Circuit board heat dissipation structure, controller module and vehicle

Abstract

The utility model relates to the field of heat dissipation, and discloses a circuit board heat dissipation structure, a controller module and a vehicle. The circuit board heat dissipation structure comprises at least two cooling plates, the number of the cooling plates is at least two, the at least two cooling plates are arranged in a stacked mode in the first direction, and in the first direction, at least one side of each cooling plate is provided with a cooling face used for cooling a corresponding circuit board; the uniform temperature plate is used for being arranged between the corresponding cooling surface and the circuit board in the first direction, the uniform temperature plate comprises a shell and a capillary structure, the two ends of the shell abut against the cooling surface and the circuit board respectively, a cavity capable of containing the phase change medium is formed in the shell, and the capillary structure is arranged in the cavity. The cavity is formed in the shell of the vapor chamber, so that the rigidity of the shell is low, the shell is arranged between the circuit board and the cooling surface, and when the thermal expansion amount of the circuit board is large, the shell can be extruded, so that the shell is deformed, the problem of stress concentration of the circuit board is avoided, and the damage probability of the circuit board is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat dissipation technical field, concretely relates to circuit board heat dissipation structure, controller module and vehicle. BACKGROUND

[0002] With the improvement of the integration degree of the vehicle, the integration degree of the domain controller is also higher and higher. Specifically, the regional controller contains multiple specially designed circuit boards inside, these circuit boards are stacked and each undertakes different tasks, and collectively supports the operation demand of the whole vehicle.

[0003] In the integrated multi-circuit board structure, each circuit board has a high heat dissipation demand, so a cooling plate needs to be set for each circuit board, that is, the circuit board is connected with the corresponding cooling plate. In the related art, in order to improve the heat transfer effect between the circuit board and the cooling plate, a uniform plate is arranged between the circuit board and the corresponding cooling plate, and the uniform plate has high heat diffusion and heat conduction performance.

[0004] However, the heat generating part on the circuit board will produce thermal expansion problem in the heating process, and the cumulative thermal expansion amount is larger when the number of circuit boards is larger. The uniform plate is a rigid structure and is closely attached to the circuit board, so in the expansion process of the circuit board, the uniform plate will generate pressure on the circuit board, which is easy to cause the deformation or damage of the circuit board. SUMMARY

[0005] Therefore, the utility model provides a circuit board heat dissipation structure, controller module and vehicle to solve or improve the problem that the cumulative thermal expansion amount of the circuit board is large and the pressure from the uniform plate is large.

[0006] In a first aspect, the utility model provides a circuit board heat dissipation structure, comprising:

[0007] Cooling plate, the number of the cooling plate is at least two, at least two cooling plates are stacked along the first direction, and at least one side of each cooling plate is provided with a cooling surface for cooling the corresponding circuit board in the first direction;

[0008] Uniform plate, in the first direction, the uniform plate is arranged between the corresponding cooling surface and the circuit board, the uniform plate comprises a shell and a capillary structure, both ends of the shell are in contact with the cooling surface and the circuit board respectively, the inside of the shell has a cavity capable of containing a phase change medium, and the capillary structure is arranged in the cavity.

[0009] In an optional embodiment, the cooling plate is arranged as a liquid cooling plate, and the inside of the cooling plate is provided with a cooling flow channel;

[0010] The cooling flow channels of the at least two cooling plates are arranged in series or in parallel.

[0011] In an alternative embodiment, the at least two cooling plates are sequentially connected in the first direction.

[0012] The circuit board heat dissipation structure further comprises a support, which is connected to the cooling plate at the end in the first direction.

[0013] In an alternative embodiment, the uniform temperature plate further comprises an elastic assembly.

[0014] The elastic assembly is arranged in the cavity, extends in the first direction, and one end of the elastic assembly abuts against the inner wall of the shell close to the cooling surface, and the other end of the elastic assembly abuts against the inner wall of the shell close to the circuit board.

[0015] In an alternative embodiment, the elastic assembly comprises a first connecting body, a second connecting body and an elastic piece.

[0016] One of the first connecting body and the second connecting body is connected to the inner wall of the shell close to the cooling surface, and the other is connected to the inner wall of the shell close to the circuit board.

