Glue residue removing device for circuit board manufacturing

Abstract

The utility model discloses a glue residue removing device for circuit board manufacturing, which comprises a conveying device comprising two conveyor belts which are arranged at an interval and are parallel to each other; the first glue residue removing unit is used for removing glue residues on the upper surface of the circuit board on the conveying belt; the connecting rod turn-over mechanism is arranged at the downstream of the first glue residue removing unit and comprises a first arm body and a second arm body, in the turn-over process, the first arm body and the second arm body synchronously and oppositely turn over, the first arm body supports the circuit board on the conveying belt and then conveys the circuit board to the second arm body, and the second arm body supports the circuit board and then synchronously turns over back to back with the first arm body; the circuit board is turned over and then placed on the conveyor belt; and the second glue residue removing unit is used for removing glue residues on the upper surface of the turned circuit board on the conveying belt. Due to the arrangement of the connecting rod turn-over mechanism, when residual glue residues on the surface of the double-sided circuit board are removed, automatic turn-over of the circuit board can be achieved, the labor cost is reduced, the working efficiency is improved, and meanwhile the error rate in the turn-over process can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a device for removing adhesive residue in circuit board manufacturing. Background Technology

[0002] A PCB (Printed Circuit Board) is an indispensable component of electronic devices. It transfers circuit patterns onto printed lines to form a functional circuit structure, thereby enabling electrical connections between electronic components. These circuit boards are manufactured using electronic printing techniques, hence the name "printed circuit board." Their main function is to provide support, fixation, and connection for electronic components, connecting them through different types of circuits to ensure the proper functioning of the electronic equipment.

[0003] During PCB manufacturing, adhesives and residues remain on the PCB surface. To prevent these residues from affecting subsequent processing, they need to be removed. For double-sided PCBs, after removing adhesive residue from one side, the PCB needs to be flipped over to remove the residue from the other side. Currently, this flipping process is usually done manually, increasing labor costs, hindering efficiency, and resulting in a relatively high error rate. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a device for removing adhesive residue in circuit board manufacturing. When removing residual adhesive residue from the surface of a double-sided circuit board, it can automatically flip the board over, remove the adhesive residue from one side, and then immediately remove the adhesive residue from the other side.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a device for removing adhesive residue in circuit board manufacturing is provided, comprising:

[0006] The conveying device includes two parallel conveyor belts spaced apart for conveying circuit boards in a horizontal direction.

[0007] The first adhesive residue removal unit is located above the conveyor belt and is used to remove adhesive residue from the upper surface of the circuit board on the conveyor belt.

[0008] A linkage flipping mechanism is located below the conveyor belt and downstream of the first adhesive residue removal unit. The linkage flipping mechanism includes a first arm and a second arm. During the flipping process, the first arm and the second arm flip towards each other synchronously. The first arm lifts the circuit board on the conveyor belt and passes it to the second arm. After receiving the circuit board, the second arm flips in opposite directions synchronously with the first arm, and then the circuit board is flipped and placed on the conveyor belt.

[0009] The second adhesive residue removal unit is located above the conveyor belt and downstream of the connecting rod flipping mechanism, and is used to remove adhesive residue from the surface of the circuit board after it has been flipped on the conveyor belt.

[0010] Furthermore, the adhesive residue removal device for circuit board manufacturing of this utility model also includes a rinsing unit and a drying unit.

[0011] The rinsing unit is located on the upper and lower sides of the conveyor belt and downstream of the second adhesive residue removal unit. It washes away the residual adhesive residue that is still attached to the two sides of the circuit board after being removed by the adhesive residue removal unit by spraying water.

[0012] The air-drying unit is located on the upper and lower sides of the conveyor belt and downstream of the rinsing unit. It is used to air-dry the circuit board after it has been rinsed by the rinsing unit.

[0013] Furthermore, the rinsing unit includes two rows of water spray nozzles respectively arranged on the upper and lower sides of the conveyor belt; the drying unit includes two sets of hot air blowers respectively arranged on the upper and lower sides of the conveyor belt.

[0014] Furthermore, the first adhesive residue removal unit includes a first spraying mechanism and a first brush roller;

[0015] The first spraying mechanism is provided with a plurality of first nozzles for spraying atomized adhesive remover onto the upper surface of the circuit board that has moved below it;

[0016] The first brush roller is located downstream of the first spraying mechanism and is used to brush away adhesive residue adhering to the surface of the circuit board.

