Semiconductor processing heating disc with adjusting function

Abstract

The utility model discloses a semiconductor processing heating plate with an adjusting function, which relates to the field of semiconductor heating plates, and comprises a heating plate main body, a resistance wire is arranged in the heating plate main body, one end of the resistance wire is fixedly connected with a temperature controller, a central temperature sensor is arranged in the heating plate main body, and the central temperature sensor is fixedly connected with the temperature controller. An edge temperature sensor is installed in the heating disc body, heat dissipation fins are installed at the bottom of the heating disc body, a temperature controller is started, a resistance wire can be heated, and heat is conducted to the top of the heating disc body through the interior of the heating disc body; the center temperature sensor is fixedly connected to the interior of the heating disc body, the temperature of the center of the heating disc body can be monitored in real time, and the edge temperature sensor is fixedly connected to the interior of the heating disc body, so that the temperature of the edge of the heating disc body can be monitored in real time; and the effect of conveniently carrying out temperature control adjustment on the heating disc main body is achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor heating disc, concretely to a heating disc for semiconductor processing with adjusting function. BACKGROUND

[0002] The semiconductor heating disc is a kind of heating equipment for the processing of semiconductor materials. It mainly works based on Joule heat principle. When electric current passes through heating element with certain resistance, electric energy will be converted into heat energy. For most semiconductor heating discs, heating element is usually resistance wire or other material with suitable resistance characteristics. These heating elements are embedded or attached in the main structure of heating disc, and heat is generated when electric current passes through, then heat is transferred to the semiconductor materials placed on the surface of heating disc through heat conduction, so as to realize the heating of semiconductor materials. The current semiconductor heating disc for semiconductor processing has uneven distribution of resistance wire inside, which leads to uneven heating of heating disc, therefore, a semiconductor heating disc for semiconductor processing with adjusting function is needed.

[0003] The existing semiconductor heating disc for semiconductor processing is inconvenient to control the temperature of the heating disc when in use, which leads to uneven heating of each position of the heating disc, affects the quality of semiconductor wafer heating processing, and the heat conduction performance of the current heating disc is poor, so part of heat energy is wasted, therefore, a semiconductor heating disc for semiconductor processing with adjusting function is urgently needed. SUMMARY

[0004] Therefore, the utility model discloses a semiconductor heating disc for semiconductor processing with adjusting function is provided to solve the problems of inconvenient temperature control of the existing semiconductor heating disc for semiconductor processing and poor heat conduction performance of the heating disc.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a semiconductor heating disc for semiconductor processing with adjusting function, comprising a heating disc main body, an electric resistance wire is installed in the inside of the heating disc main body, a temperature controller is fixedly connected to one end of the electric resistance wire, a center temperature sensor is installed in the inside of the heating disc main body, an edge temperature sensor is installed in the inside of the heating disc main body, and a heat dissipation fin is installed at the bottom of the heating disc main body.

[0006] The outer wall of the heating disc main body is fixedly connected with a graphene coating, and the outer wall of the graphene coating is fixedly connected with an aluminum oxide coating.

[0007] Preferably, the heating disc main body is fixedly connected with the temperature controller, and the electric resistance wire is spirally arranged.

[0008] Preferably, the edge temperature sensor is arranged in a ring shape around the central axis of the heating disc main body, and the edge temperature sensor is arranged in parallel with the center temperature sensor.

[0009] Preferably, the heating disc body is fixedly connected with the heat dissipation fins, and the heat dissipation fins are arranged in an L shape.

[0010] Preferably, the heating disc body is fixedly connected with the heat dissipation fins, and the heat dissipation fins are arranged in an L shape.

[0011] Preferably, the heating disc body is fixedly connected with the heat dissipation fins, and the heat dissipation fins are arranged in an L shape.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1、 the utility model discloses a heating disc body, resistance wire, temperature controller, center temperature sensor and edge temperature sensor are set up, and through starting temperature controller, can make resistance wire heat -generating, and the heat is conducted to the top of heating disc body through the inside of heating disc body, and the semiconductor wafer placed on the heating disc body is heated, and the inside of heating disc body is fixedly connected with center temperature sensor, can carry out real -time monitoring to the temperature of the center of heating disc body, and the inside of heating disc body is fixedly connected with edge temperature sensor, can carry out real -time monitoring to the temperature of the edge of heating disc body, and the effect that the temperature of heating disc body is conveniently adjusted is played.

[0014] 2、 the utility model discloses a heating disc body, graphene coating and alumina coating are set up, and the outer wall of heating disc body is fixedly connected with graphene coating, can improve the heat conduction performance of heating disc body, and the outer wall of graphene coating is fixedly connected with alumina coating, can improve the high temperature resistance of heating disc body. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;

[0016] Figure 2 It is the three-dimensional view of the heating disc body of the utility model;

[0017] Figure 3 It is the three-dimensional view of the resistance wire of the utility model;

[0018] Figure 4 It is the three-dimensional sectional view of the heating disc body of the utility model.

