Uniform coating device for semiconductor packaging elargol

Abstract

The utility model provides a semiconductor packaging elargol uniform coating device which comprises a workbench, two lifting frames are connected to the two sides of the top end of the workbench in a sliding mode, a top frame is fixedly installed on the inner walls of the top ends of the two lifting frames, a plurality of adhesive storage pipes are connected to the inner side wall of the top frame in a sliding mode, and sealing pistons are connected to the inner side walls of the adhesive storage pipes in a sliding mode. The silver adhesive feeding device has the advantages that the adhesive storage pipe can be used for storage transition of silver adhesive, so that in the pumping process of the sealing piston, the silver adhesive can be conveyed into the adhesive storage pipe from the feeding pipe and then output to the bottom of the pressing plate from the output pipe to be output outwards; and the outer cover slides downwards along with the sealing piston under the action of the connecting rod and is in contact with the top of the semiconductor, and the part between the pressing plate and the outer cover can be filled with the silver colloid under the action of the pressing plate on the inner wall of the outer cover, so that the uniform coating of the semiconductor packaging silver colloid can be improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to silver glue uniform coating technical field, concretely relates to a semiconductor package silver glue uniform coating device. BACKGROUND

[0002] Semiconductor package conductive silver glue (conductive glue) is a kind of special material for the packaging of semiconductor devices, it is mainly used to connect the electrical signal and power transmission between semiconductor chip and packaging substrate, and heat dissipation, and the current silver glue uniform coating mainly exists the following consensus defects:

[0003] In the traditional semiconductor package silver glue uniform coating operation, since the traditional coating mode is through the round pipe to the semiconductor glue drop, it will cause the middle part of semiconductor glue more and the surrounding part of glue less, in turn, cause the non-uniformity of overall coating operation. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a semiconductor package silver glue uniform coating device, to solve the problem of the non-uniformity of overall coating operation caused by the traditional coating mode being through the round pipe to the semiconductor glue drop, in turn, cause the middle part of semiconductor glue more and the surrounding part of glue less.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A semiconductor package silver glue uniform coating device, including workbench, the top end both sides of workbench are connected with two lifting frames slidingly, the top end inner wall of two lifting frames is fixedly installed with top frame, the inboard wall of top frame is connected with a plurality of glue storage pipes slidingly, the inboard wall of a plurality of glue storage pipes is connected with sealing piston slidingly, the top end of sealing piston is fixedly installed with electric telescopic handle, the fixed end of electric telescopic handle is fixedly connected with the top end inner wall of glue storage pipe, the bottom of glue storage pipe is connected with first check valve pipe, the bottom of first check valve pipe is connected with output pipe, the bottom outside of output pipe is fixedly installed with pressing plate, the outside of pressing plate is equipped with outer cover, one side of outer cover is fixedly installed with connecting rod, the top end of connecting rod is fixedly connected with the bottom of sealing piston, the bottom of glue storage pipe is also connected with second check valve pipe, one end of second check valve pipe is connected with feeding pipe.

[0007] As a preferred embodiment of the utility model, the both sides of glue storage pipe are screw-connected with fixed block, and one end of fixed block is fixedly installed with limit spring.

[0008] As a preferred embodiment of the utility model, the outside of top frame is connected with fixed strip slidingly, one side of fixed strip is fixedly installed with insertion rod, and the outside of insertion rod is connected with the inboard wall of top frame slidingly, and the outside of glue storage pipe is provided with insertion hole.

[0009] As a preferred of the utility model, the bottom end of the lifting frame is fixedly installed with two electric hydraulic rods, and the fixed ends of the two electric hydraulic rods are fixedly connected with the inner side wall of the workbench.

[0010] As a preferred of the utility model, the inner side wall of the workbench is rotationally connected with a conveying wheel, and the outer side of the conveying wheel is sleeved with a conveying belt.

[0011] As a preferred of the utility model, one side of the workbench is fixedly installed with a driving motor, and the output end of the driving motor is fixedly connected with one end of the conveying wheel.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] 1) the glue storage pipes are arranged to store and transition silver glue, so that the silver glue can be conveyed from the feeding pipe to the inside of the glue storage pipe, and then output from the output pipe to the bottom of the pressing plate for external output, the outer cover is driven to slide downward by the connecting rod to contact the top of the semiconductor, and the pressing plate is arranged in the inner wall of the outer cover, so that the silver glue can be filled between the pressing plate and the outer cover, thereby improving the uniform coating of the silver glue on the semiconductor packaging.

