Transfer robot

By setting up multiple load-bearing platforms and clamping components on the handling robot, the problem that existing technologies can only handle wafer cassettes has been solved, enabling the handling of multiple materials, improving production efficiency and reducing costs.

CN223798658UActive Publication Date: 2026-01-13SHENZHEN YOUIBOT ROBOTICS CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202423236073.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2026-01-13
Estimated Expiration
2034-12-24

AI Technical Summary

Technical Problem

Existing material handling robots' storage platforms can only hold wafer boxes and cannot simultaneously handle different materials, resulting in high production costs.

Method used

Design a material handling robot, comprising a robot body, a robotic arm, and a gripping mechanism. A first support platform is set up to support a wafer cassette, and a second support platform is set up to support a fixed frame. Different gripping components are equipped to grip the wafer cassette and the fixed frame to realize the handling of multiple materials.

Benefits of technology

Without increasing the number of robots, it can simultaneously handle wafer cassettes and fixed frames, improving production efficiency and reducing production costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223798658U_ABST
    Figure CN223798658U_ABST
Patent Text Reader

Abstract

The utility model relates to the technical field of robots, and discloses a transfer robot which comprises a robot body, a mechanical arm and a clamping mechanism, one end of the mechanical arm is connected with the robot body, and the other end of the mechanical arm is connected with the clamping mechanism; the robot body is provided with a first bearing platform and a second bearing platform, the first bearing platform is used for bearing a wafer box, and the second bearing platform is used for bearing a fixed frame; the clamping mechanism comprises a first clamping assembly and a second clamping assembly, the first clamping assembly is used for clamping the wafer box, and the second clamping assembly is used for clamping the fixed frame. The utility model aims to solve the technical problem that only a wafer box can be placed on a storage platform of a transfer robot and only can be transferred.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of robotics, and in particular to a material handling robot. Background Technology

[0002] In the wafer fabrication process, wafer cassettes serve as wafer carriers, holding multiple wafers and acting as placement and transport devices. Currently, the industry uses handling robots to grip and place wafer cassettes.

[0003] In practical applications, the storage platform of the handling robot can only hold wafer boxes, and the handling robot can only handle wafer boxes. If different materials need to be handled at the same time, the number of handling robots needs to be increased, resulting in higher production costs. Utility Model Content

[0004] The purpose of this utility model is to provide a handling robot to solve the technical problem that the storage platform of the handling robot can only hold wafer boxes, and the handling robot can only handle wafer boxes.

[0005] To achieve the above objectives, this utility model provides a handling robot, which includes: a robot body, a robotic arm, and a clamping mechanism, wherein one end of the robotic arm is connected to the robot body, and the other end of the robotic arm is connected to the clamping mechanism;

[0006] The robot body is provided with a first support platform and a second support platform. The first support platform is used to support the wafer cassette, and the second support platform is used to support the fixed frame.

[0007] The clamping mechanism includes a first clamping component and a second clamping component, wherein the first clamping component is used to clamp the wafer cassette and the second clamping component is used to clamp the fixing frame.

[0008] In the handling robot of this application, the robot body includes a main body and support parts respectively disposed on both sides of the main body, the robotic arm is connected to the main body, and the first bearing platform and the second bearing platform are disposed on the support parts.

[0009] In the handling robot of this application, in the vertical direction of the support part, the height of the first bearing platform is greater than the height of the second bearing platform and less than the height of the main body.

[0010] In the handling robot of this application, the first carrying platform is provided with a first limiting member, which is used to limit the wafer cassette;

[0011] The second bearing platform is provided with a second limiting member, which is used to restrict the fixed frame.

[0012] In the handling robot of this application, the fixed frame includes a frame body and a mounting part connected to the frame body. The frame body is provided with a receiving cavity for accommodating a wafer cassette, and the second clamping assembly is used to clamp the mounting part.

[0013] In the handling robot of this application, the mounting part is fixed to the top of the frame body.

[0014] In the handling robot of this application, the first gripping assembly includes two first grippers for gripping the wafer cassette, and the two first grippers are provided with a first pressure detection device for abutting against the wafer cassette.

[0015] In the handling robot of this application, the second gripping assembly includes two second grippers for gripping the mounting part, and the two second grippers are provided with a second pressure detection device for abutting the mounting part.

[0016] In the handling robot of this application, the handling robot also includes a monitoring device, which is disposed on the clamping mechanism.

[0017] In the handling robot of this application, the handling robot also includes a mobile chassis, which is disposed at the bottom of the robot body.

