SoC stability testing device

Abstract

The utility model relates to an SoC stability testing device, which comprises an electric control box, a plurality of sliding seats, a clamping assembly and a temperature control assembly, wherein the sliding seats are arranged at the top of the electric control box in a sliding manner; the clamping assembly and the temperature control assembly are respectively and detachably connected and arranged on the sliding seats; the clamping assembly comprises a bearing plate and a clamping plate. The temperature control assembly comprises a supporting frame, a support, a floating frame, a water cooling base, a heat conduction base, a temperature controller and a temperature sensor. One surface of the temperature controller is contacted with the water-cooling seat, and the other surface of the temperature controller is contacted with the heat-conducting seat; the heat conduction seat correspondingly abuts against the SoC chip. The SoC stability testing device is simple in structure and light in size, and is provided with the detachable clamping assembly and the detachable temperature control assembly, so that the space utilization rate is remarkably improved, the overall structure is more compact, and the SoC stability testing device adapts to a narrow space. Meanwhile, the supporting frame in the temperature control assembly is movably connected with the bracket, so that the position of the heat conducting seat is adjustable, SoC chips of different models can be adapted conveniently, and the universality of the testing device is greatly enhanced.

Description

TECHNICAL FIELD

[0001] The utility model relates to SoC performance test technical field especially relates to a SoC stability test device. BACKGROUND

[0002] With the rapid development of modern electronic technology, system on chip (SoC) has been widely used in smart devices such as mobile phones. As a special integrated circuit integrating CPU, GPU, communication and other modules, the performance stability of SoC is crucial to the overall operation of smart devices. However, smart devices may face various temperature environments during use, including high temperature and low temperature environments, which may have a significant impact on the performance of SoC.

[0003] In order to evaluate the performance of SoC under different temperature environments, existing SoC environmental temperature test equipment has emerged. However, when the existing SoC environmental temperature test equipment reaches subzero temperature, it often needs to use a large number of refrigeration equipment and complex temperature control system, resulting in a large overall volume of the equipment and a large occupied area. This not only increases the manufacturing cost of the equipment, but also limits its use in small spaces. SUMMARY

[0004] Based on this, the utility model provides a kind of SoC stability test device, simple structure, light volume, with detachable clamping assembly and temperature control component, significantly improve space utilization, make overall structure more compact and adapt to small space. At the same time, the support frame and support in temperature control component are movably connected, so that the position of the heat conduction seat can be adjusted, which is convenient for adapting to different models of SoC chips, greatly enhancing the versatility of the test device.

[0005] In order to achieve the purpose of the utility model, the utility model adopts the following technical solutions:

[0006] A kind of SoC stability test device, comprising: electric control box, a plurality of slides slidably installed on the top of electric control box, and detachably connected clamping assembly and temperature control component installed on slide respectively;Clamping assembly and temperature control component one-to-one matching;Clamping assembly includes load-bearing plate for connecting slide, and clamping plate installed on load-bearing plate;Clamping plate is used for positioning clamping test motherboard, and test motherboard has SoC chip;Temperature control component includes support frame for connecting slide, support movably installed on support frame, floating frame elastically connected to support, water cooling seat connected to floating frame, heat conduction seat attached to water cooling seat, temperature controller installed in one side of heat conduction seat close to water cooling seat, and temperature sensor installed in one side of heat conduction seat away from water cooling seat;One side of temperature controller contacts water cooling seat, and the other side of temperature controller contacts heat conduction seat;Heat conduction seat corresponds to abut SoC chip.

[0007] The aforementioned SoC stability testing device features a simple structure and lightweight design. It incorporates detachable clamping and temperature control components, significantly improving space utilization and making the overall structure more compact and adaptable to confined spaces. Furthermore, the support frame and bracket within the temperature control component are movably connected, allowing for adjustable positions of the heat sink and easy adaptation to different SoC chip models, greatly enhancing the device's versatility.

[0008] In one embodiment, the heat-conducting base is a copper heat-conducting base.

[0009] In one embodiment, the temperature controller is a semiconductor TEC chip.

[0010] In one embodiment, the temperature control component further includes an adapter pipe that passes through the bracket and the floating frame and connects to the water-cooling base; the end of the adapter pipe away from the water-cooling base is connected to the chiller.

