Laser micro-hole machining equipment and laser micro-hole machining system

Abstract

The utility model relates to the technical field of laser drilling equipment, discloses laser micro-hole machining equipment and a laser micro-hole machining system, and aims to solve the problem that the efficiency of a single PCB in the laser micro-hole machining process is low. The laser micropore machining equipment comprises a base, and a laser generator, a light path assembly and a lens assembly are sequentially arranged on the base in the light path direction. The laser micropore machining equipment further comprises a carrying platform arranged on the base, and the carrying platform is provided with a machining area used for positioning and supporting a preset plate. Wherein the lens assembly comprises a main lens and an auxiliary lens, the main lens and the auxiliary lens are sequentially distributed in the first horizontal direction, and the main lens and the auxiliary lens are arranged corresponding to the same machining area and used for machining the same preset plate in the machining area. The same preset plate in the same machining area is machined through the main lens and the auxiliary lens, and therefore the micropore machining speed and machining efficiency of the single preset plate are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of laser drilling equipment, in particular to a laser micro-hole machining device and a laser micro-hole machining system. BACKGROUND

[0002] With the rapid development of microelectronic technology, PCB (Printed Circuit Board) boards develop towards high integration and high density, so that the aperture requirement is smaller and smaller, the number of holes is more and more, and the process requirement is higher and higher.

[0003] In the processing and production process of the PCB board, the laser micro-hole machining device takes a long time to process micro-holes on the PCB board, and the smaller the micro-holes and the more the number of micro-holes, the longer the micro-hole processing time is under the condition of drilling a same PCB board. In order to improve the production and processing efficiency of the PCB board, it is more and more important to improve the processing speed and efficiency of the laser micro-hole machining device on the PCB board. CONTENT OF THE INVENTION

[0004] The application aims to provide a laser micro-hole machining device and a laser micro-hole machining system, and aims to solve the problem of low efficiency of a single PCB board in the laser micro-hole machining process.

[0005] To achieve the above-mentioned purpose, the application adopts the following technical scheme:

[0006] On the one hand, some embodiments of the application provide a laser micro-hole machining device, which comprises a base, and the base is sequentially provided with a laser generator, an optical path assembly and a lens assembly along an optical path direction. The laser micro-hole machining device further comprises a loading platform arranged on the base, and the loading platform is provided with a processing area for positioning and supporting a preset board. The lens assembly comprises a main lens and a sub-lens, the main lens and the sub-lens are sequentially distributed along a first horizontal direction, and the main lens and the sub-lens are arranged corresponding to a same processing area for processing a same preset board of the processing area.

[0007] Beneficial effects: the laser micro-hole machining device generates a laser beam through the laser generator, and transmits the laser beam to the main lens and the sub-lens of the lens assembly through a plurality of optical devices in the optical path assembly, so that the light beams emitted by the main lens and the sub-lens meet the micro-hole laser requirements. The preset board is positioned and installed in the processing area of the loading platform, so that the main lens and the sub-lens can be arranged corresponding to the same processing area, and the preset board loaded in the processing area can be quickly processed. That is, one preset board is arranged in one processing area, so that the main lens and the sub-lens can quickly process the same preset board of the processing area. The micro-hole processing speed and efficiency of a single preset board are greatly improved.

[0008] Taking the first horizontal direction as a left-right direction and the main lens being located at the left side of the sub-lens as an example, if the preset plate is equally divided into left and right parts, and the number of micropores in the left half and the right half of the preset plate is the same and symmetrically distributed. At this time, the main lens and the sub-lens can be used to synchronously process the micropores in the left half and the right half of the preset plate. In this way, compared with processing the micropores of the preset plate by a single lens, the processing speed and efficiency of a single preset plate can be doubled at most.

[0009] In some embodiments, the lens assembly comprises a first driving member, at least one of the main lens and the sub-lens is connected with the first driving member, and the first driving member is used to adjust the interval size between the main lens and the sub-lens along the first horizontal direction.

[0010] In some embodiments, the lens assembly further comprises a second driving member. One second driving member is connected with the main lens and is used to adjust the height size of the main lens along the vertical direction. One second driving member is connected with the sub-lens and is used to adjust the height size of the sub-lens along the vertical direction.

[0011] In some embodiments, the number of main lenses is at least two, and the number of sub-lenses and the number of processing areas are the same as the number of main lenses. The main lens, the sub-lens and the processing area are one-to-one correspondingly arranged, and one main lens and one sub-lens corresponding to each other are sequentially arranged along the first horizontal direction.

[0012] In some embodiments, one object platform is provided with at least two processing areas, and the at least two processing areas are arranged at intervals along the first horizontal direction.

[0013] Alternatively, the number of object platforms is at least two, each object platform is provided with one processing area, and the at least two object platforms are arranged at intervals along the first horizontal direction.