[0018] This utility model provides a handling robot, which has the following advantages:

[0019] This utility model discloses a handling robot by incorporating a first and a second support platform on its main body. The first support platform supports wafer cassettes, and the second support platform supports a fixed frame, which in turn holds the wafer cassettes. Without increasing the number of handling robots, this allows the robot to simultaneously handle different materials. When a wafer cassette needs to be handled, either the robotic arm can drive a first gripping assembly to clamp the cassette and place it on the first support platform, or the cassette can be loaded onto the fixed frame, and then the robotic arm can drive a second gripping assembly to clamp the fixed frame and place it on the second support platform. This utility model, by incorporating different support platforms and gripping assemblies on the robot body, enables the handling robot to simultaneously handle wafer cassettes and fixed frames, thereby improving production efficiency and reducing production costs. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of the handling robot provided in an embodiment of the present utility model;

[0022] Figure 2 Another structural schematic diagram of the handling robot provided in this embodiment of the utility model;

[0023] Figure 3 Another structural schematic diagram of the handling robot provided in this embodiment of the utility model;

[0024] Figure 4 Another structural schematic diagram of the handling robot provided in this embodiment of the utility model;

[0025] Figure 5 This is a schematic diagram of the clamping mechanism provided in an embodiment of the present utility model;

[0026] Figure 6 A schematic diagram of the structure of the fixed frame provided in the embodiment of this utility model;

[0027] Figure 7 Another structural schematic diagram of the clamping mechanism provided in this embodiment of the utility model;

[0028] Figure 8 Another structural schematic diagram of the clamping mechanism provided in an embodiment of this utility model.

[0029] The markings in the image are as follows:

[0030] 1. Robot body; 11. First support platform; 12. Second support platform; 13. Main body; 14. Support part; 15. First limiting component; 16. Second limiting component; 2. Robotic arm; 3. Gripping mechanism; 31. First gripping assembly; 311. First gripper; 32. Second gripping assembly; 321. Second gripper; 4. Wafer cassette; 5. Fixed frame; 51. Frame body; 52. Mounting part; 6. First pressure detection device; 7. Second pressure detection device; 8. Monitoring device; 9. Mobile chassis. Detailed Implementation

[0031] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit its scope.

[0032] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "inner", "outer" and other terms used in this utility model to indicate the orientation or positional relationship are based on the positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device and components referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0033] In the description of this utility model, it should be understood that the terms "first," "second," etc., are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0034] like Figures 1 to 5 As shown, this utility model embodiment provides a handling robot, which includes a robot body 1, a robotic arm 2, and a clamping mechanism 3. One end of the robotic arm 2 is connected to the robot body 1, and the other end of the robotic arm 2 is connected to the clamping mechanism 3. The robot body 1 is provided with a first bearing platform 11 and a second bearing platform 12. The first bearing platform 11 is used to bear a wafer cassette 4, and the second bearing platform 12 is used to bear a fixed frame 5. The clamping mechanism 3 includes a first clamping component 31 and a second clamping component 32. The first clamping component 31 is used to clamp the wafer cassette 4, and the second clamping component 32 is used to clamp the fixed frame 5.

[0035] In this embodiment, the robot body 1 is the main structure of the handling robot, integrating components such as a controller and sensors. The robot body 1 is provided with a first support platform 11 and a second support platform 12, the positions of which are not limited. The first support platform 11 is used to support the wafer cassette 4, and the second support platform 12 is used to support the fixing frame 5. The fixing frame 5 can also be used to load and fix the wafer cassette 4.

[0036] The clamping mechanism 3 includes a first clamping component 31 and a second clamping component 32. The clamping mechanism 3 is provided with a driving device inside to drive the first clamping component 31 and the second clamping component 32 to perform clamping. The driving device can be driven by a motor or a cylinder. This embodiment does not impose specific limitations.

[0037] Based on the above technical solution, this embodiment sets a first carrying platform 11 and a second carrying platform 12 on the robot body 1. The first carrying platform 11 is used to carry the wafer cassette 4, and the second carrying platform 12 is used to carry the fixed frame 5. The fixed frame 5 is used to load the wafer cassette 4. Without increasing the number of handling robots, this handling robot can simultaneously handle different materials. When it is necessary to handle the wafer cassette 4, the first clamping component 31 can be driven by the robotic arm 2 to clamp the wafer cassette 4 and place it on the first carrying platform 11, or the wafer cassette 4 can be loaded onto the fixed frame 5, and then the second clamping component 32 can be driven by the robotic arm 2 to clamp the fixed frame 5 and place it on the second carrying platform 12. This embodiment sets different carrying platforms and different clamping components on the robot body 1, enabling the handling robot to simultaneously handle the wafer cassette 4 and the fixed frame 5, thereby improving production efficiency and reducing production costs.

