Mechanical side-pushing heat dissipation base for chip pressure measurement
By using a detachable water-cooled and air-cooled heat dissipation base and inclined guide pillars to guide the chip pressing block, the problems of large size, cumbersome steps, and slow temperature adjustment of chip three-temperature testing equipment are solved, realizing rapid temperature adjustment and efficient testing.
Patent Information
- Application Number
- CN202422923838.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2034-11-28
AI Technical Summary
Existing chip three-temperature testing equipment is bulky, has complicated testing procedures, and slow temperature adjustment response, resulting in low testing efficiency and accuracy, and excessive cost.
It adopts a detachable water-cooled and air-cooled heat dissipation base, combined with inclined guide pillars to guide the chip pressure block to push the chip, so as to achieve rapid temperature adjustment and efficient contact testing.
It enables rapid temperature regulation, simplifies testing procedures, improves testing efficiency and accuracy, and reduces equipment size and cost.
Smart Images
Figure CN223798520U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a heat dissipation device used when testing chip performance, specifically a mechanical side-push heat dissipation base for chip stress testing. Background Technology
[0002] In modern electronics, chips are core components, and their stability and reliability are crucial. To ensure chip performance in practical applications, three-temperature testing is essential during both the laboratory and mass production stages. Three-temperature testing is a chip testing method primarily used to detect the reliability and stability of chips at different temperatures. This method uses low-temperature, room-temperature, and high-temperature environments to evaluate chip performance and lifespan under various operating conditions. Currently, three-temperature testing of chips mainly employs a combination of pressure testing fixtures and a test chamber. The chip is placed in the pressure testing fixture, which is then placed in a dedicated test chamber and powered on to perform performance testing on the chip. The ambient temperature within the test chamber is adjustable, and multiple pressure testing fixtures can be used simultaneously. However, this existing method is cumbersome, requires numerous pressure testing fixtures, has a large test chamber, occupies a lot of space, has low testing efficiency, and is too costly. Furthermore, the test chamber's response to ambient temperature adjustment is slow, which affects test stability. Therefore, there is a need to develop a chip stress testing instrument that has fast temperature regulation, small size, simple testing steps, and can improve testing efficiency and accuracy. Utility Model Content
[0003] To address the aforementioned problems and technical requirements, this utility model provides a mechanical side-push heat dissipation base for chip pressure testing. It can select between air cooling or water cooling as needed to cool the base, and the base provides oblique guidance to the chip pressing block above it, so that when the chip pressing block presses down on the chip, it can simultaneously push the chip forward, thereby enhancing the chip contact effect and improving test stability and efficiency.
[0004] The technical solution of this utility model is as follows: A mechanical side-push heat dissipation base for chip pressure testing includes a water-cooled base, an air-cooled pressure testing base, and a chip. The water-cooled base has a mounting groove, and the air-cooled pressure testing base is embedded in the mounting groove and detachably installed with the water-cooled base. The air-cooled pressure testing base includes a base body, a flexible side-push block, and a push rod assembly. A cavity is formed in the middle of the bottom surface of the base body, and the shape of the cavity corresponds to that of the flexible side-push block. The flexible side-push block is embedded in the cavity from the bottom. A chip slot is provided in the middle of the upper surface of the base body, and the chip is placed therein. Inside the chip slot, a strip-shaped push port is vertically arranged on the front side of the chip slot. A push groove is provided in the middle of the flexible side push block. The push groove is corresponding to the push port. A push rod assembly is installed in the push groove. The push rod assembly protrudes from the push port. The front end of the push rod assembly abuts against the chip. The push rod assembly can automatically push the chip. The upper surface of the base body is provided with a window. The windows protrude on both sides of the flexible side push block. Each side of the upper surface of the flexible side push block is provided with an inclined guide post. The inclined guide post can slide to connect with the chip pressing block above, driving the chip pressing block to push the chip downward and forward.
