Surface-mounted electronic component

Abstract

The utility model provides a surface-mounted electronic component, which relates to the technical field of electronic components and comprises a circuit board, two embedding grooves are arranged at the top of the circuit board, two clamping grooves are arranged on the inner surface wall of the circuit board, embedding blocks are movably inserted into the inner surface walls of the two embedding grooves, and push rods are movably inserted into the inner surface walls of the two embedding blocks. Wedge-shaped blocks are fixedly connected to the bottoms of the two push rods correspondingly, push rods are movably inserted into the inner surface walls of the two embedded blocks correspondingly, and wedge-shaped blocks are fixedly connected to the bottoms of the two push rods correspondingly. According to the utility model, under the interaction of all the components of the device, the stable installation of electronic components is realized, even under long-term vibration or violent impact, the displacement of the components can be prevented, the stable connection between the pins and the circuit board is ensured, the continuity and reliability of electrical transmission are ensured, the short circuit and open circuit faults of the circuit are effectively prevented, and the service life of the device is prolonged. Therefore, stable operation of electronic products is ensured.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to a surface mount electronic component. Background Technology

[0002] Electronic components are a general term for electronic elements and devices. Elements are the basic materials that make up electronic products, such as resistors and capacitors; devices can independently perform specific functions, such as diodes and transistors, which are the basic units of electronic circuits.

[0003] In modern electronic product manufacturing, electronic components are often directly mounted on the surface of circuit boards to achieve miniaturization and weight reduction. Compared with traditional through-hole components, this method saves a lot of space and facilitates high-density integration. Surface mount electronic components achieve electrical connection with the circuit board through materials such as pads and solder paste to ensure stable and reliable circuit connectivity. Through the reflow soldering process, the solder paste melts and solidifies, allowing the components to be tightly connected to the circuit board and ensuring accurate signal transmission.

[0004] However, existing surface-mount electronic components have the following shortcomings:

[0005] In the existing technology, electronic products are subject to bumps and vibrations during transportation in scenarios where they are frequently in motion or under long-term vibration. Although surface-mount electronic components are widely used due to their advantages of being small, lightweight, and easy to install, long-term continuous vibration or severe impact can cause the components to gradually shift. The solder joints between the pins and the pads may be pulled or twisted, resulting in cracks or breaks in the solder joints. Ultimately, this can lead to short circuits or open circuits, causing equipment failure and affecting the normal operation of electronic products.

[0006] Therefore, we propose a surface-mount electronic component to address the problems mentioned above. Utility Model Content

[0007] The purpose of this invention is to provide a surface-mount electronic component that utilizes the quick-locking of an elastic fixing component to form a robust mortise and tenon structure between the embedded plate and the circuit board. At the same time, the protective box assembly provides effective protection for the electronic component, thereby solving the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: a surface-mount electronic component, including a circuit board, wherein two embedding slots are formed on the top of the circuit board, and two slots are formed on the inner surface of the circuit board. An embedding block is movably inserted into the inner surface of each of the two embedding slots, and a push rod is movably inserted into the inner surface of each of the two embedding blocks. A wedge block is fixedly connected to the bottom of each of the two push rods. A set of first springs is fixedly connected to the inner surface of each of the two embedding blocks. A locking block is fixedly connected between the outer surface of each of the two sets of first springs, and the outer surface of each locking block is movably inserted into the two slots. A limiting groove is formed on one side of the outer surface of each of the two push rods. A second spring is fixedly connected to the inner surface of each of the two embedding blocks, and a limiting block is fixedly connected to the outer surface of each of the two second springs, and the outer surface of each limiting block is movably inserted into the limiting groove.

[0009] Preferably, a lower protective box is fixedly connected between one side of the outer wall of the two embedded blocks. The top of the lower protective box has four mounting holes, and mounting blocks are movably inserted into the inner surface of each of the four mounting holes.

[0010] Preferably, an upper protective box is fixedly connected between the tops of the four mounting blocks, a fixing groove is provided on one side of the outer wall of each of the four mounting blocks, and a fixing block is movably inserted into the inner surface of each of the four fixing grooves.

