PCB circuit board with edge side surface plating
By using a combination of straight lines and arcs along the edges of the holes on the PCB substrate, and by setting a three-dimensional plating layer around the holes and connecting it with the GND layer, the problems of insufficient mechanical strength and assembly wobbling in the existing PCB circuit boards are solved, achieving higher mechanical strength, heat dissipation performance and design freedom.
Patent Information
- Application Number
- CN202520347430.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-02-28
AI Technical Summary
The limited shape of mechanically drilled holes along the edges of existing PCB circuit boards can lead to problems such as wobbling and insufficient mechanical strength during assembly.
The hole contour edges of the PCB substrate are combined with straight and curved edges to form a variety of hole structures, and a three-dimensional plating layer is set around the holes, including side and front and back plating areas, and connected to the GND layer to enhance mechanical strength and thermal conductivity.
It improves the mechanical strength and heat dissipation performance of PCB circuit boards, reduces shaking during assembly, enhances electrostatic protection capabilities, and increases design freedom.
Smart Images
Figure CN223798513U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of PCB circuit boards, and particularly to a PCB circuit board with edge side plating. Background Technology
[0002] During the manufacturing process of PCB circuit boards, some PCB circuit boards have notches machined into certain edges using mechanical drilling, and then a plating layer is applied to the outline of the notches. The purpose of this is to enhance the mechanical strength of the area, aid in heat dissipation, and so on.
[0003] The advantage of mechanical drilling is its mature and stable process, but its disadvantage is the limitation on the shapes that can be processed, which are limited to circles, semicircles, etc. Most notches are arc-shaped, and due to their geometric shape, arc-shaped notches are difficult to restrict in terms of rotational freedom. Therefore, existing PCB circuit boards with plated notches may experience PCB board wobbling during assembly. Utility Model Content
[0004] This application is made in view of the aforementioned state of the prior art. The purpose of this application is to provide a PCB circuit board with edge side plating.
[0005] The technical solution adopted in this application includes: a hole, the hole penetrating both sides of the PCB substrate, the hole being located at the edge or inside of the PCB substrate, the hole located at the edge of the PCB substrate being a notch hole, and the hole located inside the PCB substrate being a hollow hole; a plating layer, the plating layer contacting the outline of the hole, the plating layer including a side plating area covering the sidewall of the hole, and also including a front and back plating area contacting the front or back of the PCB substrate, the front and back plating areas being vertically connected to both sides of the side plating area, and the cross-sectional outline of the plating layer being a semi-enclosed shape with an opening; a GND layer, the GND layer being electrically connected to the plating layer; wherein, the outline edge of the hole includes a straight edge and an arc edge, the end of the straight edge being tangentially connected to the end of the arc edge.
[0006] As a further improvement of this application, the straight edge includes a first straight edge and a second straight edge, the length direction of the first straight edge is perpendicular to the length direction of the second straight edge, and the arc edge between the first straight edge and the second straight edge is an inner rounded corner.
[0007] As a further improvement of this application, the opening of the notch has curved edges on both sides, and the curved edges are rounded at the outer corners.
[0008] As a further improvement of this application, the outline edge of a single hole includes a plurality of arc edges, and the arc radii of the plurality of arc edges are not equal to each other.
[0009] As a further improvement of this application, the outline edge of the hollow hole includes the arc edge with a central angle of 270°.
[0010] As a further improvement of this application, the outline edge of the notch includes four curved edges and one straight edge. The straight edge has two curved edges at both ends. The two curved edges at the same end of the straight edge are an inner rounded corner and an outer rounded corner. The end of the inner rounded corner is tangentially connected to the end of the straight edge, and the end of the outer rounded corner is tangentially connected to the end of the adjacent inner rounded corner.
[0011] As a further improvement of this application, the number of notches is not less than four, and each edge of the PCB substrate has at least one notch.
[0012] As a further improvement of this application, the width of the side plating area is greater than twice the width of a single front and back plating area.
[0013] As a further improvement of this application, the thickness of a single front and back plating area is 1.2 to 1.5 times the thickness of the side plating area.
[0014] As a further improvement of this application, the plating layer includes, from the inside out, a copper plating layer, a nickel plating layer, and a gold plating layer; the thickness of the copper plating layer is not less than 10 μm, the thickness of the nickel plating layer is not less than 4 μm, and the thickness of the gold plating layer is not less than 0.04 μm.
[0015] The beneficial effects of the PCB circuit board with edge side plating in this application include:
[0016] The outline of the hole is covered with a plating layer, which increases the mechanical strength of the PCB board in that area. If the hole is not electroplated, the outline of the hole will expose the original material of the PCB substrate (such as resin). When components are assembled through such holes, bumps and knocks are inevitable, which can easily cause the resin edges to crack.