[0017] Furthermore, the second adhesive residue removal unit includes a second spraying mechanism and a second brush roller;

[0018] The second spraying mechanism is equipped with multiple second nozzles for spraying atomized adhesive remover onto the upper surface of the circuit board after it has been moved and flipped over below it.

[0019] The second brush roller is located downstream of the second spraying mechanism and is used to brush away the adhesive residue adhering to the surface of the circuit board after it has been flipped.

[0020] Furthermore, the linkage flipping mechanism also includes a rotating block and a first motor;

[0021] The first arm and the second arm are arranged one in front of the other close to the first glue removal unit and the second glue removal unit, respectively, along the conveying direction of the conveyor belt.

[0022] The first arm is sleeved on the first fixed shaft and can rotate around the axis of the first fixed shaft; the upper part of the first arm has a first support area for supporting the circuit board.

[0023] The second arm is sleeved on the second fixed shaft and can rotate around the axis of the second fixed shaft; the upper part of the second arm forms a second support area for supporting the circuit board; wherein the first fixed shaft and the second fixed shaft are arranged at approximately the same height.

[0024] The rotating block can be driven to rotate by the first motor, thereby causing the first arm and the second arm to flip synchronously towards each other or synchronously in opposite directions.

[0025] Furthermore, the linkage flipping mechanism also includes a first linkage and a second linkage;

[0026] One end of the first connecting rod is hinged to the bottom of the first arm body;

[0027] One end of the second connecting rod is hinged to the bottom of the second arm;

[0028] One end of the rotating block is hinged to the end of the first connecting rod away from the first arm body via a first movable shaft, and the other end of the rotating block is hinged to the end of the second connecting rod away from the second arm body via a second movable shaft.

[0029] The first motor is used to drive the rotating block to rotate in the forward or reverse direction, so as to drive the first arm and the second arm to rotate synchronously in opposite directions or synchronously in opposite directions through the first link and the second link.

[0030] Furthermore, the first arm body includes two spaced-apart first arm plates; there are two first connecting rods, and one end of each of the two first connecting rods is hinged to the bottom of the two first arm plates, and the other end of each of the two first connecting rods is hinged to both ends of the first movable shaft; the middle part of the first movable shaft is passed through and hinged to one end of the rotating block.

[0031] The second arm includes two spaced-apart second arm plates; there are two second connecting rods, one end of each second connecting rod is hinged to the bottom of the two second arm plates, and the other end of each second connecting rod is hinged to both ends of the second movable shaft; the middle part of the second movable shaft is passed through and hinged to the other end of the rotating block.

[0032] Furthermore, the first arm also includes a first connecting rod that serves as a stabilizing element connected between the two first arm plates;

[0033] The second arm also includes a second connecting rod that serves as a stabilizing element connecting the two second arm plates.

[0034] Furthermore, the two first arm plates are respectively located outside the two second arm plates, and the first connecting rod is hinged to the first arm plate from the outside of the first arm plate, and the second connecting rod is hinged to the second arm plate from the inside of the second arm plate.

[0035] The beneficial effects of this utility model are as follows:

[0036] Because this invention incorporates a linkage flipping mechanism, it can automatically flip the circuit board when removing residual adhesive residue from the surface of a double-sided circuit board. That is, after removing adhesive residue from one side of the circuit board, it will automatically flip over via the linkage flipping mechanism, and then immediately remove the adhesive residue from the other side. Compared to the manual flipping process, this reduces labor costs, improves work efficiency, and also reduces the error rate during the flipping process. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the overall structure of the adhesive residue removal device for road slab manufacturing provided by this utility model;

[0038] Figure 2 yes Figure 1 The front view;

[0039] Figure 3 This is an independent view of the linkage flipping mechanism in this utility model;

[0040] Figure 4 yes Figure 3 The front view;

[0041] Figure 5 yes Figure 3 Top view;

[0042] Figure 6 This is a process diagram of the connecting rod flipping mechanism flipping the circuit board in this utility model. Detailed Implementation

[0043] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0044] See Figures 1 to 5 This utility model provides a device for removing adhesive residue in circuit board manufacturing, which includes: a conveying device 100, a first adhesive residue removal unit 200, a connecting rod flipping mechanism 300, and a second adhesive residue removal unit 400.

[0045] The conveying device 100 includes two parallel conveyor belts 110 spaced apart for conveying circuit board a in a horizontal direction.

