LED support structure
By setting grooves and dam structures on the LED bead bracket, the problem of insufficient airtightness caused by thermal expansion and contraction of hardware and plastic is solved, which improves the airtightness and reliability of LED beads and extends their lifespan.
Patent Information
- Application Number
- CN202423204096.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2026-01-16
- Estimated Expiration
- 2034-12-25
AI Technical Summary
The insufficient airtightness between the metal and plastic parts of existing LED chips due to thermal expansion and contraction leads to problems such as red ink failure, bracket corrosion, and delamination, affecting the performance and lifespan of the LED chips.
Grooves and dam structures are set on the lamp bead bracket. The dams in the grooves cover part of the electrode area, avoiding contact between the die bond adhesive and the plastic of the large chip, enhancing the adhesion between the hardware and the plastic, and reducing moisture intrusion.
It improves the airtightness of LED beads, resolves delamination issues, enhances the experimental results of red ink, and extends the lifespan and reliability of the beads.
Smart Images
Figure CN223810100U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to LED lamp production technical field relates to an improved LED lamp bead stratification, red ink experimental effect of LED support structure. BACKGROUND
[0002] The current TOP series RGB LED lamp bead semi-finished product adopts internal glue filling packaging technology. The existing outdoor lamp bead brightness needs to meet the customer's high brightness display requirement. Due to the limitation of lamp bead size, when large size chips (referred to as large chips) are used, part of the chips will exceed the hardware area, and the chip part area and die bonding glue contact with the plastic. Because the structure of the lamp bead is mainly composed of hardware and plastic, there is still a gap between the hardware and plastic. Under the condition of 160 DEG C high temperature baking, the die bonding glue solidifies and has internal stress pulling between the plastic and the hardware, which causes the gap between the plastic and the hardware to gradually increase, thereby reducing the air tightness of the support bottom.
[0003] The insufficient air tightness not only increases the risk of red ink failure, but also may cause problems such as support corrosion, delamination and dead lamp, which seriously affects the performance and service life of the LED lamp bead.
[0004] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. INVENTION CONTENTS
[0005] The utility model aims at providing a kind of LED support structure, solve the problem of insufficient air tightness of large chip caused by stress pulling between plastic and hardware after die bonding glue solidification.
[0006] The utility model aims at the following technical scheme realization:
[0007] A kind of LED support structure, including the lamp bead support being set on substrate, the bottom of the lamp bead support is provided with lamp bead end foot, bowl cup is provided on the lamp bead support, the upper end surface of the lamp bead support is etched to form two independent grooves, the upper end surface of the lamp bead support is formed first electrode area and second electrode area by the groove, the groove, first electrode area and second electrode area are distributed in the region enclosed by bowl cup;Dam body is provided at two the groove where large chip is exposed.
[0008] As a further improvement of the utility model one embodiment, wherein the dam body is located at the bending of two the groove.
[0009] As a further improvement of the utility model one embodiment, wherein the dam body is formed by three 150 um, staggered distribution of glue ring is formed by 160 DEG C high temperature baking dam body.
[0010] As a further improvement of the embodiment of the present application, the dam body covers a first electrode area and a second electrode area.
[0011] As a further improvement of the embodiment of the present application, the width of the first electrode area covered by the dam body is 10-20 um, and the width of the second electrode area covered by the dam body is 10-20 um.
[0012] As a further improvement of the embodiment of the present application, one of the two grooves is in a "<" shape, and the other is in a "⊥" shape.
[0013] As a further improvement of the embodiment of the present application, the two grooves form a first electrode area and three independent second electrode areas on the upper end surface of the lamp bead support, the first electrode area is centrally distributed, and the second electrode areas are distributed on the outer side of the first electrode area.
[0014] As a further improvement of the embodiment of the present application, three pads are arranged in the first electrode area, each pad is electrically connected to an independent second electrode area through a conductive gold wire, two pads are located on the outer side of the two dam bodies, and one pad is located in the enclosed area of the two dam bodies for placing a large wafer.
[0015] The above technical solution has the following beneficial effects: by using the dam body in the groove, the contact between the die bonding glue and the large wafer during subsequent die bonding is avoided, the risk of increasing the gap between the hardware and the plastic is reduced, the adhesion between the plastic and the hardware is protected, external moisture intrusion is effectively reduced, the LED lamp bead delamination and red ink experiment effect are improved, and the lamp bead airtightness is improved. BRIEF DESCRIPTION OF DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only exemplary, and for those skilled in the art, other embodiments can be derived from the provided drawings without creative labor.
