Field effect transistor chip with uniform current distribution

Abstract

The utility model discloses a field effect transistor chip with uniform current distribution, which comprises a chip body, a silica gel bottom plate is arranged below the chip body, a convenient-to-disassemble mechanism is arranged on the left side of the chip body, and the convenient-to-disassemble mechanism comprises an electrode, an upper limiting plate, a lower limiting plate, a spring, a magnet block and a magnet hole. Electrodes are connected to the left side of the interior of the chip body at equal intervals in a clamped mode, upper limiting plates are tightly attached to the upper sides of the exteriors of the electrodes, and lower limiting plates are tightly attached to the lower portions of the exteriors of the electrodes. According to the field effect transistor chip with the uniform current distribution, the electrodes can be conveniently disassembled and installed through the arrangement of the convenient-to-disassemble mechanism, once the electrodes are damaged, the electrodes can be immediately replaced, meanwhile, the heat dissipation mechanism is arranged, heat dissipation of the chip during operation can be accelerated, the service life of the chip can be greatly prolonged, and in addition, the convenient-to-maintain mechanism is arranged, so that the service life of the chip is greatly prolonged. Therefore, the whole chip is convenient to disassemble and assemble and can be overhauled and replaced.

Description

TECHNICAL FIELD

[0001] The utility model relates to field effect transistor chip technical field, concretely is a kind of current distribution even field effect transistor chip. BACKGROUND

[0002] Field effect transistor chip is a kind of semiconductor device using the electric field effect of control input loop to control output loop current, mainly by three electrodes: gate, source and drain, gate and source and drain are separated by an insulating layer, the current between source and drain is controlled by adjusting gate voltage, usually referred to as metal-oxide-semiconductor field effect transistor, the current distribution even field effect transistor chip suitable for market at present is various, but still there are some shortcomings.

[0003] As in actual use process, the current distribution even field effect transistor chip of general, three electrodes and chip are welded and fixed together, once electrode appears damage and cannot quickly disassemble and replace, simultaneously, when general chip runs, a large amount of heat is generated, heat cannot quickly dissipate, can lead to chip damage, secondly, chip and mounting plate connection are also welded together, once chip has exception, also cannot quickly disassemble and overhaul etc. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of current distribution even field effect transistor chip to solve the current distribution even field effect transistor chip of above background art, three electrodes and chip are welded and fixed together, once electrode appears damage and cannot quickly disassemble and replace, simultaneously, when general chip runs, a large amount of heat is generated, heat cannot quickly dissipate, can lead to chip damage, secondly, chip and mounting plate connection are also welded together, once chip has exception, also cannot quickly disassemble and overhaul etc.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of current distribution even field effect transistor chip, comprising:

[0006] Chip body, the lower portion of the chip body is equipped with silica gel bottom plate;

[0007] Further comprising:

[0008] The left side of the chip body is provided with a convenient dismounting mechanism, wherein the convenient dismounting mechanism comprises an electrode, an upper limiting plate, a lower limiting plate, a spring, a magnet block and a magnet hole, the left side of the inside of the chip body is connected with the electrode at equal distances, the upper side of the outside of the electrode is tightly combined with the upper limiting plate, the lower side of the outside of the electrode is tightly combined with the lower limiting plate, the upper side of the middle of the upper limiting plate and the lower side of the middle of the lower limiting plate are fixedly connected with the spring, and the outside of the spring is fixedly connected with the chip body.

[0009] The outside of the chip body is provided with a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a heat-conducting silica gel sheet, a front limiting support, a connecting block, a connecting groove and an electrode, the outside of the chip body is provided with the heat-conducting silica gel sheet, the rear side of the heat-conducting silica gel sheet is tightly combined with the rear limiting support, the front side of the heat-conducting silica gel sheet is tightly combined with the front limiting support, and the front limiting support and the rear limiting support are rotationally connected with the chip body.

[0010] Preferably, the magnet block is symmetrically arranged on the lower side of the upper limiting plate, the magnet hole is symmetrically arranged on the outside of the magnet block, and the magnet hole is arranged in the inside of the lower limiting plate.

[0011] Preferably, the connecting block is arranged on the upper rear side of the front limiting support, and the connecting groove is connected with the outside of the connecting block.

[0012] Preferably, the connecting groove is arranged on the upper front side of the rear limiting support.

[0013] Preferably, the lower right side of the chip body is provided with a mounting plate, and the inside of the lower rear side of the mounting plate and the chip body is connected with the fixed rod.

[0014] Preferably, the rear end of the fixed rod is connected with the fixed cap, and the front side of the fixed cap is fixedly connected with the mounting plate.