[0046] The first adhesive residue removal unit 200 is disposed above the conveyor belt 110 and is used to remove adhesive residue from the upper surface of the circuit board a on the conveyor belt 110.

[0047] The linkage flipping mechanism 300 is located below the conveyor belt 110 and downstream of the first adhesive residue removal unit 200. The linkage flipping mechanism 300 includes a first arm 310 and a second arm 320. During the flipping process, the first arm 310 and the second arm 320 flip synchronously towards each other. The first arm 310 lifts the circuit board a on the conveyor belt 110 and passes it to the second arm 320. The second arm 320 receives the circuit board a and flips synchronously in opposite directions with the first arm 310, so that the circuit board a is flipped and placed on the conveyor belt 110.

[0048] The second adhesive residue removal unit 400 is disposed above the conveyor belt 110 and downstream of the connecting rod flipping mechanism 300, and is used to remove adhesive residue from the upper surface of the circuit board a after it has been flipped on the conveyor belt 110.

[0049] Normally, such as Figure 1 and Figure 2 As shown, the adhesive residue removal device for circuit board manufacturing of this utility model also includes a rinsing unit 500 and a drying unit 600.

[0050] The rinsing unit 500 is located on the upper and lower sides of the conveyor belt 110 and downstream of the second adhesive residue removal unit 400. It washes away the residual adhesive residue that is still attached to the two sides of the circuit board a after being removed by the adhesive residue removal unit by spraying water.

[0051] The air-drying unit 600 is disposed on the upper and lower sides of the conveyor belt 110 and is located downstream of the rinsing unit 500. It is used to air-dry the circuit board a after it has been rinsed by the rinsing unit 500.

[0052] In a preferred embodiment, see Figure 1 and Figure 2 As shown, the rinsing unit 500 includes two rows of water spray nozzles 510 respectively disposed on the upper and lower sides of the conveyor belt 110. These nozzles are supplied with water via corresponding pipelines. The water sprayed from the nozzles 510 rinses the surface of the circuit board a, further removing residual adhesive residue not completely removed in the previous process. The drying unit 600 includes two sets of hot air blowers 610 respectively disposed on the upper and lower sides of the conveyor belt 110. During operation, after the circuit board a is rinsed by the rinsing unit 500, it arrives at the corresponding position in the drying unit 600. The hot air blowers 610 then blow hot air to dry the surfaces of the upper and lower sides of the circuit board a, rapidly drying the surface for subsequent processing.

[0053] In a preferred embodiment, see Figure 1 and Figure 2As shown, the first adhesive residue removal unit 200 includes a first spraying mechanism 210 and a first brush roller 220.

[0054] The first spraying mechanism 210 is equipped with multiple first nozzles 211, which are connected to corresponding pipelines to spray atomized adhesive remover onto the upper surface of the circuit board a below it, softening and dissolving adhesive residue. The first brush roller 220 is located downstream of the first spraying mechanism 210 and can be driven to rotate by the second motor 230 to brush the surface of the circuit board a after spraying with the atomized adhesive remover, removing the softened adhesive residue from the surface of the circuit board a.

[0055] In a preferred embodiment, see Figure 1 and Figure 2 As shown, the second adhesive residue removal unit 400 includes a second spraying mechanism 410 and a second brush roller 420.

[0056] The second spraying mechanism 410 is equipped with multiple second nozzles 411, which are connected to corresponding pipelines to spray atomized adhesive remover onto the upper surface of the circuit board a after it has been moved and flipped downwards, softening and dissolving adhesive residue. The second brush roller 420 is located downstream of the second spraying mechanism 410 and can be driven to rotate by a third motor 430 to brush the other surface of the circuit board a after the atomized adhesive remover has been sprayed, removing the softened adhesive residue from the other surface of the circuit board a.

[0057] In a preferred embodiment, see Figures 3 to 5 As shown, the linkage flipping mechanism 300 also includes a rotating block 330 and a first motor 340.

[0058] The first arm 310 and the second arm 320 are arranged one in front of the other close to the first glue removal unit 200 and the second glue removal unit 400, respectively, along the transmission direction of the conveyor belt 110.

[0059] The first arm 310 is sleeved on the first fixed shaft 350 and can rotate around the axis of the first fixed shaft 350. The upper part of the first arm 310 forms a first support area 31a for supporting the circuit board a. The bottom of the first support area 31a forms a first stepped surface 31b for bearing the weight of the circuit board a when it is lifted.