[0017] The structures, proportions, sizes, etc. shown in the specification are only used to cooperate with the content disclosed in the specification, to enable those skilled in the art to understand and read, and are not used to limit the implementation conditions of the present application, so they do not have technical significance. Any modification of structure, change of proportion relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed by the present application.
[0018] Fig. 1 The first state structure schematic view is provided in the utility model.
[0019] Fig. 2 The internal position distribution schematic view is provided in the utility model.
[0020] Fig. 3 The LED support structure whole schematic view is provided in the utility model.
[0021] In the drawing,
[0022] 1-base plate;
[0023] 2-lamp bead support;
[0024] 3-lamp bead end foot;
[0025] 4-bowl cup;
[0026] 51, 52-groove;
[0027] 61-first electrode area;
[0028] 71, 72, 73-second electrode area;
[0029] 81, 82-dam body;
[0030] 91, 92, 93-solder pad. DETAILED DESCRIPTION
[0031] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The utility model will be described in detail below with reference to the drawings and in combination with the embodiments.
[0032] It should be noted that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.
[0033] In the utility model, the orientation words such as 'up, down, top, bottom' used without making the opposite statement are generally for the direction shown in the drawing, or for the component itself in the vertical, perpendicular or gravity direction. Similarly, for the convenience of understanding and description, 'inner, outer' refers to the inner and outer of the contour of each component itself, but the above orientation words are not used to limit the utility model. EMBODIMENT
[0034] Reference is made to Figs. 1-3As shown, an LED support structure includes a lamp bead support 2 arranged on a substrate 1, and the bottom of the lamp bead support 2 is provided with a lamp bead pin 3 for electrical connection. The lamp bead support 2 is provided with a bowl cup 4 for accommodating and fixing an LED wafer. The upper end surface of the lamp bead support 2 is etched to form two independent grooves 51, 52, which divide the upper end surface of the lamp bead support into a first electrode area 61 and second electrode areas 71, 72, 73. The grooves 5, the first electrode area 61 and the second electrode areas 71, 72, 73 are distributed within the area enclosed by the bowl cup 4, ensuring the compactness of the structure and the integrity of the function.
[0035] For large wafers, part of the wafers will exceed the hardware area. For the position exceeding the large wafer, a dam body is arranged. In this embodiment, the middle green light adopts a large wafer, so a dam body 81, 82 is arranged at the bending position of the two grooves 51, 52. Through the application of the dam body 81, 82, the contact between the die bonding glue and the plastic is avoided during subsequent die bonding, thereby reducing the risk of increasing the gap between the hardware and the plastic, protecting the bonding force between the plastic and the hardware, and effectively reducing the intrusion of external water vapor.
[0036] Specifically, among the two grooves, the groove 51 is in a “〈” shape bending structure, and the groove 52 is in a “⊥” shape bending structure. These two bending structures are not only beautiful but also practical. They jointly act on the upper end surface of the lamp bead support, and ingeniously divide the area into a central first electrode area 61 and three independent second electrode areas 71, 72, 73. The first electrode area 61 is located at the center position, and the second electrode areas 71, 72, 73 are evenly distributed on the periphery of the first electrode area 61. Such layout not only optimizes the distribution of electrodes, but also ensures the stability of current transmission.
[0037] Three pads 91, 92, 93 are arranged in the first electrode area to prevent RGB lamp beads. The middle pad 92 is used to place the green light of the large wafer, and the pads 91, 93 on both sides are used to place the red light and blue light of the small wafer. The pads 91 are electrically connected to the second electrode area 71 through conductive gold wires, the pads 92 are electrically connected to the second electrode area 72 through conductive gold wires, and the pads 93 are electrically connected to the second electrode area 73 through conductive gold wires. Such design ensures that the RGB lamp beads can stably and efficiently receive current. It is worth noting that since the red light and the blue light use small wafers, they are not exposed in the groove, so there is no need to design a dam body. The middle large wafer green light is partially exposed in the groove, so a dam body is arranged in the two grooves for the middle large wafer. The overall structure is as follows: two pads 91, 93 are located outside the two dam bodies 81, 82, and one pad 92 is located in the enclosed area of the two dam bodies 81, 82.