[0015] Preferably, the front end of the fixed rod is provided with a threaded body, the outside of the threaded body is threadedly connected with a threaded cap, and the rear side of the threaded cap is tightly combined with the mounting plate.

[0016] Compared with the prior art, the current distribution uniform field effect tube chip has the advantages that: the convenient dismounting mechanism can facilitate the dismounting and mounting of the electrode, the damaged electrode can be replaced immediately, the heat dissipation mechanism can accelerate the heat dissipation of the chip during use, thereby greatly prolonging the service life of the chip, and the convenient maintenance mechanism facilitates the dismounting of the chip, and the chip can be repaired and replaced;

[0017] 1. The utility model provides a chip body, electrode, upper limit stop plate and lower limit stop plate are provided with, through the equal distance clamping connection of electrode in the left side of chip body, and the upper side and the lower side of the outside of electrode are closely combined with upper limit stop plate and lower limit stop plate respectively and are positioned, and the upper side of the middle part of upper limit stop plate and the lower side of the middle part of lower limit stop plate are fixedly connected with spring and are positioned, in addition, the front and rear sides below upper limit stop plate are provided with magnet block, and the front and rear sides of the inside of lower limit stop plate are symmetrically provided with magnet hole and are adsorbed and connected, so that upper limit stop plate and lower limit stop plate are firmly clamped on the outside of electrode and limit electrode, so that electrode and chip body are firmly connected.

[0018] 2. The utility model provides a chip body and silica gel bottom plate are provided with, through the bottom of chip body is provided with silica gel bottom plate, the setting of silica gel bottom plate can effectively reduce the vibration damage of chip body when running,

[0019] 3. The utility model provides a heat conduction silica gel piece is provided with, through the outside of chip body is provided with heat conduction silica gel piece, and heat conduction silica gel piece can effectively accelerate the heat dissipation of chip body, thereby can prolong the service life of chip body,

[0020] 4. The utility model provides a front limit support, connecting block, connecting groove and rear limit support are provided with, through the front side of heat conduction silica gel piece is closely combined and is provided with front limit support, and the rear side of heat conduction silica gel piece is closely combined and is provided with rear limit support, and the lower side of rear limit support and front limit support is rotatably connected with chip body, and the upper rear side of front limit support is installed with connecting block, and connecting block is effectively clamped and is connected with the connecting groove of the upper front side of rear limit support, that is, rear limit support and front limit support can fix the position of heat conduction silica gel piece, make it firmly adhere to the outside of chip body, help chip body effectively dissipate heat,

[0021] 5. The utility model provides an installation plate, fixed rod, screw body and screw cap are provided with, through the right lower side of chip body is provided with installation plate, and the right lower side of the inside of chip body is provided with fixed rod, and the rear side of fixed rod is clamped and is connected with the fixed cap of installation plate rear side, in addition, the front side of fixed rod is provided with screw body, and screw body is firmly screwed with screw cap, that is, fixed rod is arranged in the right lower side of the inside of installation plate and chip body, can make chip body and installation plate firmly connect installation. ACCURACY OF DRAWINGS

[0022] Figure 1 It is the perspective structure schematic diagram of the utility model;

[0023] Figure 2 It is the heat conduction silica gel piece, front limit support and connecting block connection perspective structure schematic diagram of the utility model;

[0024] Figure 3This is a perspective view of the connection structure of the chip body, silicone base plate and mounting plate of this utility model.

[0025] Figure 4 This is a perspective disassembled structural diagram of the fixing rod, threaded body, and threaded cap of this utility model;

[0026] Figure 5 This is a perspective disassembly diagram of the electrode, upper limit plate, and lower limit plate of this utility model;

[0027] Figure 6 This is a perspective view of the connection structure of the thermally conductive silicone sheet, the front limiting bracket, and the connecting block of this utility model.

[0028] In the diagram: 1. Chip body; 2. Electrode; 3. Upper limit plate; 4. Lower limit plate; 5. Spring; 6. Magnet block; 7. Magnet hole; 8. Thermal conductive silicone sheet; 9. Front limit bracket; 10. Connecting block; 11. Connecting groove; 12. Rear limit bracket; 13. Silicone base plate; 14. Mounting plate; 15. Fixing rod; 16. Threaded body; 17. Threaded cap; 18. Fixing cap. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-6 This utility model provides a technical solution:

[0031] Example 1: To address the problems existing in the prior art, this example provides the following technical solution: a field-effect transistor chip with uniform current distribution, comprising a chip body 1 with a pad; a disassembly mechanism located on the left side of the chip body 1, allowing for easy disassembly and installation of the electrode 2 mounted on the left side of the chip body 1, enabling immediate replacement of the electrode 2 if it is damaged; a heat dissipation mechanism located on the outside of the chip body 1, accelerating heat dissipation and extending the lifespan of the chip body 1; and a maintenance mechanism located on the right side of the chip body 1, facilitating the connection between the chip body 1 and the mounting plate 14, allowing for immediate disassembly and repair of the chip body 1 if any abnormality is detected; firstly, in the chip... Electrode 2 is engaged with the left side of the chip body 1. An upper limit plate 3 and a lower limit plate 4 are tightly fitted to the upper and lower sides of electrode 2, respectively. Springs 5 ​​are installed at the upper center of the upper limit plate 3 and the lower center of the lower limit plate 4 for positioning. Magnets 6 are installed on the lower front and rear sides of the upper limit plate 3. These magnets 6 are attracted to the lower limit plate 4 through magnet holes 7, ensuring a firm fit between the upper and lower limit plates 3 and the outer side of electrode 2. If electrode 2 malfunctions, the upper limit plate 3 can be pulled upwards or the lower limit plate 4 downwards, causing the magnets 6 and magnet holes 7 to disengage, allowing electrode 2 to be removed from the chip body 1 for further processing. The chip body 1 is replaced with a silicone base plate 13 at its bottom for effective vibration damping. A thermally conductive silicone sheet 8 is also placed on the outer side of the chip body 1, allowing heat generated during operation to dissipate quickly. A front limiting bracket 9 and a rear limiting bracket 12 are tightly fitted to the front and rear sides of the thermally conductive silicone sheet 8, respectively. The lower parts of the front and rear limiting brackets 9 and 12 are rotatably connected to the chip body 1. A connecting block 10 is installed above the rear side of the front limiting bracket 9, and it engages firmly with the connecting groove 11 on the front side of the rear limiting bracket 12. This ensures that the rear limiting bracket 12 and the front limiting bracket 9 firmly limit the thermally conductive silicone sheet 8. To ensure the thermally conductive silicone pad 8 functions better, a mounting plate 14 is installed on the lower right side of the chip body 1. A fixing rod 15 is connected through the mounting plate 14 and the chip body 1. The rear side of the fixing rod 15 is engaged with a fixing cap 18 installed on the rear side of the mounting plate 14. A threaded body 16 is installed on the front side. The threaded body 16 is threadedly connected to the threaded cap 17 for limiting. If the chip body 1 malfunctions, the threaded cap 17 fixed to the threaded body 16 can be unscrewed, and the fixing rod 15 can be pulled forward. This will disengage the fixing rod 15 from the fixing cap 18, and the fixing rod 15 will be pulled out of the chip body 1 and the mounting plate 14, allowing the chip body 1 to be disassembled and repaired.

[0032] In existing field-effect transistor (FET) chips, the three electrodes 2 are soldered and fixed to the chip body 1, resulting in the inability to quickly disassemble and replace them if the electrodes 2 are damaged. Therefore, this embodiment addresses this issue by employing the following technical solution: Figure 1 and Figure 5 As shown, the easy-to-disassemble mechanism includes an upper limit plate 3 located on the outer side above electrode 2, and a lower limit plate 4 tightly attached to the outer side below electrode 2. Springs 5 ​​are fixedly connected to the upper middle part of the upper limit plate 3 and the lower middle part of the lower limit plate 4 for limiting their position. Magnet blocks 6 are located on the front and rear sides below the upper limit plate 3. These magnet blocks 6 are attracted to the symmetrically opened magnet holes 7 on the front and rear sides inside the lower limit plate 4, allowing the upper limit plate 3 and lower limit plate 4 to firmly engage with the outer side of electrode 2, limiting its position and ensuring a secure connection between electrode 2 and chip body 1. If electrode 2 is damaged, the upper limit plate 3 can be moved upwards, or the lower limit plate 4 can be moved downwards, causing the magnet blocks 6 below the upper limit plate 3 to separate from the magnet holes 7 inside the lower limit plate 4, allowing electrode 2 to be removed from the chip body 1 for replacement.

[0033] Example 2: Existing field-effect transistor chips generate a large amount of heat during operation using a typical chip body 1. This heat cannot be dissipated quickly, leading to damage to the chip body 1. Therefore, this example addresses this issue through the following technical solution: Figure 1 , Figure 2 and Figure 4 As shown, the heat dissipation mechanism includes a thermally conductive silicone pad 8 disposed on the outside of the chip body 1. The thermally conductive silicone pad 8 can effectively accelerate the heat dissipation of the chip body 1. At the same time, a front limiting bracket 9 is tightly attached to the front side of the thermally conductive silicone pad 8, and a rear limiting bracket 12 is tightly attached to the rear side of the thermally conductive silicone pad 8. The rear limiting bracket 12 and the front limiting bracket 9 are rotatably connected to the chip body 1 at their lower ends. A connecting block 10 is installed on the rear side above the front limiting bracket 9. The connecting block 10 is effectively engaged with the connecting groove 11 opened on the front side above the rear limiting bracket 12. That is, the rear limiting bracket 12 and the front limiting bracket 9 can fix the position of the thermally conductive silicone pad 8, so that it is firmly attached to the outside of the chip body 1, which helps the chip body 1 to effectively dissipate heat.