[0060] The second arm 320 is sleeved on the second fixed shaft 360 and can rotate around the axis of the second fixed shaft 360. The upper portion of the second arm 320 forms a second support area 32a for supporting the circuit board a. The bottom of the second support area 32a forms a second stepped surface 32b for bearing the weight of the circuit board a when it is lifted. Furthermore, the first fixed shaft 350 and the second fixed shaft 360 are arranged at approximately the same height.

[0061] The rotating block 330 can be powered by the first motor 340 (see...). Figure 2 The rotation drives the first arm 310 and the second arm 320 to rotate synchronously towards each other or synchronously towards each other.

[0062] Further, see Figures 3 to 5 As shown, the linkage flipping mechanism 300 also includes a first link 370 and a second link 380.

[0063] One end of the first connecting rod 370 is hinged to the bottom of the first arm 310.

[0064] One end of the second connecting rod 380 is hinged to the bottom of the second arm 320.

[0065] One end of the rotating block 330 is hinged to the end of the first connecting rod 370 away from the first arm body 310 via the first movable shaft 391, and the other end of the rotating block 330 is hinged to the end of the second connecting rod 380 away from the second arm body 320 via the second movable shaft 392.

[0066] The first motor 340 is used to drive the rotating block 330 to rotate in the forward or reverse direction, so as to drive the first arm 310 and the second arm 320 to rotate synchronously in opposite directions or synchronously in opposite directions through the first connecting rod 370 and the second connecting rod 380.

[0067] Furthermore, see Figure 3 and Figure 5 As shown, the first arm body 310 includes two spaced-apart first arm plates 311. There are two first connecting rods 370, with one end of each first connecting rod 370 hinged to the bottom of the two first arm plates 311, and the other end of each first connecting rod 370 hinged to both ends of the first movable shaft 391. The middle portion of the first movable shaft 391 passes through and is hinged to the lower end of the rotating block 330.

[0068] The second arm body 320 includes two spaced-apart second arm plates 321. There are two second connecting rods 380, one end of which is hinged to the bottom of each of the two second arm plates 321, and the other end of which is hinged to both ends of the second movable shaft 392. The middle portion of the second movable shaft 392 passes through and is hinged to the upper end of the rotating block 330.

[0069] For an even better option, see [link to previous section]. Figure 3 and Figure 5 As shown, the first arm body 310 further includes a first connecting rod 312 serving as a stabilizing member connected between the two first arm plates 311. The second arm body 320 further includes a second connecting rod 322 serving as a stabilizing member connected between the two second arm plates 321.

[0070] Also see Figure 3 and Figure 5 As shown, the two first arm plates 311 are located on the outer sides of the two second arm plates 321, and the first connecting rod 370 is hinged to the first arm plate 311 from the outer side of the first arm plate 311, while the second connecting rod 380 is hinged to the second arm plate 321 from the inner side of the second arm plate 321. Therefore, the linkage flipping mechanism 300 will not interfere with each other during movement. That is, when the rotating block 330 rotates forward or backward, the arm plates and connecting rods will not collide or rub against each other, ensuring that the first arm 310 and the second arm 320 can smoothly and synchronously flip in opposite directions or synchronously flip in opposite directions.

[0071] The working process of the above-mentioned linkage flipping mechanism 300 is as follows:

[0072] When circuit board a is conveyed by conveyor belt 110 to the top of first arm 310 (see...) Figure 6 In step I), the conveyor belt 110 pauses operation. Then, the first motor 340 drives the rotating block 330 to rotate forward. During this forward rotation, the first connecting rod 370 and the second connecting rod 380 respectively drive the bottoms of the first arm 310 and the second arm 320 to move, thereby causing the first arm 310 and the second arm 320 to rotate around the first fixed axis 350 and the second fixed axis 360 respectively, achieving the purpose of synchronously flipping the first arm 310 and the second arm 320 towards each other. During the flipping process, the first arm 310 will first lift the circuit board a on the conveyor belt 110 (see...). Figure 6 (Step II) Then, when the first arm 310 is flipped to be relatively close to the second arm 320, the first arm 310 will tilt slightly towards the second arm 320, thereby transferring the circuit board a to the second arm 320 by gravity (see... Figure 6 (Step III);

[0073] After the second arm 320 receives the circuit board a, the first motor 340 will drive the rotating block 330 to reverse. During the reversal process, similar to the previous principle, the first connecting rod 370 and the second connecting rod 380 will respectively drive the first arm 310 and the second arm 320 to rotate synchronously in the opposite direction (see...). Figure 6 (Step IV) During this process, when the second arm 320 flips to be below the conveyor belt 110, the circuit board a will be flipped over and placed on the conveyor belt 110 (see... Figure 6 (Step V);

[0074] Subsequently, conveyor belt 110 starts, moving circuit board a to the next process; thus completing the entire process of automatically flipping circuit board a.