[0038] In one embodiment, such as Figures 1 to 4 As shown, the robot body 1 includes a main body 13 and support parts 14 respectively disposed on both sides of the main body 13. The robotic arm 2 is connected to the main body 13, and the first bearing platform 11 and the second bearing platform 12 are disposed on the support parts 14.

[0039] Specifically, the main body 13 is connected to the two sides of the support part 14. Each support part 14 is provided with a first bearing platform 11 and a second bearing platform 12. By making full use of the space of the robot body 1, the number of bearing platforms is increased, so that the robot can carry multiple different materials at one time, which improves the handling efficiency and shortens the handling cycle.

[0040] In one embodiment, such as Figures 1 to 4 As shown, in the vertical direction of the support part 14, the height of the first bearing platform 11 is greater than the height of the second bearing platform 12, but less than the height of the main body part 13.

[0041] Specifically, the height of the first support platform 11 and the second support platform 12 is less than the height of the main body 13. On the one hand, by limiting the height of the support platform, the problem of instability of the center of gravity of the wafer box 4 or the fixed frame 5 due to excessive platform height is avoided, preventing material tipping and ensuring the safety and stability of the handling operation. On the other hand, the different heights of the first support platform 11 and the second support platform 12 make the wafer box 4 and the fixed frame 5 misaligned. When the clamping mechanism 3 clamps the wafer box 4 (or the fixed frame 5), interference with the fixed frame 5 (or the wafer box 4) can be avoided.

[0042] In one embodiment, such as Figures 1 to 3 As shown, the first carrier platform 11 is provided with a first limiting member 15, which is used to limit the wafer box 4; the second carrier platform 12 is provided with a second limiting member 16, which is used to limit the fixed frame 5.

[0043] Specifically, a plurality of first limiting members 15 may be spaced apart on the first supporting platform 11. When the wafer cassette 4 is placed on the first supporting platform 11, the plurality of first limiting members 15 abut against the outer edge of the wafer cassette 4 to prevent the wafer cassette 4 from sliding, thereby enhancing the stability of the wafer cassette 4. A plurality of second limiting members 16 may be spaced apart on the second supporting platform 12. The plurality of second limiting members 16 abut against the outer edge of the fixed frame 5 to prevent the fixed frame 5 from sliding, thereby enhancing the stability of the fixed frame 5.

[0044] In this embodiment, the first limiting member 15 and the second limiting member 16 can be a snap-fit ​​structure with elastic buffering function.

[0045] In one embodiment, such as Figure 6 As shown, the fixed frame 5 includes a frame body 51 and a mounting part 52 that connects to the frame body 51. The frame body 51 is provided with a receiving cavity for accommodating the wafer cassette 4, and the second clamping assembly 32 is used to clamp the mounting part 52.

[0046] Specifically, the frame body 51 is the main structure of the fixed frame 5, and its shape and size match the shape and size of the wafer cassette 4. It forms an internal receiving cavity, allowing the wafer cassette 4 to be securely fixed inside the frame body 51 after being placed in the cavity, preventing damage due to shaking or collision during handling. The mounting part 52 is located on the outer edge of the frame body 51. The mounting part 52 can be a protruding lug, hook, or other structure that facilitates clamping and connection. During handling, the mounting part 52 is clamped by the second clamping assembly 32 to connect the clamping mechanism 3 to the fixed frame 5.

[0047] In one embodiment, such as Figure 6 As shown, the mounting part 52 is fixed to the top of the frame body 51.

[0048] Specifically, the mounting part 52 and the frame body 51 can be mechanically fixed by welding, riveting, or threaded connection, so that the mounting part 52 is firmly fixed to the top of the frame body 51. Choosing the fixing position of the mounting part 52 at the top of the frame body 51 makes it easier for the second clamping assembly 32 to dock and cooperate with the mounting part 52, improving the accuracy of handling operations.

[0049] In one embodiment, the mounting part 52 and the frame body 51 are integrally formed.

[0050] In one embodiment, such as Figure 7 As shown, the first clamping assembly 31 includes two first clamping jaws 311, which are used to clamp the wafer cassette 4. The two first clamping jaws 311 are provided with a first pressure detection device 6, which is used to abut against the wafer cassette 4.

[0051] Specifically, the two first grippers 311 are structurally symmetrical to facilitate gripping the opposite sides of the wafer cassette 4. A first pressure detection device 6 is provided on the surface of the first grippers 311 that contacts the wafer cassette 4. The first pressure detection device 6 monitors the clamping force applied to the wafer cassette 4 by the first grippers 311 in real time to ensure that the clamping force is not too large and will cause damage to the wafer cassette 4, nor too small and will cause the wafer cassette 4 to be unstable.

[0052] In this embodiment, the first pressure detection device 6 is a pressure sensor, such as a piezoresistive, capacitive, or piezoelectric sensor, which can convert pressure changes during the clamping process into electrical signal outputs. The control system then performs real-time monitoring and analysis based on the electrical signals.