[0005] Furthermore, the flexible side push block has a U-shaped structure with two arms extending backward. Each of the upper surfaces of the two arms has an oblique guide hole, and two oblique guide posts are inserted into the oblique guide holes. The upper ends of the oblique guide posts are locked to the chip pressing block by screws. When the chip pressing block is pressed downward, the oblique guide posts slide in the oblique guide holes, so that the chip pressing block pushes the chip downward and forward at the same time, and the front side of the chip is pressed against the push rod assembly.
[0006] Furthermore, the push rod assembly includes a fixed terminal, a push spring, and a push rod. The fixed terminal is located at the end of the push groove, and the other end of the fixed terminal is connected to the push spring. The other end of the push spring is connected to the push rod, and the push rod protrudes from the push port. The free end of the push rod presses against the front side of the chip.
[0007] Furthermore, the chip has two push ports on its front side, and correspondingly, the upper surface of the flexible side push block has two push grooves. Each push groove is equipped with a set of push rod assemblies, and the two sets of push rod assemblies push the chip's front side simultaneously.
[0008] Furthermore, a limiting spring is provided between the flexible side push block and the cavity sidewall of the base body. Two spring holes are opened on the rear side of the flexible side push block. One end of the limiting spring is connected to the spring hole, and the other end of the limiting spring is pressed against the cavity sidewall, keeping the limiting spring in a compressed state.
[0009] Furthermore, a cavity cover plate is connected to the bottom surface of the base body, and the cavity cover plate is connected to the base body by screws, and the cavity cover plate seals the flexible side push block inside the cavity.
[0010] Furthermore, positioning posts are provided on both sides of the middle part of the mounting groove, and a mounting bolt is provided at each of the four corners of the mounting groove. The mounting bolt passes through the water-cooled base from the bottom and is perpendicular to the bottom surface of the mounting groove. The bottom surface of the base body is provided with two positioning holes and four screw holes. The positioning holes correspond to the positioning posts, and the screw holes correspond to the mounting bolts and are locked together.
[0011] Furthermore, the water-cooled base is equipped with water-cooling pipes.
[0012] Furthermore, the base body is a copper shell, and the flexible side push block is made of plastic.
[0013] Furthermore, the inclined guide post has mounting surfaces on both sides of its circumference, which are used for screw installation and tightening.
[0014] The beneficial effects of this utility model are:
[0015] 1) The water-cooled base and the air-cooled pressure testing base have water-cooling and air-cooling functions respectively, and the two can be used separately. Since the base body is made of copper shell, it has good heat dissipation effect. Therefore, in the laboratory stage, only the air-cooled pressure testing base can be used to dissipate heat through air cooling and achieve the purpose of rapid temperature adjustment. In the mass production stage, the air-cooled pressure testing base can be installed on the water-cooled base. The water-cooled base has a higher cooling efficiency and heat dissipation efficiency than the base body. It is also smaller in size. The test steps can be achieved by pressure testing alone. The steps are simple and the test efficiency is high.
[0016] 2) To achieve better contact during testing, the chip needs to be offset forward by a certain distance to fully adhere to the test contact end. If a cylinder or other mechanism is used to push the chip, it will not only increase the size of the equipment, but the cylinder also requires a response time and the pushing speed is slow. This utility model uses an inclined guide post to guide the chip pressing block to push the chip forward. While the working pressure is applied, the inclined guide post can convert the downward pressure into a horizontal thrust, driving the chip forward to adhere more closely to the test end, which greatly shortens the testing time and improves testing efficiency and mass production capacity.