[0017] The thermal conductivity of the coating is used to help dissipate heat.
[0018] The electrical connection between the plating layer and the GND layer is used to prevent electrostatic damage. If there is static electricity on the PCB substrate, it will be grounded through the plating layer of the holes, thus achieving the effect of static discharge.
[0019] Furthermore, the coating provides a more robust coverage, and it's not just a side coating covering the sides of the holes. The entire coating also has front and back coating areas, which are essentially extensions of the side coating areas. Therefore, the coating is three-dimensional, not flat. This semi-enclosed, three-dimensional coating structure allows for a tighter bond between the coating and the PCB substrate, resulting in greater structural strength.
[0020] Furthermore, the location and shape of the holes are more diverse. Holes can be located inside the PCB substrate or along its edges. The edges of the holes can be freely combined with straight edges and curved edges, creating numerous geometric shapes, resulting in diverse final hole outlines. The addition of straight edges allows for diverse notch shapes along the PCB substrate edges, thus increasing the overall diversity of the PCB's outline. Ultimately, this allows for more flexible PCB design, enabling it to adapt to the internal spaces of electronic products such as mobile phones. Compared to curved edges, straight edges better restrict PCB rotation and looseness, reducing PCB wobble. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a top view of the first embodiment of the PCB circuit board with edge side plating of this application;
[0023] Figure 2 This is a front view of a first embodiment of the PCB circuit board with edge side plating according to this application;
[0024] Figure 3 yes Figure 2 Enlarged view of a portion at point A;
[0025] Figure 4 This is a perspective view of the first embodiment of the PCB circuit board with edge side plating of this application;
[0026] Figure 5 yes Figure 4 A magnified view of section B;
[0027] Figure 6 This is a top view of a second embodiment of the PCB circuit board with edge side plating of this application;
[0028] Figure 7 This is a cross-sectional view of the plating layer of the first embodiment of the PCB circuit board with edge side plating of this application;
[0029] Figure 8 This is a top view of the third embodiment of the PCB circuit board with edge side plating of this application.
[0030] Explanation of reference numerals in the attached figures
[0031] 1-PCB substrate; 2-hole; 21-straight edge; 211-first straight edge; 212-second straight edge; 22-curved edge; 221-inner rounded corner; 222-outer rounded corner; 2a-notch; 2b-cutout; 3-plating layer; 31-side plating area; 32-front and back plating areas; 3a-copper plating layer; 3b-nickel plating layer; 3c-gold plating layer; 4-GND layer; L1-first width; L2-second width; H1-first thickness; H2-second thickness. Detailed Implementation
[0032] Exemplary embodiments of this application are described below with reference to the accompanying drawings. It should be understood that these specific descriptions are for teaching those skilled in the art how to implement this application only, and are not intended to exhaustively describe all possible methods of this application, nor to limit the scope of this application.
[0033] See Figure 1 , Figure 5 and Figure 8 This application provides a PCB circuit board with edge side plating. The PCB circuit board includes holes 2, plating layers 3, and a GND layer (i.e., ground layer) 4. The holes 2 penetrate both sides of the PCB substrate 1 and are located at the edge or inside of the PCB substrate 1. The PCB circuit board includes a PCB substrate 1, which can be made of materials such as resin. Figure 8 As shown, the holes 2 located on the edge of the PCB substrate 1 can be notched holes 2a, and the holes 2 located inside the PCB substrate 1 can be hollow holes 2b. The plating layer 3 contacts the outline of the holes 2, as shown. Figure 5 As shown, the plating layer 3 includes a side plating area 31 covering the sidewall of the hole 2, and a front and back plating area 32 in contact with the front or back of the PCB substrate 1. The front and back plating areas 32 are vertically connected to both sides of the side plating area 31. Each side plating area 31 is connected to one front and back plating area 32 on each side. The cross-sectional outline of the plating layer 3 is a semi-enclosed shape with an opening. Figure 5 As shown, GND layer 4 is electrically connected to plating layer 3. GND layer 4 (Ground Layer) can be an internal layer located on the PCB circuit board. Additionally, as... Figure 1 As shown, the outline of the hole 2 includes a straight edge 21 and an arc edge 22, and the end of the straight edge 21 can be tangentially connected to the end of the arc edge 22.
[0034] For ease of expression, Figures 1 to 5 The PCB substrate 1 has the same shape. Figure 6 and Figure 8 The PCB substrate 1 has a different shape. Figure 8 The example shows two typical notch holes 2a and two typical hollow holes 2b assembled on a PCB substrate 1.