[0014] In some embodiments, the object platform is arranged between the base and the main lens along the vertical direction. The laser micropore processing device further comprises a platform driving assembly, and the platform driving assembly comprises a transverse driving member and a longitudinal driving member. The transverse driving member is connected with the object platform and the base and is used to adjust the position state of the object platform along the first horizontal direction. The longitudinal driving member is arranged between the base and the object platform and is used to adjust the position state of the object platform along the second horizontal direction. Wherein, the first horizontal direction, the second horizontal direction and the vertical direction are arranged perpendicular to each other.

[0015] In some embodiments, the lens assembly comprises a thickness detection member, which is connected with the main lens or the sub-lens and is used to detect the thickness size of the preset plate along the vertical direction.

[0016] In some embodiments, the lens assembly comprises a power detection meter configured to be arranged to move along the first horizontal direction for detecting the light output power of the primary lens and the secondary lens.

[0017] In another aspect, some embodiments of the present application provide a laser micro-hole processing system comprising a feeding device, a discharging device, and the laser micro-hole processing device in the above aspect. The feeding device is configured to provide the preset plate to the processing area. The discharging device is configured to recycle the preset plate in the processing area.

[0018] Beneficial effects: since the laser micro-hole processing system comprises the laser micro-hole processing device in the above aspect, the laser micro-hole processing system has all the beneficial effects of the laser micro-hole processing device, which will not be repeated here.

[0019] In some embodiments, the number of primary lenses is at least two, and the number of secondary lenses and the number of processing areas is the same as the number of primary lenses. The primary lens, the secondary lens, and the processing area are arranged one by one, and the corresponding one primary lens and one secondary lens are distributed along the first horizontal direction in sequence.

[0020] The feeding device is provided with at least two first mechanical arms, and the at least two first mechanical arms are configured to synchronously provide the preset plate to the at least two processing areas.

[0021] The discharging device is provided with at least two second mechanical arms and a turnover mechanical arm, the at least two second mechanical arms are configured to synchronously recycle the preset plate in the at least two processing areas, and the turnover mechanical arm is configured to turn over the double-sided processed preset plate. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0023] Figure 1 A perspective structural schematic diagram of a laser micro-hole processing system according to an embodiment of the present application is shown in the figure;

[0024] Figure 2 A perspective structural schematic diagram of a laser micro-hole processing device according to an embodiment of the present application is shown in the figure; Figure 1 A perspective structural schematic diagram of a laser micro-hole processing device according to an embodiment of the present application is shown in the figure;

[0025] Figure 3 A perspective structural schematic diagram of a laser micro-hole processing device according to an embodiment of the present application is shown in the figure; Figure 1 A perspective structural schematic diagram of a laser micro-hole processing device according to an embodiment of the present application is shown in the figure;

[0026] Figure 4 A perspective structural schematic diagram of a laser micro-hole processing device according to an embodiment of the present application is shown in the figure; Figure 3A bottom structure diagram of the carrier platform shown in FIG. 1;

[0027] Figure 5 A bottom structure diagram of the carrier platform shown in FIG. 1; Figure 3 A partial enlarged diagram at A in FIG. 1;

[0028] Figure 6 A bottom structure diagram of the carrier platform shown in FIG. 1; Figure 3 A partial enlarged diagram at B in FIG. 1;

[0029] Figure 7 A bottom structure diagram of the carrier platform shown in FIG. 1; Figure 1 A perspective structure diagram of the feeding device shown in FIG. 2;

[0030] Figure 8 A perspective structure diagram of the feeding device shown in FIG. 2; Figure 1 A perspective structure diagram of the feeding device shown in FIG. 2.

[0031] Reference signs:

[0032] 1000, a laser micro-hole processing system;

[0033] 100, a laser micro-hole processing device;

[0034] 10, a base; 20, a laser generator; 30, an optical path assembly; 40, a lens assembly; 41, a main lens; 42, a sub-lens; 43, a first driving member; 44, a second driving member; 45, a thickness detecting member; 46, a power detector; 47, a dust cover; 50, a carrier platform; 51, a processing area; 60, a platform driving assembly; 61, a transverse driving member; 611, a transverse sliding rail; 612, a transverse driving part; 62, a longitudinal driving member; 621, a longitudinal sliding rail; 622, a longitudinal driving part; 70, a crossbeam; 80, a supporting block;

[0035] 200, a feeding device; 201, a first mechanical arm; 202, a first hopper member;

[0036] 300, a discharging device; 301, a second mechanical arm; 302, a turnover mechanical arm; 303, a second hopper member. DETAILED DESCRIPTION

[0037] In order to make the above objectives, features and advantages of the present application more apparent and comprehensible, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the spirit of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0038] In the description of the present application, it should be understood that, if there are terms of "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0039] In addition, if there are terms of "first", "second", these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can be explicitly or implicitly included at least one feature. In the description of the present application, if there are terms of "a plurality of", the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0040] In the present application, unless otherwise explicitly specified and limited, if there are terms of "mounting", "connection", "connection", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If there is, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for the purpose of illustration, and do not represent the only implementation.

