Carbon-based heat-conducting shielding film
By designing a carbon-based thermally conductive shielding film, the problems of difficult adhesion of metal shielding covers and current stray interference are solved, achieving the effects of thermal conductivity, shielding, and thinness, thus ensuring circuit stability.
Patent Information
- Application Number
- CN202520078586.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-13
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2035-01-13
AI Technical Summary
Existing metal shielding covers are not easy to attach to the device body and are prone to generating stray currents that interfere with radio frequency signals.
Design a carbon-based thermally conductive shielding film, including a thermally conductive shielding layer, a conductive layer and an adhesive backing layer, with a thickness of less than 0.2 mm. Conductive metal particles are set in the conductive layer, and the adhesive backing layer is used to fix it to the machine body. The conductive metal particles form a conductive path to ground and avoid stray current interference.
It achieves the characteristics of heat conduction, shielding and thinness, while solving the problem of current stray interference with radio frequency signals, ensuring circuit stability.
Smart Images
Figure CN223798563U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electromagnetic shielding technology, and in particular to a carbon-based thermally conductive shielding film. Background Technology
[0002] Electromagnetic waves can be emitted from the circuitry of electronic devices through the atmosphere or transmitted through wires, generating electromagnetic interference. This interference can degrade the performance of peripheral electronic devices, cause noise, damage electronic imaging, and shorten the lifespan of electronic devices, ultimately leading to malfunctions and unusable equipment. Electromagnetic interference can also have adverse effects on human health and the natural environment. In electronics, communications, medical, and related fields, various electromagnetic interference shielding materials are typically used to fill the gaps inside electronic devices, reducing electromagnetic wave leakage and thus mitigating the harmful effects of electromagnetic interference.
[0003] Existing metal shielding covers are electromagnetic interference shielding materials with thermal conductivity. They are usually made of 0.2mm thick stainless steel or nickel silver, which have good thermal conductivity and shielding effect. However, these products have certain limitations. They are not easy to stick to the device body and are prone to generating current spurious interference with radio frequency signals.
[0004] Therefore, existing technologies still need to be improved and developed. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide a carbon-based thermally conductive shielding film to address the above-mentioned defects of the prior art. This film aims to solve the problem that traditional metal shielding covers are not easy to stick to the machine body and are prone to generating current stray interference with radio frequency signals.
[0006] The technical solution adopted by this utility model to solve the technical problem is as follows:
[0007] A carbon-based thermally conductive shielding film, comprising:
[0008] Thermally conductive shielding layer;
[0009] A conductive layer is disposed on one side of the thermally conductive shielding layer;
[0010] Adhesive backing layer; disposed on the side of the conductive layer away from the thermally conductive shielding layer, wherein a plurality of conductive metal particles are disposed within the adhesive backing layer;
[0011] The thermally conductive shielding layer, the conductive layer, and the adhesive backing layer are arranged in layers from top to bottom and have a thickness of less than 0.2 mm.
[0012] The carbon-based thermally conductive shielding film, wherein the thermally conductive shielding layer comprises:
[0013] First shielding layer;
[0014] A first thermally conductive layer is disposed on one side of the first shielding layer;
[0015] The conductive layer is disposed on the side of the first thermally conductive layer that is away from the first shielding layer.
[0016] The carbon-based thermally conductive shielding film, wherein the thermally conductive shielding layer comprises:
[0017] Insulating layer;
[0018] A second thermally conductive layer is disposed on one side of the insulating layer;
[0019] The second shielding layer is disposed on the side of the second thermally conductive layer that is away from the insulating layer;
[0020] The conductive layer is disposed on the side of the second shielding layer opposite to the second thermally conductive layer.
[0021] The carbon-based thermally conductive shielding film, wherein the first thermally conductive layer is a carbon-based film first thermally conductive layer, and the carbon-based film first thermally conductive layer is filled with a first carbon fiber, a first carbon powder, or a first carbon nanotube.
[0022] The carbon-based thermally conductive shielding film, wherein the first shielding layer is a copper foil first shielding layer, an aluminum foil first shielding layer, a gold-plated polyimide first shielding layer, or a tin-plated polyimide first shielding layer.