[0011] Preferably, metal pull blocks are fixedly connected to one side of the outer wall of each of the four fixed blocks, and two magnetic blocks are fixedly connected to the inner surface of the lower protective box, and the outer surfaces of the two metal pull blocks are magnetically attracted to the outer surfaces of the two magnetic blocks.

[0012] Preferably, the inner surface of the lower protective box is in contact with the main body of the component, and the outer surface of the main body of the component is provided with two sets of pins.

[0013] Preferably, the outer wall of the lower protective box is fixedly connected with two sets of protective shells, and the top of the upper protective box is fixedly installed with a miniature fan.

[0014] Preferably, a heat-conducting plate is fixedly connected to the top of the main body of the component, and heat dissipation fins are fixedly connected to the top of the heat-conducting plate.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0016] 1. In this utility model, through the interaction of the various components of the device, the quick engagement of the elastic fixing component allows the embedded plate and the circuit board to form a robust mortise and tenon structure. At the same time, the protective box component provides effective protection for the electronic components. In this way, the electronic components are stably installed, preventing displacement of the components even under long-term vibration or severe impact, ensuring a stable connection between the pins and the circuit board, guaranteeing the continuity and reliability of electrical transmission, effectively preventing short circuits and open circuit faults, and thus ensuring the stable operation of electronic products.

[0017] 2. In this utility model, through the interaction of the various components of the device, efficient heat dissipation of electronic components is achieved, enabling surface-mount electronic components to work stably in a suitable temperature environment, avoiding performance degradation or damage caused by overheating, thereby ensuring the reliability and durability of electronic products. Attached Figure Description

[0018] Figure 1 This utility model provides a perspective view of the main structure of a surface-mount electronic component;

[0019] Figure 2 This utility model provides a three-dimensional sectional view of a portion of the structure of a surface-mount electronic component.

[0020] Figure 3 This utility model provides a three-dimensional exploded view of a portion of the structure of a surface-mount electronic component;

[0021] Figure 4 This invention provides a side-view three-dimensional exploded view of a portion of the structure of a surface-mount electronic component.

[0022] Legend: 1. Circuit board; 2. Embedding slot; 3. Slot; 4. Embedding block; 5. Push rod; 6. Wedge block; 7. First spring; 8. Slot; 9. Limiting slot; 10. Second spring; 11. Limiting block; 12. Lower protective box; 13. Mounting hole; 14. Mounting block; 15. Upper protective box; 16. Fixing slot; 17. Fixing block; 18. Metal pull block; 19. Magnetic block; 20. Component body; 21. Pin; 22. Protective shell; 23. Miniature fan; 24. Heat conduction plate; 25. Heat dissipation fins. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0025] Example 1, as shown in the attached document Figure 1 -Appendix Figure 4 As shown, this utility model provides a technical solution: a surface mount electronic component, including a circuit board 1. The top of the circuit board 1 has two embedding slots 2, and the inner surface of the circuit board 1 has two slots 3. An embedding block 4 is movably inserted into the inner surface of each of the two embedding slots 2. A push rod 5 is movably inserted into the inner surface of each of the two embedding blocks 4. A wedge block 6 is fixedly connected to the bottom of each of the two push rods 5. A set of first springs 7 is fixedly connected to the inner surface of each of the two embedding blocks 4. A locking block 8 is fixedly connected between the outer surface of each of the two sets of first springs 7, and the outer surface of each locking block 8 is movably inserted into the interior of the two slots 3. A limiting groove 9 is provided on one side of the outer surface of each of the two push rods 5. A second spring 10 is fixedly connected to the inner surface of each of the two embedding blocks 4. A limiting block 11 is fixedly connected to the outer surface of each of the two second springs 10, and the outer surface of each limiting block 11 is movably inserted into the interior of the limiting groove 9.