[0075] The working process of this utility model is as follows:

[0076] Circuit board a is placed on the conveyor belt 110 of the conveyor device 100 and is driven by the conveyor belt 110 to pass through each processing unit in sequence.

[0077] When circuit board a moves to the area below the first adhesive residue removal unit 200, firstly, the first nozzle 211 of the first spraying mechanism 210 sprays atomized adhesive remover onto the upper surface of circuit board a to soften and dissolve the adhesive residue; then, the first brush roller 220 brushes away the adhesive residue adhering to the upper surface of circuit board a.

[0078] Next, the process is as follows: Figure 6 As shown, circuit board a continues to move above the linkage flipping mechanism 300 (see...). Figure 6 (Step I) After that, the first arm 310 and the second arm 320 flip towards each other synchronously. The first arm 310 lifts up the circuit board a and passes it to the second arm 320 (see...) Figure 6 In steps II and III), after the second arm 320 receives the circuit board a, it flips backwards synchronously with the first arm 310 (see...). Figure 6 (Step IV), then the circuit board a is flipped over and placed on conveyor belt 110 (see...) Figure 6 (Step V);

[0079] Then, the flipped circuit board a continues to move to the bottom of the second adhesive residue removal unit 400. First, the second nozzle 411 of the second spraying mechanism 410 sprays atomized adhesive remover onto the upper surface of the flipped circuit board a to soften and dissolve the adhesive residue. Subsequently, the second brush roller 420 brushes away the adhesive residue adhering to the upper surface of the flipped circuit board a.

[0080] Afterwards, circuit board a is moved to the rinsing unit 500, and the water spray nozzle 510 of the rinsing unit 500 sprays water to rinse the upper and lower surfaces of circuit board a, further removing residual adhesive residue.

[0081] Finally, circuit board a is moved to the drying unit 600, where the hot air blower 610 blows out hot air to dry the upper and lower surfaces of circuit board a, thus quickly drying the surface of circuit board a and completing the entire process of removing adhesive residue.

[0082] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A device for removing adhesive residue in circuit board manufacturing, characterized in that, include: The conveying device (100) includes two parallel conveyor belts (110) spaced apart for conveying circuit boards (a) in a horizontal direction. The first adhesive residue removal unit (200) is disposed above the conveyor belt (110) and is used to remove adhesive residue from the upper surface of the circuit board (a) on the conveyor belt (110). A linkage flipping mechanism (300) is disposed below the conveyor belt (110) and downstream of the first adhesive residue removal unit (200). The linkage flipping mechanism (300) includes a first arm (310) and a second arm (320). During the flipping process, the first arm (310) and the second arm (320) flip in opposite directions synchronously. The first arm (310) lifts the circuit board (a) on the conveyor belt (110) and passes it to the second arm (320). The second arm (320) receives the circuit board (a) and flips in opposite directions synchronously with the first arm (310). Then, the circuit board (a) is flipped and placed on the conveyor belt (110). The second adhesive residue removal unit (400) is located above the conveyor belt (110) and downstream of the connecting rod flipping mechanism (300), and is used to remove adhesive residue from the upper surface of the flipped circuit board (a) on the conveyor belt (110).

2. The device for removing adhesive residue in circuit board manufacturing according to claim 1, characterized in that, It also includes a rinsing unit (500) and a drying unit (600); The rinsing unit (500) is located on the upper and lower sides of the conveyor belt (110) and downstream of the second adhesive residue removal unit (400). It washes away the residual adhesive residue that is still attached to the two sides of the circuit board (a) after being removed by the adhesive residue removal unit by spraying water. The air-drying unit (600) is disposed on the upper and lower sides of the conveyor belt (110) and located downstream of the rinsing unit (500), and is used to air-dry the circuit board (a) after it has been rinsed by the rinsing unit (500).

3. The device for removing adhesive residue in circuit board manufacturing according to claim 2, characterized in that, The rinsing unit (500) includes two rows of water spray nozzles (510) respectively arranged on the upper and lower sides of the conveyor belt (110); the drying unit (600) includes two sets of hot air blowers (610) respectively arranged on the upper and lower sides of the conveyor belt (110).