[0023] The carbon-based thermally conductive shielding film includes a first adhesive layer between the first shielding layer and the first thermally conductive layer, and between the first thermally conductive layer and the conductive layer.
[0024] The carbon-based thermally conductive shielding film, wherein the insulating layer is a polyethylene terephthalate insulating layer, a polyimide insulating layer, or a thermoplastic polyurethane insulating layer.
[0025] The carbon-based thermally conductive shielding film includes a second adhesive layer between the second thermally conductive layer and the second shielding layer, and between the second shielding layer and the conductive layer.
[0026] The carbon-based thermally conductive shielding film, wherein the conductive layer is a conductive cloth conductive layer, a polyimide conductive layer, a copper foil conductive layer, or an aluminum foil conductive layer.
[0027] The carbon-based thermally conductive shielding film, wherein the adhesive backing layer is a pressure-sensitive adhesive backing layer, a voltage-conductive pressure-sensitive adhesive backing layer, a double-sided adhesive backing layer, or a conductive hot melt adhesive backing layer.
[0028] Beneficial effects:
[0029] This invention provides a carbon-based thermally conductive shielding film. By setting a thermally conductive shielding layer on one side of the conductive layer and an adhesive backing layer on the other side of the conductive layer, and by combining the thermally conductive shielding layer, the conductive layer, and the adhesive backing layer in layers from top to bottom with a thickness of less than 0.2 mm, this device combines the characteristics of thermal conductivity, shielding, and thinness. At the same time, the adhesive backing layer is used to fix it to the body. Conductive metal particles are set in the adhesive backing layer, which can form a conductive path on the adhesive backing layer, playing a role in electromagnetic shielding. It can also play a grounding role, so that any stray current flows to the ground wire and will not interfere with the circuit, thereby solving the problem of current stray interference with radio frequency signals when in contact with the body. Attached Figure Description
[0030] Figure 1 This is a structural diagram of the first embodiment of the carbon-based thermally conductive shielding film of this utility model;
[0031] Figure 2 This is a structural diagram of the second embodiment of the carbon-based thermally conductive shielding film of this utility model.
[0032] In the picture:
[0033] 1. First shielding layer; 2. First adhesive layer; 3. First thermally conductive layer; 3-1. First carbon fiber; 4. Conductive layer; 5. Backing adhesive layer; 6. Second shielding layer; 7. Second thermally conductive layer; 7-1. Second carbon fiber; 8. Insulating layer; 9. Second adhesive layer; 10. Thermally conductive shielding layer. Detailed Implementation
[0034] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0035] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0036] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] Example 1
[0038] Please see Figure 1 As shown, this application provides a carbon-based thermally conductive shielding film, including a thermally conductive shielding layer 10, a conductive layer 4, and an adhesive backing layer 5. The thermally conductive shielding layer 10 is used for thermal shielding. The conductive layer 4 is disposed on one side of the thermally conductive shielding layer 10. The adhesive backing layer 5 is disposed on the side of the conductive layer 4 away from the thermally conductive shielding layer 10. The adhesive backing layer 5 contains a plurality of conductive metal particles for fixing to the machine body. The thermally conductive shielding layer 10, the conductive layer 4, and the adhesive backing layer 5 are layered and formed from top to bottom, and the thickness is less than 0.2 mm.
[0039] Specifically, this embodiment discloses a carbon-based thermally conductive shielding film comprising a thermally conductive shielding layer 10, a conductive layer 4, and an adhesive backing layer 5. The thermally conductive shielding layer 10 is used for thermal shielding, and the conductive layer 4 is used to provide good electromagnetic compatibility. After the thermally conductive shielding layer 10, the conductive layer 4, and the adhesive backing layer 5 are assembled and formed from top to bottom, the thickness is less than 0.2 mm, which makes the device have the characteristics of thermal conductivity, shielding, and thinness.