[0017] The elastic piece is arranged between the first connecting body and the second connecting body, and is used to drive the first connecting body and the second connecting body to move away from each other.

[0018] The first connecting body is provided with a first clamping portion at one end close to the second connecting body, the second connecting body is provided with a second clamping portion at one end close to the first connecting body, the first clamping portion is arranged on the side away from the first connecting body of the second clamping portion, and forms a limit with the second clamping portion in the first direction.

[0019] In an alternative embodiment, the capillary structure comprises:

[0020] A first capillary structure connected to the inner wall of the shell close to the cooling surface.

[0021] A second capillary structure connected to the inner wall of the shell close to the circuit board.

[0022] A third capillary structure, one end of which is connected to the inner wall of the shell close to the cooling surface, and the other end of which is connected to the inner wall of the shell close to the circuit board.

[0023] In an alternative embodiment, the housing comprises a main body portion, a bending portion and a mounting portion near one end of the circuit board, the bending portion is connected between the main body portion and the mounting portion, and the bending portion is arranged to bend towards the first direction;

[0024] The heat conduction block is connected to a surface of the mounting portion away from the cavity, and protrudes from the main body portion and the bending portion in the first direction, and is used to abut against the circuit board.

[0025] In an alternative embodiment, the housing comprises a first plate body and a second plate body, the first plate body and the second plate body are arranged along the first direction and connected, and the cavity is formed between the first plate body and the second plate body, the first plate body abuts against the corresponding circuit board, and the second plate body abuts against the corresponding cooling plate.

[0026] In a second aspect, the utility model also provides a controller module, including circuit board and circuit board heat dissipation structure as described above, circuit board with cooling surface one to one correspondence.

[0027] In a third aspect, the utility model also provides a vehicle, including circuit board heat dissipation structure as described above or controller module as described above.

[0028] The circuit board heat dissipation structure provided by the utility model can integrate at least two circuit boards and cool each circuit board by arranging at least two cooling plates and each cooling plate having at least one cooling surface.

[0029] The cavity is arranged in the housing of the heat conduction plate, so that the rigidity of the housing is low, and the housing is arranged between the circuit board and the cooling surface, so that the circuit board can extrude the housing when the thermal expansion amount of the circuit board is large, so that the housing is deformed, the problem of stress concentration of the circuit board is avoided, and the probability of damage of the circuit board is reduced.

[0030] The heat conduction plate is arranged between the cooling surface and the circuit board, the capillary structure and the phase change medium are arranged in the heat conduction plate, the phase change medium circulates in the cavity to evaporate and condense, so that the effect of conducting heat is achieved.

[0031] The controller module and the vehicle in the utility model comprise the circuit board heat dissipation structure in the utility model, so they also comprise all the advantages of the circuit board heat dissipation structure. BRIEF DESCRIPTION OF DRAWINGS

[0032] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 An exploded view of the controller module provided in an embodiment of this utility model;

[0034] Figure 2 A schematic diagram of the internal structure of a heat spreader provided in an embodiment of this utility model;

[0035] Figure 3 A schematic diagram of the internal structure of another heat spreader provided in an embodiment of this utility model;

[0036] Figure 4 An isometric view of the temperature distribution plate provided in this embodiment of the utility model;

[0037] Figure 5 An exploded view of the heat spreader provided in an embodiment of this utility model;

[0038] Figure 6 A schematic diagram of the structure of the elastic component provided in the embodiment of this utility model;

[0039] Figure 7 A schematic diagram of the parallel cooling channels of the cooling plate provided in an embodiment of this utility model;

[0040] Figure 8 This is a schematic diagram of the cooling channels connected in series for a cooling plate provided in an embodiment of the present invention.

[0041] Explanation of reference numerals in the attached figures:

[0042] 1. Cooling plate; 101. Cooling surface; 102. Cooling channel; 103. Liquid inlet channel; 104. Liquid return channel; 105. Liquid inlet; 106. Liquid return outlet; 2. Heat spreader; 201. Outer shell; 2011. First plate; 2011a. Main body; 2011b. Bending part; 2011c. Mounting part; 2012. Second plate; 202. Capillary structure; 2021. First capillary structure; 2022. Second capillary structure; 2023. Third capillary structure; 203. Cavity; 204. Elastic component; 2041. First connector; 2042. Second connector; 2043. Elastic element; 2044. First snap-fit ​​part; 2045. Second snap-fit ​​part; 205. Heat-conducting block; 3. Support; 4. Circuit board; 5. Fastener. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0044] The following is combined with Figures 1 to 8 This describes the heat dissipation structure of the circuit board provided in the embodiments of this utility model.