[0042] As Figure 1As shown, the present application provides a laser micro-hole processing system 1000, which comprises a laser micro-hole processing device 100, a feeding device 200 and a discharging device 300. The laser micro-hole processing device 100 is used to process a plurality of micro-holes on a preset board (such as a PCB board) by a laser beam. The feeding device 200 is used to provide the preset board to the laser micro-hole processing device 100. The discharging device 300 is used to recycle the preset board processed by the laser micro-hole processing device 100.

[0043] In order to solve the problem of low efficiency of single PCB board (i.e. preset board) in the process of laser micro-hole processing.

[0044] As shown in Figure 2 and Figure 3 The laser micro-hole processing device 100 comprises a base 10, which is sequentially provided with a laser generator 20, an optical path assembly 30 and a lens assembly 40 along the optical path direction. The laser micro-hole processing device 100 further comprises a carrying platform 50 provided on the base 10, which is provided with a processing area 51 for positioning and supporting the preset board. The lens assembly 40 comprises a main lens 41 and a sub-lens 42, which are sequentially distributed along a first horizontal direction (such as X direction) and correspond to the same processing area 51 for processing the same preset board. Figure 2

[0045] In the embodiment of the present application, the laser micro-hole processing device 100 generates a laser beam by the laser generator 20, and transmits the laser beam to the main lens 41 and the sub-lens 42 of the lens assembly 40 through a plurality of optical devices (such as a beam splitter, a mirror and a diaphragm) in the optical path assembly 30, so that the beams emitted by the main lens 41 and the sub-lens 42 meet the micro-hole laser requirements. The preset board is positioned and installed on the processing area 51 of the carrying platform 50, so that the main lens 41 and the sub-lens 42 can be arranged corresponding to the same processing area 51 and quickly process the preset board loaded on the processing area. That is, one preset board is arranged on one processing area 51, so that the main lens 41 and the sub-lens 42 can quickly process the same preset board on the processing area 51. Thus, the micro-hole processing speed and efficiency of single preset board are greatly improved.

[0046] ​Taking a horizontal direction as left-right, with the main lens 41 located to the left of the secondary lens 42 as an example. If the preset material is divided into two equal parts, left and right, and the number of micropores in the left and right halves of the preset material is the same and symmetrically distributed, then the main lens 41 and the secondary lens 42 can simultaneously process the micropores in the left and right halves of the preset material. Thus, compared to processing the micropores of the preset material using a single lens, the processing speed and efficiency of a single preset material can be increased by up to 100%.

[0047] In some embodiments, such as Figure 3 As shown, there are at least two main lenses 41, and the number of secondary lenses 42 and processing areas 51 is the same as the number of main lenses 41. That is, the main lenses 41, secondary lenses 42, and processing areas 51 are arranged in a one-to-one correspondence, so that one main lens 41 and one secondary lens 42 can process the preset material in the same processing area 51. Moreover, the corresponding main lens 41 and secondary lens 42 are arranged sequentially along the X direction.

[0048] Taking an example where there are two main lenses 41, and two secondary lenses 42 and two processing areas 51, one main lens 41 and one secondary lens 42 are set up to form a processing group. The two processing groups can be set apart along the X direction, and the two processing areas 51 are set up with the two processing groups and distributed at intervals along the X direction, so that each processing group can quickly process a preset board material in each processing area 51.

[0049] It should be noted that the processing group, including a main lens 41 and a secondary lens 42, is set up in a one-to-one correspondence with the processing area 51 and the preset board. That is, one preset board is positioned and installed in one processing area 51, and the corresponding processing group is used to process the preset board in the processing area 51, thereby increasing the processing speed and efficiency of a single preset board by up to 100%.

[0050] Based on this, if the number of processing groups is increased so that the laser micro-hole processing equipment 100 can process multiple preset plates in multiple processing areas 51 simultaneously through multiple processing groups, then each additional processing group will double the overall processing speed and efficiency of the laser micro-hole processing equipment 100.

[0051] Wherein, through the above scheme, if the number of main lens 41 and auxiliary lens 42 is two, the processing speed and efficiency of the preset plate can be maximally improved by three times. If the number of main lens 41 and auxiliary lens 42 is three, the processing speed and efficiency of the preset plate can be maximally improved by five times, and so on. In this way, in the laser micro-hole processing system 1000, through the setting of the feeding device 200 and the discharging device 300, the preset plate processed at the processing area 51 in the laser micro-hole processing device 100 can be automatically fed and discharged. That is, the feeding device 200 can provide the preset plate to the processing area 51, and the discharging device 300 can recycle the preset plate at the processing area 51. In order to improve the production efficiency and reduce the labor cost by continuous operation and less interval waiting time (i.e. feeding and discharging time).

