in a direction away from the first adhesive member 300, and the distance from the second horizontal member 440 to the display portion 211 is less than the distance from the first adhesive member 300 to the display portion 211.

[0042] When the laptop was subjected to a 105mm impact test, reference Figure 1 , Figure 2The impact force received by a conventional laptop is transmitted to the back panel 102 through the foam adhesive 101, and then to the array substrate 103 through the back panel 102. Since the opposing substrate 104 of the laptop does not cover the area of ​​the bonding portion 1031 of the array substrate 103, the opposing substrate 104 cannot provide support for the bonding portion 1031 of the array substrate 103. The edge area of ​​the array substrate 103 corresponding to the opposing substrate 104 is subjected to greater stress, which makes the array substrate 103 of the laptop prone to breakage. The technical solution of this application involves connecting the first adhesive member 300 to the top plate 113, with at least a portion of the first adhesive member 300 connected to the bonding portion 212, and disposing the buffer assembly 400 between the top plate 113 and the array substrate 210, with the buffer assembly 400 located on one side of the first adhesive member 300. The buffer assembly 400 includes a connector 430 and a second horizontal member 440. The connector 430 is connected to the second horizontal member 440 and the top plate 113, and the second horizontal member 440... The second horizontal member 440 extends in the direction away from the first adhesive member 300, and the distance from the second horizontal member 440 to the display part 211 is less than the distance from the first adhesive member 300 to the display part 211; when the display device is subjected to a heavy object 105 impact test, the force-bearing area of ​​the array substrate 210 can be close to one side of the display part 211 to reduce the bending arm of the array substrate 210, thereby reducing the bending stress of the array substrate 210 corresponding to the edge area of ​​the opposing substrate 220, and thus improving the problem of fragmentation of the array substrate 210 of the display device.

[0043] In this embodiment, the display device includes a laptop computer.

[0044] In this embodiment, reference Figure 4 At least a portion of the second horizontal member 440 overlaps with a portion of the display portion 211. By setting at least a portion of the second horizontal member 440 to overlap with a portion of the display portion 211, the bending stress on the bonding portion 212 of the array substrate 210 can be reduced, thereby improving the problem of fragmentation of the array substrate 210 of the display device.

[0045] In this embodiment, reference Figure 4A portion of the second horizontal member 440 overlaps with a portion of the display portion 211, and another portion of the second horizontal member 440 overlaps with a portion of the bonding portion 212. By setting a portion of the second horizontal member 440 to overlap with a portion of the display portion 211 and another portion of the second horizontal member 440 to overlap with a portion of the bonding portion 212, on the one hand, the force on the back plate can be transferred towards the area of ​​the display portion closer to the array substrate, reducing the bending stress on the bonding portion 212 of the array substrate 210; on the other hand, it can prevent the portion of the first horizontal member 420 located in the display portion 211 from being too long, thus affecting the display effect of the display device.

[0046] In this embodiment, the second horizontal member 440 overlaps with a portion of the display portion 211. By setting the second horizontal member 440 to overlap with a portion of the display portion 211, that is, the second horizontal member 440 is entirely located within the display portion 211, the stress-bearing area of ​​the array substrate 210 can be completely located within the display portion 211, thereby further reducing the bending stress on the bonding portion 212 of the array substrate 210.

[0047] In this embodiment, the connector 430 extends toward the thickness direction of the display device, and the connector 430 is perpendicular to the top plate 113 and the second horizontal member 440.

[0048] In this embodiment, the connector 430 is inclined.

[0049] In this embodiment, the second horizontal member 440, the connecting member 430, and the top plate 113 are integrally formed.

[0050] The third embodiment of this application provides a display device, with reference to... Figure 5The display device includes a backlight module 100, a display panel 200, a first adhesive component 300, and a buffer assembly 400. The backlight module 100 includes a back plate 110, which includes a bottom plate 111, a side plate 112, and a top plate 113. The top plate 113 is connected to the bottom plate 111 via the side plate 112. The display panel 200 is disposed on one side of the backlight module 100 and includes an array substrate 210 and an opposing substrate 220. The array substrate 210 is disposed on one side of the backlight module 100 and includes a display portion 211 and a bonding portion 212. The bonding portion 212 is connected to the top plate 113. The opposing substrate 220 is disposed on the opposite side of the array substrate 210. On one side away from the backlight module 100; the first adhesive 300 is connected to the top plate 113, and at least a portion of the first adhesive 300 is connected to the bonding portion 212; the buffer assembly 400 is disposed between the top plate 113 and the array substrate 210, and the buffer assembly 400 is located on one side of the first adhesive 300; wherein, in the top view of the display device, the opposing substrate 220 overlaps with the display portion 211; specifically, the buffer assembly 400 includes a buffer 450, the buffer 450 is connected to the top plate 113 and the bonding portion 212, and the distance from the buffer 450 to the display portion 211 is greater than the distance from the first adhesive 300 to the display portion 211.