[0017] 3) The flexible side push block is made of plastic. The cushioning effect of plastic can protect the inclined guide post and prevent the inclined guide post from being scratched or damaged. In addition, a removable cavity cover plate is provided on the lower surface of the base body. The flexible side push block can be easily replaced by removing the bottom cover plate, which helps the flexible side push block maintain a good working condition. Attached Figure Description
[0018] Figure 1 This is an exploded view of the mechanical side-push heat dissipation base for chip pressure testing according to this utility model;
[0019] Figure 2 This is an assembly structure diagram of the mechanical side-push heat dissipation base for chip pressure testing according to this utility model;
[0020] Figure 3 A diagram showing the positional relationship between the flexible side pusher, the cavity cover plate, and the water-cooled base mounting slot;
[0021] Figure 4 This is a diagram of the bottom structure of the air-cooled pressure testing base;
[0022] Figure 5 This is a top structural diagram of the air-cooled pressure testing base;
[0023] Figure 6 This is a structural diagram of the bottom surface of the base body;
[0024] Figure 7 This is an assembly structure diagram of the flexible side pusher block, chip, and inclined guide post;
[0025] The components in the diagram are labeled as follows: water-cooled base 1, mounting groove 11, positioning post 12, mounting bolt 13, air-cooled pressure testing base 2, base body 3, cavity 31, cavity cover 311, chip slot 32, push port 33, window 34, positioning hole 35, screw hole 36, flexible side push block 4, push groove 41, oblique guide hole 42, spring hole 43, limit spring 431, push rod assembly 5, fixed terminal 51, push spring 52, push rod 53, chip 6, oblique guide post 7, mounting plane 71. Detailed Implementation
[0026] The present invention will now be further described with reference to the accompanying drawings and embodiments.
[0027] like Figure 1-7 The diagram shows a mechanical side-push heat dissipation base for chip pressure testing according to this utility model. It includes a water-cooled base 1, an air-cooled pressure testing base 2, and a chip 6. The water-cooled base 1 has a mounting groove 11. The air-cooled pressure testing base 2 is embedded in the mounting groove 11 and detachably installed with the water-cooled base 1. The air-cooled pressure testing base 2 includes a base body 3, a flexible side-push block 4, and a push rod assembly 5. A cavity 31 is formed in the center of the bottom surface of the base body 3, the shape of which corresponds to the flexible side-push block 4. The flexible side-push block 4... The bottom is embedded in the cavity 31. The upper surface of the base body 3 is provided with a chip slot 32 in the middle. The chip 6 is placed in the chip slot 32. A strip-shaped push port 33 is vertically arranged on the front side of the chip slot 32. The flexible side push block 4 is provided with a push groove 41 in the middle. The push groove 41 is correspondingly arranged with the push port 33. The push rod assembly 5 is installed in the push groove 41. The push rod assembly 5 protrudes from the push port 33. The front end of the push rod assembly 5 abuts against the chip 6. The push rod assembly 5 can automatically push the chip.
[0028] The water-cooled base 1 is equipped with water-cooling pipes. The base body 3 is a copper shell, and the flexible side push block 4 is made of plastic. The water-cooled base 1 and the air-cooled pressure testing base 2 have water-cooling and air-cooling functions respectively, and the two can be used separately. Since the base body 3 is made of copper shell, it has good heat dissipation effect. Therefore, in the laboratory stage, only the air-cooled pressure testing base 2 can be used to dissipate heat through air cooling and achieve the purpose of rapid temperature adjustment. In the mass production stage, the air-cooled pressure testing base 2 can be installed on the water-cooled base 1. The water-cooled base 1 has a higher cooling efficiency and heat dissipation efficiency than the base body 3.
[0029] The upper surface of the base body 3 is provided with a window 34, and the flexible side push block 4 exposes the window on both sides. Each side of the upper surface of the flexible side push block 4 is provided with an inclined guide post 7. The inclined guide post 7 can be slidably connected with the chip pressing block (not shown in the figure) above, driving the chip pressing block to push the chip 6 downward and forward. The two sides of the peripheral surface of the inclined guide post 7 are provided with mounting planes 71, which are used for screw installation and tightening.