[0045] Specifically, the heat dissipation structure of the circuit board includes a cooling plate 1 and a heat spreader 2.

[0046] The number of cooling plates 1 is at least two, and the at least two cooling plates 1 are stacked along a first direction. For example, the first direction may be consistent with the thickness direction of the circuit board 4.

[0047] In the first direction, each cooling plate 1 has a cooling surface 101 on at least one side for cooling the corresponding circuit board 4. For example, if one end of the cooling plate 1 has a cooling surface 101, then that end of the cooling plate 1 with the cooling surface 101 can be used to mount the circuit board 4. Alternatively, if both ends of the cooling plate 1 have cooling surfaces 101, then both ends of the cooling surfaces 101 can be used to mount the circuit board 4. Optionally, the circuit board 4 corresponds one-to-one with the cooling surface 101, that is, each circuit board 4 is cooled by the corresponding cooling surface 101.

[0048] In the first direction, the heat exchanger 2 is used to be disposed between the corresponding cooling surface 101 and the circuit board 4. Optionally, the heat exchanger 2 and the cooling surface 101 correspond one-to-one, that is, the circuit board 4 is in contact with the corresponding cooling surface 101 through the corresponding heat exchanger 2.

[0049] The heat spreader 2 includes a housing 201 and a capillary structure 202. The two ends of the housing 201 abut against the cooling surface 101 and the circuit board 4, respectively. The interior of the housing 201 has a cavity 203 for accommodating a phase change medium, optionally including but not limited to water. The capillary structure 202 is disposed within the cavity 203.

[0050] In this embodiment, by providing at least two cooling plates 1, and each cooling plate 1 having at least one cooling surface 101, the heat dissipation structure of the circuit board can integrate at least two circuit boards 4 and cool each circuit board 4.

[0051] By making the cavity 203 inside the outer shell 201 of the heat spreader 2, the rigidity of the outer shell 201 is reduced. Therefore, the outer shell 201 is placed between the circuit board 4 and the cooling surface 101. When the circuit board 4 has a large amount of thermal expansion, the circuit board 4 can squeeze the outer shell 201, thereby deforming the outer shell 201, avoiding the problem of stress concentration on the circuit board 4, and reducing the probability of damage to the circuit board 4.

[0052] Since most circuit boards 4 are small in size and have high heat flux density, direct contact with the cooling surface 101 for heat conduction would result in low heat transfer efficiency. A vapor chamber 2 is placed between the cooling surface 101 and the circuit board 4. The vapor chamber 2 contains a capillary structure 202 and a phase change medium. During cooling, the phase change medium absorbs heat from the chip and vaporizes near the circuit board 4 in the cavity 203. Then, it releases heat and condenses near the cooling surface 101 in the cavity 203. The condensed phase change medium flows back to the cavity 203 near the circuit board 4 through the capillary structure 202, absorbs heat again, and vaporizes. This cycle repeats, providing better heat dissipation for the circuit board.

[0053] Optionally, the heat spreader 2 and the cooling surface 101 can be connected by thermally conductive adhesive. Alternatively, the heat spreader 2 and the cooling surface 101 can be directly abutted together.

[0054] Optionally, the heat spreader 2 and the circuit board 4 can be connected by thermally conductive adhesive. Alternatively, the heat spreader 2 and the circuit board 4 can be directly connected.

[0055] In some embodiments of this invention, the cooling plate 1 is configured as a liquid-cooled plate, and the interior of the cooling plate 1 is provided with cooling channels 102 for the flow of coolant. Through the circulating flow of the coolant, utilizing its high heat capacity, the heat generated by the circuit board 4 can be quickly absorbed and carried away. Furthermore, the liquid-cooled plate cooling method produces less noise.

[0056] Optionally, refer to Figure 7 As shown, at least two cooling plates 1 have cooling channels 102 connected in parallel.