[0051] When the laptop was subjected to a 105mm impact test, reference Figure 1 . Figure 2The impact force received by a conventional laptop is transmitted to the back panel 102 through the foam adhesive 101, and then to the array substrate 103 through the back panel 102. Since the opposing substrate 104 of the laptop does not cover the area of ​​the bonding portion 1031 of the array substrate 103, the opposing substrate 104 cannot provide support for the bonding portion 1031 of the array substrate 103. The edge area of ​​the array substrate 103 corresponding to the opposing substrate 104 is subjected to greater stress, which makes the array substrate 103 of the laptop prone to breakage. The technical solution of this application involves connecting the first adhesive member 300 to the top plate 113, with at least a portion of the first adhesive member 300 connected to the binding portion 212, and placing the buffer assembly 400 between the top plate 113 and the array substrate 210. The buffer assembly 400 is located on one side of the first adhesive member 300, and includes a buffer member 450 connected to the top plate 113 and the binding portion 212. The distance from the buffer member 450 to the display portion 211 is greater than the distance from the first adhesive member 300 to the display portion 211. When the display device is subjected to a heavy object 105 impact test, the force-bearing area of ​​the array substrate 210 can be close to one side of the display portion 211, thereby reducing the bending arm of the array substrate 210 and reducing the bending stress of the array substrate 210 corresponding to the edge area of ​​the opposing substrate 220, thus improving the problem of fragmentation of the array substrate 210 of the display device.

[0052] In this embodiment, the display device includes a laptop computer.

[0053] In this embodiment, the buffer 450 is a second adhesive, and the hardness of the second adhesive is less than the hardness of the first adhesive 300.

[0054] In this embodiment, reference Figure 5 In the top view of the display device, the buffer 450 overlaps with at least a portion of the bonding portion 212, and at least a portion of the first adhesive 300 overlaps with a portion of the display portion 211. By setting the buffer 450 to overlap with at least a portion of the bonding portion 212 and the first adhesive 300 to overlap with a portion of the display portion 211, the force on the back plate 110 can be transmitted towards the area of ​​the display portion 211 closer to the array substrate 210, thereby reducing the bending stress on the bonding portion 212 of the array substrate 210.

[0055] In this embodiment, reference Figure 5 The buffer 450 overlaps with a portion of the binding part 212, and the first adhesive 300 overlaps with a portion of the display part 211.

[0056] In this embodiment, the buffer 450 overlaps with a portion of the binding portion 212, a portion of the first adhesive 300 overlaps with a portion of the display portion 211, and another portion of the first adhesive 300 overlaps with the binding portion 212.

[0057] In this embodiment, the buffer 450 is a silicone pad or a rubber pad.

[0058] The fourth embodiment of this application provides a display device, referring to... Figure 6 , Figure 7 The display device includes a backlight module 100, a display panel 200, a first adhesive component 300, and a buffer assembly 400. The backlight module 100 includes a back plate 110, which includes a bottom plate 111, a side plate 112, and a top plate 113. The top plate 113 is connected to the bottom plate 111 via the side plate 112. The display panel 200 is disposed on one side of the backlight module 100 and includes an array substrate 210 and an opposing substrate 220. The array substrate 210 is disposed on one side of the backlight module 100 and includes a display portion 211 and a bonding portion 212. The bonding portion 212 is connected to the top plate 113. The opposing substrate 220 is disposed on the array substrate 210 away from the backlight module 100. The first adhesive 300 is connected to the top plate 113, and at least a portion of the first adhesive 300 is connected to the binding portion 212; the buffer assembly 400 is disposed between the top plate 113 and the array substrate 210, and the buffer assembly 400 is located on one side of the first adhesive 300; wherein, in the top view of the display device, the opposing substrate 220 overlaps with the display portion 211; specifically, the buffer assembly 400 includes a buffer cavity 460, and the distance from the edge of the buffer cavity 460 to the display portion 211 is greater than the distance from the first adhesive 300 to the display portion 211, wherein the buffer cavity 460 is the area enclosed by the binding portion 212, the side plate 112 and the first adhesive 300.