[0030] The flexible side pusher 4 has a U-shaped structure with two arms extending backward. Each arm has a slanted guide hole 42 on its upper surface. Two slanted guide posts 7 are inserted into the slanted guide holes 42. The upper ends of the slanted guide posts 7 are locked to the chip pressing block by screws. When the chip pressing block is pressed downward, the slanted guide posts 7 slide within the slanted guide holes 42, causing the chip pressing block to simultaneously push the chip 6 downward and forward. The front side of the chip 6 is pressed against the pusher assembly 5. The pusher assembly 5 includes a fixed terminal 51, a push spring 52, and a pusher 53. The fixed terminal 51 is located at the end of the push groove 41. The other end of the fixed terminal 51 is connected to the push spring 52, and the other end of the push spring 52 is connected to the pusher 53. The pusher protrudes from the push opening, and the free end of the pusher 53 presses against the front side of the chip 6. The chip 6 has two push ports 33 on the front side. Correspondingly, the upper surface of the flexible side push block 4 has two push grooves 41. Each push groove 41 is equipped with a set of push rod assemblies 5. The two sets of push rod assemblies 5 push the chip 6 on the front side at the same time.
[0031] A limiting spring 431 is provided between the flexible side push block 4 and the cavity sidewall of the base body 3. Two spring holes 43 are opened on the rear side of the flexible side push block 4. One end of the limiting spring 431 is connected to the spring hole 43, and the other end of the limiting spring 431 is pressed against the cavity sidewall, keeping the limiting spring 431 in a compressed state. A cavity cover plate 311 is connected to the bottom surface of the base body 3. The cavity cover plate 311 is connected to the base body 3 by screws, and the cavity cover plate 311 seals the flexible side push block 4 inside the cavity.
[0032] Positioning posts 12 are provided on both sides of the middle part of the mounting groove 11. A mounting bolt 13 is provided at each of the four corners of the mounting groove 11. The mounting bolt 13 passes through the water-cooled base 1 from the bottom and is perpendicular to the bottom surface of the mounting groove 11. The bottom surface of the base body 3 is provided with two positioning holes 35 and four screw holes 36. The positioning holes 35 correspond to the positioning posts 12, and the screw holes 36 are locked to the mounting bolts 13 one by one.
[0033] The operation process of this utility model is as follows: The flexible side push block 4 is inserted from the bottom of the base body 3. The limiting spring 431 presses the flexible side push block 4 against the inner wall of the cavity 31, keeping the flexible side push block 4 fixed in the cavity. The cavity cover plate 311 encapsulates the flexible side push block 4 inside. The copper base body 3 has good heat dissipation effect and is suitable for use in small batch testing. When large-scale production testing is required, the air-cooled pressure testing base 2 is installed as a whole in the mounting groove 11 of the water-cooled base 1. The water-cooled base 1 is equipped with water-cooling pipes inside, which can further improve the cooling efficiency. During testing, the chip 6 is placed in the chip slot 32. Supported by the push spring 52, the push rod 53 presses against the front side of the chip. The chip pressing block above drives the inclined guide post 7 to press down. Guided by the inclined guide hole 42, the inclined guide post 7 drives the chip pressing block to move forward and downward. The chip pressing block presses the chip 6 downward and forward, making it more closely attached to the front test end, resulting in better contact and more stable test conditions. At the same time, the push rod 53 in the push groove 41 retracts, and the push spring 52 is compressed. After the test is completed, the inclined guide post 7 is lifted up, the chip pressing block releases the pressure on the chip 6, the push spring 52 returns to its original position, and the push rod 53 pushes the chip 6 backward, separating the chip 6 from the test end, thus completing the test.
[0034] The above descriptions are merely several preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations and substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.