[0057] For example, an inlet channel 103 and a return channel 104 are connected between two adjacent cooling plates 1. The inlet channel 103 and the return channel 104 are arranged at intervals, and both the inlet channel 103 and the return channel 104 are connected to the cooling channels 102 of the two adjacent cooling plates 1. Each cooling plate 1 is provided with an inlet port 105 and a return port 106, wherein both the inlet port 105 and the return port 106 are used to connect to the coolant cooling module.

[0058] In this embodiment, the coolant provided by the coolant cooling module enters the corresponding cooling plate 1 through the inlet 105, flows through the cooling channel 102 of the cooling plate 1, and then flows back to the coolant cooling module through the return port 106. Simultaneously, the coolant in the cooling plate 1 enters the adjacent cooling plate 1 through the inlet channel 103, and after passing through the cooling channel 102 within the adjacent cooling plate 1, returns to the cooling plate 1 through the return channel 104.

[0059] With this configuration, at least two cooling plates 1 can share the liquid inlet 105 and the liquid return port 106, eliminating the need to set up an interface for each cooling plate 1 to connect to the coolant cooling module, thereby reducing the number of interfaces and lowering the difficulty and cost of pipeline layout.

[0060] Optionally, refer to Figure 8 As shown, at least two cooling plates 1 have cooling channels 102 connected in series.

[0061] For example, the cooling channels 102 of two adjacent cooling plates 1 are connected by a liquid inlet channel 103. In addition, among the at least two cooling plates 1, the cooling plate 1 located at the first end is provided with a liquid inlet 105, and the cooling plate 1 located at the second end is provided with a liquid return port 106.

[0062] In this embodiment, the coolant provided by the coolant cooling module enters the corresponding cooling plate 1 through the inlet 105, and then enters the adjacent cooling plate 1 through the inlet channel 103, thus passing through each cooling plate 1 in sequence. Finally, it returns to the coolant cooling module through the return port 106 on the last cooling plate 1.

[0063] With this configuration, at least two cooling plates 1 can share the liquid inlet 105 and the liquid return port 106, eliminating the need to set up an interface for each cooling plate 1 to connect to the coolant cooling module, thereby reducing the number of interfaces and lowering the difficulty and cost of pipeline layout.

[0064] refer to Figure 1 As shown, in some embodiments provided by this utility model, at least two cooling plates 1 are sequentially connected and fixed along a first direction. For example, two adjacent cooling plates 1 can be connected by fasteners 5, which include, but are not limited to, threaded parts and anchors. Alternatively, two adjacent cooling plates 1 can be snapped together by a snap-fit ​​structure. Or, two adjacent cooling plates 1 can be bonded together.

[0065] The circuit board heat dissipation structure also includes a support 3. In a first direction, the support 3 is connected to the end of one of the at least two cooling plates 1. For example, the cooling plate 1 and the support 3 can be connected by fasteners 5, including but not limited to threaded parts and anchors. Alternatively, the cooling plate 1 and the support 3 can be snapped together by a snap-fit ​​structure. Or, the cooling plate 1 and the support 3 can be bonded together.

[0066] In this embodiment, by connecting and fixing at least two cooling plates 1 in sequence and connecting at least two cooling plates 1 to the support 3, the heat dissipation structure of the circuit board is formed as a whole, which can enhance the stability and reliability of the heat dissipation structure of the circuit board.

[0067] In addition, when installing the circuit board heat dissipation structure, the installation can be completed simply by fixing the support 3 to the corresponding structural component, which simplifies the installation process of the circuit board heat dissipation structure.

[0068] refer to Figure 1 As shown, in some embodiments provided by this utility model, there are two cooling plates 1, which are connected together and connected to the support 3.

[0069] Optionally, both cooling plates 1 have a cooling surface 101, and both cooling surfaces 101 face the support 3. Accordingly, the circuit board heat dissipation structure can integrate two circuit boards 4, one of which is arranged between the two cooling plates 1, for example, the circuit board 4 is connected to the cooling plate 1. The other circuit board 4 is arranged between the cooling plate 1 and the support 3, for example, the circuit board 4 is connected to either the cooling plate 1 or the support 3.