[0052] For example, in the laser micro-hole processing device 100, a plurality of processing groups including one main lens 41 and one auxiliary lens 42 are arranged at intervals along the X direction (i.e. left-right direction). Based on this, the feeding device 200 and the discharging device 300 can be arranged on the left and right sides of the laser micro-hole processing device 100, so as to facilitate the rapid feeding and discharging of the preset plate.

[0053] In some embodiments, as shown in Figure 3 The number of the carrier platform 50 can be one, and the one carrier platform 50 is provided with at least two processing areas 51, and the at least two processing areas 51 are arranged at intervals along the X direction. In this way, the corresponding at least two main lenses 41 are also arranged at intervals along the X direction, that is, the at least two processing groups are arranged at intervals along the X direction. So that the plurality of processing groups can rapidly process the preset plate at the plurality of processing areas 51 on the same carrier platform 50, so as to improve the processing speed and efficiency of the whole machine device. The structure is simple and is conducive to improving the stability of the whole device.

[0054] Alternatively, the number of the carrier platform 50 can also be at least two, and each carrier platform 50 is provided with one processing area 51, and the at least two carrier platforms 50 are arranged at intervals along the X direction. So that the processing area 51 on each carrier platform 50 is positioned and installed with one preset plate, and the plurality of processing groups can rapidly process the preset plate on the plurality of carrier platforms 50, also improving the processing speed and efficiency of the whole machine device. Facilitating flexible processing of a plurality of preset plates.

[0055] Wherein, the plurality of processing areas 51 or the plurality of carrier platforms 50 can also be arranged at intervals along a second straight line direction, and only the processing groups need to be adjusted to be arranged at intervals along the second horizontal direction, so that the plurality of processing groups are arranged one by one corresponding to the plurality of processing areas 51. Wherein, the second horizontal direction is perpendicular to the first horizontal direction, such as the front-back direction.

[0056] Wherein, as shown in Figure 3As shown, along the Z direction, the object platform 50 is arranged between the base 10 and the main lens 41 (or the auxiliary lens 42), and the object platform 50 is connected to the base 10.

[0057] Based on this, the object platform 50 arranged on the base 10 can be a fixed component, that is, the object platform 50 is fixedly installed on the upper side of the base 10. In this way, when processing the preset plate, the position of the laser beam focus point can be adjusted by moving the main lens 41 and the auxiliary lens 42 in combination with the galvanometer component, so as to process different positions of the preset plate.

[0058] Alternatively, the object platform 50 can also be a movable component. For example, Figure 4 As shown, the laser micro-hole processing equipment 100 further comprises a platform driving assembly 60, which comprises a transverse driving member 61 and a longitudinal driving member 62. The transverse driving member 61 is connected to the object platform 50 and the base 10 (as shown in Figure 3 The longitudinal driving member 62 is arranged between the base 10 and the object platform 50, and is used to adjust the position state of the object platform 50 along the Y direction (i.e. the second horizontal direction).

[0059] Among them, the first horizontal direction, the second horizontal direction and the vertical direction are arranged perpendicular to each other. For example, the first horizontal direction, the second horizontal direction and the vertical direction are all straight directions. For example, the object platform 50 is located below the side of the lens assembly 40 along the Z direction, and Figure 3 For example, the lens assembly 40 is located at the front side of the laser micro-hole processing equipment 100 along the Y direction.

[0060] Through the arrangement of the transverse driving member 61 and the longitudinal driving member 62, the object platform 50 can be flexibly and accurately moved in the left-right direction and the front-rear direction, so that the main lens 41 and the auxiliary lens 42 can quickly and accurately process the preset plate below.

[0061] For example, along the vertical direction, the object platform 50 is sequentially provided with the longitudinal driving member 62 and the transverse driving member 61 from top to bottom.

[0062] As shown in Figure 4 The longitudinal driving member 62 comprises a plurality of longitudinal sliding rails 621 arranged at intervals along the X direction. The bottom of the object platform 50 is slidably connected to the longitudinal sliding rails 621, so that the object platform 50 can slide along the length direction of the longitudinal sliding rails 621. The longitudinal driving member 62 further comprises a longitudinal driving part 622 such as a linear motor or an electric cylinder, which is connected between the object platform 50 and the longitudinal sliding rails 621, so as to flexibly and accurately control the front-rear sliding of the object platform 50 along the Y direction.

[0063] As shown in Figure 4As shown, the transverse driving member 61 comprises a plurality of transverse sliding rails 611 arranged at intervals along the Y direction. The bottoms of the plurality of longitudinal sliding rails 621 are in sliding connection with the transverse sliding rails 611, and the transverse sliding rails 611 are arranged in connection with the base 10, so that the object carrying platform 50 and the longitudinal driving member 62 can slide left and right along the length direction of the transverse sliding rails 611. The transverse driving member 61 further comprises a transverse driving part 612 such as a linear motor or an electric cylinder, and the transverse driving part 612 is connected between the longitudinal sliding rails 621 and the transverse sliding rails 611 or between the longitudinal sliding rails 621 and the base 10, so as to flexibly and accurately control the object carrying platform 50 to slide left and right along the X direction.