[0035] In one embodiment, such as Figure 8 As shown in the notch 2a in the lower left corner, the straight edge 21 includes a first straight edge 211 and a second straight edge 212. The length direction of the first straight edge 211 is perpendicular to the length direction of the second straight edge 212. The arc edge 22 between the first straight edge 211 and the second straight edge 212 is an inner rounded corner 221.
[0036] The beneficial effects of using the above embodiments are: Figure 8 The notch 2a in the lower left corner is similar to a rounded rectangle, and the inner rounded corner 221 can avoid stress concentration in this area.
[0037] In one embodiment, such as Figure 8 As shown in the two notches 2a in the lower left and lower right corners, the openings of the notches 2a have curved edges 22 on both sides, and the curved edges 22 are outer rounded corners 222.
[0038] The beneficial effect of adopting the above embodiment is that for the notches 2a located on the side of the PCB substrate 1, the outer radius 222 can slightly enlarge the width of the opening on the side of the notch 2a, eliminate the sharp edge of the opening on the side of the notch 2a, and facilitate the mutual positioning with other components.
[0039] In one embodiment, such as Figure 8 As shown in the upper left corner of the hollow hole 2b, the outline of a single hole 2 includes several arc edges 22, and the radii of the arc edges 22 are not equal to each other.
[0040] The beneficial effect of adopting the above embodiment is that the outline formed by the hole 2 is not a standard rounded rectangle, and the shape of the hole 2 is more diverse, forming various polygons with rounded corners.
[0041] In one embodiment, such as Figure 8 As shown in the upper right corner of the cutout 2b, the outline of the cutout 2b includes an arc edge 22 with a central angle of 270°.
[0042] The beneficial effect of using the above embodiment is that a teardrop-shaped irregular hollow hole 2b can be formed.
[0043] In one embodiment, such as Figure 8As shown in the lower right corner of the notch 2a, the outline of the notch 2a includes four curved edges 22 and one straight edge 21. There are two curved edges 22 at both ends of the straight edge 21. The two curved edges 22 at the same end of the straight edge 21 are an inner rounded corner 221 and an outer rounded corner 222. The end of the inner rounded corner 221 is tangent to the end of the straight edge 21, and the end of the outer rounded corner 222 is tangent to the end of the adjacent inner rounded corner 221.
[0044] The beneficial effect of adopting the above embodiment is that the depth of the notch 2a formed in this way is relatively shallow, and both sides of the notch 2a are smoothly transitioned.
[0045] In one embodiment, such as Figure 6 As shown, the number of notches 2a is not less than four, and each edge of the PCB substrate 1 has at least one notch 2a. It can be understood that this includes... Figure 6 Some of the accompanying drawings, including this one, have enlarged the area of the hole 2 to clearly show it. This application does not limit the area percentage of the hole 2 on the PCB substrate 1.
[0046] The beneficial effects of using the above embodiments are as follows: For example, in the PCB circuit board used in new mobile phones, designers can first select a position on the outer edge of the PCB substrate 1 as needed, and then design four to five holes 2 to be processed. The position of the holes 2 also varies depending on different packaging requirements, but the plating layer 3 of the holes 2 can increase the strength of the fixed position on the edge of the PCB circuit board at this location.
[0047] In one embodiment, such as Figure 3 , Figure 5 As shown, the width of the side plating area 31 (the dimension along the thickness direction of the PCB substrate 1) is greater than the width of a single front and back plating area 32, and the width of the side plating area 31 is more than twice the width of a single front and back plating area 32. Let the width of a single side plating area 31 be the first width L1, and let the width of a single front and back plating area 32 be the second width L2, that is, L1 > (2 × L2).
[0048] The beneficial effects of adopting the above embodiment are: the side plating area 31 has a large width, and the plating layer 3 is mainly used to cover the inner wall of the hole 2.
[0049] In one embodiment, such as Figure 3 , Figure 5 As shown, the thickness of a single front and back plating area 32 is greater than the thickness of the side plating area 31, and the thickness of a single front and back plating area 32 is 1.2 to 1.5 times the thickness of the side plating area 31. Let the thickness of the side plating area 31 be the first thickness H1, and let the thickness of a single front and back plating area 32 be the second thickness H2, that is, (1.2×H1)≤H2≤(1.5×H1).
[0050] The beneficial effect of the above embodiment is that the thickness of the front and back plating areas 32 is slightly larger than the thickness of the side plating areas 31, so the overall plating layer 3 is thicker on both sides. The principle is similar to that of I-beams. Under the premise of the same plating layer 3 material, the plating layer 3 with thicker sides can further improve its resistance to damage.