[0070] Of course, the cooling plate 1 is not limited to having only one cooling surface 101. For example, in other embodiments, both cooling plates 1 have two cooling surfaces 101. Accordingly, the number of circuit boards 4 that can be integrated into the circuit board heat dissipation structure is four, wherein two cooling plates 1 can be disposed between two circuit boards 4, and one circuit board 4 can be disposed between a cooling plate 1 and a support 3. A circuit board 4 can be disposed on the end face of the cooling plate 1 that faces away from the support 3.

[0071] It should be noted that the above is an explanation of an embodiment in which both cooling plates 1 have one cooling surface 101 or both have two cooling surfaces 101. Based on this principle, one of the two cooling plates 1 may have one cooling surface 101 and the other may have two cooling surfaces 101, so that the heat dissipation structure of the circuit board can integrate three circuit boards 4.

[0072] Furthermore, based on the above analysis, the number of cooling plates 1 can also be set to three or more, so that the heat dissipation structure of the circuit board can integrate at least three circuit boards 4, without limitation.

[0073] refer to Figure 2 , Figure 3 , Figure 5 as well as Figure 6 As shown, in some embodiments provided by this utility model, the temperature distribution plate 2 further includes an elastic component 204.

[0074] The elastic component 204 is disposed within the cavity 203 and extends along the first direction.

[0075] In the first direction, one end of the elastic component 204 abuts against the inner wall of the housing 201 near the cooling surface 101, and the other end of the elastic component 204 abuts against the inner wall of the housing 201 near the circuit board 4. That is, the elastic component 204 is supported between the inner wall of the housing 201 near the cooling surface 101 and the inner wall of the housing 201 near the circuit board 4.

[0076] Because the housing 201 has a cavity 203 inside, the rigidity of the housing 201 is relatively low. Therefore, the housing 201 may deform and fail to fit tightly with the cooling surface 101 or the circuit board 4.

[0077] In this embodiment, by having one end of the elastic component 204 abut against the inner wall of the outer shell 201 near the cooling surface 101, and the other end abut against the inner wall of the outer shell 201 near the circuit board 4, the elastic component 204 can apply a preload from the inside to the outside to the outer shell 201 within the cavity 203, so as to ensure that the outer shell 201 is tightly attached to the circuit board 4 or the cooling surface 101, thereby increasing the heat transfer efficiency between the circuit board 4 and the cooling plate 1.

[0078] Furthermore, because the elastic component 204 has elastic properties, it will also be compressed during the process of the circuit board 4 expanding thermally and pressing the outer shell 201, thus not increasing the compressive stress on the circuit board 4. At the same time, after the circuit board 4 presses the outer shell 201, the elastic component 204 can drive the outer shell 201 to recover its deformation, avoiding the problem of the outer shell 201 failing to adhere to the circuit board 4.

[0079] refer to Figure 2 , Figure 3 , Figure 5 as well as Figure 6 As shown, in some embodiments provided by this utility model, the elastic component 204 includes a first connector 2041, a second connector 2042, and an elastic element 2043.

[0080] Of the two connectors, the first connector 2041 and the second connector 2042, one is connected to the inner wall of the outer casing 201 near the cooling surface 101, and the other is connected to the inner wall of the outer casing 201 near the circuit board 4.

[0081] An elastic element 2043 is disposed between the first connecting body 2041 and the second connecting body 2042, and is used to drive the first connecting body 2041 and the second connecting body 2042 away from each other. For example, the elastic element 2043 can be configured as a spring, with its two ends abutting against the first connecting body 2041 and the second connecting body 2042 respectively, and driving the first connecting body 2041 and the second connecting body 2042 away from each other.

[0082] The first connector 2041 has a first latching portion 2044 at one end near the second connector 2042, and the second connector 2042 has a second latching portion 2045 at one end near the first connector 2041. The first latching portion 2044 is located on the side of the second latching portion 2045 away from the first connector 2041, and forms a limiting relationship with the second latching portion 2045 in a first direction. That is, in the first direction, the first latching portion 2044 restricts the second latching portion 2045 from moving away from the first connector 2041.

[0083] In this embodiment, by providing a first connector 2041 and a second connector 2042, and by providing a first latching portion 2044 of the first connector 2041 on the side of the second latching portion 2045 away from the first connector 2041, the first latching portion 2044 can restrict the second latching portion 2045 from moving away from the first connector 2041, thereby limiting the maximum distance between the first connector 2041 and the second connector 2042.