[0038] In the embodiment, the dam bodies 81 and 82 are uniquely configured, which are formed by three staggered 150-micron glue rings and cured after high-temperature baking at 160℃. The design not only enhances the structural strength of the dam bodies, but also optimizes the electrical isolation performance. The edges of the dam body 81 cover part of the first electrode area 61 and the second electrode area 73, and the covered width is accurately controlled between 10-20 microns to ensure good insulation effect and protection of the electrode area. Similarly, the edges of the dam body 82 also cover part of the first electrode area 61 and the second electrode areas 71 and 72, and the covered width is also 10-20 microns.
[0039] During the manufacturing process, a pretreatment process is performed on the basis of the original support. The pretreatment process is as follows: first, dehumidification treatment is performed, then three 150-micron glue rings are uniformly taken at the groove positions on both sides of the support through the air dispensing function of the die bonder, and it is ensured that the glue rings exceed the edges of the first electrode area and the second electrode area by 10-20 microns. Then, the entire support is placed in a high-temperature environment of 160℃ for baking for 1 hour to cure the glue rings to form dam bodies, which has the effect of patching between hardware and plastic, thereby enhancing the structural stability and reliability.
[0040] The unique design avoids the direct contact between the die bonding glue and the plastic on the large wafer in the subsequent die bonding process, reduces the risk of gap enlargement between hardware and plastic due to thermal expansion and contraction and other factors, and ensures the structural stability and reliability.
[0041] In addition, the pretreatment process also effectively protects the adhesion between the plastic and the hardware, further reduces the possibility of external moisture intrusion by enhancing the bonding strength between the two. Experiments show that the lamp beads treated by this process do not show delamination after being placed at room temperature for 48 hours, and the results of three times of red ink test meet the standard. Therefore, the utility model not only improves the delamination problem of the LED lamp beads and improves the effect of the red ink experiment, but also significantly improves the airtightness of the lamp beads, providing a strong guarantee for the long-term stability and reliability of the LED products.
[0042] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor should belong to the protection scope of the utility model.
[0043] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, devices, components and / or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, devices, components and / or combinations thereof.
[0044] It should be noted that the terms "first", "second", and the like, herein do not necessarily have an either chronological or spatial relation. Rather, these terms can be used solely to distinguish a certain specific entity from another entity. It should be understood that the terms so used in the description are interchangeable under appropriate circumstances and embodiments of the application described herein are capable of operating in other sequences than described or illustrated herein.
[0045] The preferred embodiments of the present application have been described above with the aid of drawing figures, and are not limited to those embodiments; instead, they will include any changes that do not constitute departures from the spirit and scope of the present application.
Claims
1. An LED support structure comprising a lamp bead support arranged on a substrate, a bottom of the lamp bead support being provided with a lamp bead pin, and a bowl cup being arranged on the lamp bead support, characterized in that: The upper end surface of the lamp bead support is etched to form two independent grooves, which divide the upper end surface of the lamp bead support into a first electrode area and a second electrode area, and the grooves, the first electrode area and the second electrode area are distributed in the enclosed area of the bowl cup. A dam is arranged at the groove exposed by the large wafer.
2. The LED support structure of claim 1, wherein: The dam is arranged at the bending part of the two grooves.
3. The LED support structure of claim 1 or 2, wherein: The dam is formed by three 150 um staggered glue rings baked at 160 DEG C high temperature.
4. The LED support structure of claim 3, wherein: The edge of the dam covers part of the first electrode area and the second electrode area.
5. The LED support structure of claim 4, wherein: The width of the dam covering the first electrode area is 10-20 um, and the width of the dam covering the second electrode area is 10-20 um.
6. The LED support structure of claim 3, wherein: One of the two grooves is in a "<" shape bending structure, and the other is in a "⊥" shape bending structure.
7. The LED support structure of claim 6, wherein: The two grooves divide the upper end surface of the lamp bead support into a first electrode area and three independent second electrode areas, and the first electrode area is distributed in the center, and the second electrode areas are distributed on the outer side of the first electrode area.
8. The LED support structure of claim 7, wherein: Three pads are arranged in the first electrode area, and each pad is electrically connected to an independent second electrode area through a conductive gold wire, wherein two pads are arranged on the outer side of the two dams, and one pad is arranged in the enclosed area of the two dams for placing a large wafer.