[0051] In one embodiment, such as Figure 7 As shown, plating layer 3, from the inside out, includes a copper plating layer 3a, a nickel plating layer 3b, and a gold plating layer 3c. The copper plating layer 3a is in direct contact with the PCB substrate 1. The thickness of the copper plating layer 3a is not less than 10 μm, the thickness of the nickel plating layer 3b is not less than 4 μm, and the thickness of the gold plating layer 3c is not less than 0.04 μm.
[0052] The hole-making process for the PCB circuit board with edge side plating in this application can be varied. One method is milling. While milling accuracy is slightly lower than drilling, it allows for a significantly wider range of machined shapes, particularly facilitating the production of straight edges 21. Another method is laser drilling combined with milling. The finished hole 2 exhibits better contour edge dimensions and accuracy. Compared to simple drilling, the hole-making process in this application can produce holes 2 with richly varied contour edges. The addition of milling cutters significantly reduces the workload of drilling, thereby increasing production capacity.
[0053] The specific hole-making steps can be as follows: Step S1: Primary outline processing. Step S2: Through-hole electroplating. Step S3: Nickel-gold plating. Step S4: Secondary outline processing. Step S5: Post-processing. The primary outline processing involves machining the areas requiring copper and gold plating on the semi-finished PCB substrate 1, i.e., machining the approximate shape and location of each hole 2. Nickel-gold plating involves machining the plating layer 3. The secondary outline processing involves machining other different areas on the PCB substrate 1. The two outline processing steps are separate for easy operation. Post-processing can include final processing steps such as cleaning, testing, and packaging.
[0054] The above embodiments are only for illustrating the technical concept and features of this application. Their purpose is to enable those skilled in the art to understand the content of this application and implement it. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be covered within the scope of protection of this application.
Claims
1. A PCB circuit board with edge side plating, characterized in that, The application relates to a PCB substrate, which comprises: a hole penetrating through the front and back surfaces of the PCB substrate, the hole being located at the edge or inside of the PCB substrate, the hole located at the edge of the PCB substrate being a notch hole, and the hole located at the inside of the PCB substrate being a hollow hole; a plating layer in contact with the profile of the hole, the plating layer comprising a side edge plating area covering the side wall of the hole and a front and back surface plating area in contact with the front or back surface of the PCB substrate, the two sides of the side edge plating area being vertically connected with the front and back surface plating area, and the cross-sectional profile of the plating layer being a semi-enclosed shape with an opening; a GND layer electrically connected with the plating layer. The profile edge of the hole comprises a straight edge and an arc edge, and the end of the straight edge is tangentially connected with the end of the arc edge.
2. The PCB circuit board with edge side plating according to claim 1, characterized in that: The straight edge comprises a first straight edge and a second straight edge, the length direction of the first straight edge is perpendicular to the length direction of the second straight edge, and the arc edge between the first straight edge and the second straight edge is an inner fillet.
3. The PCB circuit board with edge side plating according to claim 1, characterized in that: The two sides of the opening of the notch hole are provided with the arc edge, and the arc edge is an outer fillet.
4. The edge side plated PCB circuit board of claim 1, wherein: The profile edge of a single hole comprises a plurality of arc edges, and the arc radii of the plurality of arc edges are not equal.
5. The edge side plated PCB board of claim 1, wherein: The profile edge of the hollow hole comprises the arc edge with a central angle of 270 degrees.
6. The edge side plated PCB board of claim 1, wherein: The profile edge of the notch hole comprises four arc edges and a straight edge, the two ends of the straight edge are provided with two arc edges, the two arc edges at the same end of the straight edge are an inner fillet and an outer fillet, the end of the inner fillet is tangentially connected with the end of the straight edge, and the end of the outer fillet is tangentially connected with the end of the adjacent inner fillet.
7. The edge side plated PCB board of claim 1, wherein: The number of the notch holes is not less than four, and each edge of the PCB substrate is provided with at least one notch hole.
8. The edge side plated PCB board of claim 1, wherein: The width of the side edge plating area is greater than twice the width of a single front and back surface plating area.
9. The edge side plated PCB board of claim 1, wherein: The thickness of a single front and back surface plating area is 1.2 to 1.5 times the thickness of the side edge plating area.
10. The edge side plated PCB circuit board of claim 1, wherein: The plating layer comprises a copper plating layer, a nickel plating layer and a gold plating layer from inside to outside, the thickness of the copper plating layer is not less than 10 mu m, the thickness of the nickel plating layer is not less than 4 mu m, and the thickness of the gold plating layer is not less than 0.04 mu m.