[0084] For example, when the first latching portion 2044 and the second latching portion 2045 are in abutting and limiting position, the length of the elastic component 204 in the first direction is H. The distance between the inner wall of the housing 201 near the circuit board 4 and the inner wall near the cooling surface 101 is H. When the elastic component 204 is disposed in the inner cavity of the housing 201, the housing 201 is not subjected to the thrust of the elastic component 204, that is, the dimension of the housing 201 in the first direction is not affected by the elastic component 204 before installation on the circuit board heat dissipation structure, so as to facilitate the installation and arrangement of the housing 201.

[0085] After assembling the heat spreader 2 and the circuit board 4, the elastic component 204 is required to be under pressure so that the heat spreader 2 can fit tightly against the circuit board 4 and the cooling surface 101.

[0086] Optionally, refer to Figure 6 As shown, the first connector 2041 includes a column, and the second connector 2042 includes a sleeve.

[0087] The sleeve has an annular protrusion on its inner wall, which forms a second locking part 2045. One end of the column extends into the sleeve and passes through the annular protrusion. The part of the column that passes through the annular protrusion has an end, which forms a first locking part 2044.

[0088] The end of the column away from the sleeve has a first flange extending radially along the column, which abuts against the inner wall of the outer casing 201. The end of the sleeve away from the column has a second flange extending radially along the sleeve, which abuts against the inner wall of the outer casing 201. The elastic element 2043 is fitted onto the outside of the sleeve, and the two ends of the spring abut against the first flange and the second flange, respectively.

[0089] Optionally, the number of elastic components 204 is set to at least two. By providing at least two elastic components 204, more force application points can be provided for the housing 201, thereby enabling the housing 201 to better fit with the circuit board 4 or the cooling surface 101.

[0090] In some embodiments provided by this utility model, the capillary structure 202 includes a first capillary structure 2021, a second capillary structure 2022, and a third capillary structure 2023.

[0091] The first capillary structure 2021 is connected to the inner wall of the outer casing 201 near the cooling surface 101. For example, the first capillary structure 2021 can be a sintered copper mesh capillary or a foam capillary. The foam can be a metal foam or a ceramic foam.

[0092] The second capillary structure 2022 is connected to the inner wall of the housing 201 near the circuit board 4. For example, the second capillary structure 2022 can be a sintered copper mesh capillary or a foam capillary.

[0093] One end of the third capillary structure 2023 is connected to the inner wall of the outer casing 201 near the cooling surface 101, and the other end of the third capillary structure 2023 is connected to the inner wall of the outer casing 201 near the circuit board 4. For example, the third capillary structure 2023 can be set as a copper mesh capillary or a foam capillary. Further, the third capillary structure 2023 is a cylindrical structure, that is, a cylindrical structure formed by copper mesh capillary or foam capillary.

[0094] In this embodiment, by providing a first capillary structure 2021 on the inner wall of the outer shell 201 near the cooling surface 101, when the condensed phase change medium comes into contact with the surface of the capillary structure 202, due to the small size and special shape of the capillary structure 202, it can increase the gas-liquid contact area and reduce the free energy of the gas-liquid interface, thereby promoting the occurrence of the condensation process. That is, the first capillary structure 2021 can enable the condensed phase change medium to quickly converge, so that the phase change medium can quickly flow back to the inner wall of the outer shell 201 near the circuit board 4.

[0095] By setting a second capillary structure 2022 on the inner wall of the outer shell 201 near the circuit board 4, the phase change medium can quickly absorb the heat of the circuit board 4 and vaporize through the high thermal conductivity of the capillary structure 202. That is, the capillary structure 202 can increase the heat exchange area between the phase change medium and the outer shell 201, thereby improving the heat exchange efficiency between the phase change medium and the outer shell 201.

[0096] By providing a third capillary structure 2023 between the inner wall near the cooling surface 101 and the inner wall near the circuit board 4, a channel can be provided for the phase change medium to flow back to the inner wall of the housing 201 near the circuit board 4, so that the phase change medium can quickly flow back to the inner wall of the housing near the circuit board 4.