Claims
1. A mechanical side-push heat dissipation base for chip pressure testing, characterized in that: The application relates to a water-cooled base, a wind-cooled pressure measuring base and a chip, wherein the water-cooled base is provided with a mounting groove; the wind-cooled pressure measuring base is embedded into the mounting groove and detachably mounted on the water-cooled base; the wind-cooled pressure measuring base comprises a base body, a flexible side pushing block and a pushing rod assembly; a cavity is formed in the middle of the bottom surface of the base body and corresponds to the flexible side pushing block; the flexible side pushing block is embedded into the cavity from the bottom; a chip groove is arranged in the middle of the upper surface of the base body; the chip is arranged in the chip groove; a strip-shaped pushing opening is vertically arranged on the front side of the chip groove; a pushing groove is arranged in the middle of the flexible side pushing block and corresponds to the pushing opening; the pushing rod assembly is arranged in the pushing groove; the pushing rod assembly is exposed from the pushing opening; the front end of the pushing rod assembly abuts against the chip; the pushing rod assembly can automatically push the chip; a window is arranged on the upper surface of the base body; the two sides of the flexible side pushing block are exposed from the window; an inclined guide column is arranged on the upper surface of each of the two sides of the flexible side pushing block; the inclined guide column is slidably connected with the chip pressing block above; the chip pressing block pushes the chip downwards and forwards.
2. The mechanical side-push heat dissipation base for chip pressure testing according to claim 1, wherein: The flexible side pushing block is in a U-shaped structure; the two arms of the flexible side pushing block stretch backwards; an inclined guide hole is arranged on the upper surface of each of the two arms; the two inclined guide columns are correspondingly inserted into the inclined guide holes; the upper ends of the inclined guide columns are locked by screws with the chip pressing block; when the chip pressing block is pressed downwards and forwards, the inclined guide columns slide in the inclined guide holes, so that the chip pressing block simultaneously pushes the chip downwards and forwards; the front side of the chip is tightly pressed by the pushing rod assembly.
3. The mechanical side-push heat dissipation base for chip pressure testing according to claim 2, characterized in that: The pushing rod assembly comprises a fixed terminal, a pushing spring and a pushing rod; the fixed terminal is arranged at the end of the pushing groove; the other end of the fixed terminal is connected with the pushing spring; the other end of the pushing spring is connected with the pushing rod; the pushing rod is exposed from the pushing opening; the free end of the pushing rod tightly presses the front side of the chip.
4. The mechanical side-push heat dissipation base for chip pressure testing according to claim 3, characterized in that: The front side of the chip is provided with two pushing openings; correspondingly, the upper surface of the flexible side pushing block is provided with two pushing grooves; a group of pushing rod assemblies are arranged in each of the pushing grooves; the two groups of pushing rod assemblies simultaneously push the front side of the chip.
5. The mechanical side-push heat dissipation base for chip pressure testing according to claim 4, characterized in that: Limiting springs are arranged between the flexible side pushing block and the side wall of the cavity of the base body; two spring holes are formed in the rear side of the flexible side pushing block; one end of the limiting spring is connected in the spring hole; the other end of the limiting spring is tightly pressed on the side wall of the cavity; the limiting spring is kept in a compressed state.
6. The mechanical side-push heat dissipation base for chip pressure testing according to claim 5, characterized in that: The bottom surface of the base body is connected with a cavity cover plate; the cavity cover plate and the base body are connected by screws; the cavity cover plate seals the flexible side pushing block in the cavity.
7. The mechanical side-push heat dissipation base for chip pressure testing according to claim 6, characterized in that: The middle of the mounting groove is provided with positioning columns on both sides; mounting bolts are arranged at the four corners of the mounting groove; the mounting bolts vertically pass through the water-cooled base from the bottom and are perpendicular to the bottom surface of the mounting groove; the bottom surface of the base body is provided with two positioning holes and four screw holes; the positioning holes correspond to the positioning columns; the screw holes correspond to the mounting bolts and are tightly connected.
8. The mechanical side-push heat dissipation base for chip pressure testing according to claim 7, characterized in that: The water-cooled base is provided with a water-cooled pipeline.
9. The mechanical side-push heat dissipation base for chip pressure testing according to claim 8, characterized in that: The base body is a copper shell; the flexible side pushing block is made of plastic.
10. The mechanical side-push heat dissipation base for chip pressure testing according to claim 9, wherein: The circumferential surface of the inclined guide column is provided with mounting planes on both sides; the mounting planes are used for mounting and tightly pressing the screws.