[0014] 2) the limiting springs are arranged to act on the two glue storage pipes, so that the plurality of glue storage pipes can slide on the top frame according to the required number, and are uniformly distributed to simultaneously perform the silver glue coating operation on the semiconductor packaging, and the electric hydraulic rod is arranged to drive the lifting frame to lift, so that the position of the semiconductor can be adjusted, and the lifting operation before and after the coating is separated from and contacted with the semiconductor. BRIEF DESCRIPTION OF DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute a limitation on the utility model. In the drawings:

[0016] Figure 1 It is the overall structure schematic view of the utility model;

[0017] Figure 2 It is the fixed strip structure schematic view of the utility model;

[0018] Figure 3 It is the internal structure schematic view of the top frame of the utility model;

[0019] Figure 4 It is the outer cover structure schematic view of the utility model;

[0020] Figure 5The utility model discloses an inside structure schematic view of the glue storage pipe.

[0021] In the drawing: 1, workbench;2, lifting frame;21, electric hydraulic rod;3, top frame;31, fixed strip;32, plug-in rod;4, glue storage pipe;41, sealing piston;42, electric telescopic rod;43, insertion hole;5, first check valve pipe;51, output pipe;52, pressing plate;53, outer cover;54, connecting rod;6, second check valve pipe;61, feeding pipe;7, fixed block;71, limit spring;8, conveying wheel;81, conveying belt;82, drive motor. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skilled in the art without creative work belong to the protection scope of the utility model.

[0023] Please refer to Figures 1-5 The utility model provides the following technical scheme: a semiconductor packaging silver glue uniform coating device, including workbench 1, the top both sides of workbench 1 are slidably connected with two lifting frames 2, and the top inner wall of two lifting frames 2 is fixedly installed with top frame 3, and the inner side wall of top frame 3 is slidably connected with a plurality of glue storage pipes 4, and the inner side wall of a plurality of glue storage pipes 4 is slidably connected with sealing piston 41, and the top of sealing piston 41 is fixedly installed with electric telescopic rod 42, and the fixed end of electric telescopic rod 42 is fixedly connected with the top inner wall of glue storage pipe 4, and the bottom of glue storage pipe 4 is connected with first check valve pipe 5, and the bottom of first check valve pipe 5 is connected with output pipe 51, and the bottom outside of output pipe 51 is fixedly installed with pressing plate 52, and the outside of pressing plate 52 is equipped with outer cover 53, and the side of outer cover 53 is fixedly installed with connecting rod 54, and the top of connecting rod 54 is fixedly connected with the bottom of sealing piston 41, and the bottom of glue storage pipe 4 is also connected with second check valve pipe 6, and one end of second check valve pipe 6 is connected with feeding pipe 61.

[0024] In specific use, when the silver glue is applied to the semiconductor, the number of the glue storage pipes 4 inside the top frame 3 can be increased or decreased according to the number of the semiconductor to be coated, and the glue storage pipes 4 are evenly distributed on the top frame 3. When the coating operation is performed, the sealing piston 41 is driven by the electric telescopic rod 42 to slide up and down inside the glue storage pipe 4. When the sealing piston 41 slides upward, the silver glue is extracted into the glue storage pipe 4 through the filling pipe 61 and the second one-way valve pipe 6. When the sealing piston 41 slides downward, the silver glue is output downward through the first one-way valve pipe 5 and is delivered to the lower position of the pressing plate 52 through the output pipe 51 to contact the semiconductor. Since the outer cover 53 is in contact with the semiconductor at this time by the driving of the connecting rod 54, the silver glue can be filled between the outer cover 53 and the pressing plate 52 and can be evenly distributed on the semiconductor. When the sealing piston 41 moves upward, the outer cover 53 is driven upward by the connecting rod 54, so that the pressing plate 52 slides relative to the outer cover 53, and the silver glue on the inner wall of the outer cover 53 is scraped to the semiconductor position, thereby achieving the uniform coating effect of the silver glue on the surface of the semiconductor.

[0025] Preferably, the two sides of the glue storage pipe 4 are threadedly connected with fixing blocks 7, and one end of each fixing block 7 is fixedly installed with a limiting spring 71.

[0026] In specific use, when the number of the glue storage pipes 4 needs to be increased or decreased to follow the number of the semiconductor to be packaged, the silver glue pipes can be evenly distributed inside the top frame 3 after the number adjustment by the limiting spring 71 between the two fixing blocks 7 and the glue storage pipe 4.

