Crystal support capable of preventing wire jamming during cutting
By setting a metal frame and adhesive layer under the silicon rod, the thickness of the adhesive layer can be controlled, solving the problem of wire jamming during silicon wafer cutting, improving the slicing yield and reducing losses.
Patent Information
- Application Number
- CN202520269000.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-20
- Publication Date
- 2026-01-20
- Estimated Expiration
- 2035-02-20
AI Technical Summary
Existing technologies struggle to effectively control the uniformity of adhesive layer thickness during silicon wafer cutting, leading to frequent wire jamming issues, scratches and wire breaks on the silicon wafer, and increased losses.
A crystal holder to prevent wire jamming is adopted by setting a metal frame and an internal adhesive layer under the silicon rod, and fixing a plastic plate to the bottom of the metal frame. The bottom of the adhesive layer is fixedly connected to the top of the plastic plate, and the crystal holder is connected to the bottom of the plastic plate. The thickness of the adhesive layer is controlled at 0.4mm. The thickness of the adhesive layer is adjusted by using the metal frame to reduce the wire jamming rate.
By controlling the adhesive layer thickness, the wire jamming rate can be significantly reduced, the slicing yield can be improved, and the company's losses can be reduced.
Smart Images
Figure CN223812219U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic silicon rod slicing technical field, concretely is a crystal holder of preventing cutting line carding. BACKGROUND
[0002] At present, 156,000 transistors can be integrated on a rice grain size silicon wafer, which is how delicate engineering! It is the crystallization of multidisciplinary collaborative efforts, and is another milestone of scientific and technological progress. The core of the modern wire saw is the ultra-fine high-strength cutting wire used to complete the cutting action under the cooperation of the grinding slurry. At most, 1000 parallel cutting wires are wound on the guide wire wheel to form a horizontal cutting wire "net". The motor drives the guide wire wheel to move the entire cutting wire net at a speed of 5 to 25 meters per second. The speed, straight-line motion or back-and-forth motion of the cutting wire will be adjusted according to the shape of the silicon ingot during the entire cutting process. During the movement of the cutting wire, the nozzle continuously sprays the cutting wire with grinding slurry containing suspended silicon carbide particles.
[0003] In recent years, the photovoltaic industry has developed rapidly, and the silicon wafer preparation link plays an increasingly important role in the entire industry chain. The line carding problem in the slicing process greatly affects the yield. The glue layer carding is more common during the cutting process, which can cause silicon wafer scratches and broken lines, thereby causing huge losses. A large amount of data proves that the thickness of the glue is crucial to the carding, and the thinner the glue layer, the easier it is to card. Therefore, it is particularly important to control the thickness of the glue layer. The existing traditional process method is difficult to quantify the thickness, which can easily cause uneven glue layer, even empty glue, and cause unnecessary losses. SUMMARY
[0004] In view of the deficiencies of the prior art, the utility model provides a crystal holder for preventing cutting line carding, which solves the problem of glue layer carding during the cutting process, which can cause silicon wafer scratches and broken lines, thereby causing huge losses.
[0005] To achieve the above purpose, the utility model realizes the following technical scheme: a crystal holder for preventing cutting line carding, comprising a silicon rod, a metal frame is arranged below the silicon rod, a glue layer is arranged in the metal frame, the bottom of the silicon rod is fixedly connected with the top of the glue layer, a plastic plate is arranged at the bottom of the metal frame, the bottom of the glue layer is fixedly connected with the top of the plastic plate, and the bottom of the plastic plate is fixedly connected with a crystal holder.
[0006] Preferably, the length of the plastic plate is greater than the length of the metal frame, and the length of the metal frame is consistent with the length of the silicon rod.
[0007] Preferably, the length of the plastic plate is less than the length of the crystal holder, and the thickness of the crystal holder is greater than the thickness of the plastic plate.
[0008] Preferably, the thickness of the glue layer is 0.4mm.
[0009] Preferably, the metal frame is spliced by a first frame and a second frame, one side of the first frame is fixedly connected with a clamping rod, and the second frame is provided with a clamping hole matched with the clamping rod on the side close to the first frame.