[0059] When the laptop was subjected to a 105mm impact test, reference Figure 1 , Figure 2In a conventional laptop, the impact force is transmitted to the back panel 102 via the foam adhesive 101, and then to the array substrate 103 via the back panel 102. Since the opposing substrate 104 of the laptop does not cover the area of ​​the bonding portion 1031 of the array substrate 103, the opposing substrate 104 cannot effectively support the bonding portion 1031 of the array substrate 103. The edge area of ​​the array substrate 103 corresponding to the opposing substrate 104 experiences greater stress, leading to the problem of the array substrate 103 of the laptop easily breaking. The technical solution of this application connects the first adhesive member 300 to the top plate 113, with at least a portion of the first adhesive member 300 connected to the bonding portion 212. A buffer assembly 400 is disposed between the top plate 113 and the array substrate 210, and the buffer assembly 400 is located on one side of the first adhesive member 300. The buffer assembly 400 includes a buffer cavity 460, and the distance from the edge of the buffer cavity 460 to the display portion 211 is greater than the distance from the first adhesive member 300 to the display portion 211. The distance between the display section 211 and the buffer cavity 460 is the area enclosed by the binding section 212, the side plate 112 and the first adhesive 300. When the display device is subjected to a heavy object 105 impact test, the force-bearing area of ​​the array substrate 210 can be close to one side of the display section 211 to reduce the bending arm of the array substrate 210, thereby reducing the bending stress of the array substrate 210 corresponding to the edge area of ​​the opposing substrate 220, and thus improving the problem of fragmentation of the array substrate 210 of the display device.

[0060] In this embodiment, the display device includes a laptop computer.

[0061] In this embodiment, reference Figure 6 In the top view of the display device, the edge of the buffer cavity 460 is located within the bonding portion 212, and at least a portion of the first adhesive 300 overlaps with a portion of the display portion 211. By setting the edge of the buffer cavity 460 within the bonding portion 212 and at least a portion of the first adhesive 300 overlapping with a portion of the display portion 211, the force on the back plate 110 is prevented from being transmitted towards the edge of the bonding portion 212 of the array substrate 210, reducing the bending stress on the bonding portion 212 of the array substrate 210, thereby improving the problem of fragmentation of the array substrate 210 of the display device.

[0062] In this embodiment, reference Figure 6 In the top view of the display device, the edge of the buffer cavity 460 is located within the binding portion 212, and the first adhesive 300 overlaps with a portion of the display portion 211.

[0063] In this embodiment, reference Figure 6In the top view of the display device, the edge of the buffer cavity 460 is located inside the binding portion 212, a portion of the first adhesive 300 overlaps with a portion of the display portion 211, and a portion of the first adhesive 300 overlaps with a portion of the binding portion 212.

[0064] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display device, characterized in that, include: A backlight module, the backlight module including a back plate, the back plate including a bottom plate, a side plate and a top plate, the top plate being connected to the bottom plate through the side plate; The display panel is disposed on one side of the backlight module. The display panel includes an array substrate and an opposing substrate. The array substrate is disposed on one side of the backlight module. The array substrate includes a display portion and a bonding portion. The bonding portion is connected to the top plate. The opposing substrate is disposed on the side of the array substrate away from the backlight module. A first adhesive element is connected to the top plate, and at least a portion of the first adhesive element is connected to the binding portion. A buffer assembly is disposed between the top plate and the array substrate, and the buffer assembly is located on one side of the first adhesive member; In the top view of the display device, the opposing substrate overlaps with the display section.

2. The display device according to claim 1, characterized in that, The buffer assembly includes a bending member and a first horizontal member. The bending member is connected to the first horizontal member and the top plate. The first horizontal member extends toward the first adhesive member, and the distance from the first horizontal member to the display part is less than the distance from the first adhesive member to the display part.

3. The display device according to claim 2, characterized in that, The first horizontal member and the top plate have a first gap, which is not greater than the thickness of the first adhesive member.

4. The display device according to claim 2, characterized in that, In a top view of the display device, at least a portion of the first horizontal member overlaps with a portion of the display section.

5. The display device according to claim 1, characterized in that, The buffer assembly includes a connector and a second horizontal member. The connector is connected to the second horizontal member and the top plate. The second horizontal member extends in a direction away from the first adhesive member, and the distance from the second horizontal member to the display part is less than the distance from the first adhesive member to the display part.

6. The display device according to claim 1, characterized in that, The buffer assembly includes a buffer member, which is connected to the top plate and the binding part, and the distance from the buffer member to the display part is greater than the distance from the first adhesive member to the display part.

7. The display device according to claim 6, characterized in that, The buffer is a second adhesive component, and the hardness of the second adhesive component is less than that of the first adhesive component.

8. The display device according to claim 6, characterized in that, In a top view of the display device, the buffer overlaps with at least a portion of the bonding portion, and at least a portion of the first adhesive overlaps with a portion of the display portion.

9. The display device according to claim 1, characterized in that, The buffer assembly includes a buffer cavity, and the distance from the edge of the buffer cavity to the display part is greater than the distance from the first adhesive to the display part, wherein the buffer cavity is the area enclosed by the binding part, the side plate and the first adhesive.

10. The display device according to claim 9, characterized in that, In a top view of the display device, the edge of the buffer cavity is located within the bonding portion, and at least a portion of the first adhesive overlaps with a portion of the display portion.

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