[0034] Example 3: Existing field-effect transistor chips are also soldered together via the chip body 1 and mounting plate 14. This leads to problems such as difficulty in quickly disassembling and repairing the chip body 1 if it malfunctions. Therefore, this example addresses these issues through the following technical solution: Figure 2 , Figure 4 and Figure 6As shown, the maintenance mechanism includes a mounting plate 14 located on the lower right side of the chip body 1. A fixing rod 15 is connected through the mounting plate 14 to the lower right side of the chip body 1. The rear side of the fixing rod 15 is engaged with a fixing cap 18 installed on the rear side of the mounting plate 14. A threaded body 16 is provided on the front side of the fixing rod 15. The threaded body 16 is firmly threadedly connected to the threaded cap 17. In other words, the fixing rod 15 is located inside the lower right side of the mounting plate 14 and the chip body 1, which allows the chip body 1 and the mounting plate 14 to be firmly connected and installed. If the chip body 1 malfunctions, first unscrew the threaded cap 17 that is threaded to the fixing rod 15, and then pull the fixing rod 15 forward to disengage it from the fixing cap 18. At the same time, move it out of the interior of the chip body 1 and the mounting plate 14, so that the mounting plate 14 is separated from the chip body 1, and the chip body 1 can be removed for maintenance.

[0035] The contents not described in detail in this specification are existing technologies known to those skilled in the art. All standard parts used in this utility model can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0036] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A field-effect transistor chip with uniform current distribution, comprising: Chip body (1), with a silicone base plate (13) installed below the chip body (1); Its characteristic is that it further includes: The chip body (1) is provided with a disassembly mechanism on the left side, which includes an electrode (2), an upper limit plate (3), a lower limit plate (4), a spring (5), a magnet (6), and a magnet hole (7). The electrode (2) is equidistantly connected to the left side of the chip body (1), and the upper limit plate (3) is tightly attached to the upper side of the electrode (2), and the lower limit plate (4) is tightly attached to the lower side of the electrode (2). The upper part of the upper limit plate (3) and the lower part of the lower limit plate (4) are both fixedly connected to the upper part of the middle and the lower part of the middle. The chip body (1) is fixedly connected to the outer side of the spring (5). A heat dissipation mechanism is provided on the outer side of the chip body (1), wherein the heat dissipation mechanism includes a thermally conductive silicone sheet (8), a front limiting bracket (9), a connecting block (10), a connecting groove (11), and an electrode (2). A thermally conductive silicone sheet (8) is provided on the outer side of the chip body (1), and a rear limiting bracket (12) is tightly attached to the rear side of the thermally conductive silicone sheet (8), and a front limiting bracket (9) is tightly attached to the front side of the thermally conductive silicone sheet (8). Both the front limiting bracket (9) and the rear limiting bracket (12) are rotatably connected to the chip body (1).

2. A field-effect transistor chip with uniform current distribution according to claim 1, characterized in that: Magnet blocks (6) are symmetrically installed on the lower side of the upper limit plate (3), and magnet holes (7) are attached to the outer side of the magnet blocks (6), and the magnet holes (7) are symmetrically opened inside the lower limit plate (4).

3. A field-effect transistor chip with uniform current distribution according to claim 1, characterized in that: A connecting block (10) is installed on the upper rear side of the front limiting bracket (9), and a connecting groove (11) is engaged on the outer side of the connecting block (10).

4. A field-effect transistor chip with uniform current distribution according to claim 3, characterized in that: The connecting groove (11) is located on the front side above the rear limiting bracket (12).

5. A field-effect transistor chip with uniform current distribution according to claim 1, characterized in that: A mounting plate (14) is provided on the lower right side of the chip body (1), and a fixing rod (15) is engaged with both the mounting plate (14) and the lower rear side interior of the chip body (1).

6. A field-effect transistor chip with uniform current distribution according to claim 5, characterized in that: The rear end of the fixing rod (15) is engaged with a fixing cap (18), and the front side of the fixing cap (18) is fixedly connected to the mounting plate (14).

7. A field-effect transistor chip with uniform current distribution according to claim 6, characterized in that: The front end of the fixing rod (15) is provided with a threaded body (16), and the outer side of the threaded body (16) is threadedly connected with a threaded cap (17), and the rear side of the threaded cap (17) is tightly fitted with the mounting plate (14).

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