[0040] This embodiment also discloses that the adhesive layer 5 is disposed below the conductive layer 4, and a number of conductive metal particles are disposed within the adhesive layer 5. The conductive metal particles include silver, copper, gold, and nickel. Silver has the best conductivity and relatively stable chemical properties, and is not easily oxidized in air. Copper has the second best conductivity after silver, and its cost is lower, but its chemical stability is worse than that of silver. Gold has good conductivity and stable chemical properties, but its price is relatively expensive. Nickel has lower conductivity than silver, copper, and gold, but it has good corrosion resistance and electromagnetic shielding properties. Therefore, silver is preferred as the conductive metal particle because it is chemically stable and has a lower cost. In actual use, the adhesive layer 5 is directly fixed to the body. The conductive metal particles disposed within the adhesive layer 5 can form a conductive path in the adhesive layer 5, which can play a role in electromagnetic shielding and grounding. This allows stray currents to flow to the ground wire and will not interfere with the circuit, thereby solving the problem of current stray interference with radio frequency signals when in contact with the body.
[0041] In some embodiments, conductive metal particles are uniformly distributed in the adhesive layer 5 to reduce radiation caused by uneven local current density.
[0042] In some embodiments, the diameter of the conductive metal particles is selected and set according to the actual size of the adhesive layer 5. Smaller conductive metal particles are more likely to form a denser conductive network, while larger conductive metal particles are more likely to affect the overall flexibility and physical properties of the adhesive layer 5.
[0043] Please see Figure 1 As shown, in another embodiment of this application, the thermally conductive shielding layer 10 includes a first shielding layer 1 and a first thermally conductive layer 3, with the first thermally conductive layer 3 disposed on one side of the first shielding layer 1; wherein, the conductive layer 4 is disposed on the side of the first thermally conductive layer 3 opposite to the first shielding layer 1.
[0044] Specifically, this application provides an embodiment of a carbon-based thermally conductive shielding film. The thermally conductive shielding layer 10 includes a first shielding layer 1 and a first thermally conductive layer 3. The first shielding layer 1 is located above the first thermally conductive layer 3, and the first thermally conductive layer 3 is located above the conductive layer 4. By providing the first shielding layer 1 on the first thermally conductive layer 3, the first shielding layer 1 can prevent the first thermally conductive layer 3 from being partially detached due to compression or friction, thereby protecting the first thermally conductive layer 3.
[0045] In another embodiment of this application, the first thermally conductive layer 3 is a carbon-based film first thermally conductive layer, and the carbon-based film first thermally conductive layer is filled with a first carbon fiber 3-1, a first carbon powder, or a first carbon nanotube.
[0046] Specifically, the first thermally conductive layer 3 is made of carbon-based film material. The carbon-based film is mainly composed of carbon atoms, which form a thin film structure in a specific arrangement, giving the carbon-based film high electrical conductivity, high thermal conductivity, and good mechanical properties. Then, carbon materials with different structures are added to the first thermally conductive layer 3. The carbon materials can be selected from first carbon fiber 3-1, first carbon powder, and first carbon nanotubes, with first carbon fiber 3-1 being preferred. First carbon fiber 3-1 is a high thermal conductivity material with good mechanical properties and excellent thermal conductivity and radiative heat dissipation capabilities. At the same time, first carbon fiber 3-1 can effectively resist external loads, so that the first thermally conductive layer 3 is flexible without losing strength and rigidity, greatly extending its service life.
[0047] In some embodiments, the thickness of the first thermally conductive layer 3 is 0.02-0.06 mm, preferably 0.04 mm. This avoids the first thermally conductive layer 3 being too thin, which would reduce its thermal conductivity, while also avoiding the first thermally conductive layer 3 being too thick, which would hinder its thinness and increase its cost.
[0048] In another embodiment of this application, the first shielding layer 1 is a copper foil first shielding layer, an aluminum foil first shielding layer, a gold-plated polyimide first shielding layer, or a tin-plated polyimide first shielding layer.