[0097] Optionally, the third capillary structure 2023 is configured as a cylindrical structure and fitted on the outside of the elastic component 204, so as to avoid the phase change medium from accumulating on the surface of the elastic component 204 and affecting the heat exchange effect of the heat exchange plate 2.

[0098] Optionally, both the first capillary structure 2021 and the second capillary structure 2022 are provided with clearance holes. The clearance holes pass through the first capillary structure 2021 or the second capillary structure 2022 along the first direction and are used to avoid the third capillary structure 2023.

[0099] In some embodiments provided by this utility model, the outer shell 201 includes a first plate 2011 and a second plate 2012.

[0100] The first plate 2011 and the second plate 2012 are arranged and connected along a first direction, forming a cavity 203 between them. For example, the first plate 2011 and the second plate 2012 are welded together. The first plate 2011 abuts against the corresponding circuit board 4, and the second plate 2012 abuts against the corresponding cooling plate 1. For example, an elastic component 204 can be disposed between the first plate 2011 and the second plate 2012.

[0101] With this design, the outer casing 201 has a simple structure and is easy to manufacture.

[0102] In some embodiments provided by this utility model, the end of the outer casing 201 near the circuit board 4 includes a main body portion 2011a, a bent portion 2011b, and a mounting portion 2011c.

[0103] The curved portion 2011b is connected between the main body portion 2011a and the mounting portion 2011c, and the curved portion 2011b is bent in a first direction. For example, the curved portion 2011b is configured as a wave-shaped structure, which undulates in the first direction.

[0104] The heat spreader 2 also includes a heat-conducting block 205, which is connected to the surface of the mounting portion 2011c away from the cavity 203. In the first direction, the heat-conducting block 205 protrudes from the main body portion 2011a and the bent portion 2011b. The heat-conducting block 205 is used to abut against the circuit board 4.

[0105] In this embodiment, by providing a bent portion 2011b between the mounting portion 2011c and the main body portion 2011a, the bent portion 2011b can be regarded as adding an elastic region between the mounting portion 2011c and the main body portion 2011a, so that when the mounting portion 2011c is subjected to external force, energy can be absorbed and released through the elastic deformation of the bent portion 2011b, so that the bent portion 2011b can absorb the deformation of the heat spreader 2 during the assembly process.

[0106] Since the bent portion 2011b may protrude from the surface of the main body, a heat-conducting block 205 is provided on the mounting portion 2011c to abut against the circuit board 4, which can avoid interference between the bent portion 2011b and the circuit board 4 and increase the heat exchange area between the heat exchange plate 2 and the circuit board 4.

[0107] Optionally, the heat-conducting block 205 can be made of copper, which gives it better heat conduction.

[0108] refer to Figure 5 As shown, optionally, the first plate 2011 includes a main body 2011a, a bent portion 2011b, and a mounting portion 2011c. The main body 2011a is used to connect with the second plate 2012. The bent portion 2011b is generally annular and surrounds the outside of the mounting portion 2011c.

[0109] Optionally, the elastic component 204 is disposed between the mounting portion 2011c and the second plate 2012, and the number of elastic components 204 is at least two, so that the heat-conducting block 205 on the mounting portion 2011c can better fit with the circuit board 4.

[0110] This utility model embodiment also provides a controller module.

[0111] Specifically, the controller module includes circuit board 4 and the heat dissipation structure of the circuit board as described above, with circuit board 4 corresponding one-to-one with cooling surface 101.

[0112] It should be noted that the controller module includes a circuit board heat dissipation structure, and thus also includes all the advantages of the circuit board heat dissipation structure mentioned above, so it will not be elaborated further.

[0113] This utility model also provides a vehicle in its embodiments.

[0114] Specifically, the vehicle includes the circuit board heat dissipation structure as described above, or the controller module as described above.

[0115] It should be noted that the vehicle includes a circuit board heat dissipation structure, which also includes all the advantages of the circuit board heat dissipation structure mentioned above, so it will not be elaborated further.