[0064] In the machining group, the main lens 41 is located on the left side of the auxiliary lens 42, i.e., the positioning reference of the preset plate is set as the left side edge and the front side edge of the rectangular structure of the machining area.

[0065] If the base 10 is provided with one object carrying platform 50, and the object carrying platform 50 is provided with a plurality of machining areas 51. That is, the platform driving assembly 60 drives the object carrying platform 50 to move in the front-rear and left-right directions, so that the plurality of machining groups can simultaneously machine different areas of the plurality of preset plates, thereby improving the machining speed and efficiency of the whole machine.

[0066] If the base 10 is provided with a plurality of object carrying platforms 50, and each object carrying platform 50 is provided with one machining area 51. The platform driving assembly 60 below the object carrying platform 50 can control the plurality of object carrying platforms 50 to move synchronously in the front-rear and left-right directions, so that the plurality of machining areas 51 move synchronously. Thus, the plurality of machining groups can simultaneously machine different areas of the plurality of preset plates, thereby improving the machining speed and efficiency of the whole machine.

[0067] Alternatively, the platform driving assembly 60 can also drive the plurality of object carrying platforms 50 individually, so that the plurality of machining areas move asynchronously in the front-rear and left-right directions. In this way, the plurality of machining groups can machine different types of preset plates respectively, which has good flexibility.

[0068] For example, the object carrying platform 50 is provided with a plurality of negative pressure holes in the machining area, so that the preset plate can be accurately fixed on the machining area by the negative pressure air source, which facilitates the accurate and rapid machining of the main lens 41 and the auxiliary lens 42.

[0069] In some embodiments, referring to Figure 2 and Figure 3 The laser micro-hole machining device 100 comprises a cross beam 70 and two support blocks 80. The two support blocks 80 are arranged at intervals along the left-right direction and located on the upper side of the base 10. The cross beam 70 is arranged along the left-right direction and located above the two support blocks 80, the left end of the cross beam 70 is fixedly connected with the base 10 through the left support block 80, and the right end of the cross beam 70 is fixedly connected with the base through the right support block 80.

[0070] The support block 80 is fixedly supported so that the cross beam 70 is spaced apart from the base, so that the object platform 50 drives the preset plate to reciprocate in the front-rear direction.

[0071] As shown in Figure 5 The lens assembly 40 further includes a first driving member 43. At least one of the main lens 41 and the auxiliary lens 42 is connected with the first driving member 43, for adjusting the interval size between the main lens 41 and the auxiliary lens 42 in the X direction.

[0072] For example, the auxiliary lens 42 is arranged on the front side of the cross beam 70 and connected with the cross beam 70 through the first driving member 43. The first driving member 43 can adjust the position of the auxiliary lens 42 in the left-right direction, so as to change the interval size (i.e. the width gap) of the main lens 41 and the auxiliary lens 42 in the left-right direction. The machining group including the main lens 41 and the auxiliary lens 42 can process micro-holes on the preset plate synchronously according to different lens width gaps.

[0073] The first driving member 43 is used to adjust the width gap of the group of main lenses 41 and auxiliary lenses 42, so as to adapt to preset plates of different size ranges, and make the main lens 41 and the auxiliary lens 42 process the preset plates in the size range as much as possible, so as to maximize the micro-hole processing speed and processing efficiency of the preset plate.

[0074] For example, the size range of the preset plate in the embodiment of the application is 550mm×650mm-660mm×815mm. In the size range, the left half and the right half of the preset plate can be flexibly adjusted, and the main lens 41 and the auxiliary lens 42 can process micro-holes synchronously according to the above left-right partition, so as to ensure the processing precision and have faster processing speed and processing efficiency.

[0075] It should be noted that the first driving member 43 can also be installed between the main lens 41 and the cross beam 70. Or the first driving member 43 is installed on the rear side of the main lens 41 and the auxiliary lens 42 respectively. Both can be used to adjust the left-right interval size between the main lens 41 and the auxiliary lens 42.

[0076] In some embodiments, continuing to refer to Figure 5 The lens assembly 40 further includes a second driving member 44. One second driving member 44 is connected with the main lens 41, for adjusting the height size of the main lens 41 in the Z direction. One second driving member 44 is connected with the auxiliary lens 42, for adjusting the height size of the auxiliary lens 42 in the Z direction.

[0077] Since the main lens 41 and the auxiliary lens 42 are used to perform micro-hole processing on the preset plate on the lower object platform 50 by the laser beam, the first driving member 43 is arranged. The height position between the main lens 41 and the auxiliary lens 42 and the preset plate can be flexibly adjusted, so as to adjust the focal length of the laser beam at the preset plate, so as to adapt to different processing requirements.

[0078] For example, the first driving member 43 can be a linear motor transmission component, which includes a linear motor and a guide component extending along the X direction, so as to flexibly and accurately adjust the position state of the auxiliary lens 42 along the Y direction.