[0049] Specifically, the material of the first shielding layer 1 can be copper foil, aluminum foil, gold-plated polyimide, or tin-plated polyimide. Copper foil has good conductivity and shielding performance, is soft, and is easy to process and shape. Aluminum foil has good thermal conductivity and oxidation resistance, and is low in cost, but has poor conductivity and shielding performance. Gold-plated polyimide is a composite material in which gold metal is deposited on a polyimide film, and has excellent conductivity and shielding performance. Tin-plated polyimide is a composite material in which tin metal is deposited on a polyimide film, and has environmental durability, good conductivity, and solderability. In this embodiment, the first shielding layer 1 is preferably a copper foil first shielding layer, which also has certain thermal conductivity, thereby increasing the overall heat dissipation capacity of the product.
[0050] In some embodiments, the thickness of the first shielding layer 1 is 0.006-0.05 mm, preferably 0.02 mm. If the thickness of the first shielding layer 1 is too thin, it will reduce the bending resistance, tensile performance and shielding performance; if the thickness of the first shielding layer 1 is too thick, it will be detrimental to the thinning and lightening process and increase the cost.
[0051] See Figure 1 As shown, in another embodiment of this application, a first adhesive layer 2 is provided between the first shielding layer 1 and the first thermally conductive layer 3, and between the first thermally conductive layer 3 and the conductive layer 4.
[0052] Specifically, a first adhesive layer 2 is disposed between the first shielding layer 1 and the first thermally conductive layer 3, and between the first thermally conductive layer 3 and the conductive layer 4. The material of the first adhesive layer 2 can be selected from pressure-sensitive adhesive, conductive voltage-sensitive adhesive, polyethylene terephthalate-based double-sided adhesive, or conductive hot melt adhesive tape. Pressure-sensitive adhesive has excellent bonding strength; conductive voltage-sensitive adhesive can enhance shielding effectiveness, has good conductivity, and can be used at room temperature; polyethylene terephthalate-based double-sided adhesive has good high-temperature resistance, durability, and resistance to deformation, as well as strong support; hot melt adhesive has good plasticity, strong stability, and high efficiency, making it suitable for high-speed automated production, and its bonding effect is better than that of pressure-sensitive adhesive, but it requires operation in a heated environment. In this embodiment, the first adhesive layer 2 is preferably made of conductive voltage-sensitive adhesive, which not only has the characteristics of traditional pressure-sensitive adhesive, but can also conduct current, improving product performance.
[0053] See Figure 1 As shown, in another embodiment of this application, the conductive layer 4 is a conductive cloth conductive layer, a polyimide conductive layer, a copper foil conductive layer, or an aluminum foil conductive layer.
[0054] Specifically, the conductive layer 4 is a conductive cloth conductive layer, a polyimide conductive layer, a copper foil conductive layer, or an aluminum foil conductive layer. In this embodiment, the conductive layer 4 is preferably a conductive cloth conductive layer. The conductive cloth includes a substrate, a texture, and a plating. The substrate is polyester fiber, and the texture can be non-woven fabric, plain weave fabric, or checkered fabric. Non-woven fabric is preferred because it has excellent flexibility, which allows it to better fit the device surface, prevents wrinkling, and provides good contact. The plating can be copper, silver, nickel, or other metals, with nickel being preferred because the nickel layer can give the entire thermally conductive carbon-based shielding film good shielding effectiveness, corrosion resistance, and electromagnetic compatibility. Using a conductive cloth conductive layer provides both excellent conductivity and outstanding protective properties, reducing the maintenance cost of the conductive layer 4 and extending its service life.
[0055] In some embodiments, the thickness of the conductive layer 4 can be selected from 0.012 mm to 0.05 mm, preferably 0.02 mm. This thickness allows the conductive layer 4 to have both conductive properties and a thin profile.
[0056] In another embodiment of this application, the adhesive backing layer 5 is a pressure-sensitive adhesive backing layer, a conductive voltage-sensitive adhesive backing layer, a double-sided adhesive backing layer, or a conductive hot melt adhesive backing layer.