[0026] The effect achieved by the entire embodiment 1 is as follows: When installing components, firstly, two embedding blocks 4 need to be embedded into the corresponding embedding slots 2 on the top of the circuit board 1. Then, press down on the two push rods 5. The push rods 5 drive the wedge blocks 6 to move down synchronously. As the wedge blocks 6 descend, their inclined surfaces will contact and interact with the inclined surfaces of the locking blocks 8. Since the outer walls of the two locking blocks 8 are movably inserted into the interior of the two embedding blocks 4, the downward pushing force of the wedge blocks 6 will drive the locking blocks 8 to move to one side until one end of the locking blocks 8 is embedded in the corresponding locking slot 3, thereby achieving a firm connection between the embedding blocks 4 and the circuit board 1. The mortise and tenon joint ensures that the connection structure maintains high stability and robustness even when electronic components are subjected to long-term vibration or severe impact, thus effectively guaranteeing the normal operation of electronic products. In addition, when the locking block 8 is successfully engaged in the locking slot 3, the position of the limiting slot 9 will naturally correspond to the position of the limiting block 11. At this time, the elastic restoring force of the second spring 10 can make the limiting block 11 smoothly engage in the corresponding limiting slot 9, ensuring that the wedge block 6 can continuously provide stable thrust, thereby enhancing the stability and reliability of the component connection.

[0027] Example 2, as Figure 2-4As shown, a lower protective box 12 is fixedly connected between one side of the outer wall of the two embedded blocks 4. The top of the lower protective box 12 has four mounting holes 13. Mounting blocks 14 are movably inserted into the inner surface of each of the four mounting holes 13. An upper protective box 15 is fixedly connected between the tops of the four mounting blocks 14. A fixing groove 16 is provided on one side of the outer wall of each of the four mounting blocks 14. Fixing blocks 17 are movably inserted into the inner surface of each of the four fixing grooves 16. Metal pull blocks 18 are fixedly connected between one side of the outer wall of each of the four fixing blocks 17. The lower protective box 12... Two magnetic blocks 19 are fixedly connected to the inner surface wall, and the outer surfaces of the two metal pull blocks 18 are magnetically connected to the outer surfaces of the two magnetic blocks 19. The inner surface wall of the lower protective box 12 is in contact with the component body 20. The outer surface wall of the component body 20 is provided with two sets of pins 21. The outer surface wall of the lower protective box 12 is fixedly connected with two sets of protective shells 22. A miniature fan 23 is fixedly installed on the top of the upper protective box 15. A heat-conducting plate 24 is fixedly connected to the top of the component body 20. A heat dissipation fin 25 is fixedly connected to the top of the heat-conducting plate 24.

[0028] The overall effect of Embodiment 2 is as follows: During use, the two sets of protective shells 22 effectively wrap the two sets of pins 21, thereby providing necessary protection for the pins 21. This protection can prevent the pins 21 from being damaged by external impact, friction or corrosion during use or transportation, thereby extending their service life and maintaining their good electrical connection performance. During the operation of the component body 20, the heat-conducting plate 24 can efficiently absorb the heat generated by the component body 20 and quickly transfer this heat to the heat dissipation fins 25. The heat dissipation fins 25 have a large heat dissipation area, which can significantly improve the heat dissipation efficiency. In addition, the micro fan 23 generates airflow to create a negative pressure environment inside the upper protective box 15. This negative pressure effect causes cold air from the outside to be drawn into the box through multiple sets of ventilation holes on the outer wall of the upper protective box 15. This cold air exchanges heat with the heat dissipation fins 25 inside the box, effectively removing the heat from the component body 20. This heat dissipation method ensures that the component body 20 can work stably in a suitable temperature environment, avoiding performance degradation or damage caused by overheating, thereby ensuring the reliability and durability of electronic products.