[0079] The second driving member 44 can also be a linear motor transmission component, which includes a linear motor and a guide component extending along the Z direction, so as to flexibly and accurately adjust the height position of the main lens 41 and the auxiliary lens 42 along the Z direction, respectively.

[0080] Alternatively, the first driving member 43 and the second driving member 44 can also be electric cylinders or other linear adjustment components, which can also flexibly and accurately adjust the position state of the corresponding lens along the linear direction.

[0081] Therefore, the height dimension of the main lens 41 and the auxiliary lens 42 along the vertical direction can be flexibly adjusted by the second driving member 44, so as to adjust the focal length of the laser beam.

[0082] The first driving member 43 can adjust the position state of the auxiliary lens 42 in the left-right direction to change the interval dimension of the main lens 41 and the auxiliary lens 42 in the left-right direction, so as to adapt to different specifications of the preset plate.

[0083] For example, in the laser micro-hole processing device 100 and the laser micro-hole processing system in the embodiment, the specification of the preset plate is required to be at least 550mm*650mm (width*length), and at most 660mm*815mm. That is, the preset plate with a specification between the above requirements, such as 550mm*700mm, 550mm*750mm, 550mm*800mm, 600mm*700mm, 600mm*750mm, 600mm*800mm, 650mm*700mm, 650mm*750mm, 650mm*800mm, can meet the processing requirements.

[0084] In some embodiments, as shown in Figure 6 The lens assembly 40 further includes a thickness detection member 45. The thickness detection member 45 is connected with the main lens 41 or the auxiliary lens 42, and is used to detect the thickness dimension of the preset plate along the vertical direction.

[0085] Exemplarily, the thickness detecting member 45 can be a predetermined marker arranged along the vertical direction, with the lower end thereof being lower than the lower end of the main lens 41 or the sub lens 42. Taking the case where the thickness detecting member 45 is arranged in connection with the main lens 41 as an example, the second driving member 44 is adjusted to move the main lens 41 downward in the vertical direction until the thickness detecting member 45 contacts the upper side of the preset plate and the upper side of the object platform 50. Thus, the thickness dimension of the preset plate can be calculated according to the height difference between the two, so as to flexibly adjust the focal length and power of the laser beam.

[0086] Alternatively, the thickness detecting member 45 can also be arranged in connection with the main lens 41 or the sub lens 42 through a third driving member. The third driving member is a Z-direction guide rail driving component same as the second driving member 44, so that the third driving member can adjust the vertical position of the thickness detecting member 45, so that the lower end of the thickness detecting member 45 contacts the upper side of the preset plate and the upper side of the object platform 50, respectively, so as to calculate and obtain the thickness dimension of the preset plate.

[0087] Taking the case where the thickness detecting member 45 is arranged in connection with the main lens 41 as an example, the position of the thickness detecting member 45 along the vertical direction is adjusted so that the thickness detecting member 45 contacts the upper side of the preset plate and the upper side of the object platform 50 during the movement of the object platform 50 along the X direction and the Y direction. The upper side of the object platform 50 or the preset plate is arranged in alignment with the lower end of the thickness detecting member 45 along the Z direction.

[0088] In some embodiments, as shown in Figure 6 The lens assembly 40 further comprises a power detecting meter 46 configured to be arranged to move along the X direction for detecting the light output power of the main lens 41 and the sub lens 42.

[0089] Exemplarily, the power detecting meter 46 is arranged in connection with the object platform 50. For example, the power detecting meter 46 is connected to the rear side edge of the object platform 50. The power detecting meter 46 can be adjusted to be close to the corresponding main lens 41 and sub lens 42 by the movement of the object platform 50 along the X direction and the Y direction, so as to accurately measure the light output power of the laser beam.

[0090] In some embodiments, as shown in Figure 5 and Figure 6 The lens assembly 40 further comprises a dust suction cover 47. Along the Z direction, the side (e.g., the lower side) of the main lens 41 and the sub lens 42 close to the base 10 is respectively provided with the dust suction cover 47. The dust suction cover is used to perform negative pressure suction on the smoke generated during the micro-hole machining process, so as to avoid the dispersion of the smoke affecting the transmission of the laser beam and the machining effect.

[0091] In addition, the laser micro-hole processing equipment 100 also includes a cooling device, which is used at least to cool the laser generator 20. The cooling device can also be used to cool the optical path assembly 30 and the lens assembly 40 to ensure that the laser micro-hole processing equipment 100 can operate stably for a long time.

[0092] Taking a case where there are at least two main lenses 41 and the same number of secondary lenses 42 as the main lenses, one secondary lens 42 is set up corresponding to one main lens 41 and distributed sequentially along the X direction to process the same preset material.