[0116] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A circuit board heat dissipation structure, characterized by comprising: The application relates to an electric circuit board heat dissipation structure. The electric circuit board heat dissipation structure comprises: cooling plates (1), the number of the cooling plates (1) is at least two, the at least two cooling plates (1) are arranged in a stack along a first direction, and at least one side of each of the cooling plates (1) is provided with a cooling surface (101) for cooling a corresponding electric circuit board (4) in the first direction; 2. The circuit board heat dissipating structure according to claim 1, wherein a uniform temperature plate (2) arranged between the corresponding cooling surface (101) and the electric circuit board (4) in the first direction, the uniform temperature plate (2) comprising an outer shell (201) and a capillary structure (202), the two ends of the outer shell (201) abutting the cooling surface (101) and the electric circuit board (4) respectively, the inner part of the outer shell (201) having a cavity (203) capable of containing a phase change medium, and the capillary structure (202) being arranged in the cavity (203). The cooling plate (1) is a liquid cooling plate, and the cooling plate (1) is internally provided with a cooling flow channel (102).

3. The circuit board heat dissipating structure according to claim 1, wherein The cooling flow channels (102) of the at least two cooling plates (1) are arranged in series, or the cooling flow channels (102) of the at least two cooling plates (1) are arranged in parallel. The at least two cooling plates (1) are sequentially connected and fixed along the first direction.

4. The circuit board heat dissipating structure according to any one of claims 1 to 3, characterized by, The electric circuit board heat dissipation structure further comprises a support (3) connected to the cooling plate (1) located at the end of the at least two cooling plates (1) in the first direction. The uniform temperature plate (2) further comprises an elastic assembly (204).

5. The circuit board heat dissipating structure according to claim 4, wherein The elastic assembly (204) is arranged in the cavity (203), extends along the first direction, and one end of the elastic assembly (204) abuts the inner wall of the outer shell (201) close to the cooling surface (101), and the other end of the elastic assembly (204) abuts the inner wall of the outer shell (201) close to the electric circuit board (4) in the first direction. The elastic assembly (204) comprises a first connecting body (2041), a second connecting body (2042) and an elastic member (2043). One of the first connecting body (2041) and the second connecting body (2042) is connected to the inner wall of the outer shell (201) close to the cooling surface (101), and the other is connected to the inner wall of the outer shell (201) close to the electric circuit board (4). The elastic member (2043) is arranged between the first connecting body (2041) and the second connecting body (2042) and is used for driving the first connecting body (2041) and the second connecting body (2042) to move away from each other. The first connector (2041) is provided with a first clamping part (2044) near one end of the second connector (2042), the second connector (2042) is provided with a second clamping part (2045) near one end of the first connector (2041), the first clamping part (2044) is arranged on the side of the second clamping part (2045) away from the first connector (2041) and forms a limit with the second clamping part (2045) in the first direction.

6. The circuit board heat dissipating structure according to any one of claims 1 to 3, characterized by The capillary structure (202) comprises: A first capillary structure (2021) connected to the inner wall of the shell (201) near the cooling surface (101); A second capillary structure (2022) connected to the inner wall of the shell (201) near the circuit board (4); A third capillary structure (2023) one end of which is connected to the inner wall of the shell (201) near the cooling surface (101) and the other end of which is connected to the inner wall of the shell (201) near the circuit board (4).

7. The circuit board heat dissipating structure according to any one of claims 1 to 3, characterized by, The end of the shell (201) near the circuit board (4) comprises a main body part (2011a), a curved part (2011b) and a mounting part (2011c), the curved part (2011b) is connected between the main body part (2011a) and the mounting part (2011c) and is arranged to bend towards the first direction; The heat conduction block (205) is connected to the surface of the mounting part (2011c) away from the cavity (203) and protrudes from the main body part (2011a) and the curved part (2011b) in the first direction and is used to abut against the circuit board (4).

8. The circuit board heat dissipating structure according to any one of claims 1 to 3, characterized by, The shell (201) comprises a first plate body (2011) and a second plate body (2012), the first plate body (2011) and the second plate body (2012) are arranged along the first direction and are connected, the cavity (203) is formed between the first plate body (2011) and the second plate body (2012), the first plate body (2011) abuts against the corresponding circuit board (4) and the second plate body (2012) abuts against the corresponding cooling plate (1).

9. A controller module, characterized by A circuit board (4) and a circuit board heat dissipation structure according to any one of claims 1-8, the circuit board (4) corresponds to the cooling surface (101) one by one.

10. A vehicle characterized by comprising: A circuit board heat dissipation structure according to any one of claims 1-8 or a controller module according to claim 9.

Images