[0011] In one embodiment, the clamping assembly further includes a communication module mounted on one end of the clamping plate, a power switch mounted on the other end of the clamping plate, and a power supply module mounted on one side of the clamping plate; the power supply module is electrically connected to the control box via the power switch; the motherboard under test is electrically connected to the communication module and the power supply module. Attached Figure Description

[0012] Figure 1 This is a three-dimensional schematic diagram of a SoC stability testing device according to an embodiment of the present invention;

[0013] Figure 2 for Figure 1 An exploded view of the SoC stability testing device shown;

[0014] Figure 3 for Figure 2 An exploded view of another perspective of the SoC stability testing device shown;

[0015] Figure 4 for Figure 2 A three-dimensional schematic diagram of the components mounted in the SoC stability testing device shown;

[0016] Figure 5 for Figure 2 A three-dimensional schematic diagram of the temperature control component in the SoC stability testing device shown;

[0017] Figure 6 for Figure 5 An exploded view of the temperature control component in the SoC stability testing device shown.

[0018] Figure 7 for Figure 6 The diagram shows an exploded view of the temperature control component in the SoC stability testing device from another perspective.

[0019] BRIEF DESCRIPTION OF DRAWINGS

[0020] 10 - electric control box

[0021] 20 - sliding seat

[0022] 30 - clamping assembly, 31 - bearing plate, 32 - clamping plate, 33 - communication module, 34 - power switch, 35 - power supply module

[0023] 40 - temperature control assembly, 41 - support frame, 411 - first frame body, 4110 - first guide groove, 412 - second frame body, 4120 - second guide groove, 42 - bracket, 43 - floating frame, 44 - water cooling seat, 45 - heat conduction seat, 46 - temperature controller, 47 - temperature sensor, 48 - adapter pipe

[0024] 50 - to-be-tested mainboard, 51 - SoC chip DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0026] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be an intervening element.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application.

[0028] Please refer to Figures 1 to 7 , the SoC stability test device of an embodiment of the present application, including electric control box 10, a plurality of sliding seats 20 slidably installed on the top of the electric control box 10, and clamping assembly 30 and temperature control assembly 40 respectively detachably connected and installed on the sliding seat 20. Clamping assembly 30 and temperature control assembly 40 are matched one by one. Among them, clamping assembly 30 is used for clamping to-be-tested mainboard 50, to-be-tested mainboard 50 has SoC chip 51, and temperature control assembly 40 is used for abutting SoC chip 51.

[0029] The clamping assembly 30 comprises a bearing plate 31 for connecting the sliding seat 20, a clamping plate 32 mounted on the bearing plate 31, a communication module 33 mounted on one end of the clamping plate 32, a power switch 34 mounted on the other end of the clamping plate 32, and a power supply module 35 mounted on one side of the clamping plate 32; the power supply module 35 is electrically connected to the electric control box 10 through the power switch 34. Among them, as shown in Figure 4 The clamping plate 32 is used to position and clamp the to-be-tested mainboard 50, and the to-be-tested mainboard 50 is electrically connected to the communication module 33 and the power supply module 35. Specifically, the to-be-tested mainboard 50 is connected to the test system through the communication module 33, and the to-be-tested mainboard 50 obtains power supply through the power supply module 35. Here, the test system can be integrated on the electric control box 10, or can be another terminal device.

[0030] The temperature control assembly 40 comprises a support frame 41 for connecting the sliding seat 20, a support 42 movably mounted on the support frame 41, a floating frame 43 elastically connected to the support 42, a water-cooled seat 44 connected to the floating frame 43, a heat-conducting seat 45 attached to the water-cooled seat 44, a temperature controller 46 mounted on one side of the heat-conducting seat 45 close to the water-cooled seat 44, a temperature sensor 47 mounted on the other side of the heat-conducting seat 45 away from the water-cooled seat 44, and an adapter pipe 48 passing through the support 42 and the floating frame 43 and connecting the water-cooled seat 44; one end of the adapter pipe 48 away from the water-cooled seat 44 is connected to a water chiller (not shown). Among them, one side of the temperature controller 46 contacts the water-cooled seat 44, and the other side of the temperature controller 46 contacts the heat-conducting seat 45. The inside of the water-cooled seat 44 is provided with a liquid flow channel (not shown), and the flow of cold water can be used to dissipate heat for the temperature controller 46 during heating.