[0093] Based on this, such as Figure 7 As shown, the feeding device 200 is equipped with at least two first robotic arms 201, which are used to feed materials into at least two processing areas 51 (e.g., ...). Figure 3 (As shown) Pre-set boards are provided simultaneously. For example... Figure 8 As shown, the unloading device 300 is equipped with at least two second robotic arms 301 and a flipping robotic arm 302. The at least two second robotic arms 301 are used to simultaneously collect the preset plates from at least two processing areas 51, and the flipping robotic arm 302 is used to flip the preset plates that are processed on both sides.

[0094] Taking an example where there are two main lenses 41, two secondary lenses 42, and two processing areas 51, two first robotic arms 201 and two second robotic arms 301 are set up so that the loading device 200 can simultaneously load two preset plates into the two processing areas 51, and the unloading device 300 can simultaneously unload the two preset plates from the two processing areas. Compared to loading and unloading the preset plates one by one, the simultaneous loading and unloading method can significantly reduce the waiting time of the processing group during the loading and unloading process, thereby improving the processing efficiency of the entire system.

[0095] In the unloading equipment 300, the flipping robot 302 is configured to sequentially flip the pre-processed plates from the two second robots 301 and place them into the material pile of the hopper. This allows the pre-processed plates, which have been processed on both sides, to be directly fed and processed in subsequent processes.

[0096] Thus, during the material feeding process, such as Figure 7 As shown, after the two first robotic arms 201 successively grab the preset plate material in the first hopper 202, the two first robotic arms 201 move synchronously to the left along the X direction to the base 10 (e.g., Figure 3 Above (as shown), so that the two first robotic arms 201 are set one-to-one with the two processing areas 51. Then, the two first robotic arms 201 simultaneously place the two preset plates in the two processing areas 51 and position the preset plates based on the left edge and front edge of the processing area 51.

[0097] Subsequently, the air pump is started to suck and fix the preset board at the processing area through the plurality of negative pressure holes, so as to avoid dislocation of the preset board during the micro-hole processing. Then, the relative positions of the object platform 50 and the thickness detection member 45 are adjusted, so that the main lens 41 can drive the thickness detection member 45 to sequentially contact the object platform 50 and the preset board, thereby measuring the thickness of the preset board.

[0098] During the micro-hole processing, the height positions of the main lens 41 and the auxiliary lens 42 can be adjusted by the second driving member 44, and the spacing between the main lens 41 and the auxiliary lens 42 can be adjusted by the first driving member 43, so as to adapt to different types and different positions of micro-hole processing. Then, the object platform 50 is driven to move in the left-right direction and the front-back direction by the transverse driving member 61 and the longitudinal driving member 62, so that the main lens 41 and the auxiliary lens 42 can process different positions of the preset board.

[0099] Among them, the plurality of processing groups can synchronously process the same preset board at the plurality of processing areas 51. After the processing is completed, in combination with Figure 3 and Figure 8 , the two second mechanical arms 301 are synchronously moved to the upper side of the two processing areas 51 in the X direction to the right, so as to synchronously grab the two processed preset boards. Then, the two second mechanical arms 301 are synchronously moved to the left to the discharging device 300, so as to complete the discharging step.

[0100] In the discharging device 300, as shown in Figure 8 , if the preset board is a single-sided processing structure, the two second mechanical arms 301 sequentially stack the two preset boards in the second storage bin 303.

[0101] Continuing to refer to Figure 8 , if the preset board is a double-sided processing structure, in the discharging device 300, the two second mechanical arms 301 sequentially deliver the preset boards to the turnover mechanical arm 302, and the turnover mechanical arm 302 stacks the turned-over preset boards in the second storage bin 303 after turning over the preset boards.

[0102] After the first-side processing of the double-sided processed preset board, and the second storage bin 303 is stacked with the first-processed preset boards, the second storage bin 303 can be taken out by a forklift or a VGA (Automated Guided Vehicle), and transported to the feeding device 200 as a second storage bin, for feeding the first-processed preset boards to the processing area 51 for secondary processing, and the feeding process does not need to be turned over.

[0103] In addition, the preset boards processed by the first side are flipped by the flipping manipulator 302 after being discharged by the first side processing, and are stacked in the second material bin 303. At this time, the preset boards are loaded by the discharging device 300 and discharged by the loading device 200. The two preset boards in the second material bin 303 are sequentially grabbed by the two second manipulators 301 in the discharging device 300, and are synchronously loaded to the two processing areas 51. After the second side of the preset boards is processed, the two first manipulators 201 are synchronously moved to the two processing areas 51, and the preset boards are synchronously grabbed and moved back to the first material bin 202 to sequentially stack the preset boards processed by the two sides.