[0010] Beneficial effects
[0011] The utility model provides a prevent cutting crystal holder of carding, has the following beneficial effects compared with prior art: the crystal holder of cutting carding prevention of this, through the metal frame of setting down of silicon rod, and the inside of metal frame is provided with the glue layer, the bottom of silicon rod and the top of glue layer fixed connection, the bottom of metal frame is provided with the plastic plate, and the bottom of glue layer and the top of plastic plate fixed connection, the bottom fixed connection of plastic plate has crystal holder, through the way of adjusting or pressure matching weight to control the thickness of glue layer, between plastic plate and silicon rod and set up a metal frame quantization glue layer thickness, reduce carding rate, thereby improve the whole slice yield, reduce loss, after using the process method, greatly solve the problem of glue layer carding, greatly improve the cutting yield, greatly reduce the enterprise loss. BRIEF DESCRIPTION OF DRAWINGS
[0012] Figure 1 It is the perspective view of the utility model structure;
[0013] Figure 2 It is the exploded view of the utility model structure;
[0014] Figure 3 It is the carding rate display drawing of the utility model;
[0015] Figure 4 It is the expanded view of the metal frame of the utility model.
[0016] In the drawing: 1 - silicon rod, 2 - metal frame, 21 - first frame, 22 - second frame, 23 - clamping rod, 24 - clamping hole, 3 - glue layer, 4 - plastic plate, 5 - crystal holder. DETAILED DESCRIPTION
[0017] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0018] Please refer to Figures 1-4The utility model provides a technical scheme: a crystal holder preventing cutting card line, including silicon rod 1, the below of silicon rod 1 is provided with metal frame 2, metal frame 2 is formed by splicing first frame 21 and second frame 22, one side of first frame 21 is fixedly connected with card bar 23, and second frame 22 is close to the side of first frame 21 and is provided with the card hole 24 of adapting with card bar 23, the first frame 21 and second frame 22 are pulled apart to the opposite direction, metal frame 2 can be removed, and the inside of metal frame 2 is provided with adhesive layer 3, the thickness of adhesive layer 3 is 0.4mm, the bottom of silicon rod 1 is fixedly connected with the top of adhesive layer 3, the bottom of metal frame 2 is provided with plastic plate 4, the length of plastic plate 4 is greater than the length of metal frame 2, and the length of metal frame 2 and the length of silicon rod 1 are identical, the length of plastic plate 4 is less than the length of crystal holder 5, and the thickness of crystal holder 5 is greater than the thickness of plastic plate 4, and the bottom of adhesive layer 3 is fixedly connected with the top of plastic plate 4, the bottom of plastic plate 4 is fixedly connected with crystal holder 5, and the contents not being described in detail in the specification all belong to the prior art known to those skilled in the art.
[0019] When using, metal frame 2 is located on plastic plate 4, rod glue is added to metal frame 2 to form adhesive layer 3, silicon rod 1 is placed above adhesive layer 3, solidifies 2 hours, first frame 21 and second frame 22 are pulled apart to the opposite direction, metal frame 2 can be removed, by placing metal frame 2 in adhesive layer 3, card line rate is obviously reduced after controlling the thickness of adhesive layer 3 0.4mm, specific data is as shown in Figure 3 Card line rate is greatly reduced after using adhesive layer 3 frame.
[0020] It should be noted that, in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0021] Although the embodiments of the utility model have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, and the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A crystal holder for preventing cutting of a wire, comprising a silicon rod (1), characterized in that: The lower part of the silicon rod (1) is provided with a metal frame (2), and the inside of the metal frame (2) is provided with a glue layer (3), the bottom of the silicon rod (1) is fixedly connected with the top of the glue layer (3), the bottom of the metal frame (2) is provided with a plastic plate (4), and the bottom of the glue layer (3) is fixedly connected with the top of the plastic plate (4), and the bottom of the plastic plate (4) is fixedly connected with a crystal holder (5).
2. A wafer boat for preventing cutting of a wire according to claim 1, wherein: The length of the plastic plate (4) is greater than the length of the metal frame (2), and the length of the metal frame (2) is consistent with the length of the silicon rod (1).
3. A wafer boat for preventing cutting of a wire according to claim 1, wherein: The length of the plastic plate (4) is less than the length of the crystal holder (5), and the thickness of the crystal holder (5) is greater than the thickness of the plastic plate (4).
4. The wafer boat of claim 1, wherein: The thickness of the glue layer (3) is 0.4mm.
5. A wafer boat for preventing cutting of a wire according to claim 1, wherein: The metal frame (2) is spliced by a first frame (21) and a second frame (22), one side of the first frame (21) is fixedly connected with a clamping rod (23), and the side close to the first frame (21) of the second frame (22) is provided with a clamping hole (24) matched with the clamping rod (23).