[0057] Specifically, the backing layer 5 is made of pressure-sensitive adhesive, conductive voltage-sensitive adhesive, double-sided adhesive, or conductive hot melt adhesive. Pressure-sensitive adhesive has the advantages of easy adhesion, ease of use, and wide compatibility; conductive voltage-sensitive adhesive has the advantages of both conductivity and adhesion; double-sided adhesive has the advantages of convenience and ease of bonding; conductive hot melt adhesive has the advantages of high-strength adhesion, strong chemical stability, and temperature resistance. In this embodiment, the backing layer 5 is preferably made of conductive voltage-sensitive adhesive. Conductive voltage-sensitive adhesive has excellent bonding strength, which can enhance shielding effectiveness, has good conductivity, and can be used at room temperature, making the product more reliable and stable.
[0058] Example 2
[0059] like Figure 2 As shown, this application provides another embodiment of a carbon-based thermally conductive shielding film. The thermally conductive shielding layer 10 includes an insulating layer 8, a second thermally conductive layer 7, and a second shielding layer 6. The second thermally conductive layer 7 is disposed on one side of the insulating layer 8, and the second shielding layer 6 is disposed on the side of the second thermally conductive layer 7 away from the insulating layer 8. The conductive layer 4 is disposed on the side of the second shielding layer 6 away from the second thermally conductive layer 7.
[0060] Specifically, the thermally conductive shielding layer 10 includes an insulating layer 8, a second thermally conductive layer 7, and a second shielding layer 6. In this embodiment, the insulating layer 8 is located at the top, the second thermally conductive layer 7 is installed on the lower surface of the insulating layer 8, the second shielding layer 6 is installed on the lower surface of the second thermally conductive layer 7, the conductive layer 4 is installed on the lower surface of the second shielding layer 6, and the adhesive layer 5 is disposed on the lower surface of the conductive layer 4. In this embodiment, by adjusting the positional relationship between the second thermally conductive layer 7 and the second shielding layer 6, and by adding an insulating layer 8 on the second thermally conductive layer 7, it is beneficial to prevent the material of the second thermally conductive layer 7 from falling off, so that this device can also be applied to different application scenarios.
[0061] In some embodiments, the insulating layer 8 is a polyethylene terephthalate insulating layer, a polyimide insulating layer, or a thermoplastic polyurethane insulating layer.
[0062] Specifically, the material of the insulation layer 8 can be polyethylene terephthalate, polyimide, or thermoplastic polyurethane. Polyethylene terephthalate film has good transparency and strong airtightness, and has good creep resistance, fatigue resistance, and abrasion resistance; polyimide has good high temperature resistance and electrical insulation; thermoplastic polyurethane has good high elasticity and low temperature resistance. Users can choose the insulation layer 8 with the corresponding performance according to their requirements in different product application scenarios.
[0063] In another embodiment of this application, the second thermally conductive layer 7 is a carbon-based film second thermally conductive layer, which is filled with a second carbon fiber 7-1, a second carbon powder, or a second carbon nanotube.
[0064] Specifically, the second thermally conductive layer 7 is made of carbon-based film material. The carbon-based film is mainly composed of carbon atoms, which form a thin film structure in a specific arrangement, giving the carbon-based film high electrical conductivity, high thermal conductivity, and good mechanical properties. Then, carbon materials with different structures are added to the second thermally conductive layer 7. The carbon materials can be selected from second carbon fiber 7-1, second carbon powder, and second carbon nanotubes, with second carbon fiber 7-1 being preferred. Second carbon fiber 7-1 is a high thermal conductivity material with good mechanical properties and excellent thermal conductivity and radiative heat dissipation capabilities. At the same time, second carbon fiber 7-1 can effectively resist external loads, so that the second thermally conductive layer 7 is flexible without losing strength and rigidity, greatly extending its service life.
[0065] Furthermore, in another embodiment of this application, a second adhesive layer 9 is provided between the second thermally conductive layer 7 and the second shielding layer 6, and between the second shielding layer 6 and the conductive layer 4.
[0066] Specifically, in this embodiment, the second adhesive layer 9 is used to connect the second thermally conductive layer 7 to the second shielding layer 6, and the second shielding layer 6 to the conductive layer 4. The second adhesive layer 9 uses the voltage-sensitive adhesive material described above, and the specific effects will not be repeated.