[0104] Alternatively, the preset boards processed by the first side are synchronously discharged by the second manipulator 301 after being discharged by the first side processing, and are sequentially stacked in the second material bin 303. When the second material bin 303 is stacked, the discharging device 300 is loaded, and the loading device 200 is discharged. The two preset boards in the second material bin 303 are sequentially grabbed by the flipping manipulator 302 in the discharging device 300, and are sequentially transferred to the second manipulator 301 after being flipped. Then, the two second manipulators 301 are synchronously moved to the two processing areas 51 to synchronously load. After the second side of the preset boards is processed, the two first manipulators 201 are synchronously moved to the two processing areas 51, and the preset boards are synchronously grabbed and moved back to the first material bin 202 to sequentially stack the preset boards processed by the two sides.

[0105] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present disclosure.

[0106] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, several modifications and improvements can be made, which are within the scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A laser microvia processing apparatus, characterized by, The base (10) is sequentially provided with a laser generator (20), an optical path assembly (30) and a lens assembly (40) along an optical path direction; The laser micro-hole processing equipment further comprises a material loading platform (50) provided on the base (10), and the material loading platform (50) is provided with a processing area (51) for positioning and supporting a preset plate; The lens assembly (40) comprises a main lens (41) and a sub-lens (42), the main lens (41) and the sub-lens (42) are sequentially arranged along a first horizontal direction, and the main lens (41) and the sub-lens (42) are arranged corresponding to the same processing area (51) for processing the same preset plate in the processing area (51).

2. The laser microvia machining apparatus according to claim 1, wherein, The lens assembly (40) comprises a first driving member (43), at least one of the main lens (41) and the sub-lens (42) is connected with the first driving member (43), and the first driving member (43) is used for adjusting the interval size between the main lens (41) and the sub-lens (42) along the first horizontal direction.

3. The laser microvia machining apparatus of claim 1, wherein, The lens assembly (40) further comprises a second driving member (44); One of the second driving members (44) is connected with the main lens (41) for adjusting the height size of the main lens (41) along a vertical direction; One of the second driving members (44) is connected with the sub-lens (42) for adjusting the height size of the sub-lens (42) along the vertical direction.

4. The laser microperforation apparatus according to any one of claims 1 to 3, characterized in that, The number of the main lens (41) is at least two, the number of the sub-lens (42) and the number of the processing area (51) are the same as the number of the main lens (41); The main lens (41), the sub-lens (42) and the processing area (51) are arranged one by one and corresponding, and one main lens (41) and one sub-lens (42) corresponding to each other are sequentially arranged along the first horizontal direction.

5. The laser microvia machining apparatus of claim 4, wherein, One of the material loading platforms (50) is provided with at least two processing areas (51), and the at least two processing areas (51) are arranged at intervals along the first horizontal direction; or, The number of the material loading platforms (50) is at least two, each of the material loading platforms (50) is provided with one processing area (51), and the at least two material loading platforms (50) are arranged at intervals along the first horizontal direction.

6. The laser microperforation apparatus according to any one of claims 1 to 3, characterized in that, The material loading platform (50) is arranged between the base (10) and the main lens (41) along a vertical direction; the laser micro-hole processing equipment further comprises a platform driving assembly (60), the platform driving assembly (60) comprises: A transverse driving member (61) connected with the material loading platform (50) and the base (10) for adjusting the position state of the material loading platform (50) along the first horizontal direction; and A longitudinal driving member (62) arranged between the base (10) and the material loading platform (50) for adjusting the position state of the material loading platform (50) along a second horizontal direction. The first horizontal direction, the second horizontal direction and the vertical direction are perpendicular to each other.

7. The laser microvia machining apparatus according to any one of claims 1 to 3, characterized by, The lens assembly (40) comprises: A thickness detection member (45) is arranged in connection with the main lens (41) or the auxiliary lens (42) and is used for detecting the thickness of the preset plate in the vertical direction.

8. The laser microperforation apparatus according to any one of claims 1 to 3, characterized in that, The lens assembly (40) comprises: A power detection meter (46) is arranged in the first horizontal direction and is used for detecting the light output power of the main lens (41) and the auxiliary lens (42).

9. A laser microvia machining system, characterized by, The laser micro-hole processing device comprises: The laser micro-hole processing device comprises: A feeding device (200) is arranged and is used for providing the preset plate to the processing area (51); and A discharging device (300) is arranged and is used for recycling the preset plate in the processing area (51).

10. The laser microvia machining system of claim 9, wherein, The number of the main lens (41) is at least two, the number of the auxiliary lens (42) and the number of the processing area (51) are the same as the number of the main lens (41); the main lens (41), the auxiliary lens (42) and the processing area (51) are arranged one by one, and one main lens (41) and one auxiliary lens (42) are arranged in the first horizontal direction in sequence. The feeding device (200) is provided with at least two first mechanical arms (201), and the at least two first mechanical arms (201) are used for synchronously providing the preset plate to the at least two processing areas (51). The discharging device (300) is provided with at least two second mechanical arms (301) and a turnover mechanical arm (302), the at least two second mechanical arms (301) are used for synchronously recycling the preset plate in the at least two processing areas (51), and the turnover mechanical arm (302) is used for turning over the double-sided processed preset plate.

Images