[0029] The working principle of the entire device is as follows: First, the two insert blocks 4 are precisely inserted into the corresponding insert slots 2 on the top of the circuit board 1. Then, the two push rods 5 are pressed down, causing the wedge block 6 to move downwards. During this movement, the inclined surface of the wedge block 6 contacts and interacts with the inclined surface of the locking block 8. Because the outer wall of the locking block 8 can slide flexibly inside the corresponding insert block 4, the downward pushing force of the wedge block 6 will drive the locking block 8 to move to one side until one end is firmly embedded in the corresponding locking slot 3, thus achieving a strong tenon-and-mortise connection between the insert block 4 and the circuit board 1. Simultaneously, the positions of the limiting slot 9 and the limiting block 11 naturally correspond. With the help of the elastic restoring force of the second spring 10, the limiting block 11 is smoothly pushed into the corresponding limiting slot 9. This step ensures that the wedge block 6 can continuously provide a stable pushing force, thereby enhancing the stability of the component connection. In addition, the lower protective box 12 and the upper protective box 15 together provide effective protection for the component body 20. When maintenance or replacement of the main body 20 of the component is required, simply pull the two metal pull blocks 18 to disengage them from the corresponding magnetic blocks 19, allowing the four fixing blocks 17 to be removed from the corresponding fixing slots 16, thus quickly and conveniently opening the upper protective box 15. During use, the heat-conducting plate 24 can efficiently absorb the heat generated by the main body 20 of the component and transfer this heat to the heat dissipation fins 25. The heat dissipation fins 25 improve the heat dissipation efficiency by increasing the heat dissipation area. At the same time, it is connected to the power management system of the electronic device through the power interface of the micro fan 23, ensuring that the micro fan 23 can be powered on and started smoothly during use. Once started, the micro fan 23 will generate airflow, creating a negative pressure environment inside the upper protective box 15. This negative pressure effect causes cold air from the outside to be drawn into the box through multiple sets of ventilation holes on the outer wall of the upper protective box 15. This cold air exchanges heat with the heat dissipation fins 25 inside the box, effectively removing the heat from the main body 20 of the component.

[0030] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A surface-mount electronic component, characterized in that: Includes a circuit board (1), the top of which has two recessed slots (2), and the inner wall of which has two slots (3). A mounting block (4) is movably inserted into the inner wall of each of the two recessed slots (2), and a push rod (5) is movably inserted into the inner wall of each of the two mounting blocks (4). A wedge block (6) is fixedly connected to the bottom of each of the two push rods (5), and a set of first springs (7) is fixedly connected to the inner wall of each of the two mounting blocks (4). Each of the outer walls of the first spring (7) is fixedly connected with a locking block (8), and the outer walls of the two locking blocks (8) are movably inserted into the two locking slots (3). Each of the outer walls of the two push rods (5) has a limiting groove (9) on one side. Each of the inner walls of the two embedded blocks (4) is fixedly connected with a second spring (10). Each of the outer walls of the two second springs (10) is fixedly connected with a limiting block (11), and the outer walls of the two limiting blocks (11) are movably inserted into the limiting groove (9).

2. A surface-mount electronic component according to claim 1, characterized in that: A lower protective box (12) is fixedly connected between the outer walls of the two embedded blocks (4). The top of the lower protective box (12) has four mounting holes (13), and the inner surface of each of the four mounting holes (13) is movably fitted with a mounting block (14).

3. A surface-mount electronic component according to claim 2, characterized in that: An upper protective box (15) is fixedly connected between the tops of the four mounting blocks (14). A fixing groove (16) is provided on one side of the outer wall of each of the four mounting blocks (14). A fixing block (17) is movably inserted into the inner surface of each of the four fixing grooves (16).

4. A surface-mount electronic component according to claim 3, characterized in that: Metal pull blocks (18) are fixedly connected to one side of the outer wall of each of the four fixed blocks (17). Two magnetic blocks (19) are fixedly connected to the inner surface of the lower protective box (12), and the outer surface of the two metal pull blocks (18) is magnetically attracted to the outer surface of the two magnetic blocks (19).

5. A surface-mount electronic component according to claim 4, characterized in that: The inner surface of the lower protective box (12) is in contact with the component body (20), and the outer surface of the component body (20) is provided with two sets of pins (21).

6. A surface-mount electronic component according to claim 5, characterized in that: The lower protective box (12) has two sets of protective shells (22) fixedly connected to its outer wall, and the upper protective box (15) has a micro fan (23) fixedly installed on its top.

7. A surface-mount electronic component according to claim 6, characterized in that: A heat-conducting plate (24) is fixedly connected to the top of the main body (20) of the component, and a heat dissipation fin (25) is fixedly connected to the top of the heat-conducting plate (24).

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