[0067] It is understandable that the first heat-conducting layer 3 and the second heat-conducting layer 7 have complete structural shapes, the first shielding layer 1 and the second shielding layer 6 have complete structural shapes, and the first adhesive layer 2 and the second adhesive layer 9 have complete structural shapes. The specific effects have been discussed above and will not be repeated here.
[0068] In summary, this utility model provides a carbon-based thermally conductive shielding film. By setting a thermally conductive shielding layer on one side of the conductive layer and an adhesive layer on the other side of the conductive layer, and by combining the thermally conductive shielding layer, the conductive layer, and the adhesive layer in layers from top to bottom with a thickness of less than 0.2 mm, this device combines the characteristics of thermal conductivity, shielding, and thinness. At the same time, the adhesive layer is directly fixed to the body, and conductive metal particles are set in the adhesive layer, which can serve as grounding and electrical connection, and can also solve the problem of current stray interference with radio frequency signals when in contact with the body. By using a first thermally conductive layer and a second thermally conductive layer made of carbon-based film, and by adding a first carbon fiber and a second carbon fiber to the carbon-based film respectively, the thermal conductivity of the first thermally conductive layer and the second thermally conductive layer can be significantly improved.
[0069] It should be understood that the application of this utility model is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A carbon-based thermally conductive shielding film, characterized in that, include: Thermally conductive shielding layer; A conductive layer is disposed on one side of the thermally conductive shielding layer; Adhesive backing layer; The conductive layer is disposed on the side of the conductive layer away from the thermally conductive shielding layer, and a plurality of conductive metal particles are disposed in the adhesive layer. The thermally conductive shielding layer, the conductive layer, and the adhesive backing layer are arranged in layers from top to bottom and have a thickness of less than 0.2 mm.
2. The carbon-based thermally conductive shielding film according to claim 1, characterized in that, The thermally conductive shielding layer includes: First shielding layer; A first thermally conductive layer is disposed on one side of the first shielding layer; The conductive layer is disposed on the side of the first thermally conductive layer that is away from the first shielding layer.
3. The carbon-based thermally conductive shielding film according to claim 1, characterized in that, The thermally conductive shielding layer includes: Insulating layer; A second thermally conductive layer is disposed on one side of the insulating layer; The second shielding layer is disposed on the side of the second thermally conductive layer that is away from the insulating layer; The conductive layer is disposed on the side of the second shielding layer opposite to the second thermally conductive layer.
4. The carbon-based thermally conductive shielding film according to claim 2, characterized in that, The first thermally conductive layer is a carbon-based film first thermally conductive layer, which is filled with a first carbon fiber, a first carbon powder, or a first carbon nanotube.
5. A carbon-based thermally conductive shielding film according to claim 2, characterized in that, The first shielding layer is a copper foil first shielding layer, an aluminum foil first shielding layer, a gold-plated polyimide first shielding layer, or a tin-plated polyimide first shielding layer.
6. The carbon-based thermally conductive shielding film according to claim 2, characterized in that, A first adhesive layer is provided between the first shielding layer and the first thermally conductive layer, and between the first thermally conductive layer and the conductive layer.
7. The carbon-based thermally conductive shielding film according to claim 3, characterized in that, The insulating layer is a polyethylene terephthalate insulating layer, a polyimide insulating layer, or a thermoplastic polyurethane insulating layer.
8. The carbon-based thermally conductive shielding film according to claim 3, characterized in that, A second adhesive layer is provided between the second thermally conductive layer and the second shielding layer, and between the second shielding layer and the conductive layer.
9. A carbon-based thermally conductive shielding film according to claim 1, characterized in that, The conductive layer is a conductive cloth conductive layer, a polyimide conductive layer, a copper foil conductive layer, or an aluminum foil conductive layer.
10. A carbon-based thermally conductive shielding film according to claim 1, characterized in that, The adhesive backing layer is a pressure-sensitive adhesive backing layer, a conductive voltage-sensitive adhesive backing layer, a double-sided adhesive backing layer, or a conductive hot melt adhesive backing layer.