[0053] In one embodiment, such as Figure 8 As shown, the second clamping assembly 32 includes two second clamping jaws 321, which are used to clamp the mounting part 52. The two second clamping jaws 321 are provided with a second pressure detection device 7, which is used to abut against the mounting part 52.

[0054] Specifically, the two second grippers 321 are structurally symmetrical to facilitate clamping the opposite sides of the mounting portion 52. A second pressure detection device 7 is provided on the side of the two second grippers 321 that abuts against the mounting portion 52. The second pressure detection device 7 monitors the clamping force applied to the mounting portion 52 by the second grippers 321 in real time to ensure that the clamping force is not too large and will cause damage to the fixing frame 5, nor too small and will cause the fixing frame 5 to be unstable.

[0055] In this embodiment, the second pressure detection device 7 is a pressure sensor, such as a piezoresistive, capacitive, or piezoelectric sensor, which can convert pressure changes during the clamping process into electrical signal outputs. The control system then performs real-time monitoring and analysis based on the electrical signals.

[0056] In one embodiment, such as Figure 1 As shown, the handling robot also includes a monitoring device 8, which is mounted on the clamping mechanism 3.

[0057] Specifically, the monitoring device 8 is used to monitor whether there is material in front of the clamping mechanism 3. The monitoring device 8 can be a camera, an infrared sensor, or other types of sensor, and its installation position should ensure that it can clearly capture images or signals of the area in front of the clamping mechanism 3.

[0058] In one embodiment, such as Figures 1 to 3 As shown, the transport robot also includes a mobile chassis 9, which is located at the bottom of the robot body 1.

[0059] Specifically, the mobile chassis 9 can be equipped with a positioning radar. The handling robot scans the surrounding environment using the positioning radar and can determine its own position in real time, autonomously plan the handling path, avoid collisions with obstacles, and achieve efficient and accurate handling tasks. The positioning radar is not affected by environmental factors such as light and smoke, and can work stably in various complex environments, enabling the handling robot to perform handling operations in various environments and greatly enhancing its environmental adaptability.

[0060] Among them, the mobile chassis 9 provides a stable mobile platform for the handling robot, ensuring that the handling robot can operate in various terrains and environments. Secondly, the mobile chassis 9 has load-bearing capacity and motion performance, enabling the robot to carry the robot body 1 and complete the handling task.

[0061] It should be understood that the term "and / or" as used in this specification and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, herein, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0062] The sequence numbers of the above-described embodiments of this utility model are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above descriptions are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A transport robot, characterized in that, include: The robot body, the robotic arm, and the gripping mechanism are provided. One end of the robotic arm is connected to the robot body, and the other end of the robotic arm is connected to the gripping mechanism. The robot body is provided with a first support platform and a second support platform. The first support platform is used to support the wafer cassette, and the second support platform is used to support the fixed frame. The clamping mechanism includes a first clamping component and a second clamping component, wherein the first clamping component is used to clamp the wafer cassette and the second clamping component is used to clamp the fixing frame.

2. The handling robot according to claim 1, characterized in that, The robot body includes a main body and support parts respectively disposed on both sides of the main body. The robotic arm is connected to the main body, and the first bearing platform and the second bearing platform are disposed on the support parts.

3. The handling robot according to claim 2, characterized in that, In the vertical direction of the support, the height of the first bearing platform is greater than the height of the second bearing platform, but less than the height of the main body.

4. The handling robot according to claim 1, characterized in that, The first carrier platform is provided with a first limiting member, which is used to limit the wafer cassette; The second bearing platform is provided with a second limiting member, which is used to restrict the fixed frame.

5. The handling robot according to claim 1, characterized in that, The fixed frame includes a frame body and a mounting part connected to the frame body. The frame body is provided with a receiving cavity for accommodating a wafer cassette, and the second clamping assembly is used to clamp the mounting part.

6. The handling robot according to claim 5, characterized in that, The mounting part is fixed to the top of the frame body.

7. The handling robot according to claim 1, characterized in that, The first clamping assembly includes two first jaws for clamping the wafer cassette, and the two first jaws are provided with a first pressure detection device for abutting against the wafer cassette.

8. The handling robot according to claim 5, characterized in that, The second clamping assembly includes two second jaws for clamping the mounting portion, and the two second jaws are provided with a second pressure detection device for abutting against the mounting portion.

9. The handling robot according to claim 1, characterized in that, The transport robot also includes a monitoring device, which is mounted on the clamping mechanism.

10. The handling robot according to any one of claims 1 to 9, characterized in that, The transport robot also includes a mobile chassis, which is located at the bottom of the robot body.