[0031] In this embodiment, the heat-conducting seat 45 is a copper heat-conducting seat 45, which corresponds to abutting the SoC chip 51 and provides a corresponding environmental temperature for the test of the SoC chip 51 by refrigeration or heating through the temperature controller 46.

[0032] In this embodiment, the temperature controller 46 is a semiconductor TEC sheet, which can be refrigerated or heated by changing the direction of the current.

[0033] As Figure 7As shown, the support frame 41 comprises a first frame body 411 and a second frame body 412 movably connected with the first frame body 411. The first frame body 411 is provided with first guide grooves 4110 on opposite sides, respectively. The second frame body 412 is connected with the first frame body 411 by means of bolts penetrating the second frame body 412 and the first guide grooves 4110 and connecting nuts. Similarly, the second frame body 412 is provided with second guide grooves 4120 on opposite sides, respectively. The length direction of the second guide grooves 4120 is perpendicular to the length direction of the first guide grooves 4110. The second frame body 412 is connected with the bracket 42 by means of bolts penetrating the second guide grooves 4120 and connecting brackets 42. In actual use, by loosening the bolts, the relative positions of the first frame body 411 and the second frame body 412 and the relative positions of the bracket 42 and the second frame body 412 are changed, so that the position of the heat conduction seat 45 is adjusted to adapt to the SoC chip 51 on the different to-be-tested mainboards 50, greatly improving the versatility and flexibility of the entire SoC stability test device. Moreover, by changing the clamping assembly 30 and the temperature control assembly 40, multiple tests can be realized.

[0034] The above SoC stability test device has simple structure, light volume, detachable clamping assembly 30 and temperature control assembly 40, significantly improves the space utilization, and makes the overall structure more compact and suitable for narrow space. At the same time, the support frame 41 and the bracket 42 in the temperature control assembly 40 are movably connected, so that the position of the heat conduction seat 45 is adjustable, facilitating the adaptation to different models of SoC chips 51, and greatly enhancing the versatility of the test device.

[0035] The technical features of the above-described embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above-described embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the description.

[0036] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled persons in the art, without departing from the concept of the present application, some modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A SoC stability test apparatus, characterized by, The utility model relates to a kind of temperature control device for SoC chip, including: Electric control box, multiple slides slidably installed on the top of electric control box, and respectively detachably connected mounting clamping assembly and temperature control assembly installed on slide;Clamping assembly and temperature control assembly one-to-one matching;Clamping assembly includes the load plate for connecting slide, and clamping plate is installed on load plate;Clamping plate is used to position clamping to be measured mainboard, and the measured mainboard has SoC chip;Temperature control assembly includes the support frame for connecting slide, bracket movably installed on support frame, elastic connection bracket's floating frame, water cooling seat connected floating frame, heat conduction seat pasted water cooling seat, temperature controller is installed in the one side of heat conduction seat close to water cooling seat, and temperature sensor is installed in the one side of heat conduction seat away from water cooling seat;One side of temperature controller contacts water cooling seat, and the other side of temperature controller contacts heat conduction seat;Heat conduction seat corresponds to the abutment SoC chip.

2. The SoC stability test apparatus according to claim 1, wherein Heat conduction seat is copper heat conduction seat.

3. The SoC stability test apparatus of claim 1, wherein Temperature controller is semiconductor TEC piece.

4. The SoC stability test apparatus of claim 1, wherein Temperature control assembly further includes and connects water cooling seat after passing through bracket and floating frame adapter pipe;The end of adapter pipe away from water cooling seat is connected to water chiller outward.

5. The SoC stability test apparatus of claim 1, wherein Clamping assembly further includes communication module installed in one end of clamping plate, power switch installed in the other end of clamping plate, and power supply module installed in one side of clamping plate;Power supply module is electrically connected electric control box by power switch;The measured mainboard is electrically connected communication module and power supply module.

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