[0019] In the drawing: 1, heating disc body;2, resistance wire;3, temperature controller;4, center temperature sensor;5, edge temperature sensor;6, heat dissipation fin;7, graphene coating;8, alumina coating. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. The embodiments described below with reference to the drawings are exemplary and are used only for explaining the present application, and cannot be understood as limiting the present application.

[0021] The embodiments will be described below according to the overall structure of the present application.

[0022] Please refer to Figures 1-4 The utility model discloses a heating disc for semiconductor processing with adjusting function, including heating disc main part 1, the inside installation of heating disc main part 1 has resistance wire 2, and one end of resistance wire 2 is fixedly connected with temperature controller 3, and the inside installation of heating disc main part 1 has center temperature sensor 4, and the inside installation of heating disc main part 1 has edge temperature sensor 5, and the bottom installation of heating disc main part 1 has radiating fin 6, and heating disc main part 1 is fixedly connected with temperature controller 3, and resistance wire 2 is spirally arranged, and edge temperature sensor 5 is arranged in a ring around the central axis of heating disc main part 1, and edge temperature sensor 5 is parallelly arranged with center temperature sensor 4, and heating disc main part 1 is fixedly connected with radiating fin 6, and radiating fin 6 is L type arrangement, can be convenient for the temperature control adjustment of heating disc main part 1.

[0023] Please refer to Figures 1-4 The utility model discloses a heating disc for semiconductor processing with adjusting function, and the outer wall of heating disc main part 1 is fixedly connected with graphene coating 7, the outer wall of graphene coating 7 is fixedly connected with alumina coating 8, heating disc main part 1 and graphene coating 7 are closely combined, and heating disc main part 1 and graphene coating 7 are parallelly arranged, graphene coating 7 and alumina coating 8 are closely combined, and graphene coating 7 and alumina coating 8 are parallelly arranged, can improve the heat conductivity of heating disc main part 1.

[0024] Working principle: in use, by starting the temperature controller 3, the resistance wire 2 can heat, the heat is conducted to the top of the heating disc body 1 through the inside of the heating disc body 1, the semiconductor wafer placed on the heating disc body 1 is heated, the center temperature sensor 4 fixedly connected in the inside of the heating disc body 1 can monitor the temperature of the center of the heating disc body 1 in real time, the edge temperature sensor 5 fixedly connected in the inside of the heating disc body 1 can monitor the temperature of the edge of the heating disc body 1 in real time, finally the temperature is controlled and adjusted through the temperature controller 3, when not in use, the heat is conducted to the heat dissipation fin 6, the heat on the heat dissipation fin 6 is taken away through air circulation, the heating disc body 1 is cooled, the graphene coating 7 is fixedly connected to the outer wall of the heating disc body 1, the heat conduction performance of the heating disc body 1 can be improved, the alumina coating 8 is fixedly connected to the outer wall of the graphene coating 7, the high temperature resistance of the heating disc body 1 can be improved, so the use process of the device is completed, the contents not described in detail in the specification belong to the prior art known to the person skilled in the art.

[0025] Although the utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or part of the technical features can be replaced, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A heating plate for semiconductor processing having a regulating function, comprising a heating plate main body (1), characterized by: The inside of the heating disc body (1) is internally provided with a resistance wire (2), one end of the resistance wire (2) is fixedly connected with a temperature controller (3), the inside of the heating disc body (1) is internally provided with a center temperature sensor (4), the inside of the heating disc body (1) is internally provided with an edge temperature sensor (5), the bottom of the heating disc body (1) is internally provided with a heat dissipation fin (6); The outer wall of the heating disc body (1) is fixedly connected with a graphene coating (7), the outer wall of the graphene coating (7) is fixedly connected with an alumina coating (8).

2. The heating plate for semiconductor processing with a regulating function according to claim 1, characterized in that: The heating disc body (1) is fixedly connected with the temperature controller (3), and the resistance wire (2) is spirally arranged.

3. The heating plate for semiconductor processing with the adjusting function according to claim 1, characterized in that: The edge temperature sensor (5) is arranged in a ring shape with the central axis of the heating disc body (1) as the center, and the edge temperature sensor (5) is arranged in parallel with the center temperature sensor (4).

4. The heating plate for semiconductor processing with the adjusting function according to claim 1, characterized in that: The heating disc body (1) is fixedly connected with the heat dissipation fin (6), and the heat dissipation fin (6) is arranged in an L shape.

5. The heating plate for semiconductor processing with the adjusting function according to claim 1, characterized in that: The heating disc body (1) is closely attached to the graphene coating (7), and the heating disc body (1) is arranged in parallel with the graphene coating (7).

6. The heating plate for semiconductor processing with a regulating function according to claim 1, characterized in that: The graphene coating (7) is closely attached to the alumina coating (8), and the graphene coating (7) is arranged in parallel with the alumina coating (8).

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