4. The device for removing adhesive residue in circuit board manufacturing according to claim 1, characterized in that, The first adhesive residue removal unit (200) includes a first spraying mechanism (210) and a first brush roller (220); The first spraying mechanism (210) is provided with a plurality of first nozzles (211) for spraying atomized adhesive remover onto the upper surface of the circuit board (a) that has moved below it; The first brush roller (220) is located downstream of the first spraying mechanism (210) and is used to brush away adhesive residue adhering to the upper surface of the circuit board (a).

5. The device for removing adhesive residue in circuit board manufacturing according to claim 1, characterized in that, The second adhesive residue removal unit (400) includes a second spraying mechanism (410) and a second brush roller (420); The second spraying mechanism (410) is provided with a plurality of second nozzles (411) for spraying atomized adhesive remover onto the upper surface of the circuit board (a) after it has been moved to the underside and flipped over. The second brush roller (420) is located downstream of the second spraying mechanism (410) and is used to brush away the adhesive residue adhering to the upper surface of the flipped circuit board (a).

6. The device for removing adhesive residue in circuit board manufacturing according to claim 1, characterized in that, The linkage flipping mechanism (300) also includes a rotating block (330) and a first motor (340); The first arm (310) and the second arm (320) are arranged one in front of the other close to the first slag removal unit (200) and the second slag removal unit (400) respectively along the transmission direction of the conveyor belt (110); The first arm (310) is sleeved on the first fixed shaft (350) and can rotate around the axis of the first fixed shaft (350); the upper part of the first arm (310) forms a first support area (31a) for supporting the circuit board (a); The second arm (320) is sleeved on the second fixed shaft (360) and can rotate around the axis of the second fixed shaft (360); the upper part of the second arm (320) forms a second support area (32a) for supporting the circuit board (a); wherein the first fixed shaft (350) and the second fixed shaft (360) are arranged at approximately the same height; The rotating block (330) can be driven to rotate by the first motor (340), thereby driving the first arm body (310) and the second arm body (320) to rotate synchronously towards each other or synchronously towards each other.

7. The device for removing adhesive residue in circuit board manufacturing according to claim 6, characterized in that, The linkage flipping mechanism (300) further includes a first link (370) and a second link (380); One end of the first connecting rod (370) is hinged to the bottom of the first arm body (310); One end of the second connecting rod (380) is hinged to the bottom of the second arm (320); One end of the rotating block (330) is hinged to the end of the first connecting rod (370) away from the first arm body (310) via the first movable shaft (391), and the other end of the rotating block (330) is hinged to the end of the second connecting rod (380) away from the second arm body (320) via the second movable shaft (392). The first motor (340) is used to drive the rotating block (330) to rotate in the forward or reverse direction, so as to drive the first arm (310) and the second arm (320) to rotate synchronously in opposite directions or synchronously in opposite directions through the first connecting rod (370) and the second connecting rod (380).

8. The device for removing adhesive residue in circuit board manufacturing according to claim 7, characterized in that, The first arm body (310) includes two spaced-apart first arm plates (311); there are two first connecting rods (370), and one end of each of the two first connecting rods (370) is hinged to the bottom of the two first arm plates (311), and the other end of each of the two first connecting rods (370) is hinged to both ends of the first movable shaft (391); the middle part of the first movable shaft (391) is passed through and hinged to one end of the rotating block (330); The second arm body (320) includes two spaced-apart second arm plates (321); there are two second connecting rods (380), and one end of each of the two second connecting rods (380) is hinged to the bottom of the two second arm plates (321), and the other end of each of the two second connecting rods (380) is hinged to both ends of the second movable shaft (392); the middle part of the second movable shaft (392) is passed through and hinged to the other end of the rotating block (330).

9. A device for removing adhesive residue in circuit board manufacturing according to claim 8, characterized in that, The first arm body (310) also includes a first connecting rod (312) that serves as a stabilizing member and is connected between the two first arm plates (311); The second arm (320) also includes a second connecting rod (322) that serves as a stabilizing element and is connected between the two second arm plates (321).

10. A device for removing adhesive residue in circuit board manufacturing according to claim 9, characterized in that, The two first arm plates (311) are located on the outside of the two second arm plates (321), and the first connecting rod (370) is hinged to the first arm plate (311) from the outside of the first arm plate (311), and the second connecting rod (380) is hinged to the second arm plate (321) from the inside of the second arm plate (321).

Images