[0027] Preferably, the outer side of the top frame 3 is slidably connected with a fixing strip 31, one side of the fixing strip 31 is fixedly installed with a plug rod 32, the outer side of the plug rod 32 is slidably connected with the inner side wall of the top frame 3, and the outer side of the glue storage pipe 4 is provided with a plug hole 43.

[0028] In specific use, after the glue storage pipes 4 are evenly distributed inside the top frame 3 by the limiting spring 71, the plug rod 32 can be connected with the plug hole 43 on the glue storage pipe 4 by the sliding of the plug rod 32 into the top frame 3 driven by the fixing strip 31, so that the evenly distributed glue storage pipes 4 can be fixed.

[0029] Preferably, the bottom end of the lifting frame 2 is fixedly installed with two electric hydraulic rods 21, and the fixed ends of the two electric hydraulic rods 21 are fixedly connected with the inner side wall of the workbench 1.

[0030] In specific use, the electric hydraulic rod 21 drives the lifting frame 2 to lift, so that the glue storage pipes 4 on the top frame 3 can be lifted, and the semiconductor can be continuously coated with the silver glue by the lifting operation.

[0031] Preferably, the inner side wall of the workbench 1 is rotationally connected with a conveying wheel 8, and the outer side of the conveying wheel 8 is sleeved with a conveying belt 81.

[0032] In specific use, the semiconductor can be continuously conveyed by the conveying belt 81 driven by the conveying wheel 8 on the workbench 1, and then the semiconductor can be continuously coated with silver glue by the glue storage pipe 4.

[0033] Preferably, one side of the workbench 1 is fixedly installed with a driving motor 82, and the output end of the driving motor 82 is fixedly connected with one end of the conveying wheel 8.

[0034] In specific use, the rotation of the conveying wheel 8 can be driven by the driving motor 82.

[0035] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the foregoing embodiments of the present application are described in detail, for the skilled in the art, it still can be modified for the technical solutions recorded in the foregoing embodiments, or for equivalent replacement of some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor encapsulation silver glue uniform coating device, comprising a workbench (1), characterized in that, The top end of the workbench (1) is slidably connected with two lifting frames (2), the top end inner wall of the two lifting frames (2) is fixedly installed with a top frame (3), the inner side wall of the top frame (3) is slidably connected with a plurality of glue storage pipes (4), the inner side wall of the plurality of glue storage pipes (4) is slidably connected with a sealing piston (41), the top end of the sealing piston (41) is fixedly installed with an electric telescopic rod (42), the fixed end of the electric telescopic rod (42) is fixedly connected with the top end inner wall of the glue storage pipe (4), the bottom end of the glue storage pipe (4) is communicated with a first one-way valve pipe (5), the bottom end of the first one-way valve pipe (5) is communicated with an output pipe (51), the bottom end outer side of the output pipe (51) is fixedly installed with a pressing plate (52), the outer side of the pressing plate (52) is sleeved with an outer cover (53), one side of the outer cover (53) is fixedly installed with a connecting rod (54), the top end of the connecting rod (54) is fixedly connected with the bottom end of the sealing piston (41), the bottom end of the glue storage pipe (4) is also communicated with a second one-way valve pipe (6), one end of the second one-way valve pipe (6) is communicated with a feeding pipe (61).

2. The device according to claim 1, wherein the device is characterized by: The two sides of the glue storage pipe (4) are threadedly connected with fixed blocks (7), one end of the fixed block (7) is fixedly installed with a limiting spring (71).

3. The device according to claim 1, wherein the device is characterized by: The outer side of the top frame (3) is slidably connected with a fixed strip (31), one side of the fixed strip (31) is fixedly installed with a plug rod (32), the outer side of the plug rod (32) is slidably connected with the inner side wall of the top frame (3), and the outer side of the glue storage pipe (4) is provided with a plug hole (43).

4. The device according to claim 1, wherein the device is characterized by: The bottom end of the lifting frame (2) is fixedly installed with two electric hydraulic rods (21), and the fixed ends of the two electric hydraulic rods (21) are fixedly connected with the inner side wall of the workbench (1).

5. The device according to claim 1, wherein the device is characterized by: The inner side wall of the workbench (1) is rotatably connected with a conveying wheel (8), and the outer side of the conveying wheel (8) is sleeved with a conveying belt (81).

6. The device according to claim 5, wherein the device is characterized by: One side of the workbench (1) is fixedly installed with a driving motor (82), and one end of the conveying wheel (8) is fixedly connected with the output end of the driving motor (82).

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